KR102019767B1 - Automatic pcb cutting apparatus and cutting method using the same - Google Patents

Abstract

The present invention relates to a PCB automatic cutting device and a cutting method using the device, the first horizontal transfer portion 110 and the first vertical to be lifted from one side of the first horizontal transfer portion 110 to seat the PCB The first cutting part 130 and the first cutting part 130 that fold the PCB on the upper side of the sending part 120, the first vertical transfer part 120, and the first cutting part 130 are divided into the first cutting part. A first cutting module 100 formed of a second vertical transfer part 140 that lifts and lifts a plurality of PCBs individually; The PCB is mounted on the second horizontal transfer part 210, the third vertical transfer part 220, and the third vertical transfer part 220, which are lifted from one side of the second horizontal transfer part 210. A second vertical cutting part 230 which is folded and cut second, a fourth vertical transfer part 240 which individually seats and lifts a plurality of PCBs divided by the second cutting under the second cutting part 230; As the second cutting module 200 includes a third horizontal transfer unit 250 for discharging the PCB, a series of cutting processes for multi-cutting the PCB assembly are automatically performed.

Description

AUTOMATIC PCB CUTTING APPARATUS AND CUTTING METHOD USING THE SAME}

The present invention relates to an automatic PCB cutting device and a cutting method using the device, and more particularly, the PCB assembly forming a plurality of cutting ruled lines are automatically transferred and rotated and cut in a folding manner to be discharged into a plurality of PCB pieces. The present invention relates to a technology that can easily perform a series of cutting processes by configuring an automatic cutting device.

In general, a PCB is a printed circuit board which is formed by wiring on an insulating plate by a circuit design so as to electrically connect electrical components such as an integrated circuit.

PCBs are mainly made of hard insulating materials such as phenol or epoxy resins, and are manufactured in the form of a PCB assembly in which multiple PCB pieces are connected for work efficiency.

The PCB assembly includes a PCB piece and other bridges, and the cutting line is formed by forming a cutting ruled line in a predetermined groove shape between the PCB piece and the bridge. Therefore, the cutting and dividing the PCB piece and the bridge through a separate cutting device.

Conventionally, the PCB cutting work has been carried out by hand, but there are disadvantages of inefficiency in terms of workability and productivity. Therefore, recently, a separate device for PCB cutting has been developed and provided.

As an example of the prior art, looking at a schematic configuration of a cutting device known from Korean Patent Registration No. 10-0588055, the device for cutting a specific portion of the printed circuit board supports the bottom surface of the printed circuit board in the center thereof. And a punch for lifting and lowering the die having a through hole vertically and downwardly, and cutting a printed circuit board inserted into the through hole and inserted therebetween.

As another example, the cutting device of Korean Patent Registration No. 10-0241791 includes a head transfer means in which a PCB assembly is installed, a moving means for transferring the head transfer means, and a support member constituting an assembly of a unit PCB substrate. And cutting means for grinding the slug of each unit PCB substrate cut from the cutting means.

On the other hand, Korean Patent No. 10-1532925 has a PCB seating portion that is seated at a position where a plurality of PCBs are loaded from the outside, a PCB fixing part for fixing a plurality of PCBs, and a preset cutting area of a plurality of PCBs fixed It includes a PCB cutting part to cut sequentially by applying a rotational force along the lower end from the top of the PCB, the PCB cutting portion is installed in the main body so that the PCB is disposed on the cutting position is cut by the PCB cutting portion and the disk-shaped cutting blade A cutting head installed upright in this rotatable state, a rotating motor mounted on the cutting head and rotating the cutting head, and a three-axis moving unit moving the position along the three axis direction to cut the boundary of the cutting region of the PCB. A cutting device is provided.

Korea Patent Registration No. 10-0588055 (2006.06.09) Korea Patent Registration No. 10-0241791 (2000.02.01) Korea Patent Registration No. 10-1532925 (2015.07.02) Korea Patent Registration No. 20-0394891 (2005.09.06)

PCB cutting device to which the prior art as described above is applied is made of a configuration for cutting in a manner of hitting the PCB having a punch for cutting the printed circuit board by lifting by the operation of the lever.

Therefore, there is still a drawback of inefficiency in terms of workability and productivity since the manual labor of the worker is actually required in a series of processes of supplying and cutting the PCB.

Another example of the prior art PCB cutting device is formed in the form having a cutting means for cutting the PCB by lifting the blade member to the cylinder.

Cutting device configured to cut by hitting the PCB as described above is a jig means for supporting the PCB so that the cutting operation is made exactly corresponding to the cutting position on the PCB, and a series of configurations for operating the punch or blade member precisely There is a disadvantage to configure in conjunction.

In addition, the cutting device of the prior art includes a variety of problems caused by the occurrence or scattering of various debris due to excessive impact generated in the process of punching or punching the blade member to the PCB, and must be provided with a separate shock absorbing means There is a disadvantage.

On the other hand, the PCB cutting device of the prior art as another example is made of a form having a PCB cutting portion having a disk-shaped cutting blade for cutting by sequentially applying a rotational force from the top to the bottom of the PCB.

Therefore, it is inevitable that a large amount of dust is generated in the process of cutting the PCB by the disk-shaped cutting edge, and this involves problems such as delay in working time.

