KR20140089419A - Heater, and fixing device and drying device provided with same - Google Patents

Heater, and fixing device and drying device provided with same Download PDF

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Publication number
KR20140089419A
KR20140089419A KR1020147015146A KR20147015146A KR20140089419A KR 20140089419 A KR20140089419 A KR 20140089419A KR 1020147015146 A KR1020147015146 A KR 1020147015146A KR 20147015146 A KR20147015146 A KR 20147015146A KR 20140089419 A KR20140089419 A KR 20140089419A
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South Korea
Prior art keywords
wiring portion
heater
heat generating
resistance
resistance heating
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Application number
KR1020147015146A
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Korean (ko)
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KR102037827B1 (en
Inventor
후미까쯔 스즈끼
유지 우메무라
도모요시 아오야마
요시미 이와따
도모하루 이마이
Original Assignee
가부시키가이샤 미스즈 코우쿄우
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Publication of KR20140089419A publication Critical patent/KR20140089419A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016Heaters using particular connecting means

Abstract

A heater according to the present invention comprises a base portion 11 having a long shape and a plurality of parallel wirings formed in an electrically insulated state with respect to the base portion on the surface or inside of the base portion 11, The wiring portion 15 and at least two power supply terminal portions are connected to one terminal portion 17 and the other terminal portion 17 through the resistance heating wiring portion 15 in order to supply electric power to the resistance heat generating wiring portion 15. [ , And the resistance heating wiring portion (15) includes a material having a resistance value temperature coefficient of 500 to 4,400 ppm / DEG C, and the parallel wiring includes a sloped rectangle Pattern.

Description

TECHNICAL FIELD [0001] The present invention relates to a heater, a fixing device having the same,

The present invention relates to an elongated heater having a resistance heating wiring portion that generates heat by energization, and a fixing device and a drying device having the same.

As a heating means for heat treatment, a stainless steel heater, a ceramic heater, or the like having a resistance heating wiring portion is known. The apparatus having such a heater is used in a wide range of applications, and a stable heat treatment is performed at a desired temperature. For example, in order to form an image on the surface of a recording medium such as paper or film by using an image forming apparatus such as an electrophotographic printing machine or a copying machine, a long ceramic heater is arranged in the image forming apparatus , Toner, ink, and the like. A specific image forming method is a method in which a recording medium having a toner image unfixed on its surface is fed between a fixing roll equipped with a heater and a pressing roll and passed through a pressure contact portion therebetween to fix the recording medium. At this time, it is general to perform the recording medium while moving the recording medium in the width direction of the elongated heater (the direction perpendicular to the longitudinal direction of the heater). Thus, there has been studied a heater capable of suppressing temperature unevenness and performing stable heat treatment independently of the size of the recording medium. As a reason for this examination, considering the case where a conventional fixing heater notifies a paper of a maximum length (width) or a paper of a smaller size that can be notified (communicated) with respect to the entire length, And that the power supply is switched and operated according to the notification size. In this case, when a paper having a length (width) equal to the total length of the fixing heater is notified, there is a problem that the temperature of the entire heating element is lowered. Further, when a paper of a small size having a length (width) shorter than the entire length of the fixing heater is notified, the temperature of the area which is not notified locally rises, making it difficult to control the temperature in the notification area, There is a problem that the fixing efficiency in the paper under notification also decreases. In addition, there was a problem such as causing damage to other peripheral parts.

In order to suppress the above problem, the following techniques are known.

Patent Document 1 discloses a semiconductor device having a heat generating element that generates heat by energization on the surface of an insulating substrate, a plurality of heat generating elements having different widths along the longitudinal direction are juxtaposed on the insulating substrate, And a heating element with a narrow width is arranged on the upstream side in the width direction.

Patent Document 2 discloses a heat sink having an insulating substrate of a long flat plate shape having high thermal conductivity characteristics such as aluminum nitride, a heat generating resistor formed on one surface of the insulating substrate, a power supply electrode portion formed for supplying electric power to the heat generating resistor, A heat radiation pattern formed of a material having a thermal conductivity higher than that of the insulating substrate is formed on the back surface of the insulating substrate at a portion that radiates heat higher than other portions of the heat generating resistor when electric power is supplied from the power supply electrode portion, A fixing heater is provided.

Patent Document 3 discloses a heat generating resistor comprising a substrate having a long flat plate formed of a heat-resistant / insulating material, a heat generating resistor formed on one surface of the substrate, a power supply electrode portion formed to supply power to the heat generating resistor, Wherein the heat generating resistor has a first resistive element having a first resistivity value formed at the center in the longitudinal direction and a second resistivity value smaller than the first resistivity connected to both ends of the first resistive resistor, And a second heat generating resistor connected in series with the second heat generating resistor.

[0003] In an image forming apparatus such as an electrophotographic copying machine and a printer, an image heating and fixing apparatus for thermally fixing an unfixed toner image formed and supported on a recording material such as a transferring material or a photosensitive paper as a permanent fixing image, A film heating type apparatus is known.

This has a heater and a film in which one side is slidably moved with the heater and the other side is moved in contact with the recording material to move together and the unfixed toner image is thermally fixed to the recording material by the heat from the heater through the film I will.

In such a film heating type apparatus, since the heater and the film as a member for conducting the heat of the heater to the recording material can be made to have a low heat capacity, power saving and shortening of the weight time (quick start property) Is possible. That is, the time for raising the temperature of the apparatus from the cold state to the predetermined temperature is shortened, and it is not necessary to conduct the energization heating of the heater in the air. Further, even if the image forming apparatus is notified immediately after the power is turned on, the heater can be sufficiently heated to a predetermined temperature until the recording material reaches the fixing portion, thereby suppressing the power consumption to a low level, It is possible.

It is known that a ceramic heater is suitable as a heating member having a low heat capacity and a high heating rate. This heater includes, for example, a ceramic substrate (for example, an alumina substrate) having electrical insulation, heat resistance, or good thermal conductivity, a resistance heating element For example, silver-palladium) (hereinafter referred to as an AC line), and supplies power to the resistance heating element to generate heat. The heater is provided with a secondary system circuit (hereinafter referred to as a DC line) including a thermoelectric element (for example, a thermistor), and the heater is controlled by a temperature regulation control system to which the DC line is connected. The supply power to the resistance heating element is controlled so that the temperature is adjusted to the set temperature.

As a safety countermeasure for an apparatus having such a heater, a safety element such as a thermal fuse is interposed in series with the AC line, and the safety element is placed in contact with or close to the heater. And the power supply to the resistance heating element is urgently cut off.

In addition, as a heater for which safety measures are taken, a heater substrate made of SUS430 or the like, an insulating glass layer having a glass transition point T1 formed on the conductor substrate, a resistor pattern having a glass transition point T2 formed on the insulating glass layer, And a glass transition point T3 formed on the resist pattern and the conductor pattern, wherein the relationship between the glass transition points of the respective layers formed on the conductor substrate satisfies T1> T3 > = T2 to T1 > T2 > = T3 is known, which is suitable for a transfer-type electrophotographic process (refer to Patent Document 4).

[0003] As a drier having a heat generating resistor, for example, there is known a drier having the self-regulating electric resistance heating element disclosed in Patent Document 5. [ The self-regulating electrical resistance heating element comprises a non-conductive substrate, a first metal oxide having a resistance of positive or negative temperature coefficient less than a predetermined operating temperature attached on the substrate, a second metal oxide attached on the substrate adjacent the first metal oxide, A second metal oxide, first and second electrical contacts having a resistance of a temperature coefficient opposite to that of the first metal oxide, the first and second electrical contacts being positioned so that current can flow between the contacts through the first and second metal oxides, And a second electrical contact, wherein the first and second metal oxides are in combination, a substantially constant compositional resistance from ambient temperature to a predetermined operating temperature, and a heating element that provides a very significant increase in resistance above the operating temperature.

Japanese Patent Laid-Open No. 2001-194936 Japanese Patent Laid-Open No. 2007-121955 Japanese Patent Application Laid-Open No. 2007-232819 Japanese Patent Laid-Open No. 2002-25752 Japanese Patent Publication No. 2011-523174

As described above, the phenomenon that the temperature of the heater rises in an area where the recording medium is not notified is not completely eliminated in reality, but a member or apparatus that further suppresses this problem is required.

An object of the present invention is to provide a heater capable of suppressing a local temperature rise of a resistance heating wiring portion at the time of use and performing a stable heat treatment without depending on the size thereof and suppressing temperature unevenness, And a drying device.

Further, in the image forming apparatus such as a fixing device, an electrophotographic copying machine, a printer, etc., including resistance heating wiring, when the thermal runaway occurs, the resistance heating wiring portion reaches a high temperature such as, for example, 800 DEG C .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heater in which power supply to the resistance heat generating wiring portion is stopped when the resistance heat generating wiring portion that is generating heat becomes a predetermined temperature or more by thermal runaway or the like, and a fixing device and a drying device having the heater.

The present invention is described below.

1. A resistance heating portion formed in a state of being electrically insulated with respect to the base portion on the side of or on the surface of the base portion, the resistance heating portion having a plurality of parallel wirings generated by energization, A power supply terminal portion formed in a state of being electrically insulated with respect to the base portion on the surface or inside of the base portion, wherein the number of the power supply terminal portions is at least two, And a power supply terminal portion for electrically connecting one terminal portion and the other terminal portion through the resistance heating wiring portion in order to supply electric power, wherein the resistance heating wiring portion has a resistance value temperature coefficient of 500 to 4,400 ppm / [Deg.] C, and the parallel wiring includes a sloped rectangular pattern.

2. A conductor wiring portion formed in a state of being electrically insulated with respect to the base portion on the surface or inside of the base portion, wherein the number of the power supply terminal portions is two, and the number of the conductor wiring portions is two , And a conductor wiring portion for electrically connecting the one end side and the other end side of the resistance heating wiring portion and the two power supply terminal portions separately and a conductor wiring portion for electrically connecting at least one of the resistance heating wiring portion and at least one of the conductor wiring portions When the resistance heat generating wiring portion becomes a predetermined temperature or more on the surface or the lower layer side surface of the resistance heating wiring portion or the insulating portion for forming the contact portion formed with a length equal to or more than the line width of the conductor wiring portion (M1) constituting the resistance heat generating wiring portion and the material (m2) constituting the conductor wiring portion, And comprising a heater according to the item 1, which comprising a disconnection unit for forming isolated to form the electrically isolated by the reaction, and the resistance heating wire unit or parts of the conductor wiring disconnection.

3. The printed wiring board according to claim 1, wherein the base portion comprises a base layer including stainless steel, aluminum or an aluminum alloy, and an electrical insulating layer formed on a surface of the base layer, wherein the resistance heat generating wiring portion is formed on the surface of the electrical insulating layer Lt; / RTI >

4. The heater according to claim 1, wherein the heater is a multilayer heater including the resistive heating wiring portion and the conductor wiring portion in this order on the surface of the electrically insulating layer of the base portion, wherein a part of the resistance heating wiring portion, The heater according to the above 3, wherein at least a part and a part of the conductor wiring part have a sequentially surface-contacted part.

5. The heater according to the above 2, wherein the base portion includes insulating ceramics, and the resistance heat generating wiring portion is formed on the surface of the base portion.

6. The heater according to claim 1, wherein the heater is a laminated heater having the resistance heating wiring portion and the conductor wiring portion in this order on the surface of the base portion, wherein at least a part of the resistance heating wiring portion, The heater according to the above-mentioned 5, wherein a part of the wiring part has a sequentially-contacted part.

7. The base material according to claim 1, wherein the base portion comprises a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrically insulating layer formed on a surface of the base layer,

The heater according to the above 2, wherein the conductor wiring portion is formed on the surface of the electrically insulating layer.

8. The heater according to claim 1, wherein the heater is a multilayer heater including the conductor wiring portion and the resistance heat generating wiring portion in this order on the surface of the electrically insulating layer of the base portion, wherein at least a part of the conductor wiring portion, The heater according to the above-mentioned 7, wherein a part of the resistance heat generating wiring part and a part of the resistance heat generating wiring part have a sequentially surface contacted part.

9. The ceramic capacitor according to claim 1, wherein said base portion comprises an insulating ceramic,

The heater according to 2 above, wherein the conductor wiring portion is formed on the surface of the base portion.

10. The heater according to claim 1, wherein the heater is a multilayer heater including the conductor wiring portion and the resistance heat generating wiring portion in this order on the surface of the base portion, wherein at least a part of the conductor wiring portion, 10. The heater according to the above-mentioned 9, wherein a part of the wiring part has a sequentially-contacted part.

11. The heater according to any one of the above 2 to 10, wherein the resistance heat generating wiring portion comprises silver alloy.

12. The heater according to any one of the above 2 to 11, wherein the conductor wiring portion is silver.

13. The heater according to any one of 2 to 12 above, wherein the insulating portion for forming the single-wire portion comprises at least one kind selected from bismuth-based glass and lead-based glass.

14. The printed wiring board according to claim 1, wherein the base portion comprises a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrically insulating layer formed on a surface of the base layer, wherein the resistance heating wiring portion and the power- The heater according to the above 1, which is formed on the surface.

15. The heater according to 14 above, wherein the resistance heat generating wiring portion comprises silver alloy.

16. The heater according to 1 above, wherein the base portion includes an insulating ceramics, and the resistance heat generating wiring portion and the power supply terminal portion are formed on a surface of the base portion.

17. The heater according to the above 1, wherein the base portion includes insulating ceramics, and the resistance heat generating wiring portion is formed inside the base portion.

18. The heater according to the above 16 or 17, wherein the resistance heating wiring portion comprises tungsten or molybdenum.

19. A resistance heating unit formed in a state of being electrically insulated with respect to the base, on a surface of or in the surface of the base, comprising: a resistive heating wiring portion that generates heat by energization; Wherein the base portion is formed in an electrically insulated state with respect to the base portion on the surface side or inside of the base portion; Wherein the number of the conductor wiring portions is two and the conductor wiring portion electrically connecting the one end side and the other end side of the resistance heating wiring portion to the two power supply terminal portions separately, On the upper layer side surface or the lower layer side surface of at least one of a part of the heat generating wiring portion and a portion of the conductor wiring portion, a line width of the resistance heat generating wiring portion, (M1) constituting the resistance heat generating wiring portion and the conductor wiring portion are formed so as to have a length equal to or greater than the width of the portion of the resistance heating wiring portion And an insulating portion for forming a single-wire portion that includes a material reacting with at least one material selected from a constituent material (m2), forms an electrically insulating portion by the reaction, and disconnects the resistance heating wiring portion or the conductor wiring portion Features a heater.

