JP2010225935A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus at a part of which maintenance work is easily done, wherein the part faces a transfer robot such as a shuttle unit. <P>SOLUTION: A shuttle unit 17 for conveying wafers W is mounted in a frame 14 in a substrate processing apparatus 1. A base 18 for supporting a shuttle body 19 of the shuttle unit 17 is fixed to the frame 14 by a fixing bolt 46. Alternatively, while fixing of the base 18 by means of the fixing bolt 46 is released, the shuttle body 19 can be slid from a first position to a second position together with the base 18 by a slide mechanism 41. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus used for processing a substrate. Substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomask substrates. Substrate etc. are included.

Substrate processing equipment used in the manufacture of semiconductor devices, etc., adopts a single wafer processing method for processing substrates one by one as a processing method and a batch processing method that processes a plurality of substrates at once. There is.
A substrate processing apparatus adopting a single wafer type has a configuration in which an indexer unit is coupled to an apparatus main body. The indexer unit is provided with a placement portion on which a carrier capable of accommodating a plurality of substrates is placed, and an indexer robot that conveys the substrate to the carrier. The apparatus main body includes, for example, four processing chambers for processing a substrate, a center robot for loading / unloading the substrate into / from these processing chambers, and a substrate between the center robot and the indexer robot. And a shuttle unit for delivery.

  The apparatus main body is provided with a long substrate transfer space extending linearly from the indexer unit. A center robot is disposed in the center of the substrate transfer space. The four processing chambers are arranged so as to surround the center robot, two on each side of the substrate transfer space. A shuttle unit is installed in a substrate transfer space between the indexer unit and the center robot. The shuttle unit includes a base that is fixedly disposed in the substrate transfer space, and a unit main body that is slidable in the longitudinal direction of the substrate transfer space on the base.

  A plurality of unprocessed substrates are accommodated in the carrier placed on the placement unit. The indexer robot takes out unprocessed substrates one by one from the carrier and delivers the taken-out substrates to the unit body of the shuttle unit. At this time, the shuttle main body is arranged at a position closest to the indexer unit on the base. When the substrate is transferred from the indexer robot to the unit main body, the unit main body moves to the center robot side. When the shuttle main body moves to the position closest to the center robot on the base, the center robot receives the substrate from the shuttle main body and carries the substrate into the processing chamber. When the processing on the substrate in the processing chamber is completed, the processed substrate is unloaded from the processing chamber by the center robot, transferred from the center robot to the indexer robot via the shuttle body, and returned to the carrier by the indexer robot.

JP 2006-278508 A

  The apparatus main body is provided with a piping area adjacent to each processing chamber, where piping for supplying a processing fluid such as a chemical solution or pure water to the adjacent processing chamber is collected. Since each part of the apparatus main body has the layout as described above, the piping area adjacent to the processing chamber on the indexer unit side of the center robot inevitably faces the shuttle unit. Therefore, when an abnormality occurs in the piping system in those piping areas, the shuttle unit becomes an obstacle and it is difficult to perform maintenance work on the piping areas.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus that facilitates maintenance work for a portion facing a transfer robot such as a shuttle unit.

  The substrate processing apparatus according to claim 1, for achieving the above object, includes a frame, a transfer robot that is provided in the frame and transfers the substrate, a base that supports the transfer robot, and the base. A fixing member for fixing to the frame at the first position, and a base slide mechanism for sliding the base from the first position to the second position in a state where the fixing of the base by the fixing member is released And.

  In this substrate processing apparatus, a transfer robot for transferring a substrate is provided in a frame. The base supporting the transfer robot is fixed to the frame at the first position by the fixing member. On the other hand, in a state where the base is fixed by the fixing member, the transport robot can be slid from the first position to the second position together with the base by the base slide mechanism. Thereby, an empty space can be created at the first position where the transfer robot and the base are arranged, and the empty space can be used as a space for maintenance work at a portion facing the first position. Therefore, it is easy to perform maintenance work on the part facing the transfer robot.

Preferably, the substrate processing apparatus further includes a base slide restricting member for restricting the base from being slid beyond the second position from the first position.
Since the slide beyond the second position of the base is restricted by the base slide restricting member, the transfer robot and the base collide with a member disposed at a position beyond the second position, or may be detached from the frame. Can be prevented.

