KR102026963B1 - Substrate processing apparatus and substrate processing system including the same - Google Patents

Substrate processing apparatus and substrate processing system including the same Download PDF

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Publication number
KR102026963B1
KR102026963B1 KR1020140067719A KR20140067719A KR102026963B1 KR 102026963 B1 KR102026963 B1 KR 102026963B1 KR 1020140067719 A KR1020140067719 A KR 1020140067719A KR 20140067719 A KR20140067719 A KR 20140067719A KR 102026963 B1 KR102026963 B1 KR 102026963B1
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KR
South Korea
Prior art keywords
transfer
substrate
upper cover
unit
frame
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KR1020140067719A
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Korean (ko)
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KR20150139293A (en
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박해윤
이병우
노일호
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주식회사 원익아이피에스
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Publication of KR20150139293A publication Critical patent/KR20150139293A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers

Abstract

The present invention provides a substrate processing apparatus capable of processing a plurality of substrates at the same time, and a process module including a process chamber and a plurality of process spaces disposed in the process chamber and each processing a substrate, for a substrate processing system including the same. And a substrate processing apparatus disposed in the process chamber, the substrate processing apparatus including a transfer module for sequentially supplying the substrates to the plurality of process spaces by moving the substrate up and down and back and forth.

Figure R1020140067719

Description

Substrate processing apparatus and substrate processing system including the same {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of simultaneously processing a substrate and a substrate processing system including the same.

In general, the substrate processing system controls the charging of the substrate into the chamber and the desired processing on the substrate. A substrate processing system for a conventional deposition process combines a transfer chamber and a process chamber in a cluster type or an in-line type to process substrates in sheet units.

For example, in order to perform processes, such as film-forming and etching, on the glass substrate as a to-be-processed object used for manufacture of a display element, plasma processing is used from the viewpoint of the processing speed and controllability, and the apparatus in a batch type is used. A single processing apparatus has been used that meets the requirements for throughput by avoiding the complexity of the structure and improving the performance of the plasma.

However, this conventional substrate processing apparatus has a problem that can not process a plurality of substrates at the same time. The present invention has been made to solve various problems including the above problems, and can provide a substrate processing apparatus capable of simultaneously processing a plurality of substrates and a substrate processing system including the same. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to an aspect of the present invention, a process module, a process module disposed in the process chamber and including a plurality of process spaces for processing a substrate, and disposed in the process chamber, move the substrate up and down and back and forth to Provided is a substrate processing apparatus including a transfer module for sequentially supplying each of the substrates to a plurality of process spaces.

The process module may include a plurality of upper cover units, a first process frame having the plurality of upper cover units spaced apart from each other in the vertical direction, and a lower portion of the plurality of upper cover units, respectively, to which the substrate is to be seated. And a plurality of lower stage units which can be combined with the plurality of upper cover units to form the plurality of process spaces, respectively, and as the plurality of lower stage units are combined, the plurality of lower stage units It may include a second process frame for moving up and down at the same time.

The plurality of upper cover units may be movably coupled to the first process frame in a vertical direction. The first process frame includes a plurality of protruding frame brackets and a plurality of limiting pins extending upwardly and fixed to the plurality of frame brackets, respectively, wherein the plurality of upper cover units are connected to the plurality of frame brackets. A cover bracket may be mounted on each of the plurality of restriction pins movably coupled to the plurality of restriction pins.

The second process frame may be coupled to the first process frame so as to be movable in the vertical direction.

The second process frame may be coupled to a portion extending up and down of the first process frame, and may be movably coupled to the first process frame.

At least one of the plurality of upper cover units is formed on an upper surface of the upper cover unit, and is formed on an inlet through which process gas flows and a lower surface of the upper cover unit, respectively, along an edge of the process space S. It may be formed to include an injection port for injecting the process gas into the process space, the inlet and the injection port, at least a portion may include a fan-shaped injection flow path that is wider from the inlet to the injection port wider.

The injection hole may be disposed adjacent to an edge or an edge of the process space, and the inlet may be spaced apart from the injection hole in a central direction of the process space.

At least one of the plurality of upper cover units includes a first injection port for injecting a first process gas into the process space, a first suction port for sucking the first process gas from the process space, and a first injection port to the process space. A second injection port for injecting a second process gas and a second suction port for sucking the second process gas from the process space, wherein the first process gas and the second process gas cross each other in the process space; In order to flow in the direction, the direction in which the first injection port and the first suction port are disposed may cross the direction in which the second injection port and the second suction port are disposed.

The plurality of mask units may be disposed between the plurality of upper cover units and the plurality of lower stage units, and disposed on the substrate.

At least one of the plurality of upper cover units may include: a curtain groove extending along edges of lower surfaces of the plurality of upper covers, and the upper cover unit so that curtain gas may block the inside and the outside of the process space. Is formed on the lower surface of the may include a plurality of curtain holes formed in the curtain groove.

The first process frame includes a process cooling flow path formed therein so that the coolant flows, and the upper cover unit includes a lead cooling flow path provided in the center portion, and the process cooling flow path and the lead cooling flow path flows through the coolant flow path. Can be interconnected.

It extends up and down to penetrate the plurality of lower stage units, respectively, and an upper end may seat the substrate, and a lower end is supported or supported by an upper cover unit positioned below the lower stage unit among the plurality of upper cover units. It may include a plurality of substrate lift pins, which may be supported by the plate.

The plurality of substrate lift pins may move relative to the lower stage unit.

The transfer module may include a transfer frame disposed in a process chamber, a transfer stage installed on the transfer frame so as to be movable up and down, a transfer fork unit installed on the transfer stage and movable on the transfer stage, and the substrate mounted thereon; It may include a drive assembly for moving the transfer fork back and forth.

The drive assembly may include a transfer drive unit, a transfer shaft rotatably installed on the transfer frame, extending in an up and down direction, rotated by the transfer drive unit, and coupled to the transfer shaft so as to be movable up and down. A power transmission unit which is coupled together and rotatably coupled with the transfer shaft and connects the power transmission unit and the transfer fork unit to move the transfer fork unit forward or rearward according to a direction in which the power transfer unit rotates. It may include a conversion unit.