20. A fixing device comprising the heater according to any one of 1 to 19 above.

21. A drying apparatus comprising the heater according to any one of 1 to 19 above.

According to the heater of the present invention, the local temperature rise of the resistance heat generating wiring portion at the time of use can be suppressed, and the heat treated material can be subjected to stable heat treatment independently of the size thereof while suppressing temperature unevenness. Further, since the resistance heat generating wiring section includes the inclined rectangular pattern, even if the width of the heater is reduced, a desired effect can be obtained.

The heater of the present invention not only performs heat treatment while fixing both the heater and the object to be heat-treated, but also moves the heater in the width direction (direction perpendicular to the longitudinal direction of the heater) while fixing the object to be heat- It is suitable for the case where heat treatment is carried out while the heat-treated article is moved in the direction perpendicular to the long-shaped heater while heat treatment is performed and the heater is fixed. Particularly, in any of the case where the heat treatment is carried out while the heater is being moved while the heater is being fixed, and the case where the heat treatment is carried out while the heater is fixed while moving the heater, , It is possible to perform the stable heat treatment while suppressing the temperature unevenness without depending on the size of the article to be heat-treated.

In addition, even when the heat-treated article having different thermal properties from each other is heat-treated at the same temperature, it is possible to perform a stable treatment at a predetermined temperature without causing abnormal heat generation.

In the present invention, when the size of the object to be heat-treated is smaller than the total length of the resistance heat-generating wiring portion in the longitudinal direction of the heater, heat treatment is performed by uniform heat generation of the resistance heat-generating wiring portion adjacent thereto according to the size of the object to be heat- , The local temperature rise in the resistance heat generating wiring portion which is not in proximity is suppressed and no damage is caused to other peripheral components. Therefore, the heat treatment can be stably performed at a desired temperature, for example, at a set temperature in the range of -40 DEG C to 1,000 DEG C, without depending on the size thereof.

By arranging the heater of the present invention in a heat treatment apparatus, it is possible to fix toner, ink or the like and to bond a plurality of members, heat treatment of a coating film or a film, heat treatment of a metal product or a resin product, drying, solder reflow, Can be efficiently performed. Further, since the heater can be reduced in width as described above, it is suitable for placement in a compact heat treatment apparatus.

When a rectangle pattern shown in Fig. 1A is applied to the resistance heating wiring portion in Fig. 4 and fixing of toner, ink, and the like is performed, the non-forming portion of the wiring is provided in the width direction of the heater, However, when the heater of the present invention is used, the problem is solved.

Particularly, when the heat-treated article is paper, film or the like and is provided for printing or the like, the heater of the present invention is suitable as a fixing heater in an image forming apparatus such as a printing machine, a copying machine, a facsimile, or the like or a fixing device.

The fixing device of the present invention is suitable for fixation of toner, ink or the like using heat by a heater, bonding of a plurality of members, and the like. Particularly, by using the compression means in combination, the integral cargo can be efficiently obtained. For example, a fixing apparatus having a fixing roll including a heater of a long shape and a pressing roll is provided, in which a recording medium having a toner image not fixed on its surface is supplied between a fixing roll and a pressing roll , The recording medium is moved in the width direction of the heater while passing through the pressure contact portion of the fixing roll and the pressing roll so that the local temperature rise of the resistance heat generating wiring portion can be suppressed Toner, ink, and the like can be efficiently fixed to a recording medium.

According to the drying apparatus of the present invention, drying in a desired atmosphere can be promoted efficiently. It can be used as a vacuum dryer (decompression dryer), a pressure dryer, a dehumidifying dryer, a hot air dryer, an explosion-proof dryer and the like.

Further, according to the heater of the present invention including the insulating portion for forming the single-wire portion, overheat-on of the resistance heat generating wiring portion is started due to thermal runaway or the like, and when the temperature becomes equal to or higher than the predetermined temperature, the resistance heat generating wiring portion and / The respective constituent materials react with each other in the contact portion (covered portion) of the insulating portion for forming a portion to form an electrically insulating portion and the resistance heat generating wiring portion or the conductor wiring portion is smoothly disconnected and the operation can be stopped.

Therefore, also in the fixing device and the drying device using the heater of this type, when the heater is at the predetermined temperature or more, the resistance heating wiring portion or the conductor wiring portion can be disconnected from the magnetic circuit, and safety can be ensured.

Fig. 1 (A) is a schematic view showing a conventionally known rectangular pattern, and Fig. 1 (B) is a schematic view showing a sloping rectangular pattern.
2 is a schematic view showing another example of a slanted rectangular pattern;
3 is a schematic view showing another example of a slanted rectangular pattern;
4 is a schematic plan view showing an example of one type of heater.
Fig. 5 is a schematic view showing a cross-sectional view taken along the line XX in Fig. 4. Fig.
6 is a schematic plan view showing another example of a heater of one form.
7 is a schematic plan view showing another example of a heater of one form.
8 is a schematic sectional view showing another example of a heater of one form.
9 is a schematic sectional view showing another example of a heater of one form.
10 is a schematic plan view showing an example of another type of heater in which the insulating portion for forming the single-wire portion is covered on the surface of the conductor wiring portion.
11 is a schematic plan view showing another example of a heater of another type in which an insulating portion for forming a single-wire portion is formed on the surface of a resistance heat generating wiring portion.
12 is a schematic cross-sectional view showing another type of heater in which an insulating portion for forming a single-wire portion is formed on the surface of a conductor wiring portion.
Fig. 13 is a schematic cross-sectional view showing that the heater in Fig. 12 is thermally congested so that an electrically insulating portion is formed in a part of the conductor wiring portion and the conductor wiring portion is disconnected;
14 is a schematic cross-sectional view showing an example of another type of heater in which an insulating portion for forming a single-wire portion is formed on the surface of a resistance heat generating wiring portion.
Fig. 15 is a schematic sectional view showing another example of a heater of another type in which an insulating portion for forming a single-wire portion is covered on the surface of the resistance heat-generating wiring portion; Fig.
16 is a schematic plan view showing another example of a heater of another type in which an insulating portion for forming a single-wire portion is formed on the surface of a conductor wiring portion.
17 is a schematic cross-sectional view showing another example of a heater of another type formed so as to be surrounded by the overcoat layer on the surface side of the conductor wiring portion and in the overcoat layer.
18 is a schematic cross-sectional view showing an example of another type of heater formed so as to face the insulating portion for forming the single-wire portion, the base portion side of the conductor wiring portion and the surface side of the resistance heat generating wiring portion.
19 is a schematic cross-sectional view showing an example of another type of heater formed between the base portion and the resistance heat generating wiring portion so as to be surrounded by the first insulating layer in the first insulating layer;
20 is a schematic cross-sectional view showing an example of another type of heater having two insulating portions for forming a single-wire portion.
Fig. 21 is a schematic cross-sectional view showing that the heater of Fig. 18 is subjected to thermal runout and an electrically insulating portion is formed in a part of the conductor wiring portion and the resistance heat generating wiring portion, and the conductor wiring portion and the resistance heat generating wiring portion are disconnected.
Fig. 22 is a schematic cross-sectional view showing that the heater of Fig. 20 is subjected to thermal runout, and an electrically insulating portion is formed in a part of the conductor wiring portion and the resistance heat generating wiring portion, and the conductor wiring portion and the resistance heat generating wiring portion are disconnected.
23 is a schematic sectional view showing another example of a heater of another type formed so that the insulating portion for forming a single-wire portion is formed so as to be surrounded by the overcoat layer on the surface side of the resistance heat generating wiring portion and also in the overcoat layer.
24 is a schematic cross-sectional view showing another example of a heater of another type in which an insulating portion for forming a single-wire portion is formed so as to face the base portion side of the resistance heat generating wiring portion and the surface side of the conductor wiring portion.
25 is a schematic cross-sectional view showing another example of a heater of another type formed between the base portion and the conductor wiring portion so as to be surrounded by the first insulating layer in the first insulating layer.
26 is a schematic cross-sectional view showing another example of a heater of another type having two insulating portions for forming a single-wire portion.
27 is a schematic cross-sectional view showing another example of a heater of another type in which an insulating portion for forming a single-wire portion is formed on a surface of a conductor wiring portion;
28 is a schematic cross-sectional view showing another example of a heater of another type formed so as to be surrounded by the overcoat layer on the surface side of the conductor wiring portion and in the overcoat layer;
29 is a schematic cross-sectional view showing another example of a heater of another type formed in such a manner that the insulating portion for forming the single-wire portion, the base portion side of the conductor wiring portion and the surface side of the resistance heat generating wiring portion are formed.
30 is a schematic cross-sectional view showing another example of a heater of another type having two insulating portions for forming a single-wire portion.
31 is a schematic cross-sectional view showing another example of a heater of another type formed so that the insulating portion for forming a single-wire portion is formed so as to be surrounded by the overcoat layer on the surface side of the resistance heat generating wiring portion and also in the overcoat layer.
32 is a schematic cross-sectional view showing another example of a heater of another type in which the insulating portion for forming the single-wire portion is formed so as to face the base portion side of the resistance heat generating wiring portion and the surface side of the conductor wiring portion.
33 is a schematic cross-sectional view showing another example of a heater of another type having two insulating portions for forming a single-wire portion.
34 is a schematic cross-sectional view showing another example of a heater of another type formed on the surface of the conductor wiring portion;
Fig. 35 is a schematic cross-sectional view showing another example of a heater of another type formed on the surface of the conductor wiring portion; Fig.
36 (A1) and (A2) are plan views showing that the insulating portion for forming the single-wire portion covers the resistance heating wiring portion or the conductor wiring portion, and (B1) and (B2) Fig. 6 is a plan view showing that the wiring is covered by a wiring or conductor. Fig.
37 is a schematic perspective view showing an example of a fixing apparatus of the present invention.
38 is a schematic perspective view showing another example of the fixing device of the present invention.
39 is a schematic view showing an example of an image forming apparatus having a heater of the present invention;
40 is a plan view showing the heater manufactured in Example 1. Fig.
41 is a schematic perspective view showing a heat sink for evaluation E1 of the heater.
Fig. 42 is a schematic plan view showing an apparatus for evaluation E1 of a heater. Fig.
43 is a graph showing a test result (evaluation E1) in the heater of the embodiment 1. Fig.
44 is a plan view showing the heater manufactured in Example 2. Fig.
45 is a graph showing a test result (evaluation E1) in the heater of the second embodiment;
46 is a plan view showing the heater manufactured in Comparative Example 1. Fig.
47 is a schematic view showing the YY-line cross-section of Fig. 46;
48 is a graph showing a test result (evaluation E1) of the heater of Comparative Example 1;
49 is a schematic plan view showing a heater used in Comparative Example 2. Fig.
50 is a graph showing the test result (evaluation E1) in the heater of Comparative Example 2;
51 is a plan view showing the heater manufactured in Example 3;
52 is a schematic plan view showing an apparatus for evaluation E2 of a heater.
53 is a graph showing a test result (evaluation E2) of the heater of Example 3;
54 is a plan view showing the heater manufactured in Example 4;
55 is a graph showing a test result (evaluation E2) in the heater of the fourth embodiment;

A heater according to one aspect of the present invention is a resistance heating portion formed in a state of being electrically insulated with respect to a base portion on a long base portion and on the surface or inside of the base portion, And a power supply terminal portion electrically insulated from the base portion on the surface or inside of the base portion. The number of the power supply terminal portions is at least two, and the resistance heating wire portion And a power supply terminal portion for electrically connecting one terminal portion and the other terminal portion through the resistance heat generating wiring portion in order to supply electric power to the wiring portion, wherein the resistance heat generating wiring portion has a resistance value temperature coefficient of 500 to 4,000 ppm / And the parallel wiring is characterized by including a sloped rectangular pattern. The resistance heat generating wiring portion and the power supply terminal portion may be connected by a conductor wiring portion.

Another type of heater in the present invention is a resistance heating unit formed in a state of being electrically insulated with respect to a base portion on a long base portion and on the surface or inside of the base portion and a resistance The power supply unit includes two heat dissipation wiring portions and two power supply terminal portions formed on the surface or inside of the base portion in an electrically insulated manner with respect to the base portion. The number of conductor wirings is two, and a conductor wiring portion for electrically connecting the one end side and the other end side of the resistance heat generating wiring portion to the two power supply terminal portions separately, The wiring width of the resistance heating wiring portion or the wiring width of the conductor wiring portion on the upper layer side surface or the lower layer side surface of at least one of the part of the heat generating wiring portion and the portion of the conductor wiring portion, (M1) constituting the resistance heat generating interconnection portion and the material m2 constituting the conductor interconnection portion when the resistance heat generating interconnection portion becomes the predetermined temperature or higher, And an insulating portion for forming a single-wire portion that includes a material reacting with the material and forms an electrically insulating portion by this reaction and disconnects the resistance heat generating wiring portion or the conductor wiring portion.

One type of heater in the present invention is a heater in which a long base portion 11 (a base portion 11 including the base layer 12 and the electrically insulating layer 13) and a surface of the base portion 11 A resistance heating wiring portion 15 having a plurality of parallel wirings which are heat generated by energization and which are formed in an electrically insulated state with respect to the base portion 11, And the number of the power supply terminal portions is at least two, and electric power is supplied to the resistance heat generating wiring portion 15 And a power supply terminal portion 17 for electrically connecting one terminal portion and the other terminal portion through the resistance heat generating wiring portion 15 for supply.