According to a third aspect of the present invention, a substrate processing apparatus includes a fan filter unit provided at a third position above the first position, and an FFU for sliding the fan filter unit from the third position to the fourth position. It is preferable to further include a slide mechanism.
Since the fan filter unit is provided at the third position above the first position, it is possible to supply a downflow of clean air from the fan filter unit toward the transfer robot (first position). Therefore, it is possible to prevent the substrate from being contaminated during the transfer of the substrate by the transfer robot.

  However, if the fan filter unit is arranged above the transfer robot, the fan filter unit becomes an obstacle during teaching work for accurately operating the transfer robot (substrate transfer). That is, teaching is achieved by obtaining the deviation amount between the actual conveyance position of the substrate by the conveyance robot and the specified conveyance position, and inputting the deviation amount to the control unit for operation control of the conveyance robot. If the fan filter unit is arranged above the transfer robot, the operator cannot see the actual transfer position of the substrate by the transfer robot from above. Therefore, in the conventional substrate processing apparatus, the fan filter unit has to be removed during teaching work, and it has been troublesome to remove it.

  In the substrate processing apparatus according to claim 3, since the FFU slide mechanism for sliding the fan filter unit from the third position to the fourth position is provided, the fan filter unit is moved from the third position during teaching work. It can be moved to the fourth position. By moving the fan filter unit to the fourth position, the operator can see the transfer robot from above, so there is no need to remove the fan filter unit. Therefore, the labor required for teaching work can be greatly reduced.

In this case, as described in claim 4, it is preferable that the base slide direction by the base slide mechanism and the fan filter unit slide direction by the FFU slide mechanism are the same direction.
Since the slide direction of the base and the slide direction of the fan filter unit are the same, the footprint (plane area) of the substrate processing apparatus can be reduced.

According to a fifth aspect of the present invention, the substrate processing apparatus further includes an FFU slide restricting member for restricting the fan filter unit from sliding beyond the fourth position from the third position. preferable.
Since the FFU slide restricting member restricts the slide of the fan filter unit beyond the fourth position, the fan filter unit collides with a member disposed at a position beyond the fourth position or is detached from the substrate processing apparatus. Can be prevented.

According to a sixth aspect of the present invention, the substrate processing apparatus is provided at a position facing the first position in a direction perpendicular to the vertical direction and the sliding direction of the base, and supplies a fluid for substrate processing. You may provide the piping area where piping for this is collected.
In this case, by moving the transfer robot together with the base from the first position to the second position, an empty space can be formed in front of the piping area, so that the empty space is used as a space for maintenance work in the piping area. Can be used. Therefore, maintenance work in the piping area is easy.

According to a seventh aspect of the present invention, the substrate processing apparatus may include a processing chamber for storing the substrate and processing the substrate.
According to an eighth aspect of the present invention, the substrate processing apparatus includes: an indexer robot that moves a substrate in and out of a carrier for storing unprocessed and / or processed substrates; and a substrate for the processing chamber. A center robot for taking in and out may be further provided. In this case, the transfer robot may be a shuttle unit for transferring a substrate between the indexer robot and the center robot.

  Furthermore, as described in claim 9, the processing chambers may be stacked in a plurality of stages in the vertical direction. Since the processing chambers are stacked in a plurality of stages in the vertical direction, the throughput can be improved while suppressing an increase in the footprint of the substrate processing apparatus.

FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus shown in FIG. FIG. 3 is a schematic side view of a portion where the shuttle unit is arranged in the apparatus main body. FIG. 4 is a front view of a portion of the apparatus main body where the shuttle unit is arranged. FIG. 5 is a plan view seen from the line VV shown in FIG. 6A is a cross-sectional view taken along section line VI-VI shown in FIG. 3 and shows a state in which the fan filter unit is disposed at the third position. 6B is a cross-sectional view taken along a cutting line VI-VI shown in FIG. 3 and shows a state in which the fan filter unit is arranged at the fourth position on the center robot side. 6C is a cross-sectional view taken along section line VI-VI shown in FIG. 3 and shows a state in which the fan filter unit is arranged at the fourth position on the indexer robot side. FIG. 7A is a cross-sectional view taken along section line VII-VII shown in FIG. 3 and shows a state in which the shuttle unit is disposed at the first position. FIG. 7B is a cross-sectional view taken along section line VII-VII shown in FIG. 3 and shows a state where the shuttle unit is disposed at the second position.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view showing a layout of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus shown in FIG.
The substrate processing apparatus 1 is installed, for example, in a semiconductor device manufacturing factory or the like, and is used for processing a semiconductor wafer (hereinafter simply referred to as “wafer”) W. The processing method in the substrate processing apparatus 1 is a single wafer processing method for processing the wafers W one by one.