The power conversion unit, the first transfer gear coupled to the transfer stage, the transfer fork is fixedly coupled, the transfer to connect the power transfer unit and the first transfer gear to convert the rotational movement of the power transfer unit to linear movement It may include a connecting member.

The transfer connecting member may be a chain or a belt.

The power converter may include a second transfer gear coupled to the transfer stage, and the transfer connecting member may connect the first transfer gear, the second transfer gear, and the power transfer unit.

The power converter includes a tension gear movably coupled to the transfer stage, the tension gear pressurizing the transfer connecting member so that the transfer connecting member maintains a tension of a specific strength or more, and a pressing member providing elastic force to the tension gear. can do.

On the other hand, according to another aspect of the present invention, a substrate transporting apparatus including a transport chamber and a robot arm arranged in the transport chamber to carry in and out of the substrate, the above-described tactics for processing the substrate brought in from the substrate transport device A substrate processing system is provided that includes a substrate processing apparatus.

According to one embodiment of the present invention made as described above, it is possible to implement a substrate processing apparatus capable of processing a plurality of substrates at the same time and a substrate processing system including the same. Of course, the scope of the present invention is not limited by these effects.

1 is a plan view schematically showing a substrate processing system according to embodiments of the present invention.
2 is a side view schematically showing a substrate processing apparatus according to embodiments of the present invention.
3 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
4 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
5 is a cross-sectional view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
6 is a perspective view illustrating a defecation of a portion of a substrate processing apparatus according to embodiments of the present disclosure.
7 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
8 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
9 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
10 is a rear view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
11 is a rear view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.
12 is a perspective view schematically illustrating a portion of a substrate processing apparatus according to embodiments of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms, and the following embodiments are intended to complete the disclosure of the present invention, the scope of the invention to those skilled in the art It is provided to inform you completely. In addition, the components may be exaggerated or reduced in size in the drawings for convenience of description.

In the following embodiments, the x-axis, y-axis and z-axis are not limited to three axes on the Cartesian coordinate system, but may be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other. In addition, up and down (z direction), left and right (x direction), front and rear directions (y direction) can be interpreted in a broad sense including this.

In addition, in the following embodiments, the coupling and the connection may mean not only the direct coupling and the connection but also the indirect coupling and the connection.

1 is a plan view schematically showing a substrate processing system. The substrate processing system may include a substrate processing apparatus 10 and a substrate transport apparatus 20.

The substrate transport apparatus 20 may include a transport chamber 20 through which the substrate G is carried in and out, and a robot arm 22 that carries in and out of the substrate G. The substrate transport apparatus 20 may receive the substrate G from the load lock chamber (not shown) and pass the substrate G to the substrate processing apparatus 10. At this time, the robot arm 22 may transport the substrate (G). The robot arm 22 may transfer the substrate G up and down, before and after rotation, and left and right. The robot arm 22 may include two picks 23 on which the substrate G is seated.

In addition, the transport chamber 20 may maintain a vacuum state. In addition, the transport chamber 20 may be formed with a gate for drawing in and out of the substrate G, and an exhaust port (not shown) for vacuum may be formed.

The substrate processing apparatus 10 may perform atomic layer deposition, chemical vapor deposition, or the like, on the substrate G carried in from the substrate transport apparatus 20 in a vacuum state. Of course, the present invention is not limited thereto, and the substrate processing apparatus 10 may process the substrate even in a non-vacuum state. Hereinafter, the substrate processing apparatus 10 will be described in more detail with reference to the accompanying drawings.

2 is a sectional view schematically showing the substrate processing apparatus 10. The substrate processing apparatus 10 may include a process chamber 100, a transfer module 300, and a process module 200.

1 to 2, the process chamber 100 may be connected to the transport chamber 20. The process chamber 100 may be in a vacuum state. In addition, a portion connecting the process chamber 100 and the transport chamber 20 may also be maintained in a vacuum. In addition, the process chamber 100 may include a gate 101 through which the substrate G is loaded and taken out. The process chamber 100 may be formed of a substantially rectangular parallelepiped. Of course, it is not limited thereto, and the process chamber 100 may be formed in various forms.

The process module 200 may be disposed in the process chamber 100 and may include a plurality of process spaces S for processing the substrate G, respectively.

The transfer module 300 may be disposed in the process chamber 100, and may sequentially supply the substrate G to the plurality of process spaces S by moving the substrate G up and down and back and forth.

3 is a perspective view schematically illustrating a process module 200 of a substrate processing apparatus according to embodiments of the present invention.

The process module 200 will be described in detail with reference to FIGS. 2 and 3.

The process module 200 may include a process frame, an upper cover unit 210, a lower stage unit 220, and a lift unit 230.

The upper cover unit 210 may form the process space S. FIG. For example, the upper cover unit 210 may form at least a portion of the process space S by digging upward from the center of the concave bottom surface. Hereinafter, the upper cover unit 210 will be described as having a concave lower surface. The upper cover unit 210 may have a flat or convex lower surface, and the lower stage unit 22, which will be described later, may have a concave space to form the process space S. FIG.

The upper cover unit 210 may be connected to the tube or tube to supply the process gas to the process space (S). The process space S may be a small space formed in the process chamber 100 as a space where the substrate G is processed.

The upper cover unit 210 may be disposed to be spaced apart from each other in the vertical direction. In this case, the upper cover unit 210 may be spaced apart at approximately the same interval. The upper cover unit 210 may be formed in an approximately rectangular box shape. Of course, it is not limited to this.

At least one of the plurality of upper cover units 210 may include various components to be described below. Specifically, the plurality of upper cover units 210 may include a lid 211, a cover 212, an inlet 214, and an injection hole 215. And the like, respectively. Alternatively, only some of the plurality of upper cover units 210 may include the above components. Hereinafter, the plurality of upper cover units 210 will be described as including components, but is not limited thereto.

In detail, the upper cover unit 210 may include a lid 211 on which various pipes for process gas injection are disposed on an upper surface thereof, and may include a lid 211 and a cover 212 covering the pipe. 2 and 3 illustrate a state in which the pipe is covered by the cover 212.

The lower stage unit 220 may be formed in plural, and may be disposed below the plurality of upper cover units 210, respectively. The substrate G may be seated and may be coupled to the plurality of upper cover units 210 to form a plurality of process spaces S as they move upward. For example, the upper cover unit 210 is disposed above the lower stage unit 220, and this arrangement may be repeated upward as shown.