Another type of heater in the present invention is a heater in which a base portion 11 having a long shape (a base portion 11 including the base layer 12 and the electrically insulating layer 13) A resistance heating wiring portion 15 which is a resistance heating portion formed in a state of being electrically insulated from the base portion 11 on the surface side or inside of the base portion 11 and which is heated by energization, Two power supply terminal portions 17 which are formed inside the base portion 11 in a state of being electrically insulated from the base portion 11 and two power supply terminal portions 17 which are formed on the surface side or inside of the base portion 11 with respect to the base portion 11 The number of the conductor wiring portions is two and the number of the power supply terminal portions 17 and the one end side and the other end side of the resistance heat generating wiring portion 15 are set separately from each other, At least one of a portion of the resistance heating wiring portion 15 and a portion of the conductor wiring portion 19 Side surface of the resistance heating wiring portion 15 or the conductor wiring portion 19 with a length equal to or greater than the line width of the resistance heating wiring portion 15 or the line width of the conductor wiring portion 19, A material reacting with at least one material selected from the material m1 constituting the resistance heat generating interconnection portion 15 and the material m2 constituting the conductor interconnection portion 19 is used And an insulating portion 32 for forming a single-wire portion which forms an electrically insulating portion by this reaction and disconnects the resistance heating wiring portion 15 or the conductor wiring portion 19. [

In both configurations, the cross-sectional structure of the heater is shown in Figs. 5, 8, and 9, for example. These drawings show a case where the resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion (not shown) including the resistance wiring portion 15 and the power supply terminal portion 17, 19 are formed on the surface of the base portion 11 in an electrically insulated manner with respect to the base portion 11. [

In the present invention, the shape of the heater generally depends on the shape of the base portion or base layer. The shape of the base portion or the base layer is generally a flat plate shape and may include a concave portion, a convex portion, a hollow portion, and the like. The shape of the base portion or base layer may be a curved shape.

In the present invention, the constituent elements such as the resistance heating wiring portion, the power supply terminal portion, and the conductor wiring portion can be formed not only in the surface (one surface side or both surfaces) of the base portion, but also in the inside thereof. In the latter case, the shape of the base portion may be a hollow body or the like.

In the following description, the description such as " formation (placement) on the surface of the base portion or on the surface side of the base portion " and the like may be made on the surface of the base portion of the flat plate shape or on the surface side (Arranged) with respect to the surface of the wafer W. When the base portion is made of a hollow body, it means that it is formed (arranged) on the inner surface of the hollow portion.

The thickness of the base portion 11 is appropriately selected depending on the purpose, application, etc., and is usually 0.4 to 20 mm.

Further, the length of the base portion 11 is usually 20 mm or more, preferably 200 to 350 mm.

The constituent material of the base portion or the base layer is preferably stainless steel, aluminum, an aluminum alloy or an insulating ceramics.

The stainless steel is preferably a ferritic heat-resistant steel, particularly preferably SUS430, SUS444 and SUS436.

Since the stainless steel, aluminum or aluminum alloy has a low electrical resistance value, components such as the resistance heating wiring portion 15, the power supply terminal portion 17, and the conductor wiring portion 19 are formed directly on the surface I can not. Therefore, a base portion 11 comprising a base layer 12 comprising stainless steel, aluminum or an aluminum alloy and an electrically insulating layer 13 bonded to the base layer is used. Components such as the resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19 may be formed on both sides of the base portion 11 as described above. In this case, A base portion 11 having an electrically insulating layer 13 formed on both sides of the base 12 is used.

In the present invention, the constituent material of the base layer 12 is preferably stainless steel, and the constituent material of the electrically insulating layer 13 is preferably a crystalline glass and a semi-crystallized glass And SiO 2 -Al 2 O 3 -MO based glass having a softening point of 600 ° C or higher is preferable. Note that MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, or the like). The thickness of the electrically insulating layer 13 is preferably 60 to 120 占 퐉, more preferably 70 to 110 占 퐉, and still more preferably 75 to 100 占 퐉.

The insulating ceramics is preferably an inorganic compound having an electric resistance value of 10 7 ? 占 ㎝ m or more, and examples thereof include aluminum oxide, aluminum nitride, zirconia, silica, mullite, spinel, cordierite and silicon nitride. Of these, aluminum oxide and aluminum nitride are preferable.

In the present invention, the structure of the heater depends on the constituent material of the base portion 11 and is a plan view, for example, as a cross-sectional view of FIG. 4, FIG. 6, FIG. 7, FIG. 10, 5, 8, 9, 12, 13, 14, 15, and the like.

When the constituent material of the base portion 11 includes stainless steel as the base layer 12, the constituent elements of the resistance heat generating wiring portion 15, the power supply terminal portion 17, the conductor wiring portion 19, Is formed on the surface of the electrically insulating layer 13 (hereinafter also referred to as "first insulating layer 13") so as not to directly contact the stainless steel portion of the layer 12 (see FIGS. 4, 5, 6, 7, 10, 11, 12, 13, 14, etc.).

The thickness of the first insulating layer 13 is preferably 60 to 120 占 퐉, more preferably 70 to 110 占 퐉, and still more preferably 75 to 100 占 퐉.

8, constituent elements such as the resistance heating wiring portion 15, the power supply terminal portion 17, and the conductor wiring portion 19 are formed in the base portion 11, or may be formed so as to be in contact with a portion made of an electrically insulating material (not shown).

In the heater according to one embodiment of the present invention, the resistance heat generating wiring portion 15, which is the main part of the heater, has a resistance value temperature coefficient of 500 to 4,400 ppm / Lt; 0 > C. Specific examples include silver alloys such as silver-palladium, silver-platinum, and the like; silver; Molybdenum: tungsten. These materials may be used alone or in combination of two or more. The preferable material is appropriately selected depending on the cross-sectional structure of the heater, the constituent material of the base portion, and the like. The line width of the resistance heat generating wiring portion 15 is preferably 3 to 27 mu m.

The "oblique rectangular pattern" is, for example, a pattern 20 having a shape shown in FIG. 1 (B), FIG. 2 and FIG. That is, the pattern of the shape shown in Fig. 1A, in which the rising portion of the conventionally known rectangular pattern is inclined at an angle of?, Is referred to as a "slanted rectangular pattern". The angle [theta] is preferably 10 to 80 degrees, more preferably 20 to 70 degrees. The adjacent rectangles may have the same shape or different shapes. In addition, the wiring need not be a straight line at each point but may have a curved line partially.

The resistance heating wiring portion 15 is a resistance heating portion which is formed on the front surface or inside of the elongated base portion 11 in an electrically insulated state with respect to the base portion 11 and is a parallel wiring, And a plurality of wirings for connecting at least two power supply terminal portions 17 electrically in parallel. The power supply terminal portion 17 is also formed on the surface side or inside of the elongated base portion 11 in an electrically insulated state with respect to the base portion 11. [

The form of the parallel wiring is not particularly limited. One parallel wiring may be formed in the longitudinal direction of the heater, in the width direction of the heater, or may be formed obliquely in the width direction of the heater.

In the present invention, the heater including the resistance heating wiring portion 15 having the inclined rectangular pattern is preferably shown in Figs. 4, 6, and 7. Fig. Figs. 4 and 7 show an example in which the resistance heating wiring portion 15 includes parallel wirings in the width direction by a folding back pattern in the longitudinal direction of the heater 1. Fig. 6 shows an example in which the resistance heating wiring portion 15 is provided with parallel wirings in the width direction by a folding back pattern in the width direction of the heater 1. [ Figs. 4, 6, and 7 are preferred embodiments from the viewpoint of the temperature complementarity in the longitudinal direction of the heater 1, and two power supply terminal portions 17 are provided at both ends in the longitudinal direction of the heater 1 Fig. 7, which is shown in Fig. 4 and Fig. 7 in which two power supply terminal portions 17 are provided at one end side in the longitudinal direction of the heater 1, is a particularly preferable form. In these drawings, there is a non-forming portion 14 which is oblique to the width direction of the heater 1 in the gap portion of the resistance heat generating wiring portion 15 (see Fig. 4). That is, the configuration in which the part constituting the parallel wiring is oblique to the longitudinal direction or the width direction of the heater 1 is also preferable from the viewpoint of the temperature complementarity in the longitudinal direction of the heater 1.

Fig. 4 and Fig. 7 show a form in which the inclined rectangular pattern shown in Fig. 1 (B) is arranged obliquely with respect to the width direction of the heater 1, and Fig. 6 is a cross- Is arranged horizontally with respect to the lengthwise direction of the heater 1. [0064] As shown in Fig.

In the case of these types, since the uneven portion 14 of the wiring is oblique with respect to the longitudinal direction or the width direction of the heater as a result of having the inclined rectangular pattern, the heater 1 In the case where the heat treatment is carried out while moving the heat-treated article in the direction perpendicular to the long-shaped heater 1 while the heater 1 is fixed, A stable heat treatment can be performed without causing a local temperature rise in the resistance heat generating wiring portion in the heat dissipating unit.

4, 6, 7, 10 and 11 show a heater (hereinafter referred to as " heater (I) " ) &Quot;). Fig. 5 is a schematic view showing the X-X line section in Fig. 4. Fig.

The heater 1 of Figs. 4, 5, 6, 7, 10 and 11 has a long base layer 12, an electrically insulating layer 13 formed on the surface of the base layer 12, A resistance heating wiring portion 15 formed on the surface of the electrically insulating layer 13 and having a plurality of parallel wirings which generate heat by energization, and a resistance heating wiring portion 15 formed on the surface of the electrical insulating layer 13, And two power supply terminal portions 17 for supplying electric power to the power supply portion 15. These heaters are provided with a conductor wiring portion 19 which conducts to each of the power supply terminal portions 17 on the surface of the electrically insulating layer 13 and this conductor wiring portion 19 is branched, And is connected to a plurality of resistance heat generating wiring parts (15). For efficient construction of the parallel wiring, it is preferable that the conductor wiring portion 19 is provided. The electrical insulating layer 13 is electrically insulated between the base layer 12 and the resistance heat generating wiring portion 15 and also between the base layer 12 and the power supply terminal portion 17, . The electrically insulating layer 13 is electrically insulated also between the base layer 12 and the conductor wiring portion 19. [

In the heater I, it is preferable that the constituent material of the resistance heat generating wiring portion 15 includes a silver alloy such as silver-palladium having a resistance value temperature coefficient of 1,000 to 3,000 ppm / 占 폚.

The line thickness of the resistance heat generating wiring portion 15 is preferably 3 to 27 占 퐉, more preferably 4 to 20 占 퐉, still more preferably 5 to 17 占 퐉, particularly preferably, Is 8 to 12 占 퐉.

In the heater I, the material of the power supply terminal portion 17 and the conductor wiring portion 19 may be silver, silver-palladium, silver-platinum, copper, gold, platinum-rhodium, or the like. The material and line width of the power supply terminal portion 17 or the conductor wiring portion 19 are selected so that the resistance value per unit area is lower than the resistance heat generating wiring portion 15.

In the heater (I), the constituent material of the base layer (12) is preferably a ferritic heat-resisting steel. Particularly preferable materials are SUS430, SUS444, and SUS436.

The thickness of the base portion 11 is preferably 0.4 to 20 mm, and more preferably 0.6 to 5 mm.

The constituent material of the electrically insulating layer 13 is preferably SiO 2 -Al 2 O 3 -MO based glass from the viewpoint of balance of thermal expansion with stainless steel. Note that MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, or the like).

The thickness of the electrically insulating layer 13 is preferably 60 to 120 占 퐉, more preferably 70 to 110 占 퐉, and still more preferably 75 to 100 占 퐉.

4, 5, 6, and 7, the electrical insulating layer 13 is formed so as to be in contact with the regions of the resistance heat generating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19, But is not limited to this configuration. For example, they may have the same areas as the patterns of the resistance heat generating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19, and may be formed on the lower sides of these regions.

5 and the like, the heater I may include a protective layer covering the resistance heating wiring portion 15, the power supply terminal portion 17, and the conductor wiring portion 19. [ This protective layer may have the same area as the patterns of the resistance heat generating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19 and may be formed on each of these regions. The base layer 12 or the electrically insulating layer 13).

The protective layer is preferably made of an electrically insulating material and may be made of the same material as the electrically insulating layer 13.

The heater I shown in Figs. 4, 5, 6 and 7 is formed by, for example, a step of forming an electrical insulating film on the surface of a long stainless steel plate, To 4,400 ppm / DEG C, and further forming a resistive heat generating wiring portion including a slanted rectangular pattern; a step of forming a resistive heating wiring portion including at least two power feeding portions And a step of forming a terminal portion. Further, it may include a step of forming a conductor wiring portion, a step of forming a protective layer, and the like.

In the case of forming the electrical insulating film and the protective layer, a method of heat-treating a film formed using a composition containing a precursor of an electrically insulating material or the like can be applied.

In the case of forming the resistance heating wiring portion, the power supply terminal portion and the conductor wiring portion, the printing method; Dipping method; A physical vapor growth method such as a vapor deposition method and the like can be applied.

As shown in Figs. 10 and 11, the heater I has a problem in that when the heater has a problem such as heat congestion and the heat generating resistance wiring portion 15, which is heating up, And an insulating portion 32 for forming a single-wire portion for disconnecting the resistance heat generating wiring portion 15 or the conductor wiring portion 19. More specifically, when the resistance heat generating wiring portion 15 that is heating becomes a predetermined temperature or more, at least one of the resistance heating wiring portion 15 and the conductor wiring portion 19 And the contact portion of the one-side and the insulating portion 32 for forming the single-wire portion is transformed into the electrical insulation portion 34. [ That is, as shown in the following preferred form, the insulating portion 32 for forming the single-wire portion is formed on at least one of the upper surface of the resistance heating wiring portion 15 and the portion of the conductor wiring portion 19, Is formed in contact with the surface of the resistance heating wiring portion (15) or the conductor wiring portion (19) with a length equal to or more than the line width of the resistance heating wiring portion (15) . Therefore, when the resistance heat generating wiring portion 15 is excessively heated to the predetermined temperature or more, the constituent material of the insulating portion 32 for forming a single wire and the constituent material m1 of the resistance heat generating wiring portion 15, At least one kind selected from the constituent material m2 of the portion 19 reacts and an electrically insulating portion 34 made of an electrically insulating material is formed. In the electrically insulating portion 34, the resistance heat generating wiring portion 15 ) Or the conductor wiring portion 19 are disconnected. The insulating portions 32 for forming the single-wire portion may be disposed in one heater, or may be disposed in two or more. Fig. 12 shows a configuration in which the insulating portion 32 for forming a single-wire portion is provided on the surface of a part of the conductor wiring portion 19. Fig. 13 shows a state in which the insulating portion 32 for forming a single- (19) is broken and an electrically insulating portion (34) is formed.