As shown in FIG. 1, the substrate processing apparatus 1 has a configuration in which an indexer unit 2 is coupled to an apparatus main body 3.
The indexer unit 2 includes a carrier mounting table 4 on which a plurality of carriers C can be mounted side by side, and an indexer robot 5 for transporting the wafer W to each carrier C.

The carrier C can accommodate a plurality of (for example, 25) wafers W in a stacked arrangement state with a predetermined interval therebetween. As such a carrier C, FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical Interface) pod, OC (Open Cassette), or the like can be used.
The indexer robot 5 is disposed on the apparatus main body 3 side with respect to the carrier mounting table 4. Specifically, the indexer unit 2 is provided with a robot traveling area A extending along the direction in which the carriers C are arranged, and the indexer robot 5 is disposed in the robot traveling area A.

  As shown in FIG. 2, in the robot travel area A, a rail 7 extending in the longitudinal direction of the robot travel area A is fixed to the frame 6 of the indexer unit 2. The indexer robot 5 is provided on the rail 7 and can travel along the rail 7. The indexer robot 5 includes a plurality of hands 8 for holding the wafer W and a mechanism 9 for moving the hands 8 back and forth in the horizontal direction and moving up and down in the vertical direction. Further, the indexer robot 5 can rotate around the vertical axis to change the forward / backward direction of the hand 8. At a position where the indexer robot 5 faces each carrier C, the hand 8 can be moved back and forth with respect to the carrier C and moved up and down, and the wafer W accommodated in the carrier C can be taken out by the hand 8. C can be accommodated.

As shown in FIG. 1, a transfer chamber 10 is formed in the apparatus main body 3. The transfer chamber 10 is coupled to the central portion of the robot travel area A in plan view and extends from the central portion in a direction orthogonal to the longitudinal direction of the robot travel area A.
A center robot 11 is disposed at the center of the transfer chamber 10. The center robot 11 includes a plurality of hands 12 for holding the wafer W, a hand advancing / retracting mechanism (not shown) including an arm that moves the hand 12 back and forth in the horizontal direction, and a hand lifting / lowering mechanism (up and down) (Not shown). Further, the center robot 11 can rotate around the vertical axis.

  The apparatus main body 3 is provided with twelve processing chambers 13. The twelve processing chambers 13 are individually attached to the frame 14 of the apparatus main body 3. The twelve processing chambers 13 are stacked in three stages and arranged so as to surround the center robot 11. Specifically, on one side with respect to the transfer chamber 10, each of the six processing chambers 13 has three stages so as to be symmetrical with respect to a straight line passing through the center of the center robot 11 and perpendicular to the longitudinal direction of the transfer chamber 10. Are arranged in a stack. On the other side with respect to the transfer chamber 10, six processing chambers 13 are stacked in three stages so as to be symmetrical with respect to a straight line that passes through the center of the center robot 11 and is orthogonal to the longitudinal direction of the transfer chamber 10. ing. The processing chamber 13 stacked in three stages on one side with respect to the transfer chamber 10 and the processing chamber 13 stacked in three stages on the other side with respect to the transfer chamber 10 are horizontal directions orthogonal to the longitudinal direction of the transfer chamber 10. Are opposed to each other.

In the processing chamber 13, processing for the wafer W is performed. As processing for the wafer W, cleaning processing for cleaning the wafer W, etching processing for removing a thin film on the surface of the wafer, heat processing for heating / cooling the wafer W, and formation of a film on the surface of the wafer W are performed. Examples of the film forming process are as follows.
As shown in FIG. 2, an opening 15 with a shutter is formed on the surface of each processing chamber 13 facing the center robot 11. With the opening 15 open, the hand 12 of the center robot 11 is moved back and forth with respect to the processing chamber 13 and moved up and down, and the hand 12 unprocessed the spin chuck (not shown) accommodated in the processing chamber 13. The wafer W can be delivered, and the processed wafer W can be received from the spin chuck.