In addition, the lower stage unit 220 may include a flat top surface on which the substrate G is mounted. The lower stage unit 220 may include a heater 221 for heating the substrate G.

The lower stage unit 220 may form a process space S together with the upper cover unit 210. In detail, as the lower stage unit 220 moves upward, the concave space of the upper cover unit 210 may be closed to form the process space S. FIG. That is, the upper surface of the lower stage unit 220 and the concave space of the upper cover unit 210 may form the process space (S).

In this case, the plurality of lower stage units 220 may move upward to form a plurality of process spaces S. FIG. Of course, the plurality of lower stage units 220 may move downward together.

The plurality of lift units 230 may separate the substrate G from the lower stage unit 220. In detail, the plurality of lift units 230 may separate or seat the substrate G on the lower stage unit 220. The plurality of lift units 230 may include a plurality of substrate lift pins 231 that pass through the lower stage unit 220 and move in the vertical direction.

In this case, the plurality of substrate lift pins 231 may be caught by an upper surface of the lower stage unit 220. In addition, the lower end portion may contact the upper cover unit 210 disposed below the lower stage unit 220 among the plurality of upper cover units 210.

Meanwhile, as illustrated in FIG. 8, the lift unit 230 may include a mask lift pin 232 that lifts the mask 240 of FIG. 5. The mask lift pin 232 may be positioned above the substrate lift pin 231. That is, the mask lift pin 232 may be longer than the substrate lift pin 231.

The substrate lift pin 231 will be described in detail later.

On the other hand, the process frame is disposed in the process chamber 100, forms the overall appearance of the process module 200, the components of the process module 200 may be installed. The process frame may include a first process frame 260 and a second process frame 270.

4 is a perspective view schematically illustrating the upper cover unit 210 of the substrate processing apparatus 10. Hereinafter, the process frame will be described in more detail with reference to FIGS. 2, 3, and 4.

The plurality of upper cover units 210 may be coupled to the first process frame 260. For example, the first process frame 260 may be coupled such that the plurality of upper cover units 210 are spaced apart at regular intervals in the vertical direction. In addition, the first process frame 260 may be provided with various gas pipes. These gas pipes may be installed separately for each of the plurality of upper cover units 210.

For example, the first process frame 260 may include four frames extending in the vertical direction and a rectangular frame disposed thereon. Of course, the shape of the first process frame 260 is not limited thereto.

The plurality of lower stage units 220 may be coupled to the second process frame 270. For example, the second process frame 270 may include four frames extending in the vertical direction and a plurality of frames extending horizontally. The second process frame 270 may be coupled such that the plurality of lower stage units 220 are spaced apart at regular intervals. In this case, as described above, the plurality of lower stage units 220 and the upper cover unit 210 may be alternately disposed along the vertical direction.

Hereinafter, the vertical movement of the second process frame 270 will be described. The process module 200 may include a process screw 271 and a process drive unit 250.

The process screw 271 may extend in the vertical direction and may be rotatably coupled to the second process frame 270. In addition, the second process frame 270 is coupled to the process screw 271, and the second process frame 270 may be moved up and down as the process screw 271 rotates.

In this case, the plurality of lower stage units 220 may be coupled to the second process frame 270 to simultaneously move the plurality of lower stage units 220. Of course, the present invention is not limited thereto, and the process screw 271 may be directly coupled to the lower stage unit 220 to raise and lower the lower stage unit 220.

The process driving unit 250 may provide a driving force to raise and lower the lower stage unit 220. For example, the process driving unit 250 is a motor and is disposed on an upper surface of the process chamber 100, and the process screw 271 may be connected to the process screw 271 by a bevel gear or the like to rotate the process screw 271. The process driving unit 250 is not limited to the motor, and the position is not limited to the upper surface of the process chamber 100.

Therefore, as the process driving unit 250 rotates in the forward or reverse direction, the rotation direction of the process screw 271 may be changed, and thus, the second process frame 270 and the lower stage unit 220 may be raised and lowered.

Meanwhile, the first process frame 260 may be coupled to the plurality of upper cover units 210 to be movable at predetermined intervals along the vertical direction. Although the upper and lower intervals of the plurality of upper cover units 210 and the upper and lower intervals of the plurality of lower stage units 220 are designed to be the same, the intervals may be different due to tolerances or thermal expansion. For this reason, each process space S formed by the combination of the plurality of upper cover units 210 and the plurality of lower stage units 220 may be different. In order to prevent this, the plurality of upper cover units 210 may be installed to be movable up and down.

In detail, the first process frame 260 may include a plurality of protruding frame brackets 261 and restriction pins 262 extending from the frame brackets 261. For example, the frame bracket 261 may protrude in the horizontal direction from the frame of the first process frame 260 extending in the vertical direction. The horizontal direction may be a front-rear direction or a left-right direction. The restriction pin 262 may extend upward from the frame bracket 261 and be fixed to the frame bracket 261.

The upper cover unit 210 may include a cover bracket 213 mounted on the frame bracket 261. For example, the frame bracket 261 may protrude in the horizontal direction from the upper cover unit 210. The cover bracket 213 may be movably coupled to the limit pin 262. The restriction pin 262 may limit the moving direction and the length of the upper cover unit 210 by the nail shape. In this case, the limit pin 262 may be fixed to the frame bracket 261. Accordingly, the cover bracket 213 may move up and down along the limit pin 262. Of course, the movement structure of the upper cover unit 210 is not limited to this, it is obvious that it can be moved to another structure.

The frame bracket 261, the restriction pin 262, and the cover bracket 213 may be each formed in plural.

Meanwhile, the second process frame 270 may be spaced apart from the first process frame 260 and independently moved up and down. However, in order to effectively use space, the second process frame 270 may be coupled to the first process frame 260 to be movable in the vertical direction. For example, the second process frame 270 may be movably coupled to surround a portion extending up and down of the first process frame 260.

5 is a cross-sectional view schematically showing the cross section of the upper cover unit 210 and the lower stage unit 220, and FIG. 6 is a rear view schematically showing the lower surface of the upper cover unit 210. As shown in FIG.

