TWI724098B - Heater and fixing device, image forming device and heating device provided with the same - Google Patents

Abstract

Provided is a heater that scans one of the object to be heated and the main heater (1) while facing the object to be heated, and heats the object to be heated. The heater is provided with: a base body (11); (11) The heating layer (12) on one side (11a); is arranged between the substrate (11) and the heating layer (12), and at least one of the other side (11b) side of the substrate (11), by The soaking layer (13) formed by a material with a higher thermal conductivity than the material constituting the base (11) makes it difficult for the fluctuations of heat caused by the heating layer to be reflected on the heating surface. A heater with excellent soaking property is equipped with this Fixing device, image forming device and heating device.

Description

Heater and fixing device, image forming device and heating device provided with the same

This invention relates to a heater, a fixing device, an image forming device, and a heating device equipped with the heater. In detail, regarding the heater with excellent heat uniformity, the fixing device, the image forming device, and the heating device provided with the heater.

As a heating means for heat treatment of an object, a heater is known that uses a thin substrate formed with a heat generating layer provided on one side of the substrate. Since such a heater can be made compact, it is used for the purpose of fixing toner or ink to the recording medium, for example, when it is assembled in a photocopier or printer, or when it is assembled in a dryer to make the panel, etc. It is used for the purpose of uniform heating and drying of the processed body. Such a heater is disclosed in Patent Document 1 below.

[Prior technical literature] 〔Patent Literature〕

[Patent Document 1] International Publication No. 2013/073276 pamphlet

In such a heater, by using a thin base, power can be saved and rapid rise characteristics can be achieved. In addition, when a thin substrate is used, there is a problem of heat fluctuations of the heat generating layer provided on one side of the heat generating layer, for example, caused by the shape of the pattern, which is likely to occur on the heating surface. In addition, recently, heaters with a smaller size than in the past are required, especially heaters that are wider and narrower than the sweep direction. This narrowing of the width in the sweep direction involves more prominently reflecting the heat fluctuations caused by the pattern of the heating layer toward the heating surface, and countermeasures are necessary.

The present invention was created in view of the above-mentioned problems, and its purpose is to provide a heater that is difficult to reflect the fluctuation of heat caused by the heating layer on the heating surface and has excellent heat uniformity, and a fixing device, an image forming device, and a heating device provided with the heater .

The present invention is as follows.

The heater described in claim 1 is in a state facing the object to be heated, sweeps one of the object to be heated and the main heater to heat the object to be heated, and the gist of the heater is that the heater includes: a substrate; heat generation The layer, which is provided on one side of the substrate; and the heat-dissipating layer, which is provided between the substrate and the heating layer, and at least one of the other side of the substrate, is formed by having a thermal conductivity greater than The material of the above-mentioned base body is formed.

The heater described in claim 2 is the heater described in claim 1, and its gist is as the above-mentioned soaking layer, which has a direct-layered type soaking layer directly laminated on the above-mentioned substrate.

The heater described in claim 3 is the heater described in claim 1 or 2, and its gist is as the above-mentioned heat-dissipating layer, which has a laminated type with a glass glaze layer interposed between the substrate and the laminated layer. The soaking layer.

The heater described in claim 4 is the heater described in any one of claims 1 to 3, and the gist of the heater is the above-mentioned soaking layer, which has an omission including a cutout or a through hole penetrating through the front and back The part is a layer adjacent to one side of the heat equalizing layer and a layer adjacent to the other side of the heat equalizing layer via the missing portion.

The heater described in claim 5 is the heater described in any one of claims 1 to 4, and its gist is that the heat spreading layer has a metal porous portion formed by connecting a plurality of metal particles, and is covered The non-metal part arranged in the gap between the metal porous part.

The heater described in claim 6 is the heater described in any one of claims 1 to 5, the gist of which is that the heating layer includes a plurality of resistance heating units electrically connected in parallel, and each of the resistance heating The unit has resistance heating wiring, which connects a plurality of horizontal wiring portions arranged to be slightly perpendicular to the scanning direction, and a vertical wiring portion that connects the horizontal wiring portions to form a hairpin bend. The resistance heating units have a non-formed portion where the resistance heating wiring is not formed between each other.

The gist of the fixing device described in claim 7 is that it has the following requirements: The heater described in any one of to 6.

The gist of the image forming apparatus described in claim 8 is to include the heater described in any one of claims 1 to 6.

The gist of the heating device described in claim 9 is to include the heater described in any one of claims 1 to 6.

According to the heater of the present invention, it is possible to make the fluctuation of heat caused by the heating layer difficult to be reflected on the heating surface, and has excellent heat uniformity.

As the soaking layer, in the case of a direct-laminated type soaking layer that is directly laminated on the substrate, better heat soaking properties can be obtained than in the case of not having the soaking layer.

As the soaking layer, when the glass glaze layer is interposed with the substrate and the laminated layer is connected between the laminated layers, it can achieve better heat soaking than the case without the soaking layer. .

1‧‧‧Heater

1a‧‧‧One side of heater

1b‧‧‧The other side of the heater (heating surface)

11‧‧‧Matrix

11a‧‧‧One side of the substrate

11b‧‧‧The other side of the substrate

12‧‧‧Heating layer

121‧‧‧Resistance heating wiring

122‧‧‧Horizontal wiring part

123‧‧‧Vertical wiring part

124‧‧‧Resistance heating unit

125‧‧‧Non-formed part

13‧‧‧Heat layer

131‧‧‧Direct stack type thermal layer

132‧‧‧Indirect laminated type thermal layer

133X‧‧‧Missing part

133H‧‧‧Through hole

133S‧‧‧Cut

135a‧‧‧Metal porous part

135b‧‧‧Non-metallic Department

14,141,142,143‧‧‧Insulation layer (glass glaze layer)

2‧‧‧Object to be heated

4‧‧‧Portrait forming device

41‧‧‧Laser Scanner

42‧‧‧Mirror

43‧‧‧Charged device

44‧‧‧Photosensitive drum

45‧‧‧Visualizer

46‧‧‧Transfer roller

47‧‧‧Transfer Roller

5‧‧‧Fixing device (fixing means)

51‧‧‧Fixing roller

52‧‧‧Pressure roller

53‧‧‧Heater holder

54‧‧‧Pressure roller

P‧‧‧Recording media

D ₁ ‧‧‧Sweep direction

D ₂ ‧‧‧Width direction

Fig. 1 is a schematic cross-sectional view showing an example (embodiment 1) of the type of the main heater.

Fig. 2 is a schematic cross-sectional view showing another example (embodiment 2) of the type of the main heater.

Figure 3 shows another example (embodiment 3) of the type of the main heater Schematic cross-sectional view.

Fig. 4 is a schematic cross-sectional view showing another example (Embodiment 4) of the type of the main heater.

Fig. 5 is a schematic cross-sectional view showing another example (Embodiment 7) of the type of the main heater.

Fig. 6 is a schematic cross-sectional view showing another example (Embodiment 8) of the type of the main heater.

Fig. 7 is a schematic cross-sectional view showing another example of the type of the main heater.

Fig. 8 is a schematic plan view illustrating the relationship between the heat generating layer and the heat spreading layer in the main heater.

Fig. 9 is an explanatory diagram illustrating a missing portion of an example of a thermal layer in the main heater.

Fig. 10 is a schematic perspective view showing an example of a fixing device using a main heater.

Fig. 11 is a schematic perspective view showing another example of a fixing device using a main heater.

Fig. 12 is a schematic view showing an example of an image forming apparatus using a main heater.

Fig. 13 is a graph showing the heat equalization effect caused by the heaters related to Examples 1 to 4.

Fig. 14 is a graph showing the heat equalization effect caused by the heaters related to Examples 5 to 9.

Figure 15 is a schematic diagram showing a conventional heater (Comparative Example 1) 的sectional view.

Fig. 16 is an explanatory diagram schematically showing the metal porous part and the non-metal part in the heat-soaking layer.

Fig. 17 is an explanatory diagram showing various changes in the planar shape of the heat-soaking layer.

Fig. 18 is a graph showing the heat equalization effect caused by the heaters related to Examples 5 to 14.

Hereinafter, the present invention will be described in detail with reference to the drawings.

[1] Heater

The main heater (1) is a heater that sweeps at least one of the object to be heated and the main heater (1) while facing the object to be heated to heat the object.

In addition, the main heater (1) is provided with a base (11), a heat generating layer (12) arranged on one side (11a) of the base (11), a layer between the base (11) and the heat generating layer (12), and At least one of the sides of the other side (11b) of the base body has a thermal conductivity layer (13) formed by a material having a higher thermal conductivity than the material constituting the base body (refer to Figures 1 to 4).

(1) For the matrix

The above-mentioned "base (11)" is a substrate indicating the heating layer. The base 11 is usually in the shape of a thin plate, and the main surfaces of the front and back are shown in this specification. Set one side (11a) and the other side (11b). That is, one side 11a and the other side 11b are opposite to each other.

The material constituting the base 11 is not particularly limited, and it is not particularly limited as long as the heat generating layer is heated on the surface thereof. For example, metals, ceramics, and these composite materials can be used. In the case of using a conductive material such as metal, the substrate may be formed by providing an insulating layer on the conductive material.