A fan filter unit (FFU) 16 is provided above each processing chamber 13. In each processing chamber 13, clean air is supplied from the fan filter unit 16 to form a downflow of the clean air.
In the transfer chamber 10, a shuttle unit 17 for shuttle transfer of the wafer W between the indexer robot 5 and the center robot 11 is disposed on the indexer unit 2 (robot traveling area A) side of the center robot 11. ing. The shuttle unit 17 includes a base 18 and a shuttle body 19 that can reciprocate between the ID side position on the indexer unit 2 side and the CR side position on the center robot 11 side on the base 18. The shuttle main body 19 can exchange the wafer W with the indexer robot 5 in a state where the shuttle main body 19 is disposed at the ID side position, and the wafer W can be exchanged with the center robot 11 while being disposed at the CR side position. Can be exchanged.

  A processing fluid cabinet 20 is coupled to the opposite side of the apparatus main body 3 from the indexer unit 2. A processing fluid supply source to be supplied to each processing chamber 13 is accommodated in the processing fluid cabinet 20. The processing fluid depends on the contents of the processing in the processing chamber 13, and the processing fluid is not only directly supplied to the wafer W, but also, for example, for the heat treatment on the wafer W, Also included is a hot fluid / cooling fluid supplied to the cooling member.

  In the apparatus main body 3, pipes 21 for supplying processing fluid to the three processing chambers 13 of each processing chamber group corresponding to the processing chamber groups of the processing chambers 13 stacked in three stages are provided. A piping area 22 for housing is provided. Each piping area 22 is arranged adjacent to the corresponding processing chamber group. Therefore, the piping areas 22 adjacent to the two processing chamber groups arranged on the indexer unit 2 side of the center robot 11 are opposed to the shuttle unit 17 in the horizontal direction perpendicular to the longitudinal direction of the transfer chamber 10. Yes.

The processing fluid is supplied to the piping 21 in each piping area 22 from the processing fluid cabinet 20 through the piping 23 disposed at the bottom of the apparatus main body 3. Further, the processing fluid that has passed through the piping 21 in each piping area 22 is returned to the processing fluid cabinet 20 through the piping 24 disposed at the bottom of the apparatus main body 3.
FIG. 3 is a schematic side view of a portion where the shuttle unit is arranged in the apparatus main body, and FIG. 4 is a front view of the portion. In FIGS. 3 and 4, some members are shown through.

  The frame 14 of the apparatus main body 3 has a cubic lattice shape, and a plurality of pillar portions 31 extending in the vertical direction, and pillars at both ends of the moving direction of the shuttle main body 19 (hereinafter, this direction is referred to as “front-rear direction”). The first beam portion 32 that is constructed between the portions 31 and extends in the front-rear direction, and the column portions 31 at both ends in the horizontal direction orthogonal to the moving direction of the shuttle main body 19 (hereinafter, this direction is referred to as “left-right direction”). And a second beam portion 33 extending in the left-right direction. In the portion where the shuttle unit 17 is disposed, two first beam portions 32 and two second beam portions 33 are provided at three positions having different heights.

Below the lowermost first beam portion 32 and the second beam portion 33, a space is provided for disposing the pipes 23 and 24 that connect the processing fluid cabinet 20 and the pipe 21.
A slide base 34 having a substantially rectangular shape in plan view is provided between the two lower second beam portions 33. On the upper surface of the slide base 34, ribs 35 extending in the front-rear direction are provided at both ends in the left-right direction. In each rib 35, three rollers 36 are provided so as to be rotatable about a rotation axis extending in the left-right direction at substantially equal intervals in the front-rear direction. Further, an L-shaped shuttle stopper 37 is fixed to the end of the slide base 34 on the indexer unit 2 side.

The shuttle unit 17 is supported by the slide base 34.
More specifically, the base 18 of the shuttle unit 17 includes a base plate 38 having a substantially rectangular shape in plan view on the lower surface thereof. The peripheral surface of each roller 36 of the slide base 34 is in contact with the lower surface of the base plate 38.
Further, brackets 39 that are substantially L-shaped in front view are attached to both ends of the base plate 38 in the left-right direction with portions along the vertical direction facing outward. A substantially L-shaped holder 40 in front view is provided on the outer side of each bracket 39 in the left-right direction so as to face each bracket 39. Each holder 40 is disposed with a portion along the vertical direction facing outward, extends in the front-rear direction, and both end portions thereof are fixed to the column portion 31.