4 to 6, the upper cover unit 210 may inject the process gas and spray the process gas into the process space S. FIG. At this time, in order to process the substrate G uniformly, it is necessary to inject the process gas evenly into the process space (S). For this purpose, the flow path of the process gas can be widened in the advancing direction.

In detail, the upper cover unit 210 may include inlets 214a and 214b through which the process gas is injected, and injection holes 215a and 215b through which the process gas is injected into the process space S. FIG. For example, the inlets 214a and 214b may be formed on the upper surface of the upper cover unit 210, and the injection holes 215a and 215b may be formed on the lower surface of the upper cover unit 210. In this case, the injection holes 215a and 215b may be disposed along the edge of the process space S to flow the process gas to the substrate as a whole. As shown in detail, the injection holes 215a and 215b may be formed in plural and may be disposed side by side along the edge of the process space S. FIG. Alternatively, as illustrated, the injection holes 215a and 215b may be holes extending along the edge of the process space S. FIG.

In addition, the upper cover unit 210 connects the inlets 214a and 214b with the injection holes 215a and 215b, and at least a portion of the inlet flow passage widens from the inlets 214a and 214b to the injection holes 215a and 215b. 216a. The injection channel 216a includes a first injection channel connecting the first inlet 214a and the first injection port 215a and a first injection channel connecting the second inlet 214b and the second injection port 215b. can do.

The injection passage 216a may be widened in the horizontal direction or the front-rear direction. For example, when the inlets 214a and 214b are one hole, and the injection holes 215a and 215b are a plurality of holes arranged side by side, the injection passage 216a is the injection holes 215a and 215b at the inlets 214a and 214b. It may be a fan-shaped shape that becomes wider toward. As a result, the process gas may spread from the inlets 214a and 214b to the injection holes 215a and 215b, and may be evenly injected into the process space through the injection holes 215a and 215b arranged side by side.

In addition, the discharge passage 216b for discharging the gas via the process space S may also be the same as or similar to the injection passage 216a.

Meanwhile, the injection holes 215a and 215b may be disposed far from the portion where the substrate G is seated so that the chemical reaction is actively displayed in the process space S. FIG. For example, the injection holes 215a and 215b may be disposed adjacent to the edge or the edge of the process space S. Specifically, the injection holes 215a and 215b may be disposed in the concave space of the upper cover unit 210 and may be disposed at the edge of the concave space. The injection holes 215a and 215b may be formed in plural and may be continuously disposed along the edge of the process space S and / or the edge of the concave space.

The inlets 214a and 214b may be spaced apart from the injection holes 214a and 214b in the central direction of the process space S. FIG. In detail, the inlets 214a and 214b may be disposed adjacent to the center of the process space S and / or the upper cover unit 210. In this way, the injection holes 215a and 215b and the inlets 214a and 214b may be disposed to minimize the size of the upper cover unit 210, and the injection flow path 216a may be the maximum length in a limited space to diffuse the process gas. You can get as long as you can.

The upper cover unit 210 may inject and suck the process gas into the process space S as described above. For example, the process gas may include a first process gas and a second process gas. That is, the upper cover unit 210 may inject and inhale the first process gas into the process space S and inject and inhale the second process gas. For example, in the case of atomic layer deposition (ALD), the first process gas may be a source gas, and the second process gas may include a reaction gas.

The upper cover unit 210 may inject and suck the first process gas and the second process gas in a direction crossing each other. That is, in the process space S, the first process gas and the second process gas may flow in directions crossing each other. For example, the upper cover unit 210 may inject and inhale the first process gas in the front and rear directions, and inject and inhale the second process gas in the left and right directions.

In this way, by supplying the first process gas and the second process gas in the cross direction, it is possible to suppress the generation of particles by supplying to a separate supply line, regardless of the supply direction of the source gas and the reaction gas. In particular, when the first process gas and the second process gas are supplied in parallel directions, even if there is a time difference in each process gas supply, the paths are adjacent to each other, so that there is a high possibility of generating particles, but this problem is caused by crossing the flow directions of the process gases. Can be solved.

In addition, when the first process gas and the second process gas are supplied in parallel directions, the injection holes 215a and 215b and the suction ports 217a and 217b are disposed at both sides, respectively, so that the process gas supply path and the injection holes 215a and 215b and Although difficulties exist in manufacturing the suction ports 217a and 217b, the difficulties may be solved by supplying the first process gas and the second process gas in the cross direction.

Specifically, the inlets 214a and 214b may include a first inlet 214a through which the first process gas is introduced and a second inlet 214b through which the second process gas is introduced. The injection holes 215a and 215b may include a first injection hole 215a for injecting a first process gas and a second injection hole 215b for injecting a second process gas.

In addition, the suction ports 217a and 217b may suck the process gas to discharge the process gas existing in the process space S from the upper cover unit 210. The inlets 217a and 217b may be formed in plural and may be continuously disposed along the edge of the process space S and / or the edge of the concave space. That is, the inlets 217a and 217b may be formed at positions corresponding to the inlets 215a and 215b. The suction ports 217a and 217b may include a first suction port 217a for sucking the first process gas and a second suction port 217b for sucking the second process gas.

The first injection port 215a and the first suction port 217a may be disposed in a direction intersecting with an arrangement direction of the second injection port 215b and the second suction port 217b. For example, when the first injection port 215a and the first suction port 217a are disposed in the front-back direction, the second injection port 215b and the second suction port 217b may be disposed in the left-right direction. That is, in the process space S, the flow direction of the first process gas and the flow direction of the second process gas may be substantially perpendicular. In addition, the sucked gas may be discharged to the outside through the first and second discharge ports 218a and 218b formed in the upper cover unit 210. Alternatively, the first jet port 215a and the first suction port 217a may be located between the second jet port 215b and the second suction port 217b, and the second jet port 215b and the second suction port 217b may be provided. It may be located between the first injection port 215a and the first suction port 217a.

For example, in the case of atomic layer deposition (ALD), the spraying order of the process gas may inject and suck the first process gas, and then spray and suck the second process gas. At this time, the purge gas may be injected and sucked after the injection and suction of the first process gas and before the second process gas is injected.