Among the materials constituting the substrate, as metals, steel and the like can be cited. Even in this case, stainless steel can be suitably used in the present invention. The type of stainless steel is not particularly limited, but ferrite-based stainless steel and ferrite-based stainless steel are preferred. Moreover, even among these stainless steels, the ones with excellent heat resistance and oxidation resistance are particularly preferred. For example, SUS430, SUS436, SUS444, SUS316L, etc. can be mentioned. These may use only 1 type, and may use 2 or more types together.

In addition, as the metal constituting the base, aluminum, magnesium, copper, and alloys of these metals can be used. These may use only 1 type, and may use 2 or more types together. Among them, aluminum, magnesium, and these alloys (aluminum alloys, magnesium alloys, Al-Mg alloys, etc.) have a small specific gravity, so these can be used to reduce the weight of the main heater. Furthermore, copper and its alloys have excellent thermal conductivity, so by using these, the heat uniformity of the main heater can be improved.

Among the materials constituting the matrix, ceramics include alumina, aluminum nitride, zirconia, silica, mullite, spinel, cordierite, silicon nitride, and the like. These may use only 1 type, and may use 2 or more types together. Among these, alumina and aluminum nitride are preferred. again Furthermore, as a composite material of metal and ceramic, SiC/C or SiC/Al can be cited. These may use only 1 type, and may use 2 or more types together.

Although the size or shape of the base 11 is not particularly limited, the thickness may be 50 μm or more and 700 μm or less. In this range, especially power saving and rapid rise characteristics can be achieved. The thickness is preferably 100 μm or more and 600 μm or less, preferably 150 μm or more and 500 μm or less, more preferably 180 μm or more and 450 μm or less, and particularly preferably 200 μm or more and 400 μm or less.

Furthermore, the shape of the substrate is preferably a shape with a length in the width direction (D ₂ ) being longer than the length in the sweep direction (D ₁ ). According to this, it is easy to obtain the effect caused by the structure of the present invention. Specifically, for example, when the length in the _{sweep direction (D 1 ) of the substrate is set to L D1} and the length in the width direction (D ₂ ) of the substrate is set to L _D2 , the ratio of length (L _D1 /L _D2 ) Can be set to 0.001 or more and 0.25 or less. The ratio is preferably 0.005 or more and 0.2 or less, and more preferably 0.01 or more and 0.15 or less.

(2) For the heating layer

The above-mentioned "heat-generating layer (12)" is a layer that generates heat by energization, and is arranged on the side of one surface 11a of the base 11. Although the heat generating layer 12 is usually arranged only on the side of one surface 11a of the base 11, it may be arranged on the side of the other surface 11b.

The specific shape and the like of the heat generating layer 12 are not particularly limited. For example, even if it is a heating sheet of the same thickness across the entire surface, even if it is set to A series of resistance heating wires with a specific pattern shape may also be used. In the present invention, compared to the heating layer of the above-mentioned type, a resistance heating wiring having a plurality of resistance heating units electrically connected in parallel is preferable.

More specifically, each resistance heating unit connects a plurality of horizontal wiring portions (122) arranged to be slightly perpendicular to the _{sweep direction (D 1 ), and a vertical wiring portion connecting the horizontal wiring portions (122)} (123) The resistance heating wiring (121) formed into a hairpin bend is preferable (refer to Fig. 8).

In the case of the resistance heating wiring 121 patterned in such a hairpin bend shape, although the horizontal wiring portion 122 may be shorter than the vertical wiring portion 123, the horizontal wiring portion 122 is preferably longer than the vertical wiring portion 123. According to this, it is easy to obtain the effect of the structure of the present invention. That is, in the case of a plurality of resistance heating units electrically connected in parallel, there is a case where the heat generation between the resistance heating units is reduced, which is effective in terms of enabling uniform heating. Similarly, even in the case of the vertical wiring portion 123 arranged along the sweeping direction (D ₁ ), the heat accumulation caused by the vertical wiring portion 123 tends to increase, and it is effective in terms of heat equalization. .

From such a viewpoint, when the vertical wiring portion 123 is provided, the vertical wiring 123 is preferably inclined _{to the sweep direction (D 1 ).} By tilting, the heat accumulation caused by one vertical wiring portion 123 can be diffused, and the heat equalization effect can be obtained. Specifically, when the case where it is arranged to be _{0 degrees with respect to the scanning direction (D 1} ) is set as a non-inclined case, in the case of inclination, it can be set to be-with respect to the sweeping direction (D ₁ ). The range from 80 degrees to 80 degrees is preferably from -60 degrees to 60 degrees, and more preferably from -50 degrees to 50 degrees.

Among the above-mentioned resistance heating units, the decrease in heat is in the resistance heating wiring with a plurality of resistance heating units 124 electrically connected in parallel, and there is no resistance heating wiring between adjacent resistance heating units 124. The non-formed portion 125 (especially, the non-formed portion that crosses the sweep direction) is remarkable. In the resistance heating wiring having such a non-formed portion 125, the heat equalization effect caused by the provision of the heat equalization layer 13 can be more effectively achieved. As the type of the resistance heating unit 124 (resistance heating wiring 121), or the type of the non-formed portion 125, FIGS. 8(a) to (d) are illustrated.

Furthermore, the resistance heating material constituting the heating layer may be a material that can generate heat according to its resistance value by energizing, and its type is not particularly limited. For example, silver, copper, gold, platinum, palladium, rhodium, tungsten, molybdenum, rhenium (Re), ruthenium (Ru), etc. can be used. These may use only 1 type, and may use 2 or more types together. When two or more types are used in combination, it can be an alloy. More specifically, silver-palladium alloy, silver-platinum alloy, platinum-rhodium alloy, silver-ruthenium, silver, copper, gold, etc. can be used.

Furthermore, as described above, in the case of having resistance heating wiring with a plurality of resistance heating units electrically connected in parallel, each resistance heating wiring constituting each resistance heating unit may have any resistance heating characteristics, However, it is better to have its own temperature equalization function (self-temperature supplement function) between the resistance heating units. From a viewpoint, the resistance heating wiring constituting the resistance heating unit is preferably formed of a resistance heating material having a positive resistance heating coefficient. Specifically, the temperature coefficient of resistance in the temperature range above -200℃ and below 1000℃ is 100ppm/℃ The resistance heating material below 4400ppm/℃ is better. In addition, the resistance heating material above 300ppm/℃ and below 3700ppm/℃ is more preferred, and the resistance heating material above 500ppm/℃ and below 3000ppm/℃ is especially preferred. Examples of such resistance heating materials include silver-based alloys such as silver-palladium alloys.

In this way, the resistance heating wire formed by the resistance heating material having a positive temperature coefficient of resistance forms the resistance heating unit, and when each is connected in parallel, the plurality of resistance heating units achieve their own temperature balance with each other. That is, for example, when the second resistance heating unit is sandwiched between the first resistance heating unit and the third resistance heating unit, when the temperature of the second resistance heating unit drops, the resistance value of the second resistance heating unit decline. In this way, the current flowing into the second resistance heating unit increases and the wattage increases, and the second resistance heating unit can operate to supplement the temperature drop autonomously.

In the case where the resistance heating units have substantially the same amount of heat generation, the resistance heating units may be formed to have substantially the same resistance value. In this case, the resistance heating unit can be formed with the same line length, the same line width and the same thickness, and the same pattern of the resistance heating wiring. The thickness of the resistance heating wiring can be 3 μm or more and 40 μm or less from the viewpoint of area specific resistance, for example.

In addition, having substantially the same calorific value means that each resistance heating unit has substantially the same resistance temperature coefficient and resistance value under the same measurement conditions. For example, the difference in the resistance temperature coefficient between the resistance heating units can be set to within ±20%, and the electrical resistance between the resistance heating units The difference in resistance is set to within ±10%.

(3) For the insulating layer

Furthermore, as described above, when a conductive material is used as the base 11, insulation between the base 11 and the heating layer 12 is required. That is, an insulating layer (14) may be provided. As long as the insulating layer 14 can exhibit an insulating property that can insulate the base 11 and the heat generating layer 12 formed from a conductive material, the specific material, shape, and the like are not limited.

As the insulating layer 14, a glass glaze layer or a ceramic layer can be used. Among these, the glass glaze layer is preferred from the viewpoint of workability. The glass constituting the glass glaze layer may be amorphous, crystallized glass, or semi-crystallized glass. Specifically, SiO ₂ -Al ₂ O ₃ -MO-based glass can be mentioned. Here, MO is an oxide of alkaline earth metals (MgO, CaO, BaO, SrO, etc.).

In addition, the insulating layer 14 may include only one layer between the base 11 and the heat generating layer 12, or may include two or more layers. As the case of two or more layers, the case where the insulating layer 14 of different materials is provided is mentioned.

In addition, the thickness of the insulating layer 14 is not particularly limited, and may be, for example, 10 μm or more and 400 μm or less. In particular, when the base 11 is formed of a conductive material (stainless steel or the like), the insulating layer 14 is responsible for the insulation of the base 11 and the heating layer 12. In this case, the thickness of the insulating layer 14 between the base 11 and the heating layer 12 ((In the case where there are two or more insulating layers 14 of different materials, the total thickness of the insulating layers 14)) , Preferably 20μm or more and 300μm or less, and 30μm or more It is more preferably 200 μm or less, and particularly preferably 40 μm or more and 100 μm or less.