  A slide member 41 is interposed between each bracket 39 and the holder 40 facing it. The slide member 41 is attached to the bracket 39 and has a substantially C-shaped moving side member 42 having an opening on the holder 40 side, and is fixed to the holder 40 and has a substantially C-shaped cross section having an opening on the bracket 39 side. A side member 43 and an intermediate member 44 interposed between the moving side member 42 and the fixed side member 43 are provided. A moving-side ball retainer (not shown) that holds a plurality of balls is provided between the moving-side member 42 and the intermediate member 44, and the moving-side member 42 and the intermediate member 44 are slid relative to each other. Be able to. Further, a fixed-side ball retainer (not shown) that holds a plurality of balls is provided between the fixed-side member 43 and the intermediate member 44, and the fixed-side member 43 and the intermediate member 44 are relatively moved. It can be slid.

As a result, the base 18 is shifted to the center robot 11 side from the first position between the indexer unit 2 and the center robot 11 by the six rollers 36 and the pair of left and right slide members 41. It can slide between the second positions.
A fixing L-shaped member 45 having a substantially L-shape in a side view and bent downward from the upper surface is attached to the rear end portion of the base plate 38. An insertion hole through which the fixing bolt 46 can be inserted is formed at the lower end of the fixing L-shaped member 45. The base 18 can be fixed to the frame 14 by inserting the fixing bolt 46 through the insertion hole and screwing the tip of the fixing bolt 46 into the second beam portion 33 of the frame 14. During processing on the wafer W, the base 18 is fixed to the frame 14 in a state of being disposed at the first position.

A contact member 47 extending downward from the lower surface of the base plate 38 is provided at the front end of the base plate 38. With the base 18 fixed to the frame 14, the abutting member 47 abuts against the shuttle stopper 37 from the center robot 11 side.
The shuttle main body 19 of the shuttle unit 17 reciprocates between the ID side position on the indexer unit 2 side and the CR side position on the center robot 11 side on the base 18, as shown by a solid line and a virtual line in FIG. It is provided as possible. The shuttle body 19 includes a hand 48 that can hold the wafers W in a stacked state. The wafer W is transferred from the indexer robot 5 and the center robot 11 (see FIG. 1) to the hand 48, and the wafer W held by the hand 48 is received by the indexer robot 5 and the center robot 11.

In order to supply a downflow of clean air to the shuttle unit 17 between the first beam portion 32 and the second beam portion 33 on the uppermost side and the first beam portion 32 and the second beam portion 33 immediately below the first beam portion 32 and the second beam portion 33. The fan filter unit 49 is arranged.
FIG. 5 is a plan view seen from the line VV shown in FIG.
The work table rail having an upper surface that is lower by one step than the upper surface of the first beam portion 32 along each first beam portion 32 in a portion surrounded by the first beam portion 32 and the second beam portion 33 on the uppermost side. 51 is provided. A work table 52 is constructed on the pair of work table rails 51. The work table 52 is formed in a rectangular flat plate shape having an area equal to or less than half of the area surrounded by the uppermost first beam portion 32 and the second beam portion 33 in plan view. Thereby, the work table 52 can be slid in the front-rear direction along the work table rail 51.

6A to 6C are cross-sectional views taken along section line VI-VI shown in FIG.
As shown in FIG. 6A, the portion surrounded by the first beam portion 32 and the second beam portion 33 directly below the uppermost first beam portion 32 and the second beam portion 33 extends along the first beam portions 32. FFU rails 61 are provided. Each FFU rail 61 is fixed to the first beam portion 32. The fan filter unit 49 is installed on the pair of FFU rails 61 so as to be slidable in the front-rear direction on the FFU rails 61.