Meanwhile, although the process chamber 100 is maintained in a vacuum during the process, particles floating in the process chamber 100 may be introduced into the process space S during the process. To block this, the upper cover unit 210 may inject the curtain gas to block the inside and the outside of the process space S from the outside of the process space S.

In detail, the upper cover unit 210 may have a plurality of curtain holes 291 formed on a lower surface thereof, and a curtain groove 292 extending along the edge thereof to connect the curtain holes 291. That is, the curtain groove 292 may be formed on the lower surface along the edge of the upper cover unit 210. The curtain hole 291 may be formed in the curtain groove 292.

The curtain gas may be injected through the curtain hole 291, and may flow along the curtain groove 292 because the gap between the upper cover unit 210 and the lower stage unit 220 is narrow, and may be injected downward to finally process Blocking the space (S) can prevent particles from flowing in.

7 is a perspective view schematically illustrating the process frame and the upper cover unit 210 of the substrate processing apparatus 10. The first process frame 260 may include a process cooling passage 280 extending along the inside to allow the refrigerant to flow. For example, the first process frame 260 may include a frame extending vertically as described above, and may include an empty space extending vertically in the vertically extending frame. This empty space may be the process cooling passage 280.

Since the first process frame 260 is formed by combining a plurality of frames, the process cooling channel 280 may be disconnected between the frames. Accordingly, the first process frame 260 may include a process cooling pipe 281 connecting the disconnected process cooling flow path 280. The refrigerant may circulate along the process cooling channel 260 through the process cooling tube 281.

Meanwhile, the upper cover unit 210 may include a lead cooling passage (219 of FIG. 5) in the center portion. The lead cooling path 219 of FIG. 5 cools the upper cover unit 210 to allow particles to be attached to the lower portion of the upper cover unit 210, thereby preventing particles from being attached to the substrate.

In this case, the lead cooling passage 219 of FIG. 5 may be connected to the process cooling passage 280. That is, the refrigerant may flow along the lead cooling passage 219 of FIG. 5 and the process cooling passage 280. In this case, the lead cooling passage 219 of FIG. 5 may extend to the process cooling passage 280, or a separate connection cooling tube 219a may be added. Due to this, a complicated configuration for supplying the refrigerant can be simplified, and the amount of refrigerant can be saved. The refrigerant here may be argon.

8 is a perspective view schematically showing some embodiments of the lower stage unit 220 and the lift unit 230 of the substrate processing apparatus 10. Referring to FIGS. 2, 3, and 8, the lower stage unit 220 may have the substrate G mounted thereon as described above, and may be lifted by the second process frame 270.

The lift unit 230 may include a substrate lift pin 231 as described above. The substrate lift pin 231 may have an upper end seating the substrate G, and a lower end may be supported by the upper cover unit 210 disposed below the lower stage unit 220 of the upper cover unit 210. have. Here, the substrate lift pin 231 may contact or be fixed to an upper surface of the upper cover unit 210 positioned below.

In other words, the upper part of the substrate lift pin 231 may be caught by the lower stage unit 220, and the body portion extending downward from the head portion may pass through the lower stage unit 220 to cover the upper cover unit 210. The lower stage unit 220 may be supported by the upper cover unit 210 disposed below or may be supported by the support plate 295.

The substrate lift pin 231 may be installed on the lower stage unit 220 to be movable in the vertical direction. For example, the substrate G may be inserted between the upper cover unit 210 and the lower stage unit 220 to be seated on the substrate lift pin 231. In this case, the lower stage unit 220 may be far from the upper cover unit 210 forming the process space S of the upper cover unit 220, and may be close to the upper cover unit 220 disposed below. Therefore, since the substrate lift pin 231 is supported on the upper surface of the upper cover unit 210 having the lower end of the body portion, the head portion of the substrate lift pin 231 protrudes upward of the lower stage unit 220 so that the substrate ( G) can be seated.

Then, as the lower stage unit 220 moves upward, the substrate lift pin 231 may seat the substrate (G in FIG. 2) on the lower stage unit 220. In this case, the head of the substrate lift pin 231 may not be protruded from the lower stage unit 220 by inserting the substrate (G of FIG. 2) into the lower stage unit 220.

In addition, even if the lower stage unit 220 moves upward, the substrate lift pin 231 may be moved by the upper cover unit 210 until the head of the substrate lift pin 231 contacts the upper surface of the lower stage unit 220. Since the substrate is not supported and moved, the substrate lift pin 231 may move relative to the lower stage unit 220.

The substrate lift pin 231 may rise together with the stage unit 220 after the head portion is caught by the lower stage unit 220.

This is possible because the substrate lift pin 231 extends downward from the head and protrudes downward through the lower stage unit 220 to be supported by the upper surface of the upper cover unit 210.

Meanwhile, the upper cover unit 210 may not exist below the lift unit 230 positioned at the bottom of the substrate lift pins 231. Thus, the lowermost lift unit 230 may be supported and moved by the base of the first process frame 260 or by a separate support plate 295.

That is, some of the plurality of substrate lift pins 231 may be supported by the upper cover unit 210 positioned below, and others may be supported by the support plate 295 positioned below. Here, the other part of the plurality of substrate lift pins 231 may be located at the lowermost end as described above, and the part of the plurality of substrate lift pins 231 may be located above the other part.

On the other hand, as shown in the figure, a plurality of separate support plates 295 may be positioned between the lower stage unit 220 and the upper cover unit 210 to support the lift unit 230.

Meanwhile, as shown in FIG. 5, the substrate processing apparatus 10 is disposed between the upper cover unit 210 and the lower stage unit 220 and may be disposed on the substrate G. The mask unit 240 may be disposed on the substrate G. As shown in FIG. It may include. The mask unit 240 is a concept including a mask covering at least a portion of the substrate and a mask frame in which the mask is coupled.

The mask part 240 may be coupled to the upper cover unit 210. Meanwhile, unlike FIG. 5, the mask part 240 may not be coupled to the upper cover unit 210, but may be separately provided and supported by the mask lift pin 232.

Since the support structure of the mask lift pin 232 is substantially the same as the support structure of the substrate lift pin 231, the overlapping description thereof will be omitted. Referring to FIGS. 2 and 9, the transfer module 300 of the substrate processing apparatus 10 may be omitted. It will be described in detail.