The arrangement of the insulation portion 32 for forming the single-wire portion is shown in Fig. Fig. 36 is an enlarged view of a main portion of the heater shown in Fig. 10 and the like, for example. Fig. 36 is a sectional view of the heat generating wiring portion 15, (A2) is a configuration in which the insulating portion 32 for forming the single-wire portion is disposed on the surface of a part of the resistance heating wiring portion 15 Is arranged on the surface of a part or a part of the conductor wiring portion 19 so as not to exceed the line width and to have the same length as the line width. (B1) is provided on the surface of the insulating portion 32 for forming a single-wire portion which is arranged to have a length exceeding a line width of a part of the resistance heating wiring portion 15 or a part of the conductor wiring portion 19, A part of the resistance heating wiring part 15 or a part of the conductor wiring part 19 is arranged in a length equal to the line width of the resistance heating wiring part 15 or the conductor wiring part 19 A portion of the resistance heating wiring portion 15 or a portion of the conductor wiring portion 19 is disposed on the surface of the insulating portion 32 for forming a single wire wound portion. In these drawings, the shape of the insulating portion 32 for forming the single-wire portion is not limited thereto, but may be a rectangle, and may be a line width of the resistance heat generating wiring portion 15 or a line width of the conductor wiring portion 19. [ (Line or the like) having a length equal to or greater than the width of the substrate.

The shape in which the insulating portion 32 for forming the single-wire portion is disposed on the surface of the conductor wiring portion 19 is shown in Figs. 10 and 12, for example. 11, Fig. 14, and Fig. 15, a configuration in which the insulating portion 32 for forming a single-wire portion is disposed on the surface of the resistance heat generating wiring portion 15 is shown in Fig.

11, the insulating portion 32 for forming the single-wire portion is formed in all of the parallel wiring portions. In the case where the single-wire portion-forming insulating portion 32 is made to contact the resistance heat generating wiring portion 15, It is necessary to make contact.

In the case where the insulating portion 32 for forming the single-wire portion is made to be in contact with the conductor wiring portion 19, as shown in Fig. 10, in all the parallel wiring portions constituting the resistance heat generating wiring portion 15 In the main wiring of the conductor wiring portion 19 to be energized, it is preferable that the insulating portion 32 for forming the single-wire portion is formed in contact with the main wiring at a position close to the power supply terminal portion 17, There may be two places.

The thickness of the insulating portion 32 for forming the single-wire portion is preferably 5 to 100 占 퐉, more preferably 10 to 100 占 퐉 in terms of surely disconnection in the resistance heat generating interconnection portion 15 or the conductor wiring portion 19 Mu] m, more preferably 15 to 40 [mu] m.

The constituent material of the single-wire-portion-forming insulating portion 32 reacts with the constituent material m1 of the resistance heat-generating wiring portion 15 or the constituent material m2 of the conductor wiring portion 19 to form an electrically insulating material It is not particularly limited. The preferred material is glass, and either crystallized glass or amorphous glass is preferable. In the present invention, it is preferable that the constituent material (m1) of the resistance heat generating wiring part (15) and the constituent material (m2) of the conductor wiring part (19) include a silver or silver alloy, The insulating material 32 is preferably a bismuth-based glass or a lead-based glass. Particularly preferred constituent materials are a bismuth-based glass and a lead-based glass having a softening point of 370 ° C to 550 ° C. When the insulating portion 32 for forming the single-wire part includes bismuth glass or lead-based glass, the bismuth-based glass or lead-based glass is softened when the resistance heat generating wiring portion 15 becomes, for example, Or silver alloy to form the electrically insulating portion 34, and the resistance heating wiring portion 15 or the conductor wiring portion 19 can be disconnected.

Examples of the bismuth glass include Bi 2 O 3 -ZnO-B 2 O 3 glass and the like. Examples of the lead-based glass include PbO-B 2 O 3 -based glass and the like.

As described above, when the resistance heating wiring portion 15 becomes a predetermined temperature or more due to thermal runaway or the like, the insulating portion 32 for forming the single-wire portion forms the electrical insulating portion 34. [ This phenomenon will be described with reference to Figs. 12 and 13. Fig. 12 shows an example in which the insulating portion 32 for forming a single-wire portion is provided on the upper surface of a part of the conductor wiring portion 19 with a length equal to or larger than the line width of the conductor wiring portion 19, 13 is a schematic view of a heater not showing the resistance heat generating wiring portion 15. When the resistance heat generating wiring portion 15 becomes a predetermined temperature or more, The material and the constituent material of the conductor wiring portion 19 react with each other to form the electrically insulating portion 34 and disconnect the conductor wiring portion 19. [

In the heater of Fig. 14 including the insulating portion 32 for forming the single-wire portion formed in contact with the upper surface of the resistance heating wiring portion 15 having the parallel wiring, when the resistance heat generating wiring portion 15 becomes the predetermined temperature or more The constituent material of the heat insulating interconnection part 15 and the constituent material of the heat insulating interconnection part 15 react with each other to form an electrical insulating part 34 not shown, .

When the heater I having the insulating portion 32 for forming the single-wire portion is activated, the entire base portion 11 (or the base layer 12) becomes a heat source centering on the resistance heat generating wiring portion 15 And the electrical insulation portion 34 are formed so that the temperature of the heater may not be lowered instantaneously even if the power supply is interrupted. In the present invention, the heater (see Figs. 11 and 14) in which the insulating portion for forming the single-wire portion 32 is in contact with the resistance heating wiring portion 15 or the insulating portion 32 for forming the single- And the conductor wiring portion 19 is formed so as to intermittently extend between the densely arranged wirings (the resistance heat generating wiring portion 15) (See Fig. 16), the residual heat of the resistance heating wiring portion 15 can be lowered earlier.

Since the heater I is provided with the base portion 11 including the base layer 12 made of stainless steel and the electrically insulating layer 13 and since fine particles are not generated from the constituent member at the time of use, A clean room, a precision machine, a heat treatment apparatus accompanied by a reduced pressure or a pressure, and a fixing apparatus.

8 is a sectional view showing a heater (hereinafter also referred to as " heater (II) ") provided on the surface of the base 11 made of an insulating ceramics. The constituent elements of the surface of the base 11 made of insulating ceramics in this heater II are the same as those of the surface of the electrically insulating layer 13 in the heater I shown in Figs. As shown in Fig.

The heater shown in Fig. 8 has a base portion 11 having a long shape, a resistance heat generating wiring portion 15 formed on the surface of the base portion 11 and having a plurality of parallel wirings that generate heat by energization And two power supply terminal portions 17 formed on the surface of the base portion 11 for supplying electric power to the resistance heat generating wiring portion 15 through the conductor wiring portion 19. [ The heater (II) may have a protective layer not shown. It is also possible to provide an insulating portion 32 for forming a single-wire portion in the same manner as the heater I (see Fig. 15).

9 is a cross-sectional view showing a heater (hereinafter also referred to as " heater (III) ") having resistance heat generating wiring portion 15 or the like provided inside base portion 11 made of insulating ceramics. The constituent elements of the base portion 11 made of insulating ceramics in the heater III are the same as those of the constituent elements of the surface of the electrically insulating layer 13 in the heater I shown in Figs. . In this case, the resistance heating wiring portion 15 is connected between the power supply terminal portions 17. However, in the heater (III), the protective layer in the heater (I) is not normally arranged.

The heater III shown in the sectional view of Fig. 9 has a base portion 11 of a long shape and a resistance heat generating wiring 11 having a plurality of parallel wirings embedded in the base portion 11, And a part of the resistive heating wiring part 15 is connected to the resistance heating wiring part 15 inside the base part 11 and a part thereof is exposed on the surface of the base part 11, And two power supply terminal portions 17 for supplying power. The heater (III) may include a conductor wiring portion (19) not shown in Fig. 9 as described above.

In the heaters (II) and (III), the constituent material of the resistance heating wiring portion 15 is silver, molybdenum, tungsten, silver-palladium, silver-platinum, and the like having a resistance value temperature coefficient of 500 to 4,000 ppm / .

The line width of the resistance heat generating wiring portion 15 is preferably 3 to 20 占 퐉, more preferably 5 to 17 占 퐉, and still more preferably 8 to 12 占 퐉, from the viewpoint of area resistivity.

In the heaters (II) and (III), the constituent material of the power supply terminal portion 17 and the constituent material of the conductor wiring portion 19 are silver, silver-palladium, silver-platinum, copper, gold, Rhodium and the like.

In the heaters (II) and (III), as the constituent material of the base portion 11, aluminum oxide and aluminum nitride are preferable.

The thickness of the base portion 11 in the heater II is preferably 0.2 to 5 mm, and more preferably 0.4 to 2 mm.

The thickness of the base portion 11 in the heater III is preferably 0.2 to 5 mm, and more preferably 0.4 to 2 mm.

9 showing the heater III, the power supply terminal portion 17 is connected to the resistance heat generating wiring portion 15 and the base portion 11, but the present invention is not limited to this configuration, The dedicated terminal portions 17 may be arranged on the respective end surfaces of both ends in the longitudinal direction of the heater. 9 does not show the conductor wiring portion 19 but also includes the conductor wiring portion 19 which is electrically connected to the resistance heating wiring portion 15, May be disposed.

The heater (II) includes a step of manufacturing a long plate including insulating ceramics, a step of forming a ceramic substrate on the surface of the ceramic span, the ceramic substrate including a material having a resistance value temperature coefficient of 500 to 4,400 ppm / And a step of forming at least two power supply terminal portions at both ends or a peripheral portion of the ceramic span in the longitudinal direction of the plate. Further, a step of forming a conductor wiring portion may be included.

A method of manufacturing a ceramic span is exemplified below.

(1) a method of preparing a green sheet by using a ceramic slurry containing a powder of insulating ceramics and subjecting it to a heat treatment

To the ceramic slurry, a sintering aid such as silicon oxide, calcium oxide, titanium oxide, magnesium oxide or zirconium oxide, a dispersing agent, a plasticizer, an organic solvent and the like can be added.

(2) a method in which a mixture of an insulating ceramics powder, a sintering assistant or the like is subjected to a press molding or the like and a heat treatment is performed on the formed body of a predetermined shape

The heater (II) has a resistance temperature coefficient of 500 to 4,400 ppm / DEG C for a resistance heat generating wiring part at a predetermined position on the surface of a long green sheet including the powder of insulating ceramics prepared as described above A step of disposing a metal foil made of a paste or a metal foil made of the paste or a material made of the material for the power supply terminal portion or the conductor wiring portion at a predetermined position on the surface of the green sheet; , And a step of performing a heat treatment in these laminated states.

In all of the methods for producing the heater (II) described above, a step of forming a protective layer and the like may also be included.

The heater (III) is manufactured by, for example, a process of fabricating two long green sheets including powder of insulating ceramics, a step of forming a resistive temperature coefficient A step of disposing a paste made of a material having a specific surface area of 500 to 4,000 ppm / ° C or a metal foil made of the material, a paste made of a material for a power supply terminal portion or a material for a conductor wiring portion, A step of disposing a metal foil made of the material, and a step of arranging another green sheet so as to sandwich the surface of the laminate and performing heat treatment.

In the present invention, the positions of the power supply terminal portion 17, the conductor wiring portion 19 and the like specifically shown are not limited to the positions shown in Figs.

4 to 7, one base portion 11 is provided with one circuit. However, the present invention is not limited to this, and a plurality of circuits may be provided.

In the heater II or III having the insulating portion 32 for forming the single-wire portion, the base portion 11 as a whole is a heat source centering on the resistance heat generating wiring portion 15 during its operation The electrical insulation portion 34 is formed by thermal runaway or the like, and the temperature of the heater may not be lowered instantaneously even if the power supply is interrupted. In the present invention, the heater (see Fig. 15) in which the insulating portion for forming the single-wire portion 32 is in contact with the resistance heating wiring portion 15 or the insulating portion 32 for forming the single- And the conductor wiring portion 19 is formed so as to intermittently extend between the densely arranged wirings (the resistance heat generating wiring portion 15), and a part of the conductor wiring portion 19 The heat retaining temperature of the resistance heat generating interconnection portion 15 can be lowered earlier by using the heater (not shown) having the contact portion 32 formed in contact therewith.

One type of heater in the present invention can generate heat by connecting the power supply terminal portion 17 to a conventionally known power supply device. The heating temperature is preferably 50 占 폚 to 600 占 폚, and more preferably 120 占 폚 to 500 占 폚 in the heaters (I) and (II). Further, in the heater (III), it is preferably 50 ° C to 1,000 ° C.

In the heater of one form in the present invention, the resistance heating wiring portion 15, the power supply terminal portion 17, the conductor wiring portion 19, and the like are not necessarily formed directly on the surface of the base portion.

At least one of the resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19 is a heater having the insulating portion 32 for forming a single wire portion, As shown in Fig.

The heater shown in Figs. 18, 20, 29 and 30 is a multilayer heater in which a resistance heating wiring portion 15 and a conductor wiring portion 19 are provided in this order on one surface side of the base portion 11, A portion of the resistance heating wiring portion 15, at least a part of the insulating portion 32 for forming the single-wire portion, and a part of the conductor wiring portion 19 are in contact with each other in a sequential manner when viewed from the base portion 11 Heater.