In addition, for example, in FIG. 1, the insulating layer 14 arranged between the base 11 and the heat generating layer 12 is the insulating layer 141. Therefore, the above-mentioned thickness can be applied to the thickness of the insulating layer 141.

In addition, when used as a glass glaze layer not for the purpose of insulation, the thickness of the glass glaze layer (the thickness of the entire glass glaze layer integrated by sintering without interposing other layers) can be set to, for example, 1 μm or more Below 500μm. The thickness is preferably 2 μm or more and 400 μm or less, more preferably 3 μm or more and 300 μm or less, and particularly preferably 4 μm or more and 200 μm or less. Specifically, for example, in FIG. 1, the glass glaze layers 142 and 143 arranged on the side of the heater surface 1a compared to the heat generating layer 12 are glass glaze layers not for the purpose of insulation. In addition, in FIG. 1, the glass glaze layers 141, 142, and 143 arranged on the other side 1b of the heater are glass glaze layers that are not used for insulation.

(4) For the soaking layer

The above-mentioned "heating layer (13)" is a layer arranged between the base 11 and the heating layer 12, and at least one of the other surface 11b side of the base, and is formed of a material having a higher thermal conductivity than the material constituting the base 11的层。 The layer.

The heat equalizing layer 13 has a function of making the fluctuations of the heat formed in the heat generating layer 12 uniform. That is, in the case of a drop in the heating temperature, the temperature can be increased to the same temperature as the surroundings, and in the case of a protrusion of the heating temperature, the temperature can be decreased to the same temperature as the surroundings, so that the heat fluctuations can be evened. uniform. In particular, when the heating layer 12 is formed by using resistance heating wiring having a specific pattern shape, it is suitable for making the fluctuations of the heat generated by the pattern shape uniform. That is, by having a pattern shape, a part where the resistance heating wiring is present and a part where there is no resistance generate heat fluctuations such that the temperature of the part where the resistance heating arrangement is located is higher than that of the non-existing part. Such heat fluctuations can be made uniform by passing through the heat-soaking layer 13, so that the temperature difference can be reduced. From such a point of view, the provision of the uniform heating layer 13 as the heating layer 12 has an effect in a heater provided with a plurality of resistance heating units 121 electrically connected in parallel.

Therefore, the heat equalizing layer 13 is arranged at least between the base 11 and the heating layer 12, and at least one of the other surface 11b side of the base 11 (to be the surface side with the object to be heated). That is, it is arranged on the side closer to the heating surface (the surface to be joined to the object to be heated) than the heat generating layer 12. In addition, of course, it can also be combined and arranged on the side of the heating layer 12, which is close to the non-heating surface (the surface not in contact with the object to be heated).

The heat equalizing layer 13 may be formed of a material having a higher thermal conductivity than the material constituting the base 11. Specifically, for example, in the case where a stainless steel with a thermal conductivity of less than 50W/mK and low thermal conductivity is used as the base 11, it is better to use a material with a thermal conductivity of 100W/mK or higher as the material of the soaking layer 13. . Specifically, silver, copper, gold, aluminum, tungsten, nickel, etc., or an alloy containing at least one of these metals can be used as the thermally conductive metal. These thermally conductive metals may use only one type, or may use two or more types in combination. Even among these, silver, copper, aluminum, and alloys containing at least one of these are preferable.

Furthermore, for example, even when ceramics such as aluminum with a thermal conductivity of less than 50 W/mK and low thermal conductivity are used as the substrate 11, a material with a thermal conductivity of 100 W/mK or higher is used as the heat spreading layer 13. The use of materials is better. Specifically, in addition to thermally conductive ceramics such as aluminum nitride, the above-mentioned various thermally conductive metals can be used.

The uniform heat layer 13 may be formed in any way. Specifically, as a plating layer (an electroless plating layer, an electric field plating layer, these composite plating layers, etc.), a soaking layer 13 may be provided. Furthermore, after printing the paste containing the thermally conductive material, the printing coating film is sintered to form the soaking layer 13. For example, as a thermally conductive material, a printing paste containing metal particles (metal powder) can be used. In this case, in addition to metal particles, the printing paste may also contain a carrier for paste, or a glass component or ceramic component of the same texture.

The soaking layer 13 obtained by sintering such a printing paste can obtain, for example, a metal porous portion 135a formed by connecting a plurality of metal particles as shown in FIGS. 16(a) and 16(b), and is arranged in The heat spreading layer 13 of the non-metal part 135b in the gap of the metal porous part 135a. Furthermore, in FIG. 16, FIG. 16(a) shows a porous metal part 135a in which a plurality of metal particles are joined to each other, and FIG. 16(b) shows a porous metal part 135a in which a plurality of metal particles are fused to each other by sintering. 135a. In the heater 1 of the present invention, although the heat-soaking layer 13 may be in the form of FIG. 16(a), it may be in the form of FIG. 16(b), even if it is a composite having both of these The type is also possible, but it is better to have the type shown in FIG. 16(b). That is, the thermal layer 13 has a plurality of metal particles Preferably, the porous metal part 135a is connected by fusion with each other. In this type, higher heat transfer can be achieved.

In addition, the non-metal portion 135b is formed of a glass component or a ceramic component (including ceramics and glass ceramics). That is, in the case where the thermal layer 13 in the heater 1 of the present invention has the non-metallic portion 135b, the non-metallic portion 135b may be composed of only glass, or glass and ceramics.

In the case of the porous metal part 135a and the non-metal part 135b, the total of these is 100% by mass (especially, when the porous metal part 135a is silver and the non-metal part 135b is glass), the non-metal part 135b The ratio is not particularly limited, but it is preferably 0.1% by mass or more. By having such a non-metal portion 135b, the heat spreading layer 13 can be intervened, and the adhesion between the adjacent layer on one side and the adjacent layer on the other side can be improved, and excellent heat uniformity can be obtained. In addition, the non-metal portion 135b is usually preferably 20% by mass or less. The ratio is preferably 0.2% by mass or more and 15% by mass or less, and more preferably 0.5% by mass or more and 12% by mass or less.

As described above, the heat equalizing layer 13 may be disposed at least one of the layer between the base 11 and the heating layer 12 and the other surface 11b side of the base. Therefore, as the heat isolating layer 13, for example, there can be two types of the following (1) direct build-up type heating layer (131), and the following (2) inter-layer build-up type heating layer (132). .

(1) The direct build-up type thermal uniform layer 131 is the thermal uniform layer 13 directly laminated on the base 11. The direct build-up type thermal layer 131 does not allow other layers such as the insulating layer 14 to be interposed between the substrate 11 and the thermal layer 13 and is stacked Floor.

(2) The indirect laminated type thermal layer 132 is laminated with other layers between the base 11 and the thermal layer 13. As another layer, specifically, a glass glaze layer (insulating layer 14) is mentioned.

The direct build-up type heat spreading layer 131 and the indirect build-up type heat spreading layer 132 may have only one of them in one heater, even if they have both of them.

As the case of the direct build-up type thermal layer 131, there may be a type provided only on one side (11a) of the base 11, a type provided only on the other side (11b) of the base 11, and one side (11a) of the base 11 ) And the other side (11b) with both sides. Among these, a type provided only on one side (11a) of the base 11, or a type provided on both sides of one side (11a) and the other side (11b) of the base 11 is preferable.

Although the layer thickness of the direct build-up type thermal layer 131 is not particularly limited, when the thickness of the thermal layer (13, 131) is set to D ₁ and the thickness of the substrate 11 is set to D ₂ , D D ₁ and D ₂ ratio of ₁ / D ₂ preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, more preferably 0.005 or more and 0.57 or less, more preferably 0.008 or more and 0.53 or less, and particularly preferably 0.01 or more and 0.50 or less. More specifically, the thickness of the direct build-up type thermal layer 131 is preferably 1 μm or more and 250 μm or less, more preferably 1 μm or more and 150 μm or less, more preferably 2 μm or more and 120 μm or less, and more preferably 3 μm or more and 60 μm or less. Preferably, it is particularly preferably 3 μm or more and 40 μm or less, and more preferably 3 μm or more and 30 μm or less.

Furthermore, in the above, in the two-sided type, even if each direct product The layer-type heat-dissipating layers 131 may have the same thickness, or different thicknesses. In addition, it may be the same shape (pattern shape, etc.), or may be a different shape.

In addition, as the case of the indirect laminated type thermal layer 132, a type provided only on one side (11a) of the base 11, a type provided only on the other side (11b) of the base 11, and a type provided on the other side (11b) of the base 11 can be mentioned. A type with one side (11a) side and the other side (11b) on both sides. Among these, a type provided only on one surface (11a) of the base 11 is preferable. The indirect build-up type heat spreading layer 132 is provided on the other side (11b) of the substrate 11, resulting in a lower heat spreading effect on the entire heater 1 than the direct build-up type heat spreading layer 131.