The fan filter unit 49 is disposed at the third position in the center of the portion surrounded by the first beam portion 32 and the second beam portion 33 as shown in FIG. With the fan filter unit 49 arranged at the third position, the fan filter unit 49 faces the shuttle unit 17 in the vertical direction.
At the center of the lower surface of the fan filter unit 49, slide restricting plates 62 are provided on both sides in the left-right direction. When the fan filter unit 49 is slid toward the center robot 11 (see FIG. 1) and the slide restricting plate 62 contacts the second beam portion 33, further movement of the fan filter unit 49 is restricted. As a result, the fan filter unit 49 is arranged at the fourth position on the center robot 11 side with respect to the third position, as shown in FIG. 6B. In this state, at least half of the indexer unit 2 (see FIG. 1) side surrounded by the first beam portion 32 and the second beam portion 33 is opened. Therefore, from the opened portion, the portion on the indexer unit 2 side of the shuttle unit 17 disposed below can be seen.

  On the other hand, when the fan filter unit 49 is slid toward the indexer unit 2 and the slide restricting plate 62 comes into contact with the second beam portion 33, further movement of the fan filter unit 49 is restricted. As a result, the fan filter unit 49 is arranged at the fourth position on the indexer unit 2 side with respect to the third position, as shown in FIG. 6C. In this state, more than half of the portion surrounded by the first beam portion 32 and the second beam portion 33 on the side of the center robot 11 (see FIG. 1) is opened. Therefore, from the opened part, the part on the center robot 11 side of the shuttle unit 17 arranged below can be seen.

7A and 7B are cross-sectional views taken along section line VII-VII shown in FIG.
As described above, the base 18 of the shuttle unit 17 is moved from the first position and the first position to the center robot 11 (see FIG. 1) side by the six rollers 36 and the pair of left and right slide members 41. It is possible to slide between positions. When the shuttle unit 17 is moved together with the base 18 from the first position to the second position, the fixing bolt 46 is removed and the base 18 is pushed toward the center robot 11 side. At this time, as shown in FIG. 7B, in the slide member 41, the intermediate member 44 moves to the center robot 11 side with respect to the fixed side member 43, and the moving side member 42 moves to the center robot 11 side with respect to the intermediate member 44. Move to.

  The end of the intermediate member 44 on the indexer unit 2 side is disposed at the end of the stationary member 43 on the center robot 11 side, and the end of the moving member 42 on the indexer unit 2 side is the center of the intermediate member 44. When arranged at the end on the robot 11 side, further movement of the shuttle unit 17 is restricted. Thereby, the shuttle unit 17 is arrange | positioned in a 2nd position, as shown to FIG. 7B.

  Conversely, when the shuttle unit 17 is pushed from the second position toward the first position, the moving side member 42, the fixed side member 43, and the intermediate member 44 of the slide member 41 contract so as to overlap each other. When the contact member 47 provided in the shuttle unit 17 contacts the shuttle stopper 37 fixed to the frame 14, further movement of the shuttle unit 17 is restricted. Thereby, the shuttle unit 17 is arrange | positioned in a 1st position, as shown to FIG. 7A.

  As described above, in the substrate processing apparatus 1, the shuttle unit 17 that transports the wafer W is provided in the frame 14. The base 18 that supports the shuttle main body 19 of the shuttle unit 17 is fixed to the frame 14 at the first position by fixing bolts 46. On the other hand, in a state where the fixing of the base 18 by the fixing bolt 46 is released, the shuttle main body 19 can be slid together with the base 18 from the first position to the second position by the slide mechanism 41. As a result, an empty space can be created at the first position where the shuttle main body 19 and the base 18 are disposed, and the empty space can be used as a space for maintenance work at a portion facing the first position. . Therefore, it is easy to perform maintenance work on the portion facing the shuttle unit 17.

Further, the slide member 41 restricts the slide beyond the second position of the base 18, so that the shuttle main body 19 and the base 18 collide with members arranged at positions beyond the second position, or from the frame 14. It can be prevented from leaving.
The substrate processing apparatus 1 further includes a fan filter unit 49 provided at a third position above the first position, and an FFU rail 61 for sliding the fan filter unit 49 from the third position to the fourth position. I have.

Since the fan filter unit 49 is provided in the third position above the first position, it is possible to supply clean air downflow from the fan filter unit 49 toward the shuttle unit 17 (first position). Therefore, it is possible to prevent the wafer W from being contaminated during the transfer of the wafer W by the shuttle unit 17.
The substrate processing apparatus 1 includes an FFU rail 61 for sliding the fan filter unit 49 from the third position to the fourth position. Therefore, during the teaching work, the fan filter unit 49 can be moved from the third position to the fourth position. By moving the fan filter unit 49 to the fourth position, the operator can view the shuttle unit 17 from above, so there is no need to remove the fan filter unit 49. Therefore, the labor required for teaching work can be greatly reduced.