18 is a sectional view showing a first insulating layer 13 as an electrical insulating layer, a resistance heating wiring portion 15 and a second insulating layer 16 as an electrical insulating layer on the surface of a base layer 12 including stainless steel or the like And a second insulating layer 16 and an insulating portion 32 for forming a single-wire portion disposed so as to be surrounded by the second insulating layer 16 are formed in the second insulating layer 16, And a conductor wiring portion 19 which is formed on the surface of the insulating wiring portion 32 and is deposited from the left end of the resistance heating wiring portion 15 toward the surface side, And an overcoat layer 21 made of an insulating material. 20 shows an example in which a first insulating layer 13 as an electrical insulating layer, a resistance heat generating wiring portion 15 and a second insulating layer 13 as an electrical insulating layer are formed on the surface of a base layer 12 including stainless steel or the like, (16) and a second insulating layer (16), and an insulating portion (32) for forming a single wire portion which is disposed so as to be surrounded by the second insulating layer (16) A conductor wiring portion 19 which is formed on the surface of the insulating portion 32 for formation and which is formed so as to be deposited from the left end of the resistance heating wiring portion 15 toward the surface side, And an overcoat layer 21 made of an insulating material formed on the overcoat layer 21. The overcoat layer 21 is provided with an insulating portion 32 for forming a single-wire portion which is arranged so as to be surrounded by the overcoat layer 21. [

29 shows a structure in which a resistance heating wiring portion 15, a second insulating layer 16 as an electrical insulating layer, and a second insulating layer 16 are formed on the surface of the base portion 11 including the insulating ceramics. And an insulating portion 32 for forming a single-wire portion disposed so as to be surrounded by the second insulating layer 16 in the insulating layer 16 and the insulating portion 32 for forming a single-wire portion, And an overcoat layer 21 made of an insulating material and formed on the surface of the conductor wiring portion 19 and having a conductor wiring portion 19 formed to be deposited from the left end of the resistance heat generating wiring portion 15 toward the surface side . 30 shows a configuration in which a resistance heating wiring portion 15, a second insulating layer 16 as an electrical insulating layer, and a second insulating layer 16 are formed on the surface of the base portion 11 including the insulating ceramics. And an insulating portion 32 for forming a single-wire portion disposed so as to be surrounded by the second insulating layer 16 in the insulating layer 16 and the insulating portion 32 for forming a single-wire portion, A conductor wiring portion 19 formed to be deposited from the left end of the resistance heat generating wiring portion 15 toward the surface side and an overcoat layer 21 made of an insulating material and formed on the surface of the conductor wiring portion 19 And an insulating portion 32 for forming a single-wire portion is disposed in the overcoat layer 21 so as to be surrounded by the overcoat layer 21. [

21 and FIG. 29, when the resistance heat generating wiring portion 15 is heated to a predetermined temperature or more, as shown in FIG. 21, the constituent material of the heat insulating portion 32 for forming a single- The resistance heating wiring portion 15 and the conductor wiring portion 19 are disconnected by reacting with the constituent material of the conductor wiring portion 15 and the constituent material of the conductor wiring portion 19 to form the electrically insulating portion 34. [

20 and 30, when the resistance heat generating wiring portion 15 is heated to a predetermined temperature or more, as shown in Fig. 22, the material constituting the insulating portion 32 for forming the single- The constituent material of the wiring portion 15 and the constituent material of the conductor wiring portion 19 and the constituent material of the insulating portion 32 for forming the single-wire portion react with both the constituent material of the conductor wiring portion 19 The electrical insulation portion 34 is formed, and the resistance heating wiring portion 15 and the conductor wiring portion 19 are disconnected.

The heater shown in Figs. 24, 26, 32 and 33 is a multilayer heater having a conductor wiring portion 19 and a resistance heat generating wiring portion 15 in this order on one surface side of the base portion 11, A portion of the conductor wiring portion 19, at least a portion of the insulating portion 32 for the single-wire portion, and a portion of the resistance heat generating wiring portion 15 are in contact with each other in a sequential manner when viewed from the base portion 11 Heater.

24 shows an example in which a first insulating layer 13 as an electrical insulating layer, a conductor wiring portion 19 and a second insulating layer 16 as an electrical insulating layer are formed on the surface of a base layer 12 including stainless steel or the like, And an insulating portion 32 for forming a single-wire portion which is disposed so as to be surrounded by the second insulating layer 16 in the second insulating layer 16. The second insulating layer 16, A resistance heating wiring portion 15 formed on the surface of the insulating portion 32 and connected to the conductor wiring portion 19 deposited from the left end of the conductor wiring portion 19 toward the surface side, And an overcoat layer 21 made of an insulating material and formed on the surface of the wiring portion 15. [ 26 shows a first insulating layer 13 as an electrical insulating layer, a conductor wiring portion 19 and a second insulating layer (not shown) as an electrical insulating layer on the surface of a base layer 12 including stainless steel or the like And an insulating portion 32 for forming a single-wire portion which is disposed so as to be surrounded by the second insulating layer 16 in the second insulating layer 16. The second insulating layer 16 and the single- A resistance heating wiring portion 15 which is formed on the surface of the insulating portion 32 for formation and which is connected to the conductor wiring portion 19 deposited from the left end of the conductor wiring portion 19 toward the surface side, And an overcoat layer 21 made of an insulating material and formed on the surface of the resistance heat generating wiring portion 15. The overcoat layer 21 is provided with an insulating portion for forming a single- 32).

32 is a sectional view showing the state in which a conductor wiring portion 19, a second insulating layer 16 which is an electrical insulating layer, and a second insulating layer 16 which is an insulating layer are formed on the surface of the base portion 11 including the insulating ceramics And an insulating portion 32 for forming a single-wire portion which is disposed so as to be surrounded by the second insulating layer 16 and is formed on the surfaces of the second insulating layer 16 and the insulating portion 32 for forming a single- A resistance heating wiring portion 15 connected to the conductor wiring portion 19 deposited from the left end of the conductor wiring portion 19 toward the surface side; And an overcoat layer 21 made of a material. Fig. 33 is a plan view showing a portion of the surface of the base portion 11 including the insulating ceramics including the conductor wiring portion 19, the second insulating layer 16 which is an electrical insulating layer, And an insulating portion 32 for forming a single-wire portion which is disposed so as to be surrounded by the second insulating layer 16 and is formed on the surfaces of the second insulating layer 16 and the insulating portion 32 for forming a single- A resistance heating wiring portion 15 connected to the conductor wiring portion 19 deposited from the left end of the conductor wiring portion 19 toward the surface side; The overcoat layer 21 is provided with an insulating portion 32 for forming a single-wire portion which is disposed so as to be surrounded by the overcoat layer 21.

24 and 26, even when the resistance heat generating wiring portion 15 becomes a predetermined temperature or higher, at least a part of the conductor wiring portion 19, at least a part of the insulating portion 32 for forming a single wire portion, At least a portion of the heat-generating wiring portion 15 that is in contact with the surface of the heat-generating wiring portion 15 is formed with at least an electrically insulating portion 34 (not shown).

The insulating portion 32 for the single-wire portion is formed on the resistance heat generating wiring portion 15 and the conductor wiring portion 19, As shown in Fig. The heater of one form in the present invention may be configured such that the insulating portion 32 for forming the single-wire portion is in contact with either the resistance heating wiring portion 15 or the conductor wiring portion 19 (Fig. 17, 19, 23, 25, 28, 31, 34, and 35).

The material constituting the second insulating layer 16 or the third insulating layer 23 shown in Figs. 17 to 33 is selected from the crystallized glass and the semi-crystallized glass which are the constituent materials of the first insulating layer 13 And a softening point of 600 ° C or higher, and SiO 2 -Al 2 O 3 -MO based glass and the like are preferable. Note that MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, or the like).

The overcoat layers 21, 21A and 22B shown in Figs. 17 to 35 are arranged for protection of the resistance heating wiring portion 15 and the conductor wiring portion 19, and more specifically, And also has an action of suppressing oxidation deterioration of the resistance heat generating wiring portion 15, the conductor wiring portion 19, and the like when it is operating. The constituent material of the overcoat layer is preferably SiO 2 -Al 2 O 3 -MO based glass or the like.

The softening point of the constituent material of the overcoat layer is preferably higher than the softening point of the constituent material of the insulating portion 32 for forming the single-wire portion. The temperature difference between the two is preferably 100 DEG C or higher, and more preferably 150 DEG C or higher.

Next, in the heater according to another embodiment of the present invention, the constituent material of the resistance heat generating wiring portion 15, the wiring form thereof, and the number of power supply electrode portions are not particularly limited.

The constituent material of the resistance heat generating wiring portion 15 is preferably a resistance value temperature coefficient of 500 to 4,400 ppm / ° C, but is not limited thereto. The wiring of the resistance heat generating wiring portion 15 is preferably a parallel wiring, but the present invention is not limited to this, and a series wiring may be used. In the case of providing a rectangular pattern, the oblique rectangular pattern 20 shown in FIG. 1 (B), FIG. 2 and FIG. 3 is preferable, but it may be a pattern shown in FIG. The line width of the resistance heat generating wiring portion 15 is preferably 5 to 27 占 퐉, more preferably 7 to 24 占 퐉, and still more preferably 8 to 13 占 퐉.

In the heaters of other types in the present invention, the power supply terminal portion can be provided in three or more positions (not shown), if necessary.

The thicknesses of the power supply terminal portion and the conductor wiring portion are all preferably 5 to 27 탆, more preferably 7 to 24 탆, and still more preferably 9 to 12 탆.

As other types of heaters according to the present invention, it is preferable that the heaters of the present invention be arranged in a manner as shown in Figs. 12, 14, 15, 17, 18, 19, 20, 23, 24, 25, 26, Are shown in Figs. 28, 29, 30, 31, 32, 33, 34, The description of these drawings is the same as above except for the wiring pattern, and the description of all the components is applied.

Other types of heaters according to the present invention can generate heat by connecting the power supply terminal unit 17 to a conventionally known power supply apparatus. The exothermic temperature is preferably 50 ° C to 1,000 ° C.

By using the heater of the present invention, stable heat treatment can be performed for any of the organic matter, the inorganic substance, and the composite material obtained by combining them as the heat-treated article without depending on the size thereof, while suppressing temperature unevenness. The heat treatment method is selected depending on the purpose, purpose, and the like, but may be performed while moving the heater and the heat treatment object, or one side may be fixed and the other side may be moved.

The fixing device of the present invention includes the heater of the present invention. That is, the fixing device of the present invention is an apparatus for heating two heaters to bond two articles together.

The configuration of the fixing device of the present invention can be appropriately selected depending on the use of the obtained product, the fixing means, and the like. For example, in the case of having fixing means accompanied by pressing, and in the case of fixing toner or the like to a recording medium such as paper, and when joining a plurality of members, there is a heating portion provided with a heater, A fixing device having a fixing portion. Of course, it may be a fixing means not involving pressing. In the present invention, as shown in Fig. 37 and Fig. 38, it is preferable that the fixing device 5 for fixing the unfixed image including the toner formed on the surface of the recording medium such as paper or film to the recording medium Do.

37 and 38, the fixing device of the present invention will be described.

37 is a schematic view showing a main part of a fixing device 5 disposed in an electrophotographic image forming apparatus and includes a rotatable fixing roll 51 and a rotatable pressing roll 54, (1) is disposed inside the fixing roll (51). The heater 1 is preferably arranged so as to be close to the inner surface of the fixing roll 51.

In the fixing device 5 of Fig. 37, the heater 1 is driven by application of a voltage from a power supply (not shown), and the heat detected by a temperature measuring device (not shown) 51). Then, when a recording medium having a toner image not fixed on its surface is fed between the fixing roll 51 and the pressing roll 54, the pressure of the fixing roll 51 and the pressing roll 54 , The toner is melted and a fixed image is formed.

37, since the fixing roll 51 and the pressing roll 54 have the pressure contact portions, the fixing roll 51 and the pressing roll 54 are rotated together with the fixing roll 51 . As described above, since the local temperature rise, which is likely to occur when a small recording medium is used, is suppressed in the heater 1 as described above, temperature unevenness in the fixing roll 51 hardly occurs, . In addition, it is possible to suppress the damage to the members disposed around the heater 1.

38 is also a schematic view showing a main part of the fixing device 5 arranged in the electrophotographic image forming apparatus and includes a rotatable fixing roll 51 and a rotatable pressing roll 54 And a pressing roll 52 for pressing the recording medium together with the heater 1 and the pressing roll 54 for transferring heat to the fixing roll 51 are disposed inside the fixing roll 51 . The heater 1 is preferably disposed along the inner surface of the fixing roll 51.

In the fixing device 5 of Fig. 38, the heater 1 is driven by application of a voltage from a power supply (not shown), and heat detected by a temperature measuring device (not shown) 51). When a recording medium having an unfixed toner image on its surface is fed between the fixing roll 51 and the pressing roll 54, the fixing roll 51 is pressed against the pressing roll 52, And the pressing portion of the pressing roll 54, the toner is melted and a fixed image is formed.

38, since the fixing roll 51 and the pressing roll 54 have the pressure contact portions, the fixing roll 51 and the pressing roll 54 are rotated together with the fixing roll 51 do. As described above, since the local temperature rise, which is likely to occur when the small recording medium is used, is suppressed, the temperature of the fixing roll 51 is unlikely to be uneven, . In addition, it is possible to suppress the damage to the members disposed around the heater 1.

Another embodiment of the fixing device of the present invention is a mold having an upper mold and a lower mold, and a heater may be disposed inside at least one of the upper mold and the lower mold.

The drying apparatus of the present invention includes the heater unit including the heater of the present invention.

The configuration of the drying apparatus of the present invention can be appropriately selected depending on the shape, size, and the like of the article to be heat-treated. In the present invention, for example, a configuration may be adopted in which a housing portion, a hermetically-closable window portion arranged for inserting and receiving the object to be heat-treated, and a movable heater portion disposed inside the housing portion are provided. An exhaust part for exhausting the gas when the gas is exhausted by drying of the object to be heated, an exhaust part for regulating the pressure inside the housing part, , A pressure adjusting unit such as a vacuum pump, or the like.

The drying may be performed while fixing the heat treatment object and the heater portion, or by moving either one.

The heater of the present invention is suitable as a constituent member of an image forming apparatus.

The configuration of the image forming apparatus can be suitably selected depending on the use of the obtained product, the purpose of heating, and the like. For example, as shown in Fig. 39, there are image forming means for forming an unfixed image on the surface of a recording medium such as paper or film, fixing means 5 for fixing the unfixed image on a recording medium And the fixing means 5 can be the image forming apparatus 4 including the heater of the present invention.

The image forming apparatus will be described below based on Fig.

Fig. 39 is a schematic view showing the main part of the electrophotographic image forming apparatus 4. Fig.

As the image forming means, any of a system having a transfer drum and a system not having a transfer drum may be used, but Fig. 39 is a mode having a transfer drum.

The laser output from the laser scanner 41 is irradiated onto the charged surface of the photosensitive drum 44 charged with a predetermined potential by the charging device 43 while rotating, The electrostatic latent image corresponding to the desired image information is formed. Subsequently, the toner image is transferred to the surface of the transfer drum 46 interlocked with the photosensitive drum 44 by using the potential difference. Thereafter, the toner image is transferred onto the surface of the recording medium supplied between the transfer drum 46 and the transfer roll 47, and a recording medium having an unfixed image is obtained.

The image forming means may be provided with a cleaning device for removing insoluble toner or the like on the surface of the photosensitive drum 44 and the transfer drum 46, but is not shown in Fig.