Although the layer thickness of the indirect laminated type thermal layer 132 is not particularly limited, when the thickness of the thermal layer (13, 132) is set to D ₁ and the thickness of the substrate 11 is set to D ₂ , D D ₁ and D ₂ ratio of ₁ / D ₂ preferably 0.6 or less. The ratio is more preferably 0.001 or more and 0.6 or less, more preferably 0.005 or more and 0.57 or less, more preferably 0.008 or more and 0.53 or less, and particularly preferably 0.01 or more and 0.50 or less. More specifically, the thickness of the indirect layered heat-soaking layer 132 is preferably 1 μm or more and 250 μm or less, more preferably 1 μm or more and 150 μm or less, more preferably 2 μm or more and 120 μm or less, and more preferably 3 μm or more and 60 μm or less. Preferably, it is particularly preferably 3 μm or more and 40 μm or less, and more preferably 3 μm or more and 30 μm or less.

In addition, the indirect laminated type thermal uniform layer 132 may include any layer in one heater 1. That is, even if it has one layer, it may have two or more layers. Usually, although by having more layers However, an excessive increase in the number of layers of the indirect laminated type of the heat-soaking layer 132 is undesirable from the viewpoint of the thermal shock resistance of the heater 1 or the prevention of warpage. Therefore, it is preferable to have 1 layer or more and 10 layers or less, more preferably 1 layer or more and 5 layers or less, and particularly preferably 1 layer or more and 3 layers or less. In the case of providing two or more layers of indirect build-up-type soaking layers 132, each of the soaking layers 13 may have the same thickness or different thicknesses. In addition, it may be the same shape (pattern shape, etc.), or may be a different shape.

In particular, when the base 11 is a stainless steel base (a base made of stainless steel) with a thickness of 100 μm or more and 600 μm or less, the total thickness of the soaking layer 13 can be effectively suppressed to 60 μm or less (and 30 μm or less). It prevents warpage of the heater as a whole, and can be used with a layer thickness within a range of excellent heat soaking effect.

In addition, from the viewpoint of soaking, the thicker thickness of the soaking layer 13 is easier to achieve the effect. For example, when the soaking layer 13 with a total thickness of more than 30 μm is provided on the other side 11b of the base 11 On the side of one surface 11a of the base 11 (especially, the interlayer between the base 11 and the heating layer 12 is preferable), the heat-soaking layer 13 of the same thickness is arranged in a symmetrical configuration to prevent the entire heater from warping. In addition, when it is difficult to provide the same thickness of the heat spreading layer 13, relative to the total thickness of the heat spreading layer 13 provided on the other surface 11b side of the base 11, the thickness ratio will be 25% or more and 95% or less. The heat equalizing layer 13 is provided on the side of one surface 11a of the base 11 (especially, the interlayer between the base 11 and the heating layer 12 is preferred), so that the warpage of the entire heater can be sufficiently suppressed. The above thickness ratio is based on 30% or more and 92% or less is preferable, 35% or more and 88% or less is more preferable, and 40% or more and 85% or less is particularly preferable (refer to Figure 7).

In addition, if the thickness of the soaking layer 13 is thicker, it is easier to obtain the effect, but even if the thickness is excessively increased, the soaking effect obtained by the increased thickness tends to be smaller. Therefore, for example, with respect to a stainless steel substrate having a thickness of 100 μm or more and 600 μm or less, the total layer thickness of the heat-soaking layer 13 is preferably 250 μm or less as described above.

In the main heater 1, when comparing the direct stacking type thermal layer 131 with the indirect stacking thermal layer 132, there is a tendency that one of the direct stacking type thermal layer 131 exhibits higher thermal uniformity. Therefore, in the heater 1 of the present invention, it is preferable to have the direct-layered type thermal uniform layer 131.

Furthermore, in the case where the main heater 1 is provided with the direct-layered heat-soaking layer 131 and the indirect-layered heat-soaking layer 132, compared to the direct-layered heat-soaking layer 131, the indirect-layered heat The heat-soaking layer 132 is preferably arranged on the side closer to the heating surface.

In particular, in the heater 1 (for example, a stainless steel substrate) using a conductive material as a base material, an insulating base 11 and a heating layer 12 are required, and an insulating layer 14 is provided. The insulating layer 14 may be formed by glass glaze. Moreover, when such an insulating layer 14 is provided, it is provided with the same arrangement and thickness on the front and back of the base 11 to prevent warpage of the heater 1 as a whole, so that even the base 11 and the heat generating layer In addition to the interlayer 12, insulation is not used as the purpose, and the insulating layer 14 is often provided for the purpose of preventing warpage. Such an insulating layer 14 is usually a material with low thermal conductivity Materials, such as glass glaze, have a thermal conductivity of 5W/mK or less. Therefore, in the main heater 1, the indirect build-up type heat spreading layer 132 is provided so that the heat spreading layer 13 is provided between the insulating layers 14 with low thermal conductivity (even if the layer is not intended for insulation). It is preferable from the viewpoint of obtaining a soaking effect.

In addition, although as described above, there is an indirect build-up type of soaking layer 132, covered with a glass glaze layer (insulating layer 14) to cover the surface and back as the type of soaking layer 13, but in this case, you can It is assumed that a missing portion (133X) is provided on the indirect laminated type thermal layer 132 (refer to Figures 8(a) and 9), so that the glass glaze covers the surface of the indirect laminated type thermal layer 132 through the missing portion 133X Layer (insulating layer 14), and the glass glaze layer (insulating layer 14) covering the back surface of the indirect layered thermal soaking layer 132. By fusing the glass glaze layer on the front and back in this way, it is possible to improve the bondability between the layers with the laminated heat-soaking layer 132 between the heaters 1, and at the same time, the heat shock resistance and warpage prevention of the heater 1 can be improved. .

Examples of the missing portion 133X include a cutout (133S) or a through hole (133H) penetrating the front and back (see Fig. 8(a) and Fig. 9). These may have only one side, and may have both sides. Furthermore, in the case where the missing portion 133X is provided, it is preferable that the missing portion 133X is arranged in a place where the thermal fluctuation is small. That is, by providing the missing part 133X, the heat uniformity of this part is lower than that of other parts, so it is better to arrange the part where the temperature difference caused by the heating layer 12 is small.

More specifically, when a plurality of resistance heating units in which the heating layer 12 is electrically connected in parallel is provided, it is preferable to arrange the missing portion 133X between the resistance heating units (see FIG. 8(a)). Furthermore, the resistance heating unit has _{a plurality of horizontal wiring portions arranged to be slightly perpendicular to the sweep direction (D 1} ), and vertical wiring portions connecting the horizontal wiring portions, connecting the horizontal wiring portion 122 and the vertical wiring portion 123 In the case of the resistance heating wiring 121 formed in a hairpin bend shape, it is preferable to arrange the missing portion 133X to avoid the corresponding vertical wiring portion 123. That is, when viewing the heater 1 from the top, it is preferable that the projection image of the vertical wiring portion 123 and the projection image of the missing portion 133X do not overlap (see FIG. 8(a)). Moreover, in other words, it is better that the projection image of the vertical wiring portion 123 overlaps the actual portion of the heat uniform layer 13.

Furthermore, of course, it has nothing to do with the direct build-up type heating layer 131 or the indirect build-up type heating layer 132, which has the above-mentioned missing portion 133X (including the cutout 133S and the through hole 133H). Even any heat spreading layer 13 has an effect. That is, in the case where the soaking layer 13 has the missing portion 133, the layer adjacent to one side of the soaking layer and the layer adjacent to the other side of the soaking layer can be joined via the notch portion 133, so that higher Durable heater 1. Specifically, in the case of the indirect laminated type thermal layer 132, as described above, the layer adjacent to one side of the thermal layer and the layer adjacent to the other side of the thermal layer are all glass glazes. Layer, the glass glaze layers are joined to each other. Furthermore, in the case of the direct layered heat-distribution layer 131, and the substrate 11 is a stainless steel substrate, the layer adjacent to one side of the heat-distributing layer is a stainless steel substrate, and it can be adjacent to the other side of the heat-dissipating layer The layer is set as a glass glaze layer. In this case, a tight joint between the stainless steel substrate and the glass glaze layer can be achieved.

In the main heater 1, regardless of whether the soaking layer 13 is a direct stacking type soaking layer 131 or an indirect stacking type soaking layer 132, it can be patterned (that is, a flat shape with a missing portion 133X). Specifically, the heat isolating layer 13 may be arranged as a discontinuous layer. For example, in a specific interlayer, the patch (a part of the thermal layer 13) is arranged only where the thermal fluctuation is large, and the place with the small thermal fluctuation is the missing portion 133X (refer to FIG. 8(a)). Moreover, between specific layers, the thickness of the soaking layer 13 where the thermal fluctuation is large can be increased, and the thickness of the soaking layer 13 where the thermal fluctuation is small can be made relatively thin.

In addition, the specific shape of the thermal layer 13 that constitutes the top-view shape with the missing portion 133X is not limited. In addition to FIGS. 8(a) and 9, FIGS. 17(b) to (g), etc. (FIG. 17( a) Illustrate the planar shape without the missing portion 133X).