As described above, the transfer module 300 may be disposed in the process chamber 100, and the substrate G may be sequentially supplied to the plurality of process spaces S by moving the substrate G up and down and back and forth. The transfer module 300 may include a transfer frame 310, a transfer stage 320, a transfer fork 330, and a drive assembly 340.

The transfer frame 310 may be disposed in the process chamber 100. For example, the transfer frame 310 may include four vertically extending frames and a rectangular frame disposed thereon. Of course, the shape of the transfer frame 310 is not limited thereto.

The transfer stage 320 may be installed to be moved up and down in the transfer frame 310. For example, the transfer stage 320 is formed in the form of a square plate and is coupled to a transfer screw 350 connected to a transfer driving unit 370 to be described later, and may move up and down as the transfer screw 350 rotates.

The transfer stage 320 may include a guide portion 321 for guiding a moving direction of the transfer fork 330 which will be described later. The guide part 321 may include a guide groove 323 extending in the front-rear direction in the transfer stage. The guide groove 323 may be formed through the transfer stage 320. In addition, the guide part 321 may include a guide rail 322 formed on the upper surface of the transfer stage 320 in the front-rear direction of the transfer fork 330 to guide the moving direction.

The transfer module 300 may include a transfer drive unit 370 that provides power to move the substrate G up and down the transfer screw 350. For example, the transfer driving unit 370 is a motor and is disposed on the upper surface of the process chamber 100, and the transfer screw 350 may be connected to the transfer screw 350 by a bevel gear or the like to rotate the transfer screw 350. The transfer drive unit 370 is not limited to the motor, and the position is not limited to the upper surface of the process chamber 100.

Therefore, as the feed drive unit 370 rotates in the forward or reverse direction, the rotation direction of the feed screw 350 is changed, and thus the feed stage 320 may be raised and lowered.

The transfer fork 330 may be installed on the transfer stage 320 so as to be movable in the front-rear direction, and the substrate G may be seated. That is, the transfer fork 330 may receive the substrate G from the robot arm 22 of the substrate transportation device 20 and pass the substrate G to the process module 200.

The transfer fork 330 stably supports the substrate G, and may include three fork members 331 to avoid interference with the robot arm 22 and the substrate lift pin 231. Hereinafter, the transfer fork 330 will be described as including three fork members 331, but the number of the fork members 331 is not limited thereto. The fork member 331 of the transfer fork 330 has a bar shape extending in the front-rear direction so that the substrate G may be seated.

In addition, the transfer fork 330 may include a sliding member 332 that is movable to the transfer stage 320. In detail, the sliding member 332 may be coupled to the upper surface of the transfer stage 320 and coupled to the guide part 321. The sliding member 332 may be coupled to the fork member 331 at the top.

In more detail, a part of the sliding member 332 may extend downward through the guide groove 323 of the transfer stage 320. The power converter 343 to be described later may be coupled to a portion extending downward of the sliding member 332. A portion of the sliding member 332 inserted into the guide groove 321 may be shorter than the length of the front and rear directions of the guide groove 323.

In addition, the sliding member 332 may be coupled to the guide rail 322. For example, the sliding member 332 is fitted as shown in the guide rail 322 may move in the front and rear directions along the guide rail 322.

The drive assembly 340 may move the transfer fork 330 back and forth. In detail, the driving assembly 340 may include a transfer shaft 341, a power transmission unit 342, a power conversion unit 343, and a transfer driving unit 349. Hereinafter, the driving assembly 340 will be described in detail with reference to FIGS. 2 and 10.

The transfer driver 349 may include a motor to provide rotational force. For example, the transfer driver 349 may be provided outside the process chamber 100, and specifically, may be provided on an upper surface of the process chamber 100. Of course, the present invention is not limited thereto, and the transfer driver 349 may be provided on the bottom surface of the process chamber 100 or may be provided inside the process chamber 100.

The transfer shaft 341 is connected to the transfer driver 349 and may be rotated by the transfer driver 349. For example, the transfer driver 349 and the transfer shaft 341 may be connected by bevel gears, shafts, and the like. At this time, the transfer shaft 341 may be formed with a locking portion 341a extending in the vertical direction on the outer surface. The catching portion 341a may be a groove or a rib.

The power transmission unit 342 is movably coupled to the transfer shaft 341 and may rotate together with the transfer shaft 341. In this case, the power transmission unit 342 may move up and down together with the transfer stage 320. Specifically, the power transmission unit 342 is connected to the transfer fork 330 by the power conversion unit 343, and because the transfer fork 330 is coupled to the transfer stage 320, indirectly to the transfer stage 320 It can be combined to move in conjunction with the transfer stage 320.

Specifically, the power transmission unit 342 is a gear, the gear tooth may be formed on the outer peripheral surface. In addition, the power transmission unit 342 may wrap the transfer shaft 341 to be caught by the locking unit 341a. That is, the power transmission unit 342 may be fitted to the engaging portion 341a of the transfer shaft 341 to move together with the transfer stage 320 in the vertical direction, and may rotate together with the transfer shaft 341.

The power converter 343 connects the power transmission unit 342 and the transfer fork 330 to move the transfer fork 330 forward and backward as the power transmission unit 342 rotates. In more detail, the power converter 343 may include a first transfer gear 344 and a transfer connecting member 347.

The first transfer gear 344 may be coupled to the transfer stage 320. For example, the first transfer gear 344 may be rotatably coupled to the lower surface of the transfer stage 320 to avoid interference with the transfer fork 330.

The power converter 343 may convert a rotational motion into a linear motion. The transfer connecting member 347 connects the first transfer gear 344 and the power transfer unit 342 to rotate the power transfer unit 342. The motion can be converted to linear motion. In detail, the transfer connecting member 347 may connect the first transfer gear 344 and the power transmission unit 342 as a chain or a belt as shown. In particular, the transfer connecting member 344 is made of a chain can prevent deformation by heat. Hereinafter, the transfer connecting member 344 is described as a case of a chain, but is not limited thereto.