The toner is a particle containing a binder resin, a colorant, and an additive, and the melting temperature of the binder resin is usually 90 to 220 캜.

The fixing means 5 may have the same structure as that of the fixing device according to the present invention and includes a pressing roll 54 and a heater holder 53 having a heater And a fixing roll 51 provided in the pressing roll 54 and cooperating with the pressing roll 54. A recording medium having an unfixed image from the image forming means is supplied between the fixing roll 51 and the pressing roll 54 to obtain a recording medium on which an image is fixed. That is, the heat of the fixing roll 51 melts the toner image of the recording medium, and the molten toner is pressed by the pressure contact portion between the fixing roll 51 and the pressing roll 54, An image is fixed on the recording medium.

In general, when the temperature of the fixing roll 51 becomes uneven and the amount of heat applied to the toner is too small, the toner is peeled from the recording medium, whereas if the amount of heat is too large, And the fixing roll 51 is circled around and reattached to the recording medium. However, according to the fixing means 5 having the heater of the present invention, the adjustment to the predetermined temperature is quick, The problem can be suppressed.

The fixing unit 5 of Fig. 39 is provided with the fixing roll 51 and the pressing roll 54. However, the image forming apparatus may be modified such that the fixing roll 5 is provided with the heater 1 Or may be provided with a fixation belt arranged in close proximity.

Other means not shown in the image forming apparatus 4 of Fig. 39 include recording medium conveying means, control means for controlling the recording medium conveying means, and the respective means.

[Example]

EXAMPLES Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples unless it exceeds the gist of the present invention.

[Example 1]

(1) Manufacture of stainless steel heaters

The stainless steel heater 1A shown in Fig. 40 was manufactured in the following manner.

After the surface of the substrate (length 270 mm, width 24 mm and thickness 0.6 mm) including SUS430 was subjected to a smoothening treatment, a material for forming a crystallized glass having a composition of SiO 2 -Al 2 O 3 -RO was dried at 100 탆 To the entire surface of the substrate. Subsequently, the coated film was baked at 850 占 폚 to obtain an insulating layer containing crystallized glass having a thickness of 85 占 퐉.

Thereafter, on the surface of the insulating layer 13, a paste containing a powder including a silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) without containing lead, cadmium, And a circuit pattern which was inclined in the longitudinal direction of the stainless steel substrate was printed. Subsequently, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heat generating wiring portion 15 is 0.5 mm and the line thickness is 13 m. A pattern for the power supply terminal portion 17 and the conductor wiring portion 19 for supplying power to the resistance heat generating wiring portion 15 is printed at a predetermined position by using a paste containing silver powder Respectively. The printed portion is fired at 850 占 폚 to be fed from one power supply terminal portion 17 to the other power supply terminal portion 17 via the resistance heating wiring portion 15 and the conductor wiring portion 19 having a plurality of parallel wirings 17 (see Fig. 40).

Subsequently, on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19, A first protective layer having a thickness of 50 mu m was formed. Then, an amorphous glass forming material composed of SiO 2 -Al 2 O 3 -B 2 O 3 -RO was applied to the surface of the first protective layer. Thereafter, the coated film was fired at 750 DEG C to form a second protective layer having a thickness of 25 mu m to obtain a stainless steel heater 1A (see Fig. 40). The first protective layer and the second protective layer Not).

(2) Evaluation of heater

This evaluation (hereinafter referred to as " evaluation E1 ") is used for an image forming apparatus such as a printer, a copying machine, and a facsimile employing an electrophotographic system or the like. The unfixed toner image carried on a recording medium such as paper is heated A heat sink 3A attached to a recording medium that takes heat is brought into contact with the back surface of the stainless steel heater 1A so as to heat the heat sink 3A, Contact portion contacting the stainless steel heater 1A and the temperature at the non-contact portion where the heat sink 3A does not contact the stainless steel heater 1A are observed with the passage of time. The heat sink 3A is made of aluminum and is integral with eight pins (16 mm x 100 mm) arranged in parallel at intervals of 5 mm as shown in Fig.

42 is a schematic view of an apparatus for evaluation E1. In this evaluation device, the stainless steel heater 1A is arranged so as to support both ends while the resistance heating wiring portion and the like are directed upward. A thermocouple (K type) is connected to the center of the heater 1A and an AC voltage (100 V) is supplied from the temperature controller "E5EN" manufactured by Omron Corporation to the power supply terminal portion 17 on both ends of the stainless steel heater 1A , Operates the stainless steel heater by PID control, and generates heat at a predetermined temperature. The temperature of the heater, which is changed by the contact of the heat sink 3A, was measured by a thermo-tracer "TH9100MR / WRI" manufactured by NEC Corporation located above the stainless steel heater 1A. The thermocouple and the temperature measuring instrument are not shown in Fig.

In this evaluation test, while the temperature of the stainless steel heater 1A was maintained at 200 占 폚, the contact positions of the back surface of the heat sink 3A and the back surface of the stainless steel heater 1A were changed, (P), (Q) and (R). (P), (Q) and (R) are all the center in the width direction of the stainless steel heater 1A, and (Q) is the center of the stainless steel heater 1A, 75 mm apart. The area of the side-on point is all about 0.8 mm 2.

A method of using the heat sink 3A is as follows. That is, after the heat sink 3A is contacted at the position P in the stainless steel heater 1A maintained at 200 DEG C for 2 minutes, the heat sink 3A is removed, and the temperature of the stainless heater 1A And waits to be restored to 200 ° C. Subsequently, after the heat sink 3A is brought into contact with the stainless steel heater 1A at the position Q for 2 minutes, the heat sink 3A is removed and the temperature of the stainless heater 1A is restored to 200 DEG C . Thereafter, the heat sink 3A was brought into contact with the stainless steel heater 1A at the position R for 2 minutes, and then the heat sink 3A was removed. In the three places P, Q and R, The test is terminated at a point where the temperature is almost constant.

The results of the evaluation E1 are shown in Fig. 43, when the heat sink 3A is in contact with the positions P and R in the stainless steel heater 1A, the temperature drop at each position is about 30 to 40 DEG C , And the heat sink 3A is in contact with the position Q, the temperature rise at the positions P and R was about 40 占 폚 to 50 占 폚.

[Example 2]

A paste containing a silver-palladium alloy (resistance value temperature coefficient of 1,000 ppm / 占 폚) without containing lead, cadmium, and nickel was used as the paste for forming the resistance heat generating wiring portion 15, The stainless steel heater 1A shown in Fig. 44 was manufactured in the same manner as in Example 1 except that the resistance heating wiring portion 15 having the pattern shown in Fig. 44 was formed, and the same evaluation as in Example 1 was carried out Respectively.

The results of the evaluation E1 are shown in Fig. 45, when the heat sink 3A is in contact with the positions P and R of the stainless steel heater 1A, the temperature drop at each position is about 30 占 폚 to 40 占 폚 , And when the heat sink 3A is in contact with the position Q, the temperature rise at the positions P and R is about 60 占 폚 to 70 占 폚.

[Comparative Example 1]

A paste containing a silver-palladium alloy (resistance value temperature coefficient of 1,000 ppm / 占 폚) without containing lead, cadmium, and nickel was used as the paste for forming the resistance heat generating wiring portion 15, The stainless steel heater shown in Figs. 46 and 47 was manufactured in the same manner as in Example 1 except that the resistance heating wiring portion 15 having the pattern shown in Fig. 46 was formed, and the same evaluation as in Example 1 was carried out Respectively.

The results of the evaluation E1 are shown in Fig. 48, when the heat sink 3A is in contact with the positions P and R in the heater, the temperature drop at each position is about 20 占 폚 to 80 占 폚, but the position Q The temperature rise at the positions P and R was about 80 ° C to 90 ° C when the heat sink 3A was in contact with the heat sink 3A.

[Comparative Example 2]

Evaluation was carried out in the same manner as in Example 1 using a commercially available ceramic heater having a resistance heating wiring portion having a pattern shown in Fig. The base material is Al 2 O 3 .

The results of the evaluation E1 are shown in Fig. 50, when the heat sink 3A is in contact with the positions P and R in the heater, the temperature drop at each position is about 50 캜 to 60 캜, but the position Q The temperature rise at the positions P and R was about 90 ° C to 110 ° C when the heat sink 3A was in contact with the heat sink 3A.

[Example 3]

(1) Manufacture of stainless steel heaters

The stainless steel heater 1B shown in Fig. 51 was manufactured in the following manner.

After the surface of the substrate (length 270 mm, width 24 mm and thickness 0.6 mm) including SUS430 was subjected to a smoothening treatment, a material for forming a crystallized glass having a composition of SiO 2 --Al 2 O 3 - To the entire surface of the substrate. Subsequently, the coated film was baked at 850 DEG C to form a crystallized glass film having a thickness of 25 mu m. This coating and firing were repeated twice to obtain an insulating layer having a thickness of 75 탆.

Thereafter, a paste containing a powder containing a silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) was used to form the resistance heating wiring portion 15 shown in FIG. 51 on the surface of the insulating layer A circuit pattern including a slanted rectangular pattern and folded back in the longitudinal direction of the stainless steel substrate was printed. Subsequently, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heat generating wiring portion 15 is 0.5 mm and the line thickness is 13 m. A pattern for the power supply terminal portion 17 and the conductor wiring portion 19 for supplying power to the resistance heat generating wiring portion 15 is printed at a predetermined position by using a paste containing silver powder Respectively. The printed portion is fired at 850 占 폚 to be fed from one power supply terminal portion 17 to the other power supply terminal portion 17 via the resistance heating wiring portion 15 and the conductor wiring portion 19 having a plurality of parallel wirings 17 (see Fig. 51).

Subsequently, on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19, Using the material, coating and firing were repeated twice to form a first protective layer having a thickness of 44 탆. Then, an amorphous glass forming material composed of SiO 2 -Al 2 O 3 -B 2 O 3 -RO was applied to the surface of the first protective layer. Thereafter, the coated film was baked at 750 占 폚 to form a second protective layer having a thickness of 20 占 퐉 to obtain a stainless steel heater 1B (see Fig. 51). The first protective layer and the second protective layer Not).

(2) Evaluation of heater

For the same purpose as in Examples 1 and 2, evaluation was performed using the apparatus shown in Fig. 52 (hereinafter referred to as " evaluation E2 "). An aluminum plate 3B (100 mm wide × 300 mm long × 1 mm thick) based on the heat sink 3A shown in FIG. 41 was used as the heat sink 3A in place of the heat sink 3A used in Example 1 and the like Lt; / RTI > The aluminum plate 3B and the rear surface of the heater were spaced apart to have a distance of about 1 mm.

In the evaluation E2 apparatus shown in Fig. 52, the stainless steel heater 1B is arranged so as to support both ends with the resistance heating wiring portion and the like directed upward. A thermocouple (K type) is connected to the center of the stainless steel heater 1B and an AC voltage (100 V) is supplied from the temperature controller "E5EN" manufactured by Omron Corporation to the power supply terminal portions 17 on both ends of the stainless steel heater 1B , The heater is activated by PID control, and heat is generated at a predetermined temperature. Then, the temperature of the heater changed by the installation of the aluminum plate 3B was measured by a thermo-tracer "TH9100MR / WRI" manufactured by NEC Corporation located above the stainless steel heater 1B. The thermocouple and the temperature measuring instrument are not shown in Fig.

In this evaluation test, the loading point of the aluminum plate 3B is set to the position Q 'in a state where the temperature of the stainless steel heater 1B is maintained at 200 占 폚, and three predetermined positions P '), (Q') and (R '). (P '), (Q') and (R ') are both the center in the width direction of the stainless steel heater 1B, At a position spaced apart by 75 mm. The area of the side-on point is all about 0.8 mm 2.

The test method using the aluminum plate 3B is as follows. That is, the aluminum plate 3B is placed at the position Q 'of the stainless steel heater 1B maintained at 200 ° C for 2 minutes, the aluminum plate 3B is removed, and the temperature of the stainless heater 1B Is waited for the temperature to return to 200 DEG C, and the experiment is terminated when the temperatures at three points (P '), (Q') and (R ') are almost constant.

The test result of evaluation E2 is shown in Fig. 53, when the aluminum plate 3B is at the position Q ', the temperature rise at the positions P' and R 'was about 25 ° C to 30 ° C.

[Example 4]

The stainless steel heater 1B shown in Fig. 54 was produced in the following manner, and evaluation E2 was conducted in the same manner as in Example 3.

After the surface of the substrate (length 270 mm, width 24 mm and thickness 0.6 mm) including SUS430 was subjected to a smoothening treatment, a material for forming a crystallized glass having a composition of SiO 2 --Al 2 O 3 - To the entire surface of the substrate. Subsequently, the coated film was baked at 850 DEG C to form a crystallized glass film having a thickness of 25 mu m. This coating and firing were repeated twice to obtain an insulating layer having a thickness of 75 탆.

Thereafter, a paste containing a powder containing a silver-palladium alloy (resistance value temperature coefficient of 1,000 ppm / 占 폚) was used to form the resistance heating wiring portion 15 shown in Fig. 54 on the surface of the insulating layer A circuit pattern including a slanted rectangular pattern and folded back in the longitudinal direction of the stainless steel substrate was printed. Subsequently, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heat generating wiring portion 15 is 0.5 mm and the line thickness is 13 m. A pattern for the power supply terminal portion 17 and the conductor wiring portion 19 for supplying power to the resistance heat generating wiring portion 15 is printed at a predetermined position by using a paste containing silver powder Respectively. The printed portion is fired at 850 占 폚 to be fed from one power supply terminal portion 17 to the other power supply terminal portion 17 via the resistance heating wiring portion 15 and the conductor wiring portion 19 having a plurality of parallel wirings 17 (see Fig. 54).

Subsequently, on the entire surface of the substrate including the surfaces of the obtained resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19, Using the material, coating and firing were repeated twice to form a first protective layer having a thickness of 44 탆. Then, an amorphous glass forming material composed of SiO 2 -Al 2 O 3 -B 2 O 3 -RO was applied to the surface of the first protective layer. Thereafter, the coated film was baked at 750 占 폚 to form a second protective layer having a thickness of 20 占 퐉 to obtain a stainless steel heater 1B (see Fig. 54). The first protective layer and the second protective layer Not).