That is, Fig. 17(b) is an assembly of the soaking layer sheets that are converted into a polka dot pattern by each sheet to form the type of the soaking layer 13, which has a continuous missing portion 133X as each of the soaking layer sheets.的 gap. Furthermore, FIG. 17(c) and FIG. 17(d) are patterned so that the area ratio in the narrow width direction (sweeping direction) is uniform in the heat spreading layer 13. Among them, FIG. 17(c) has a rectangular through hole 133H and a rectangular missing portion 133S as the missing portion 133X. In addition, FIG. 17(d) is a form in which the heat spreading layer 13 is formed by an assembly of the rectangular heat spreading layer sheets that are sliced, and has a missing portion 133X that is continuous with the gap between the heat spreading sheets.

In addition, any one of Fig. 17(e)~(g) is an assembly of soaking layer sheets that are each sliced into a stripe shape to form a soaking layer The type 13 has a corresponding stripe-shaped missing part 133X as a gap between the heat-soaking layers. Among them, Fig. 17(e) is the stripe-shaped thermal layer 13 along the longitudinal direction (orthogonal to the sweep direction). In addition, FIG. 17(f) shows a stripe-shaped heat spreading layer 13 with an oblique cross in the width direction (inclination in the sweep direction) in the longitudinal direction. In addition, FIG. 17(g) shows the heat spreading layer 13 in a stripe shape along the width direction (and the longitudinal direction, and along the sweep direction). In addition, in the stripe-shaped thermal layer 13, the stripe width or the width of the missing portion 133X can be set thick and dense as needed.

(5) For other layers

In the heater 1 of the present invention, in addition to the base 11, the heat generating layer 12, the heat equalizing layer 13, and the insulating layer 14, other layers may be provided. Examples of other layers include an overcoat made of glazed glass, an overcoat made of polyimide film (polyimide layer), which melts at a high temperature above a certain level and can be cut off to generate heat. The energized self-energization cut-off layer of layer 12 (applying the technology described in Japanese Patent Application Publication No. 2002-359059), etc. Among them, the above-mentioned outer coating can be used for the purpose of improving the durability (wear resistance) of the sliding surface or improving the cleanliness. These layers may use only one type, and may use two or more types in combination.

(6) For the heating surface of the heater

In this heater 1, even if the heating surface is arranged on one surface 11a side with respect to the base 11, it may be arranged on the other surface 11b side. Yes, even if it is arranged on the sides of these two sides. That is, although any surface may be used to heat the object to be heated, it is preferable that the surface on the other surface 11b side of the base 11 is the opposite surface of the object to be heated. That is, it is preferable that the heat generating layer 12 has the surface on the opposite side sandwiching the base 11 being the surface facing the object to be heated. In this way, by arranging the heating surface, it is easier to obtain the heat equalizing effect caused by having the heat equalizing layer 13.

In addition, the base 11 may have a flat plate shape, and may be a curved shape. That is, in the state where the heating surface of the heater 1 and the object to be heated face each other, and the object to be heated and the heater are relatively scanned to heat the object, the scanning direction (D ₁ ) of the substrate 11 is The cross-sectional shape can be set as a _{circular arc shape that is centered on the axis orthogonal to the sweep direction (D 1} ) and is convex on the side opposite to the object to be heated (that is, a cylinder is cut in a plane parallel to the central axis Or the shape of a cylinder). With such a shape, the heater 1 can be installed on the cylindrical roller, and by rotating the roller, the heated object scanned on the roller can be heated efficiently.

(7) For purpose

The heater 1 is an image forming device or a fixing device incorporated in a printer, a photocopier, a facsimile machine, etc., and can be used as a fixing heater for fixing toner, ink, etc. to a recording medium. Furthermore, it can be used as a heating device that is incorporated in a heating machine to uniformly heat (dry, sinter, etc.) the object to be processed such as a panel. In addition, it can be suitable for heat treatment of metal products, coating films formed on substrates of various shapes, and heat treatment of coating films, etc. Specifically, the coating film (filter Constituent materials) heat treatment, coating drying of painted metal products, automobile-related products, woodworking products, etc., electrostatic flocking followed by drying, heat treatment of plastic processing products, solder reflow of printed circuit boards, printing and drying of thick film integrated circuits Wait.

[2] Fixing device

The fixing device provided with the heater 1 can be configured to be appropriately selected by the heating target, fixing means, or the like. For example, when it is equipped with a fixing means accompanied by pressure bonding, it is used to fix toner on paper and other recording media, or when a plurality of components are laminated, it can be set as a heating part with a heater and a pressure part. Fixing device. Of course, it can also be set as a fixing means not accompanied by crimping. In the present invention, it is preferable that the unfixed image including the toner formed on the surface of the recording medium such as paper and film is fixed to the fixing device 5 of the recording medium.

FIG. 10 shows the important part of the fixing device 5 which is arranged in the image forming device of the electrophotographic method. The fixing device 5 includes a rotatable fixing roller 51 and a rotatable pressure roller 54, and the heater 1 is arranged inside the fixing roller 51. The heater 1 is ideally arranged close to the inner surface of the fixing roller 51.

The heater 1 can be set as the fixing means 5 shown in FIG. 12, and is fixed in the heater holder 53 made of a material capable of conducting the heat emitted by the heater 1, and can heat the heater 1 The structure is passed from the inner side of the fixing roller 51 to the outer surface.

Figure 11 also shows the portrait that is placed in the electronic photo method An important part of the fixing device 5 forming the device. The fixing device 5 is provided with a rotatable fixing roller 51 and a rotatable pressing roller 54, a heater 1 that transmits heat to the fixing roller 51, and a heating device that simultaneously presses the recording medium with the pressing roller 54 The pressing roller 52 is arranged inside the fixing roller 51. The heater 1 is arranged along the cylindrical surface of the fixing roller 51.

In the fixing device 5 shown in FIG. 10 or FIG. 11, the heater 1 generates heat by applying a voltage from a power supply device (not shown), and the heat is transferred to the fixing roller 51. Furthermore, when a recording medium with an unfixed toner image on the surface is fed between the fixing roller 51 and the pressure roller 54, the pressure contact portion of the fixing roller 51 and the pressure roller 54 will cause the toner Melt to form a fixed image. Since it has the pressure contact part of the fixing roller 51 and the pressure roller 54, it rotates. As described above, since the heater 1 suppresses the local temperature rise that is likely to occur when a small recording medium is used, it is difficult to generate temperature unevenness in the fixing roller 51, and the fixing can be performed uniformly.

As another aspect of the fixing device provided with the main heater 1, a mold provided with an upper mold and a lower film may be provided, and a heater may be arranged inside at least one of the upper mold and the lower mold.

The fixing device equipped with the main heater 1 includes image forming devices such as printers and photocopiers in the direction of electrophotographs, and is installed in household electrical products, business and laboratory precision machines, etc., for heating, heat preservation, etc. The heat source is better.

[3] Image forming device

The image forming device equipped with this heater 1 can be set to The composition is appropriately selected for the purpose of heating, etc. In the present invention, as shown in FIG. 12, an imaging means for forming an unfixed image on the surface of a recording medium such as paper, film, etc., and a fixing means 5 for fixing the unfixed image on the recording medium are provided, and The fixing means 5 preferably includes the image forming device 4 having the main heater 1. In addition to the above-mentioned means, the image forming apparatus 4 may be configured with a means for transporting recording media or a control means for controlling each means.

FIG. 12 is a schematic diagram showing the main part of the image forming apparatus 4 of the electrophotographic method. As the imaging means, even if it is a method with a transfer roller and a method without a transfer roller, FIG. 12 shows a state with a transfer roller.

In the imaging means, while rotating, the charging treatment surface of the photosensitive drum 44 that is charged to a specific potential by the charging device 43 is irradiated with the laser output from the laser scanner 41, and the imaging The toner supplied to the device 45 forms an electrostatic latent image. Then, using the potential difference, the toner image is transferred to the surface of the transfer roller 46 linked with the photosensitive roller 44. After that, the surface of the recording medium fed between the transfer roller 46 and the transfer roller 47 is transferred with the toner image, and a recording medium having an unfixed image can be obtained. Carbon powder contains particles of binder resin, colorants and additives. The melting temperature of the binder resin is usually 90°C to 250°C. In addition, the surfaces of the photosensitive drum 44 and the transfer drum 46 may be provided with a cleaning device for removing insoluble carbon powder and the like.

The fixing means 5 can have the same structure as the above-mentioned fixing device 5, with a pressure roller 54 and an internal holding means for paper feeding. The heater holder 53 of the energized heater 1 has a fixing roller 51 interlocked with the pressing roller 54. The recording medium having the unfixed image from the imaging means is fed between the fixing roller 51 and the pressure roller 54. The fixing roller 51 heats the toner image of the recording medium, and the molten toner is pressurized at the pressure contact portion between the fixing roller 51 and the pressing roller 54, and the toner image is fixed to the recording medium. In the fixing means 5 of FIG. 12, even if it is provided with the fixing belt arrange|positioned close to the heater 1, instead of the aspect of the fixing roller 51, it may be sufficient.