The first transfer gear 344 and the power transmission unit 342 may be disposed along the front and rear directions. In this case, in order to prevent the power transmission unit 342 and the transfer shaft 341 from overlapping with the entry and exit line of the substrate G, the power transmission unit 342 and the transfer shaft 341 may be formed on the side of the transfer frame 310 or It may be disposed adjacent to the corner. In addition, the transfer connection member 347 may wind the first transfer gear 344 and the power transmission unit 342 as a chain. At least a portion of the transfer connecting member 347 is disposed substantially parallel to the extending direction of the guide portion 321, and the transfer fork portion 330 may be coupled to the parallel portion. In this case, the transfer connecting member 347 may be coupled to a portion (sliding member 332) passing through the guide portion 321 of the transfer fork 330.

Therefore, the transfer shaft 341 and the power transmission unit 342 rotate together with the transfer driver 349, and the transfer connection member 347 may rotate as the power transmission unit 342 rotates. In addition, the transfer fork 330 may move in the front and rear directions according to the direction in which the transfer connection member 347 rotates.

On the other hand, Figure 11 is a rear view schematically showing a transport module 300 according to another embodiment of the present invention. The transfer module 300 according to the present embodiment is substantially the same as or similar to the transfer module 300 according to the above-described embodiment. Therefore, redundant description is omitted.

The power converter 343 may include a second transfer gear 345 coupled to the transfer stage 320, and the transfer connecting member 347 may include the first transfer gear 344 and the second transfer gear 345. And a power transmission unit 342. That is, the transfer connecting member 347 may surround the power transmission unit 342, the first transfer gear 344, and the second transfer gear 345.

In this case, the first transfer gear 344 and the second transfer gear 345 may be disposed along the front-back direction. In detail, the first transfer gear 344 and the second transfer gear 345 may be rotatably coupled to the lower surface of the transfer stage 320 and disposed adjacent to the guide part 321. In particular, the first transfer gear 344 and the second transfer gear 345 may be disposed adjacent to the guide groove 323 through which the transfer fork 330 of the guide portion 321 passes. Therefore, a straight portion connecting the first transfer gear 344 and the second transfer gear 345 of the transfer connecting member 347 may be disposed adjacent to the guide groove 323.

The transfer shaft 341 to which the power transmission unit 342 is coupled may be disposed in a left or right direction of the transfer stage 320. In this case, the transfer shaft 341 may be disposed outside the transfer stage 320.

Therefore, the transfer connecting member 347 connects the first transfer gear 344, the second transfer gear 345, and the power transfer member 342 to a substantially triangular shape, and does not overlap the copper wire of the substrate G, and stably transfers the transfer connecting member 347. The fork part 330 can be moved in the front-rear direction.

At this time, since the transfer connecting member 344 is made of a chain or belt, it may not be loose and move the transfer fork 330 to the correct position. In order to prevent this, the power converter 343 is movably coupled to the transfer stage 320 and the tension gear 346 pressurizes the transfer connecting member 347 so that the transfer connecting member 347 maintains a tension of a specific strength or more. ) And a pressing member 348.

Specifically, the tension gear 346 is movably coupled to the lower surface of the transfer stage 320, and between the first transfer gear 344 and the power transmission unit 342 or the second transfer gear 345 and the power transmission unit. May be disposed between 342. The tension gear 346 may be provided on the outside of the transfer connecting member 347 to press the transfer connecting member 347.

The pressing member 348 may provide an elastic force to the tension gear 346. In detail, the pressing member 348 may be formed of a spring having one end contacted and / or coupled to the tension gear 346 and the other end fixedly coupled to the transfer stage 320. Accordingly, the pressing member 348 may push the tension gear 348 to maintain the tension of the transfer connecting member 347.

12 is a perspective view schematically illustrating the transfer frame 310 of the transfer module 300 of the substrate processing apparatus 10.

The transfer frame 310 may be expanded or deformed by heat during the process. In order to prevent this, the transfer frame 310 may include a transfer cooling passage 360 formed therein to allow the refrigerant to flow.

For example, the transfer frame 310 may have an empty space extending vertically through which the refrigerant flows inside the vertically extending frame. This empty space may be the transfer cooling flow path 360.

In addition, since the transfer frame 310 is formed by combining a plurality of frames, the transfer cooling flow path 360 may be disconnected between the frames. Therefore, the transfer cooling channel 360 may include a transfer cooling pipe 361 connecting the empty space of the transfer frame 310. The refrigerant may flow along the transfer frame 310 through the transfer cooling tube 361.

Hereinafter, the operation of each component will be described according to the movement order of the substrate G.

The robot arm 22 of the substrate transport apparatus 20 may supply the substrate G to the transfer module 300 of the substrate processing apparatus 10. In detail, the robot arm 22 may move into the process chamber 100 to place the substrate G on the transfer fork 330 of the transfer module 300 and go out of the process chamber 100. In this case, the transfer fork 330 is in a backward state and may be positioned adjacent to the gate of the process chamber 100.

The transfer fork 330 may be advanced to position the substrate G between the upper cover unit 210 and the lower stage unit 220. In this case, the lower stage unit 220 is positioned to be spaced apart from the upper cover unit 210.

In addition, the transfer fork 330 may move downward to place the substrate G on the substrate lift pin 231. That is, the fork member of the transfer fork 330 may be inserted between the substrate lift pins 231, and the transfer stage 320 may move downward to seat the substrate G on the substrate lift pins 231. In this case, the lower end of the substrate lift pin 231 may be supported by the upper surface of the upper cover unit 210 positioned below and protrude from the lower stage unit 220.

The transfer fork 330 may be mounted on the substrate lift pin 231 and then moved backward to exit between the upper cover unit 210 and the lower stage unit 220.

The lower stage unit 220 is moved upward by the process driving unit, and thus the substrate G may be seated from the substrate lift pin 231 to the lower stage unit 220. The lower stage unit 220 may be combined with the upper cover unit 210 to form a process space S. FIG.

In this case, the mask unit 240 may be coupled to the upper cover unit 210 or may be mounted on the mask lift pin 232 disposed outside the substrate lift pin 231 on which the substrate G is seated. As the lower stage unit 220 moves upward, the lower stage unit 220 may be in close contact with the substrate G.

In addition, the substrate treating apparatus 10 may process a process on the substrate G.

After the substrate G processing process is completed, the lower stage unit 220 may move downward to open the process space S, and the substrate lift pin 231 may move the substrate G to the lower stage unit 220. Can be separated from Next, the transport fork 330 may lift the substrate G out of the container.