The results of the evaluation E2 are shown in Fig. 55, when the aluminum plate 3B is at the position Q ', the temperature rise at the positions P' and R 'is about 25 ° C to 30 ° C.

[Example 5]

The stainless steel heater shown in Figs. 10 and 12, which is a schematic diagram, was manufactured in the following manner.

After smoothing the surface of the substrate (270㎜ × 24㎜ × 0.6㎜) containing the SUS430, the components are SiO 2 -Al 2 O 3 -RO (softening point: 740 degrees) in the material for forming crystallized glass, drying treatment And then coated on the surface of the substrate so as to have a thickness of 100 mu m. Subsequently, the coated film was baked at 850 占 폚 to obtain a first insulating layer 13 containing crystallized glass having a thickness of 85 占 퐉.

Thereafter, on the surface of the first insulating layer 13, a paste containing a powder including a silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) without containing lead, cadmium, A circuit pattern which is inclined in the widthwise direction of the stainless steel substrate including the inclined rectangular pattern to be the resistance heat generating wiring portion 15 shown in Fig. 10 was printed. Subsequently, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heat generating wiring portion 15 is 0.5 mm and the line thickness is 10 m. In addition, by using the paste containing the silver powder, the patterns for forming the power supply terminal portion 17 and the conductor wiring portion 19 for supplying power to the resistance heat generating wiring portion 15 are formed at predetermined positions . The printed portion is fired at 850 占 폚 to be fed from one power supply terminal portion 17 to the other power supply terminal portion 17 via the resistance heating wiring portion 15 and the conductor wiring portion 19 having a plurality of parallel wirings 17) (see Fig. 10).

Subsequently, on the surfaces of the resistance heating wiring portion 15 and the conductor wiring portion 19, a material for forming a crystallized glass used for forming the first insulating layer 13 was used and a second insulating Layer. At this time, the material for forming a crystallized glass was set so that the portion indicated by "32" (later, the portion for forming the insulating portion for forming a single-wire portion, size: 2 mm × 4 mm) And the line width of the conductor wiring portion 19 is exceeded. After the second insulating layer is formed, a concave portion is formed, and a part of the conductor wiring portion 19 indicated by "32" is exposed.

Thereafter, the same screen mask was used to leave an exposed portion of the conductor wiring portion 19 indicated by " 32 ", and a portion including SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: An amorphous glass forming material was applied to the surface of the second insulating layer. Then, the coated film was fired at 750 DEG C to form an overcoat layer having a thickness of 20 mu m. Subsequently, the amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C) was filled in the concave portion before the "32" was formed, and was fired at 450 ° C., The second insulating layer and the overcoat layer are not shown in Figure 10. In Figure 12, the resistance heating wiring portion 15, the second insulating layer 32, And the overcoat layer are not shown).

A voltage of AC 100 V was applied to each of the two power supply terminal portions 17 of the stainless steel heater obtained as described above to generate heat of the resistance heat generating wiring portion 15 so that the temperature of the stainless steel substrate portion was reduced to about 570 캜 (NEC / Quot; TH9100MR / WRI " manufactured by Avio). After 15 seconds from the application of the voltage, it was confirmed that the conductor wiring portion 19 which was in contact with the insulating portion 32 for forming the wire-wound portion was broken (see Fig. 4).

In the fifth embodiment, as shown in Fig. 10, the heaters having one insulating portion 32 for forming a single-wire portion are shown on the right side of the drawing. However, for example, It is possible to use a heater having an auxiliary insulating portion.

[Example 6]

The stainless steel heater shown in Figs. 11 and 14, which is a schematic diagram, was manufactured by the following procedure.

After smoothing the surface of the substrate including the SUS430, the components are SiO 2 -Al 2 O 3 -RO (softening point: 740 ℃) of applying a material for forming crystallized glass, the surface of the substrate so that after drying treatment 100㎛ Respectively. Subsequently, the coated film was baked at 850 占 폚 to obtain a first insulating layer 13 containing crystallized glass having a thickness of 85 占 퐉.

Thereafter, on the surface of the first insulating layer 13, a paste containing a powder including a silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) without containing lead, cadmium, A circuit pattern including a slanted rectangular pattern to be used as the resistance heating wiring portion 15 shown in Fig. 11 and folded back in the width direction of the stainless steel substrate was printed. Subsequently, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The resistance heating wiring portion 15 has a line width of 0.5 mm and a line thickness of 12 占 퐉. In addition, by using the paste containing the silver powder, the patterns for forming the power supply terminal portion 17 and the conductor wiring portion 19 for supplying power to the resistance heat generating wiring portion 15 are formed at predetermined positions . The printed portion is fired at 850 占 폚 to be fed from one power supply terminal portion 17 to the other power supply terminal portion 17 via the resistance heating wiring portion 15 and the conductor wiring portion 19 having a plurality of parallel wirings 17) (see Fig. 11).

Subsequently, on the surfaces of the resistance heating wiring portion 15 and the conductor wiring portion 19, a material for forming a crystallized glass used for forming the first insulating layer 13 was used and a second insulating Layer. At this time, the material for forming a crystallized glass was set such that the portion indicated by "32" (later the portion for forming the insulating portion for forming the single-wire portion, size: 1.7 mm x 2.5 mm) , And the line width of the resistance heat generating wiring portion (15) is exceeded. After the second insulating layer is formed, a recess is formed and a part of the resistance heat generating wiring portion 15 indicated by " 32 " is exposed.

Thereafter, using the same screen mask, SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C) was included while leaving the exposed portion of the resistance heat generating wiring portion 15 indicated by "32" Was applied to the surface of the second insulating layer. Then, the coated film was fired at 750 DEG C to form an overcoat layer having a thickness of 20 mu m. Subsequently, the amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C) was filled in the concave portion before the "32" was formed, and fired at 450 ° C, The second insulating layer and the overcoat layer are not shown in Figure 11. In Figure 14, the resistance heating wiring portion 15, the second insulating layer 32, And the overcoat layer are not shown).

A voltage of AC 100 V was applied to each of the two power supply terminal portions 17 of the stainless steel heater obtained as described above to generate heat of the resistance heat generating wiring portion 15 so that the temperature of the stainless steel substrate portion was reduced to about 570 캜 (NEC / Quot; TH9100MR / WRI " manufactured by Avio). After 10 seconds from the application of the voltage, it was confirmed that the resistance heat generating wiring portion 15 which had been in contact with the insulating portion 32 for forming the insulating portion was broken.

[Example 7]

The resistance heating wiring portion 15, the power supply terminal portion 17 and the conductor wiring portion 19 are formed on the substrate using aluminum nitride in place of the SUS430 having the first insulating layer 13, And a ceramic heater shown in Fig. 15, which is a schematic view, was produced.

Thereafter, a voltage of AC 100 V was applied to each of the two power supply terminal portions 17 of the obtained ceramic heater to generate heat of the resistance heat generating wiring portion 15 to raise the temperature of the aluminum nitride substrate portion to about 570 DEG C (NEC / Quot; TH9100MR / WRI " manufactured by Avio). After 10 seconds from the application of the voltage, it was confirmed that the resistance heat generating wiring portion 15 which had been in contact with the insulating portion 32 for forming the insulating portion was broken.

In Examples 5 to 7, an amorphous glass forming material containing SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C) was applied to the surface of the second insulating layer to form an overcoat layer However, instead of the amorphous glass forming material, an amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C.) used for forming the insulating portion 32 for forming a single-wire portion is used, A coating film may be formed on the surface of the second insulating layer to form an overcoat layer made of an insulating material. In this case, since the disconnection part forming insulation part 32 is in contact with the resistance heat generating wiring part 15, the overcoat layer having the same composition as the disconnection part forming insulation part 32 is prevented from being broken There is nothing to be done.

[Example 8]

The first insulating layer 13, the resistance heat generating wiring portion 15, the insulating portion 32 for forming a single-wire portion (second insulating layer), and the conductor wiring 15 are formed on the base portion 11 including stainless steel in the following manner. (19), and a stacked stainless steel heater shown in Fig. 18, which is a schematic view, was produced.

After smoothing the surface of the substrate including the SUS430, the components are SiO 2 -Al 2 O 3 -RO (softening point: 740 ℃) of applying a material for forming crystallized glass, the surface of the substrate so that after drying treatment 100㎛ Respectively. Subsequently, the coated film was baked at 850 占 폚 to obtain a first insulating layer 13 containing crystallized glass having a thickness of 85 占 퐉.

Thereafter, using a paste containing a powder including a silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) without containing lead, cadmium, and nickel and a paste containing silver powder, The patterns of the resistance heating wiring portion 15 and the power supply terminal portion 17A were respectively printed and fired at 850 ° C. As a result, a resistance heating wiring portion 15 including a rectangular pattern and having a series wiring in the width direction of the stainless steel substrate was obtained.

Subsequently, a second insulating layer 16 having a thickness of 55 m was formed on the surface of the resistance heating wiring portion 15 by using a material for forming a crystallized glass used for forming the first insulating layer 13 . At this time, the material for forming a crystallized glass was set such that the portion indicated by " 32 " in Fig. 18 (the portion where the insulating portion for forming the single-wire portion was later, the size: 1.7 mm x 2.5 mm) , And the line width of the resistance heat generating wiring portion (15) is exceeded. After the second insulating layer 16 is formed, a recess is formed, and a part of the resistance heat generating wiring portion 15 indicated by "32" is exposed.

Thereafter, amorphous glass forming material containing Bi 2 O 3 -Zn-B 2 O 3 (softening point: 506 ° C) was filled in the concave portion before the formation of "32", and baked at 550 ° C, Forming portion 32 was formed.

Subsequently, each pattern of the conductor wiring portion 19 and the power supply terminal portion 17B is printed so as to cover the exposed insulating portion 32 for forming the single-wire portion by using the paste containing the silver powder, And fired at 500 DEG C to form the conductor wiring portion 19 and the power supply terminal portion 17B. It is also confirmed that the line width of the conductor wiring portion 19 is 1 mm and the line thickness is 10 m and that the insulation portion 32 for the single-wire portion located on the lower layer side is longer than the line width of the conductor wiring portion 19 Respectively. Thereafter, an amorphous glass forming material containing Bi 2 O 3 -Zn-B 2 O 3 (softening point: 506 ° C) was applied to the surface of the conductor wiring portion 19. Then, the coating film was baked at 500 캜 to form an overcoat layer 21 having a thickness of 20 탆, thereby obtaining a stainless steel heater.

Thereafter, a voltage of AC100V was applied to each of the two power supply terminal portions 17A and 17B in the obtained stainless steel heater to generate heat in the resistance heat generating wiring portion 15, and the temperature of the stainless steel substrate portion was set to about 650 DEG C (NEC / &Quot; thermo-tracer " TH9100MR / WRI " manufactured by Avio). After 12 seconds from the application of the voltage, it was confirmed that the resistance heating wiring portion 15 and the conductor wiring portion 19 which were in contact with the insulating portion 32 for the wire-wound portion were broken.

[Example 9]

The resistance heating wiring portion 15, the power supply terminal portions 17A and 17B, and the conductor wiring portion (not shown) were formed on the substrate using aluminum nitride in place of the SUS430 having the first insulating layer 13, 19) and the like were formed, and a ceramic heater shown in Fig. 29, which is a schematic view, was manufactured.

Thereafter, a voltage of AC100V was applied to each of the two power supply terminal portions 17A and 17B of the obtained ceramic heater to generate heat in the resistance heat generating wiring portion 15 to raise the temperature of the aluminum nitride substrate portion to about 650 DEG C Measured by a thermo-tracer " TH9100MR / WRI " manufactured by NEC / Avio). After 13 seconds from the application of the voltage, it was confirmed that the resistance heat generating wiring portion 15 and the conductor wiring portion 19 were broken.

[Example 10]

The first insulating layer 13, the conductor wiring portion 19, the insulating portion 32 for forming a single-wire portion (second insulating layer), and the resistance heat generating wiring 32 are formed on the base portion 11 including stainless steel in the following manner. (15) in this order to produce a stacked stainless steel heater shown in Fig. 24 which is a schematic view.

After smoothing the surface of the substrate including the SUS430, the components are SiO 2 -Al 2 O 3 -RO (softening point: 740 degrees) of the material for the crystallized glass to form a coating on the surface of the substrate so that after drying treatment 100㎛ Respectively. Subsequently, the coated film was baked at 850 占 폚 to obtain a first insulating layer 13 containing crystallized glass having a thickness of 85 占 퐉.

Thereafter, each pattern of the power supply terminal portion 17A and the conductor wiring portion 19 for supplying electric power to the resistance heat generating wiring portion 15 is printed at a predetermined position by using a paste containing silver powder , And fired at 850 ° C.

Subsequently, a second insulating layer 16 having a thickness of 55 m was formed on the surface of the conductor wiring portion 19 by using the material for forming a crystallized glass used for forming the first insulating layer 13. At this time, the material for forming the crystallized glass was set so that the portion indicated by "32" (later the portion for forming the insulating portion for forming the single-wire portion, size: 1.7 mm × 2.5 mm) And the line width of the conductor wiring portion 19 is exceeded. After the second insulating layer 16 is formed, a concave portion is formed and a part of the conductor wiring portion 19 indicated by "32" is exposed.

Subsequently, the amorphous glass forming material containing SiO 2 -Al 2 O 3 -B 2 O 3 -RO (softening point: 580 ° C) was filled in the recess before "32" was formed, Thereby forming an insulating portion 32 for forming a single-wire portion.

Then, using a paste (softening point of material: 550 캜) containing powder including silver, palladium alloy (resistance temperature coefficient 1,500 ppm / 캜) without containing lead, cadmium and nickel, A circuit pattern including a slanting rectangular pattern for forming the resistance heating wiring portion 15 shown in Fig. 24 and folded back in the width direction of the stainless steel substrate was printed so as to cover the insulation portion 32 for formation . Subsequently, this printed portion was fired at 550 DEG C to form a resistance heating wiring portion 15 having a series wiring. The line width of the resistance heat generating wiring part 15 is 1 mm and the line thickness is 10 m and the insulation part 32 for the single wire part located on the lower layer side is longer than the line width of the resistance heat generating wiring part 15 Respectively. Thereafter, the pattern of the power supply terminal portion 17B for supplying power to the resistance heat generating wiring portion 15 is printed (printed) at a predetermined position using a paste (softening point of material: 550 DEG C) containing silver powder Respectively. Subsequently, an amorphous glass forming material containing Bi 2 O 3 -Zn-B 2 O 3 (softening point: 506 ° C) was applied to the surface of the resistance heating wiring portion 15. Then, the coated film was baked at 550 占 폚 to form an overcoat layer 21 having a thickness of 20 占 퐉 to obtain a stainless steel heater.