Generally speaking, the temperature of the fixing roller 51 becomes uneven, and when the amount of heat supplied to the toner is too small, the toner is peeled from the recording medium, and when the heat is too large, the toner adheres to the fixing When the roller 51 and the fixing roller 51 are attached to the recording medium once again. If the fixing means 5 equipped with the heater of the present invention is used, the temperature can be quickly adjusted to a specific temperature, so that the undesirable factors can be suppressed.

The image forming device of the present invention suppresses the overheating of the non-paper feeding area when in use, and is suitable as a printer or photocopier of the electronic photograph method.

[4] Heating device

The heating device equipped with this heater can be configured to be appropriately selected according to the size or shape of the heating target. In the present invention, for example, a frame portion, a window portion that can be hermetically arranged for in and out of the heat-treated object, and a movable heater portion arranged inside the frame portion may be provided. According to the needs, it can be equipped with a setting part of the heat-treated object inside the frame part, and the heat-treated object can be discharged by the heating of the heat-treated object. In the case of gas, pressure regulators such as an exhaust part that discharges the gas, a vacuum pump that regulates the internal pressure of the frame body, etc. In addition, heating may be performed even in a state in which the object to be heat-treated and the heater portion are fixed, and it may be performed while moving either side.

The main heating device is suitable for drying the heat-treated object containing water and an organic solvent at a desired temperature. Furthermore, it can be used as a vacuum dryer (decompression dryer), pressure dryer, dehumidifying dryer, hot air dryer, explosion-proof dryer, etc. Furthermore, it is suitable as a device for sintering green objects such as LCD panels and organic EL panels at a desired temperature. Moreover, it can be used as a vacuum sintering machine, a pressure sintering machine, and the like.

[Example]

In the following, examples are used to illustrate the present invention.

[1] The production of heater

The heaters of Examples 1 to 4 and Comparative Example 1 were produced according to the following procedures.

(1) The heater of Example 1 (refer to Figure 1)

A stainless steel thin film (SUS430, thermal conductivity of 26 W/mK) with a thickness of 300 μm was used as the base 11.

The surface on the other side 11b of the base 11 is coated with a silver paste and then sintered to form a soaking layer 13 (direct stacking type soaking layer 131) with a thickness of 8 μm.

Then, the insulating glass paste is coated on the side of one surface 11a of the substrate 11 After sintering the surface and the surface of the soaking layer 13, a glass glaze layer (insulating layer 141) with a thickness of 75 μm is formed.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heating layer 12 includes Ag-Pd. The resistance heating wiring with a positive resistance heating coefficient is provided with a plurality of resistance heating units electrically connected in parallel, and each resistance heating unit is connected and arranged so as to be relative to the sweep A plurality of horizontal wiring portions whose directions are substantially perpendicular, and a resistance heating wiring 121 formed in a hairpin bend shape by connecting the vertical wiring portions between the horizontal wiring portions are formed. In addition, the heating layer 12 has, in addition to the resistance heating wiring 121, power supply pads and power supply wiring (not shown) for supplying power to the resistance heating wiring 121. The power supply pads and power supply wiring are formed by screen printing and sintering before and after the formation of the resistance heating wiring 121 with silver paste.

After that, the insulating glass paste is applied on the surface of the insulating layer 141 exposed on the other side 11b of the base 11, and the insulating layer 141 and the heating layer 12 exposed on the side 11a of the base 11 are sintered. , And a glass glaze layer (insulating layer 142) with a thickness of 50 μm is formed.

Next, the insulating glass paste is coated on the insulating layer 142 exposed on one side 11a of the base 11 and the insulating layer 142 exposed on the other side 11b of the base 11, and then sintered to form a glass with a thickness of 20 μm. For the glaze layer (insulating layer 143), the heater 1 of Example 1 (FIG. 1) was obtained.

(2) The heater of Example 2 (refer to Figure 2)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

After coating the silver paste on the surface of the substrate 11 on the side 11a, it is sintered to form a soaking layer 13 (direct-layered soaking layer 131) with a thickness of 8 μm.

Next, the insulating glass paste is applied on the surface of the other side 11b of the base 11 and the surface of the heat-soaking layer 13, and then sintered to form a glass glaze layer (insulating layer 141) with a thickness of 75 μm.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heat generating layer 12 is the same as in the first embodiment.

After that, the insulating glass paste is applied on the surface of the insulating layer 141 exposed on the other side 11b of the base 11, and the insulating layer 141 and the heating layer 12 exposed on the side 11a of the base 11 are sintered. , And a glass glaze layer (insulating layer 142) with a thickness of 50 μm is formed.

Next, as in Example 1, a glass glaze layer (insulating layer 143) with a thickness of 20 μm was formed, and the heater 1 of Example 2 (FIG. 2) was obtained.

(3) The heater of Example 3 (refer to Figure 3)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

On the surface of the base 11 on the side of one side 11a and on the side of the other side 11b The two surfaces of the surface are coated with silver paste and then sintered to form a soaking layer 13 (direct-layered soaking layer 131) with a thickness of 8 μm.

Next, the insulating glass paste is coated on the surface of each heat-soaking layer 13 on one side 11a and the other side 11b of the base 11, and then sintered to form a glass glaze layer (insulating layer 141) with a thickness of 75 μm.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heat generating layer 12 is the same as in the first embodiment.

After that, the insulating glass paste is applied on the surface of the insulating layer 141 exposed on the other side 11b of the base 11, and the insulating layer 141 and the heating layer 12 exposed on the side 11a of the base 11 are sintered. , And a glass glaze layer (insulating layer 142) with a thickness of 50 μm is formed.

Next, as in Example 1, a glass glaze layer (insulating layer 143) with a thickness of 20 μm was formed, and the heater 1 of Example 3 (FIG. 3) was obtained.

(4) The heater of Example 4 (refer to Figure 4)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

The surface on the other side 11b of the base 11 is coated with a silver paste and then sintered to form a soaking layer 13 (direct stacking type soaking layer 131) with a thickness of 8 μm.

Next, the insulating glass paste is applied to the surface of the substrate 11 on the side 11a and the surface of the soaking layer 13, and then sintered to form a thick Glass glaze layer (insulating layer 141) with a degree of 75μm.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heat generating layer 12 is the same as in the first embodiment.

After that, the surface of the insulating layer 141 exposed on the other side 11b of the base 11 is coated with a silver paste and then sintered to form a soaking layer 13 (indirect laminated type soaking layer 132) with a thickness of 8 μm.

After that, the insulating glass paste is coated on the surface of the indirect laminated type heat-soaking layer 132, and the insulating layer 141 and the heating layer 12 exposed on the side 11a of the base 11, and then sintered to form A glass glaze layer (insulating layer 142) with a thickness of 50 μm.

Next, as in Example 1, a glass glaze layer (insulating layer 143) having a thickness of 20 μm was formed, and the heater 1 of Example 4 (FIG. 4) was obtained.

(5) The heater of Comparative Example 1 (refer to Figure 15)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

The insulating glass paste is coated on the surface of one side 11a of the substrate 11 and the surface of the other side 11b, and then sintered to form a glass glaze layer (insulating layer 141) with a thickness of 75 μm.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heating layer 12 is the same as in Example 1.

After that, the insulating glass paste is applied on the two surfaces of the insulating layer 141 and the heating layer 12 exposed on one side 11a of the base 11, and the surface of the insulating layer 141 exposed on the other side 11b of the base 11, and then sintered , And a glass glaze layer (insulating layer 142) with a thickness of 50 μm is formed.

Next, as in Example 1, a glass glaze layer (insulating layer 143) with a thickness of 20 μm was formed to obtain a heater of Comparative Example 1 (FIG. 15).

[2] Confirmation of the effect of the soaking layer

To each of the heaters of Examples 1 to 4 and Comparative Example 1 obtained in [1] above, a voltage of AC 45V was applied, and when the maximum temperature of the surface of each heater 1 reached 260°C, infrared heat was used Imager (manufactured by NEC Avio Infrared Technology Co., Ltd., model "TH9100MR"), to obtain the temperature data of the entire heater 1 together. Then, from the obtained data, pick up _{the temperature data in the center of the width of each heater 1 in the sweep direction (D 1} ), and graph them, and calculate the temperature difference between the highest temperature and the lowest temperature in the graph.

The above measurement is performed 3 times for each heater, and the average value of the obtained temperature difference is calculated, which is graphically shown in Fig. 13. As a result, the temperature difference of the heater of Comparative Example 1 was 18.03°C, Example 1 was 13.10°C, Example 2 was 13.00°C, Example 3 was 12.43°C, and Example 4 was 12.50°C. That is, Example 1 is 27.3%, Example 2 is 27.9%, Example 3 is 31.1%, and Example 4 is 30.7%. It can be seen that each temperature difference can be reduced, and any one of them can achieve an excellent soaking effect.

[3] Correlation between the thickness of the soaking layer and the formation position

(1) The heater of Example 5 (refer to Figure 1)

The heater 1 of Example 5 was obtained in the same manner as in Example 1, except that a heat-soaking layer 13 (direct-layered heat-soaking layer 131) with a thickness of 8 μm was formed on the surface on the other side 11b of the base 11. That is, the heater 1 of Example 5 has a direct build-up type uniform heat layer 131 with a total thickness of 8 μm.