Further, since the base 18 can be slid toward the center robot 11 and the fan filter unit 49 can be slid toward the same center robot 11 as the base 18, the footprint (planar area) of the substrate processing apparatus 1 can be increased. Can be small.
Further, the slide restricting plate 62 restricts the slide of the fan filter unit 49 beyond the fourth position, so that the fan filter unit 49 collides with a member disposed at a position beyond the fourth position, or the substrate processing. It is possible to prevent the device 1 from being detached.

The substrate processing apparatus 1 is provided at a position facing the first position in the vertical direction and the direction (left-right direction) orthogonal to the sliding direction of the base, and a pipe 21 for supplying a fluid for substrate processing. Are provided with a piping area 22.
By moving the shuttle unit 17 together with the base 18 from the first position to the second position, an empty space can be formed in front of the piping area 22, so that the empty space can be used as a space for maintenance work in the piping area 22. Can be used as Therefore, maintenance work in the piping area 22 is easy.

Further, since the processing chambers 13 are stacked in a plurality of stages in the vertical direction, the throughput can be improved while suppressing an increase in the footprint of the substrate processing apparatus 1.
In addition, the substrate processing apparatus 1 includes a work table 52. Thereby, teaching work or the like can be performed in a state where the worker is on the work table 52. Therefore, safety during teaching work can be improved.

  The work table 52 is slidable in the front-rear direction. Therefore, when the fan filter unit 49 is arranged at the fourth position on the front side (indexer unit 2 side), the work table 52 is arranged on the front side, and the fan filter unit 49 is arranged on the rear side (center robot 11 side). In the case where it is arranged at the fourth position, the teaching work can be performed from the work table 52 by arranging the work table 52 on the rear side.

  In the above embodiment, the processing chambers 13 are stacked in three stages. However, the processing chambers 13 may be provided in one stage, or may be stacked in two stages. It may be stacked in four or more stages.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Indexer robot 11 Center robot 13 Processing chamber 14 Frame 17 Shuttle unit (transfer robot)
18 foundation 21 piping 22 piping area 41 slide mechanism (base slide mechanism, base slide regulating member)
46 Fixing bolt (fixing member)
49 Fan filter unit 61 FFU rail (FFU slide mechanism)
62 Slide restriction plate (FFU slide restriction member)
C career

Claims (9)

Frame,
A transfer robot provided in the frame for transferring a substrate;
A base supporting the transfer robot;
A fixing member for fixing the base to the frame at a first position;
A substrate processing apparatus comprising: a base slide mechanism for sliding the base from the first position to the second position in a state in which the base is fixed by the fixing member.   The substrate processing apparatus according to claim 1, further comprising a base slide restricting member for restricting the base from being slid beyond the second position from the first position. A fan filter unit provided at a third position above the first position;
The substrate processing apparatus according to claim 1, further comprising an FFU slide mechanism for sliding the fan filter unit from the third position to the fourth position.   The substrate processing apparatus according to claim 3, wherein a slide direction of the base by the base slide mechanism and a slide direction of the fan filter unit by the FFU slide mechanism are the same direction.   5. The substrate processing apparatus according to claim 3, further comprising an FFU slide restricting member for restricting the fan filter unit from being slid beyond the fourth position from the third position. 6.   A pipe area is provided at a position facing the first position in a vertical direction and a direction orthogonal to the sliding direction of the base, and a pipe area for collecting pipes for supplying a fluid for substrate processing is provided. The substrate processing apparatus as described in any one of 1-5.   The substrate processing apparatus according to claim 1, further comprising a processing chamber for storing the substrate and processing the substrate. An indexer robot that moves a substrate in and out of a carrier for receiving unprocessed and / or processed substrates;
A center robot for taking a substrate in and out of the processing chamber;
The substrate processing apparatus according to claim 7, wherein the transfer robot is a shuttle unit for delivering a substrate between the indexer robot and the center robot.   The substrate processing apparatus according to claim 7, wherein the processing chamber is stacked in a plurality of stages in the vertical direction.

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