Thereafter, a voltage of AC100V was applied to each of the two power supply terminal portions 17A and 17B in the obtained stainless steel heater to generate heat in the resistance heat generating wiring portion 15, and the temperature of the stainless steel substrate portion was set to about 650 DEG C (NEC / &Quot; thermo-tracer " TH9100MR / WRI " manufactured by Avio). After 12 seconds from the application of the voltage, it was confirmed that the resistance heating wiring portion 15 and the conductor wiring portion 19 which were in contact with the insulating portion 32 for the wire-wound portion were broken.

In the eighth to tenth embodiments, the resistance wiring portion 15 is used as a series wiring, and the conductor wiring portion 19, the insulating portion for forming a broken line portion 32, and the resistance heating wiring portion 15 are formed in a vertical direction from the substrate, But the resistive heating wiring portion 15 is a parallel wiring and the three contacts are in contact with each other. For example, at the position of "32" shown in FIG. 10, A heater having an insulating portion can be formed.

[Example 11]

The resistance heating wiring portion 15 is formed on one surface side of the base portion 11 including stainless steel and the conductor wiring portion 19 and the insulating portion 32 for forming a single wire portion are formed on the other surface side And a stacked stainless steel heater shown in Fig. 27, which is a schematic view, was produced.

On both sides of the substrate, a crystallized glass of a material for forming, so that the 100㎛ after drying treatment: After smoothing the surfaces of the substrate including the SUS430, the components are SiO 2 -Al 2 O 3 -RO ( 740 ℃ softening point) Respectively. Subsequently, the coated film was baked at 850 캜 to obtain a first insulating layer 13 and a third insulating layer 23 including crystallized glass having a thickness of 85 탆.

Thereafter, a paste containing a powder containing silver-palladium alloy (resistance temperature coefficient 1,500 ppm / 占 폚) without containing lead, cadmium, and nickel was applied to the surface of the first insulating layer 13, A circuit pattern including a slanting rectangular pattern for forming the resistance heating wiring portion 15 as shown in Fig. 10 and folded back in the width direction of the stainless steel substrate was printed. Then, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heating wiring portion 15 is 0.5 mm and the line thickness is 11 m.

Subsequently, using a paste containing silver powder, a power supply terminal portion 17A for supplying power to the resistance heat generating wiring portion 15 at a predetermined position on the surface of the first insulating layer 13, The power supply terminal portion 17B and the conductor wiring portion 19 are formed in predetermined positions on the surface of the third insulating layer 23, Were printed. Then, these printed portions were fired at 850 占 폚 to form a resistance heating wiring portion 15 having a plurality of parallel wirings on one surface and a conductor wiring portion 19 on the other surface.

Thereafter, on the surfaces of the resistance heating wiring portion 15 and the conductor wiring portion 19, a material for forming a crystallized glass used for forming the first insulating layer 13 and the third insulating layer 23 was used , A first overcoat layer 21A and a second overcoat layer 21B having a thickness of 55 mu m were formed. At this time, the material for forming a crystallized glass was set such that the portion indicated by "32" (later the portion for forming the insulating portion for forming the single-wire portion, size: 1.7 mm × 2.5 mm) And the line width of the conductor wiring portion 19 is exceeded. After the second overcoat layer 21B is formed, a concave portion is formed and a part of the second overcoat layer 21B indicated by "32" is exposed.

Subsequently, the amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C) was filled in the concave portion before the "32" was formed, and was fired at 450 ° C., (32) was formed to obtain a stainless steel heater. In this stainless steel heater, the conductor wiring portion (terminal portion) 25 on the side (upper side) where the resistance heat generating wiring portion 15 is formed and the left end portion of the conductor wiring portion 19 on the lower side are connected by a connector, Or the like by means of a connecting member 27 such as a connecting member.

[Example 12]

The resistance heating wiring portion 15 and the power supply terminal portion 17A are formed in the same manner as in Embodiment 11 with respect to the substrate using aluminum nitride instead of the SUS430 having the first insulating layer 13 and the third insulating layer 23, And 17B, a conductor wiring portion (terminal portion) 25, a conductor wiring portion 19, and the like were formed to manufacture the ceramic heater shown in Fig. 34 which is a schematic view.

[Example 13]

A substrate having a through hole (circular shape, circular shape, inner diameter: 0.3 mm) which is made of aluminum nitride and which is vertically opened at one end side thereof is used, and the ceramic heater shown in Fig. 35 Respectively.

Using a paste containing a powder including a silver-palladium alloy (temperature coefficient of resistance value 1,500 ppm / 占 폚) without containing lead, cadmium, and nickel at a predetermined position on the surface of the first surface of the substrate, , And a circuit pattern that was inclined in the width direction of the stainless steel substrate was printed. Then, this printed portion was fired at 850 캜 to form a resistance heating wiring portion 15. The line width of the resistance heat generating wiring portion 15 is 0.5 mm and the line thickness is 10 m.

Subsequently, by using the paste containing the silver powder, the respective patterns for forming the power supply terminal portion 17B and the conductor wiring portion 19 are printed at predetermined positions on the other surface side surface of the substrate, . On the other hand, in the predetermined position on the surface of the resistance heating wiring portion 15, the respective patterns for the power supply terminal portion 17A for supplying power to the resistance heating wiring portion 15 are printed, (19). These printed portions were fired at 950 占 폚 to form wiring between the power supply terminal portions 17A and 17B to which the resistance heating wiring portions 15 and the conductor wiring portions 19 having a plurality of parallel wirings were connected.

Thereafter, a material for forming a crystallized glass having a composition of SiO 2 -Al 2 O 3 -RO (softening point: 740 ° C) was used for the surface of the resistance heating wiring portion 15 and the conductor wiring portion 19, An overcoat layer 21A and a second overcoat layer 21B were formed. At this time, the material for forming a crystallized glass was set such that the portion indicated by " 32 " in Fig. 35 (the portion where the insulating portion for forming a single-wire portion was later, the size: 1.7 mm x 2.5 mm) And the line width of the conductor wiring portion 19 is exceeded. After the second overcoat layer 21B is formed, a concave portion is formed and a part of the second overcoat layer 21B indicated by "32" is exposed.

Subsequently, the amorphous glass forming material containing PbO-B 2 O 3 (softening point: 375 ° C) was filled in the concave portion before the "32" was formed, and was fired at 450 ° C., (32) was formed to obtain a ceramic heater.

≪ Industrial applicability >

By disposing the heater of the present invention in a heat treatment apparatus, it is possible to perform various functions such as fixing of toner and ink, bonding of a plurality of members, heat treatment of a coating film or a film, heat treatment of a metal product or a resin product, drying and solder reflow, Can be efficiently performed. Further, in the present invention, since the heater can be reduced in width, it is suitable for placement in a compact heat treatment apparatus.

The fixing device of the present invention is suitably used as a heat source for heating, keeping warm, etc., by being attached to an image forming apparatus such as an electrophotographic printing machine or a copying machine, home electric appliances, business use,

The drying apparatus of the present invention is suitable as an apparatus for drying the object to be heat-treated including water, an organic solvent and the like at a desired temperature. It can be used as a vacuum dryer (decompression dryer), a pressure dryer, a dehumidifying dryer, a hot air dryer, an explosion-proof dryer and the like.

1, 1A, 1B: Heater
11: Foundation
12: foundation layer
13: electrically insulating layer (first insulating layer)
15: Resistance heat generating wiring part
16: second insulating layer
17, 17A, 17B: power supply terminal portions
19: conductor wiring portion
20: oblique rectangular pattern
21, 21A, 21B: an overcoat layer
23: Third insulating layer
24: first protective layer
25: Second protective layer
32: Insulation part for forming a single wire part
34: Electrical insulation part
3A, 3B: Heatsink
4: Image forming apparatus
41: Laser Scanner
42: mirror
43:
44: photosensitive drum
45: developing cartridge
46: Transfer drum
47: Transfer roll
5: Fixing device (fixing means)
51: Fixing roll
52: Pressurizing roll
53: Heater holder
54: pressure roll
6: Heater support
7: Temperature controller
P: recording medium

Claims (21)

A long base portion,
A resistance heating wiring portion having a plurality of parallel wirings which are heated by energization and which are formed in a surface side or inside of the base portion in an electrically insulated state with respect to the base portion;
Wherein a number of the power supply terminal portions is at least two and the power supply is provided to the resistance heat generating wiring portion And a power supply terminal portion for electrically connecting one terminal portion and the other terminal portion through the resistance heat generating wiring portion,
Wherein the resistance heat generating wiring portion includes a material having a resistance value temperature coefficient of 500 to 4,400 ppm / 占 폚, and the parallel wiring includes a slanted rectangular pattern.
The method according to claim 1,
The number of the power supply terminal portions is two,
Wherein the number of conductor wirings is two, and the one end and the other end of the resistance heating wiring portion and the other end of the resistance heating wiring portion are electrically insulated from the base portion, A conductor wiring portion for electrically connecting the two power supply terminal portions separately,
The resistance heating wiring portion and the conductor wiring portion are formed on the upper surface side or the lower surface side surface of at least one of the resistance heating wiring portion and the portion of the conductor wiring portion with a line width equal to or more than the line width of the resistance heating wiring portion or the line width of the conductor wiring portion, Wherein at least one kind of material selected from the material (m1) constituting the resistance heating wiring portion and the material (m2) constituting the conductor wiring portion reacts with the resistance heating wiring portion when the resistance heating wiring portion becomes a predetermined temperature or more And an insulating portion for forming a single-wire portion for forming an electrically insulating portion by the reaction and disconnecting the resistance heating wiring portion or the conductor wiring portion.
3. The method of claim 2,
Wherein the base portion comprises a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrically insulating layer formed on a surface of the base layer,
And the resistance heat generating wiring portion is formed on the surface of the electrically insulating layer.
The method of claim 3,
Wherein the heater is a multilayer heater having the resistance heat generating wiring portion and the conductor wiring portion in this order on the surface of the electrically insulating layer of the base portion, And a portion of the conductor wiring portion has a sequentially-contacted portion.
3. The method of claim 2,
Wherein the base portion includes an insulating ceramics,
And the resistance heat generating wiring portion is formed on a surface of the base portion.
6. The method of claim 5,
Wherein the heater is a multilayer heater having the resistive heat generating wiring portion and the conductor wiring portion in this order on the surface of the base portion, wherein the heater is formed on at least a part of the resistance heat generating wiring portion, at least a part of the insulating portion for forming the single wire portion, A heater partly having a sequentially surface-contacted part.
3. The method of claim 2,
Wherein the base portion comprises a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrically insulating layer formed on a surface of the base layer,
And the conductor wiring portion is formed on the surface of the electrically insulating layer.
8. The method of claim 7,
Wherein the heater includes a conductor wiring portion and a resistance heat generating wiring portion in this order on the surface of the electrically insulating layer of the base portion, wherein at least a part of the conductor wiring portion, at least a part of the insulating portion for forming the single- And a portion of the resistance heat generating wiring portion has a portion which is sequentially contacted with the surface.
3. The method of claim 2,
Wherein the base portion includes an insulating ceramics,
And the conductor wiring portion is formed on a surface of the base portion.
10. The method of claim 9,
Wherein the heater is a multilayer heater including the conductor wiring portion and the resistance heat generating wiring portion in this order on the surface of the base portion, wherein at least a part of the conductor wiring portion, at least a part of the insulation portion for forming the single- A heater partly having a sequentially surface-contacted part.
11. The method according to any one of claims 2 to 10,
And the resistance heat generating wiring portion includes silver alloy.
12. The method according to any one of claims 2 to 11,
And the conductor wiring portion includes silver.
13. The method according to any one of claims 2 to 12,
Wherein the insulating portion for forming the single-wire portion includes at least one selected from the group consisting of bismuth glass and lead-based glass.
The method according to claim 1,
Wherein the base portion comprises a base layer comprising stainless steel, aluminum or an aluminum alloy, and an electrically insulating layer formed on a surface of the base layer,
Wherein the resistance heat generating wiring portion and the power supply terminal portion are formed on a surface of the electrically insulating layer.
15. The method of claim 14,
And the resistance heat generating wiring portion includes silver alloy.
The method according to claim 1,
Wherein the base portion includes an insulating ceramics,
Wherein the resistance heat generating wiring portion and the power supply terminal portion are formed on a surface of the base portion.
The method according to claim 1,
Wherein the base portion includes an insulating ceramics,
And the resistance heat generating wiring portion is formed inside the base portion.
18. The method according to claim 16 or 17,
Wherein the resistance heat generating wiring portion comprises tungsten or molybdenum.
A long base portion,
A resistance heat generating portion formed on the surface of or inside the base portion so as to be electrically insulated with respect to the base portion,
Two power supply terminal portions formed on the front surface or inside of the base portion in an electrically insulated state with respect to the base portion,
Wherein the number of conductor wirings is two, and the one end and the other end of the resistance heating wiring portion and the other end of the resistance heating wiring portion are electrically insulated from the base portion, A conductor wiring portion for electrically connecting the two power supply terminal portions separately,
The resistance heating wiring portion and the conductor wiring portion are formed on the upper surface side or the lower surface side surface of at least one of the resistance heating wiring portion and the portion of the conductor wiring portion with a line width equal to or more than the line width of the resistance heating wiring portion or the line width of the conductor wiring portion, Wherein at least one kind of material selected from the material (m1) constituting the resistance heating wiring portion and the material (m2) constituting the conductor wiring portion reacts with the resistance heating wiring portion when the resistance heating wiring portion becomes a predetermined temperature or more And an insulating portion for forming a single-wire portion for forming an electrically insulating portion by the reaction and disconnecting the resistance heating wiring portion or the conductor wiring portion.
A fixing device comprising the heater according to any one of claims 1 to 19. A drying apparatus comprising the heater according to any one of claims 1 to 19.
KR1020147015146A 2011-11-15 2012-09-12 Heater, and fixing device and drying device provided with same KR102037827B1 (en)

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