The above process may be repeated.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: substrate processing apparatus 20: substrate transportation apparatus
21: transport chamber 22: robot arm
100: process chamber 200: process module
210: upper cover unit 220: lower stage unit
221: heater 230: lift unit
300: transfer module 310: transfer frame
320: transfer stage 330: transfer fork
340: drive assembly 350: feed screw
360: transfer cooling flow path 370: transfer drive unit

Claims (21)

Process chambers;
A process module disposed in the process chamber, the process module including a plurality of process spaces for processing a substrate, respectively; And
A transfer module disposed in the process chamber and sequentially feeding the substrates to the plurality of process spaces by moving the substrates up and down and back and forth,
The transfer module,
A transfer frame disposed within the process chamber;
A transfer stage mounted to the transfer frame to be movable up and down;
A transfer fork part installed on the transfer stage so as to be movable back and forth and on which the substrate is seated; And
A drive assembly for moving the transfer fork back and forth;
Comprising a substrate processing apparatus. The method of claim 1,
The process module,
A plurality of top cover units;
A first process frame having the plurality of upper cover units spaced apart from each other in a vertical direction; And
A plurality of lower portions respectively disposed under the plurality of upper cover units, and the substrates may be seated, and may be combined with the plurality of upper cover units to form the plurality of process spaces, respectively, as they move upward; A stage unit; And
A second process frame to which the plurality of lower stage units are coupled and to move the plurality of lower stage units up and down simultaneously;
A substrate processing apparatus comprising a. The method of claim 2,
And the plurality of upper cover units are movably coupled to the first process frame in a vertical direction. The method of claim 3,
The first process frame includes a plurality of protruding frame brackets and a plurality of limiting pins extending upwardly and fixed to the plurality of frame brackets, respectively.
And the plurality of upper cover units may include a plurality of cover brackets that may be mounted on the plurality of frame brackets and are movably coupled to the plurality of restriction pins, respectively. The method of claim 2,
And the second process frame is movably coupled to the first process frame in a vertical direction. The method of claim 5,
And the second process frame is coupled to an extended portion of the first process frame and is movably coupled to the first process frame. The method of claim 2,
At least one of the plurality of upper cover units,
Inlets formed respectively on upper surfaces of the plurality of upper cover units, through which process gas is introduced;
Injection holes respectively formed on lower surfaces of the plurality of upper cover units and formed along edges of the process space S to inject the process gas into the process space; And
An inlet flow passage connecting the inlet port and the injection port and having at least a part of a fan shape widening from the inlet port toward the injection port;
Comprising a substrate processing apparatus. The method of claim 7, wherein
The injection hole is disposed adjacent to or near an edge of the process space,
And the inlet is spaced apart from the injection hole in the direction of the center of the process space. The method of claim 2,
At least one of the plurality of upper cover units,
A first injection port for injecting a first process gas into each said process space;
A first suction inlet for sucking the first process gas from the process space;
A second injection hole for injecting a second process gas into the process space; And
A second suction inlet for sucking the second process gas from the process space;
Including,
In the process space, the first injection port and the first suction port are disposed in such a manner that the first process gas and the second process gas intersect with each other so that the second injection port and the second suction port are disposed. The substrate processing apparatus which cross | intersects the direction arrange | positioned. The method of claim 2,
And a plurality of mask portions disposed between the plurality of upper cover units and the plurality of lower stage units, respectively, which can be disposed on the substrate. The method of claim 2,
At least one of the plurality of upper cover units,
A curtain groove extending along an edge of a lower surface of the plurality of top covers; And
A plurality of curtain holes formed in the lower surface of the upper cover unit so as to spray the curtain gas blocking the inside and the outside of the process space and formed in the curtain groove;
A substrate processing apparatus comprising a. The method of claim 2,
The first process frame includes a process cooling flow path formed therein for the refrigerant to flow,
The plurality of upper cover units include a lead cooling flow path provided in the center portion,
And the process cooling passage and the lead cooling passage are interconnected to allow a refrigerant to flow. The method of claim 2,
It extends up and down to penetrate the plurality of lower stage units, respectively, and an upper end may seat the substrate, and a lower end is supported or supported by an upper cover unit located below the plurality of lower stage units among the plurality of upper cover units. A substrate processing apparatus comprising a plurality of substrate lift pins, which can be supported by a plate. The method of claim 13,
And the plurality of substrate lift pins are movable relative to the plurality of lower stage units. delete The method of claim 1,
The drive assembly,
A feed drive unit;
A transport shaft rotatably installed in the transport frame, extending in the vertical direction, and rotated by the transport drive unit;
A power transmission unit coupled to the transfer shaft so as to be movable up and down and moving together with the transfer stage and rotatably coupled with the transfer shaft; And
A power conversion unit connecting the power transmission unit and the transfer fork unit to move the transfer fork unit forward or rearward according to a direction in which the power transfer unit rotates;
Comprising a substrate processing apparatus. The method of claim 16,
The power converter,
A first transfer gear coupled to the transfer stage; And
A transfer connecting member fixedly coupled to the transfer fork and converting a rotational movement of the power transfer unit into a linear motion by connecting the power transfer unit and the first transfer gear;
Comprising a substrate processing apparatus. The method of claim 17,
And the transfer connecting member is a chain or a belt. The method of claim 17,
The power converter includes a second transfer gear coupled to the transfer stage,
And the transfer connecting member connects the first transfer gear, the second transfer gear, and the power transfer unit. The method of claim 17,
The power converter,
A tension gear movably coupled to the transfer stage and urging the transfer connecting member to maintain the tension of the transfer connecting member at a specific strength or more; And
A pressing member for providing an elastic force to the tension gear;
Comprising a substrate processing apparatus. A substrate transport apparatus including a transport chamber and a robot arm disposed in the transport chamber to import and unload a substrate; And
Claims 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10 for processing the substrate supplied from the substrate transport apparatus. The substrate processing apparatus of any one of Claims 11, 12, 13, 14, 16, 17, 18, 19 and 20;
Including, the substrate processing system.
KR1020140067719A 2014-06-03 2014-06-03 Substrate processing apparatus and substrate processing system including the same KR102026963B1 (en)

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