(2) The heater of Example 6 (refer to Figure 3)

Except for the two surfaces of one surface 11a and the other surface 11b of the base 11, a soaking layer 13 with a thickness of 8 μm (direct-layered soaking layer 131) is formed on each of the two surfaces.器1. That is, the heater 1 of Example 6 has a direct build-up type uniform heat layer 131 with a total thickness of 16 μm.

(3) The heater of Example 7 (refer to Figure 5)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

After coating the insulating glass paste on both surfaces of the substrate 11 on one side 11a side and the other side 11b side, sintering is performed to form a glass glaze layer (insulating layer 141) with a thickness of 75 μm.

In addition, the surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form the heating layer 12 After the green layer is sintered, the heat generating layer 12 is formed. The heat generating layer 12 is the same as in the first embodiment.

In addition, on the surface of the insulating layer 141 formed on the other side 11b of the substrate 11, the silver paste is applied by screen printing, and then sintered to form a thermal layer 13 with a thickness of 8 μm (indirect laminated type uniform Thermal layer 132).

After that, the insulating glass paste is applied on the two surfaces of the insulating layer 141 and the heating layer 12 exposed on one side 11a of the base 11, and the surface of the heat isolating layer 13 exposed on the other side 11b of the base 11. Sintering to form a glass glaze layer (insulating layer 142) with a thickness of 50 μm.

Next, as in Example 1, a glass glaze layer (insulating layer 143) with a thickness of 20 μm was formed to obtain a heater of Example 7 (FIG. 5). That is, the heater 1 of Example 7 has an interlayer heat-soaking layer 132 with a total thickness of 8 μm.

(4) The heater of Example 8 (refer to Figure 6)

As in Example 1, a stainless steel thin film with a thickness of 300 μm was used as the base 11.

After coating the insulating glass paste on both surfaces of the substrate 11 on one side 11a side and the other side 11b side, sintering is performed to form a glass glaze layer (insulating layer 141) with a thickness of 75 μm.

The surface of the insulating layer 141 formed on the side 11a of the base 11 is patterned by screen printing to form an unsintered layer that becomes the heating layer 12, and then sintered to form the heating layer 12. The heating layer 12 is the same as in Example 1.

In addition, on the surface of the insulating layer 141 formed on the other side 11b of the substrate 11, the silver paste is applied by screen printing, and then sintered to form a thermal layer 13 with a thickness of 8 μm (indirect laminated type uniform Thermal layer 132).

After that, the insulating glass paste is applied on the two surfaces of the insulating layer 141 and the heating layer 12 exposed on one side 11a of the base 11, and the surface of the heat isolating layer 13 exposed on the other side 11b of the base 11. Sintering to form a glass glaze layer (insulating layer 142) with a thickness of 50 μm.

Next, as in Example 1, a glass glaze layer (insulating layer 143) with a thickness of 20 μm was formed.

In addition, on the surface of the glass glaze layer (insulating layer 143) formed on the other side 11b of the base body 11, the silver paste is applied by screen printing, and then sintered to form a soaking layer 13 (with a thickness of 8 μm). The indirect laminated type thermal layer 132), and the heater of Example 8 (FIG. 6) was obtained. That is, the heater 1 of Example 8 has an interlayer heat-dissipating layer 132 with a total thickness of 16 μm.

(5) The heater of Example 9 (refer to Figure 5)

The heater of Example 9 was obtained in the same manner as in Example 7 except that the silver paste was applied three times and then sintered to form a soaking layer 13 (indirect laminated type soaking layer 132) with a thickness of 24 μm. That is, the heater 1 of the ninth embodiment has an interlayer heat-soaking layer 132 with a total thickness of 24 μm.

(6) The heater of Example 10 (refer to Figure 1)

The heater 1 of Example 10 was obtained in the same manner as in Example 1 except that a heat-soaking layer 13 (direct-layered heat-soaking layer 131) with a thickness of 24 μm was formed on the surface on the other side 11b of the base 11. That is, the heater 1 of Example 10 has a direct build-up type uniform heat layer 131 with a total thickness of 24 μm.

(7) The heater of Example 11 (refer to Figure 3)

Except for the two surfaces of one surface 11a and the other surface 11b of the substrate 11, a heat-soaking layer 13 (direct-layered heat-soaking layer 131) with a thickness of 36 μm is formed on each of the two surfaces of the substrate 11.器1. That is, the heater 1 of Example 11 has a direct build-up type uniform heat layer 131 with a total thickness of 72 μm.

(8) The heater of Embodiment 12 (refer to Figure 3)

Except that on both surfaces of one surface 11a and the other surface 11b of the base 11, a heat-soaking layer 13 (direct-layered heat-soaking layer 131) with a thickness of 54 μm is formed on each of the two surfaces of the substrate 11, the rest is the same as the embodiment 3, and the heating of the embodiment 11 is obtained.器1. That is, the heater 1 of Example 11 has a direct build-up type uniform heat layer 131 with a total thickness of 108 μm.

(9) The heater of embodiment 13 (refer to Figure 5)

In addition to the formation of a 54μm thick soaking layer 13 (indirect laminated type soaking Except for layer 132), the rest is the same as in Example 7, and the heater of Example 13 is obtained. That is, the heater 1 of Example 13 has an interlayer heat-soaking layer 132 with a total thickness of 54 μm.

(10) The heater of embodiment 14 (refer to Figure 6)

On the other side of the insulating layer 141, a soaking layer 13 (indirect laminated type soaking layer 132) with a thickness of 54 μm is formed, and on the other side of the glass glaze layer (insulating layer 143), a soaking layer 13 with a thickness of 18 μm is formed Except for the thermal layer 13 (indirect laminated type heat-soaking layer 132), the rest is the same as that of the embodiment 8, and the heater of the embodiment 14 is obtained. That is, the heater 1 of Example 14 has an interlayer heat-soaking layer 132 with a total thickness of 72 μm.

(11) Measurement 1

Using the heaters of Examples 5 to 9 obtained in [3] (1) to (5) above, the correlation between the thickness of the soaking layer and the formation position is discussed. Perform the same measurement as in [2] above to find the temperature difference between the highest temperature and the lowest temperature. In addition, the results are graphically shown in FIG. 14.

In FIG. 14, the straight line connecting Example 5 to Example 6 indicates the correlation between the soaking effect and the thickness of the soaking layer in the case of using the direct-laminated type of soaking layer 131. In addition, the straight line connecting Example 7 to Example 9 indicates the correlation between the soaking effect and the thickness of the soaking layer when the indirect laminated type soaking layer 132 is used.

From the results of FIG. 14, it can be seen that the thickness of the direct-layered type heat spreading layer 131 and the indirect layered type heat spreading layer 132 have the same thickness. In the case of the thickness of φ, the effect of reducing the temperature difference is relatively high is the direct build-up type thermal layer 131.

(12) Measurement 2

Using the heater of Comparative Example 1 obtained in [1](5) above, for the heaters of Examples 5-14 obtained in [3](1)~(10) above, regarding the thickness and formation of the soaking layer Discuss about the location. Perform the same measurement as in [2] above to find the temperature difference between the highest temperature and the lowest temperature (3 measurements for each heater, and the average value of the temperature differences in the data obtained). In addition, the results are graphically shown in FIG. 18.

From the results of FIG. 18, it can be seen that the direct build-up type thermal layer 131, or the indirect build-up type thermal layer 132, by providing a very thin thermal layer 13 with a thickness of 8 μm for Comparative Example 1, it has a dramatic effect Soaking effect (reducing effect of temperature difference). That is, the temperature difference in Comparative Example 1 was 18.3°C. In this regard, it was 11.2°C in Example 5 (direct build-up type soaking layer 8μm), and Example 7 (indirect build-up type soaking layer 8μm) 13.0°C. It can be said that 38.8% of the soaking effect can be obtained in Example 5, and 29.0% of the soaking effect can be obtained in Example 7. Moreover, this remarkable soaking effect can be obtained to a total thickness of about 30 μm, as can be seen from FIG. 18.

However, from FIG. 18, it can be seen that regardless of the direct build-up type heat spreading layer 131 or the indirect build-up type heat spreading layer 132, as the thickness of the heat spreading layer increases, the obtained heat spreading effect gradually decreases. That is, with respect to each of the soaking effects of Example 7, Example 8, and Example 9 of Comparative Example 1, compared to Example 5, Example 6 and Example 10 of Comparative Example 1. Each of the heat equalization effects is extremely excellent. Compared with the heat equalization effects, the soaking effect of the embodiment 12 relative to the embodiment 11, or the soaking effect of the embodiment 14 relative to the embodiment 13 is reduced. In addition, the same temperature difference in the example in which both the direct build-up type soaking layer 131 and the indirect build-up type soaking layer 132 are used to form the soaking layer 13 with a total thickness of 200 μm is 6.7°C.

From these conditions, it can be said that regardless of the direct build-up type heat spreading layer 131 or the indirect build-up type heat spreading layer 132, when a more effective heat spreading effect is obtained, the total thickness of the heat spreading layer is set to 150μm The following (usually 1 μm or more) is preferable, and it is more preferably 60 μm or less. It is more preferably 40 μm or less, and particularly preferably 30 μm or less.

[4] The relationship between the planar shape of the soaking layer and the soaking effect

Any of the planar shapes of the heat-soaking layer 13 provided in the heater 1 of the above-mentioned Example 1 to Example 14 is the rectangular shape (adhesion coating type) shown in FIG. 17(a). In this regard, either the planar shape of the thermal layer in FIG. 9 or the planar shape of the thermal layer in FIGS. 17(b) to (g) is the shape of the missing portion 133X (including 133H and 133S). In this way, the correlation between the planar shape of the soaking layer and the soaking effect is evaluated as follows.

(1) The heater of Example 15 (refer to Figure 5)

In the same manner as in Example 7, a heater of Example 15 having a heat uniform layer 132 with a thickness of 16 μm was obtained. That is, Example 15 has a thickness of 16 μm and a flat shape of a rectangular shape (adhesive coating type) with an interlayer heat spreading layer 132.

(2) The heater of Example 16 (refer to Figure 5)

Except that the planar shape of the soaking layer 13 (indirect laminated type soaking layer 132) is set to the stripe shape shown in FIG. 17(e), the other is the same as in Example 7, and the implementation of obtaining the soaking layer 132 with a thickness of 16 μm Example 15 heater. In addition, when the area ratio in the planar shape is set to 100% for the heating layer 132 of the heater of Example 15, the heating layer 132 of the heater of Example 16 is 60.0%.

(3) Measurement 3

Using the heater of Example 15 (refer to FIG. 5) obtained in [4](1) above and the heater of Example 16 (refer to FIG. 5) obtained in [4](2) above, and In the same measurement as in [2] above, find the temperature difference between the highest temperature and the lowest temperature (each heater is measured 3 times, and the average value of the temperature differences in the data obtained).

As a result, the temperature difference of Example 15 was 10.7°C. In addition, the temperature difference in Example 16 was 11.5°C. That is, it can be seen that the heat equalizing layer 132 of the heater of Example 16 exerts the same level of equalizing effect regardless of the area ratio of 60% relative to that of Example 15. Specifically, the heating layer 132 of the heater of Example 15 has an average heating effect of 0.11°C per area rate of 1%, while the heating layer 132 of the heater of Example 16 has an average rate of 1% per area. The thermal effect is 0.19°C, and it can be seen that it is possible to efficiently homogenize the heat with less material. From this result, it can be seen that by forming the missing portion 133X, the planar shape is optimized, and a higher heat equalization effect can be obtained.

In addition, since any of the heating layers 13 of the heaters of the above-mentioned embodiments and comparative examples are formed by sintering and coating the silver paste, it becomes a porous metal part 135a formed by connecting a plurality of metal particles. , And the configuration of the non-metal part 135b arranged in the gap between the metal porous part (refer to Figure 16 (a) and (b)). Among them, the metal porous portion 135a is in a form in which silver particles are connected, specifically, it is in the form of FIG. 16(b). In addition, the non-metal portion 135b is formed of glass.

In addition, in the present invention, it is not limited to what is shown in the above-mentioned specific embodiment, and can be set as an embodiment in which various changes are made within the scope of the present invention according to the purpose and application.

Furthermore, the present invention includes the following inventions.

(1) A heater whose main body is stainless steel.

(2) A heater whose main point is that the surface on the other side of the base is the surface facing the object to be heated.

(3) The material constituting the thermal layer is a heater selected from silver, copper, aluminum, and alloys containing at least one of these.

(4) to the average thickness of the thermal layer to D _1, the thickness of the substrate is set in the case of the D _2, D ₁ and D ₂ ratio D ₁ / D ₂ is 0.6 or less as the gist of the heater.

(5) The heating layer is provided with a plurality of resistance heating units electrically connected in parallel, each resistance heating unit has a resistance heating wiring, which connects a plurality of horizontal wiring portions arranged to be slightly perpendicular to the sweep direction, and A heater in which the vertical wiring portion between the horizontal wiring portions is connected to form a hairpin bend shape.

(6) A heater whose main point is that the horizontal wiring is longer than the vertical wiring.

(7) A heater with vertical wiring inclined to the sweep direction.

(8) A heater in which each resistance heating wire constituting each resistance heating unit has a positive resistance heating coefficient.

1‧‧‧Heater

1a‧‧‧One side of heater

1b‧‧‧The other side of the heater (heating surface)

11‧‧‧Matrix

11a‧‧‧One side of the substrate

11b‧‧‧The other side of the substrate

12‧‧‧Heating layer

13‧‧‧Heat layer

131‧‧‧Direct stack type thermal layer

14,141,142,143‧‧‧Insulation layer (glass glaze layer)

Claims (18)

A heater that scans one of the heated object and the main heater while facing the heated object to heat the heated object. The heater is characterized by having: a substrate; a heating layer, It is provided on one side of the base body; and a heat-soaking layer is arranged between the base body and the heating layer, and at least one of the other side of the base body, and the heat conductivity is greater than that of the base body. The material is formed, and as the above-mentioned soaking layer, there is a layered soaking layer with a glass glaze layer interposed between the substrate and the layer to be laminated. The heater of claim 1, wherein as the above-mentioned soaking layer, there is a direct-laminated type of soaking layer directly laminated on the above-mentioned substrate. The heater according to claim 1 or 2, wherein the heat spreading layer has a missing portion including a cutout or a through hole penetrating through the front and back, and a layer adjacent to one surface side of the heat spreading layer via the missing portion, It is joined to the layer adjacent to the other surface side of the above-mentioned heat-dissipating layer. The heater according to claim 1 or 2, wherein the heat spreading layer has a metal porous part formed by connecting a plurality of metal particles, and a non-metal part arranged in a gap between the metal porous part. Such as the heater of claim 1 or 2, wherein the heating layer has a plurality of resistance heating elements electrically connected in parallel Element, each of the resistance heating units has resistance heating wiring, which is connected to a plurality of horizontal wiring portions arranged to be substantially perpendicular to the scanning direction, and a vertical wiring portion connecting the horizontal wiring portions to form a hairpin The curved shape has a non-formed portion where the resistance heating wiring is not formed between the adjacent resistance heating units. A heater that scans one of the heated object and the main heater while facing the heated object to heat the heated object. The heater is characterized by having: a substrate; a heating layer, It is provided on one side of the base body; and a heat-soaking layer is arranged between the base body and the heating layer, and at least one of the other side of the base body, and the heat conductivity is greater than that of the base body. The soaking layer has a cutout or a through-hole penetrating through the front and back, a layer adjacent to one side of the soaking layer via the missing portion, and a layer adjacent to one side of the soaking layer. The layers adjacent to the other side of the thermal layer are joined. The heater of claim 6, wherein as the above-mentioned soaking layer, there is a direct-layered type soaking layer directly laminated on the above-mentioned base. The heater of claim 6 or 7, wherein as the above-mentioned soaking layer, a layered soaking layer is provided with a glass glaze layer interposed between the substrate and the laminated layer. The heater according to claim 6 or 7, wherein the heat-soaking layer has a metal porous part formed by connecting a plurality of metal particles, and a non-metal part arranged in a gap between the metal porous part. The heater of claim 6 or 7, wherein the heating layer is provided with a plurality of resistance heating units electrically connected in parallel, and each of the resistance heating units has a resistance heating wiring, which is connected to be arranged relative to the scanning direction. A plurality of horizontal wiring parts that are slightly vertical and the vertical wiring parts connecting the horizontal wiring parts are formed in a hairpin bend shape, and there is a non-formation that does not form the resistance heating wiring between the adjacent resistance heating units. unit. A heater that scans one of the heated object and the main heater while facing the heated object to heat the heated object. The heater is characterized by having: a substrate; a heating layer, It is provided on one side of the base body; and a heat-soaking layer is arranged between the base body and the heating layer, and at least one of the other side of the base body, and the heat conductivity is greater than that of the base body. The heat spreading layer has a metal porous part formed by connecting a plurality of metal particles, and a non-metal part arranged in the gap between the metal porous part. The heater of claim 11, wherein as the above-mentioned heat-dissipating layer, there is a direct-layer type heat-dissipating layer directly laminated on the above-mentioned substrate. The heater of claim 11 or 12, wherein as the above-mentioned soaking layer, a layered soaking layer is provided with a glass glaze layer interposed between the substrate and the laminated layer. The heater of claim 11 or 12, wherein the thermal layer has a missing portion including a cutout or a through hole penetrating through the front and back, and a layer adjacent to one surface side of the thermal layer via the missing portion, It is joined to the layer adjacent to the other surface side of the above-mentioned heat-dissipating layer. Such as the heater of claim 11 or 12, wherein the heating layer is provided with a plurality of resistance heating units electrically connected in parallel, and each of the resistance heating units has a resistance heating wiring, which is connected and arranged so as to be relative to the scanning direction. A plurality of horizontal wiring parts that are slightly vertical and the vertical wiring parts connecting the horizontal wiring parts are formed in a hairpin bend shape, and there is a non-formation that does not form the resistance heating wiring between the adjacent resistance heating units. unit. A fixing device characterized by having a heater according to any one of claims 1 to 15. An image forming device characterized by having a heater as claimed in any one of Claims 1 to 15. A heating device characterized by having a heater according to any one of claims 1 to 15.

Images