Therefore, the present invention is invented to solve the problems of the prior art as described above,

PCB automatic cutting device of the present invention,

A first horizontal transfer part 110 for horizontally driving the first rail means 111 for seating the PCB;

A first vertical transfer part 120 that lifts and lifts the PCB from one side of the first horizontal transfer part 110,

A first cutting part 130 that first cuts the PCB by folding the PCB on the upper side of the first vertical transfer part 120;

A first cutting module 100 formed of a second vertical transfer part 140 that individually seats and lifts a plurality of PCBs divided by primary cutting at a lower side of the first cutting part 130;

A second horizontal transfer part 210 for horizontally driving the second rail means 211 for mounting the PCB on one side of the second vertical transfer part 140;

A third vertical transfer part 220 that lifts and lifts the PCB from one side of the second horizontal transfer part 210;

A second cutting part 230 which folds the PCB on the upper side of the third vertical transfer part 220 to cut the second part;

A fourth vertical transfer part 240 which individually seats and lifts a plurality of PCBs divided by the second cutting on the lower side of the second cutting part 230,

It comprises a second cutting module 200 consisting of a third horizontal transfer unit 250 for horizontally driving the third rail means 251 for mounting the PCB on one side of the fourth vertical transfer unit 240.

In addition, in the automatic PCB cutting method for performing the first cutting process (S10) and the second cutting process (S20) using the automatic PCB cutting device of the present invention as described above,

The primary cutting process (S10),

Step (S11) of entering the PCB forming the plurality of cutting ruled lines into the first horizontal transfer part 110 of the first cutting module 100;

Placing the PCB on the first vertical transfer part 120 and ascending to the first cutting part 130 (S12);

The first grip part 151 and the second grip part 152 of the first cutting part 130 to grip the PCB and to move to the first cutting section Z1 provided with the first dust collecting part 190 (S13). Wow,

Rotating the first cutting unit 130 by 90 degrees and rotating the folding movable unit 155 at a predetermined angle to cut the PCB first (S14);

The first cutting part 130 is moved to the second vertical transfer part 140, and the second grip part 152 is released to place one PCB among the plurality of first cut PCBs in the second lifting means 142. Step S15,

Lowering the second lifting means 142 to the second horizontal transfer part 210 to enter the one side PCB into the second cutting module 200 (S16);

Releasing the first grip part 151 of the first cutting part 130 and placing the other PCB among the plurality of first cut PCBs in the first lifting means 141 (S17);

Lowering the first elevating means 141 to the second horizontal transfer part 210 to enter the other PCB into the second cutting module 200 (S18);

And returning the first cutting part 130 to the upper side of the first vertical transfer part 120 to rotate 90 degrees back (S19).

The secondary cutting process (S20),

Entering the first cut PCB into the second horizontal transfer part 210 of the second cutting module 200 (S21);

Placing the PCB on the third vertical transfer part 220 and raising the second cutting part 230 (S22);

The first grip part 151 and the second grip part 152 of the second cutting part 230 grip the PCB and move to the second cutting section Z2 provided with the second dust collecting part 260 (S23). Wow,

Rotating the second cutting unit 230 by 90 degrees and rotating the folding movable unit 155 at a predetermined angle to cut the PCB secondly (S24);

The second cutting part 230 is moved to the fourth vertical transfer part 240, and the second grip part 152 is released to seat one PCB among the plurality of second cut PCBs in the second lifting means 242. Step S25,

Discharging the one side PCB by lowering the second lifting means 242 to the third horizontal transfer part 250 (S26);

Releasing the first grip part 151 of the second cutting part 230 and placing the other PCB among the plurality of second cut PCBs in the first lifting means 241 (S27);

Lowering the first elevating means 241 to the third horizontal transfer part 250 to discharge the other PCB (S28);

Returning to the upper side of the third vertical transfer unit 220, the second cutting unit 230 is rotated 90 degrees (S29) is made.

Accordingly, it is possible to achieve the purpose of automatically and easily performing a series of cutting processes for cutting and dividing a PCB assembly forming a plurality of cutting ruled lines into a plurality of PCB pieces.

The present invention provides an automatic PCB cutting device that automatically performs the cutting process to easily perform a series of cutting processes to derive the effect of significantly improving workability and productivity.

In particular, the present invention transfers the PCB forming the cutting ruled line and rotates according to the forming direction of the cutting ruled line, the first cut by the folding method, each of the cut individual PCB is discharged in sequence to re-enter the second cutting process The advantage of mounting the configuration is the automatic cutting of non-stop PCB assemblies consisting of multiple PCB pieces.

In addition, the present invention can be easily configured to add a cutting module can be easily applied to the cutting operation of the PCB assembly connected to a plurality of PCB pieces, such as the expansion and utilization of the device has a very high advantage.

1 is a perspective view of an automatic PCB cutting device according to the present invention.
Figure 2 is a front view of the automatic PCB cutting device according to the present invention.
3 to 4 is a perspective view of the first cutting module and the second cutting module of the automatic PCB cutting device according to the present invention.
5 to 8 is a perspective view of the cutting operation unit and the operating state of the automatic PCB cutting device according to the invention.
9 to 10 are views illustrating an operating state of a cutting method using an automatic PCB cutting device according to the present invention.

Hereinafter, the configuration and operation according to a preferred embodiment of the automatic PCB cutting device and the cutting method using the device of the present invention will be described in detail with reference to the accompanying drawings. In the following description, a detailed description of parts that can be easily implemented by those skilled in the art may be omitted.

1 is a perspective view of an automatic PCB cutting device according to the present invention, FIG. 2 is a front view of an automatic PCB cutting device according to the present invention, and FIGS. 3 to 4 are first cutting modules and a first cutting module of the automatic PCB cutting device according to the present invention. 5 to 8 is a perspective view of the cutting module, Figures 5 to 8 is a perspective view and an operational state of the cutting operation of the automatic PCB cutting device according to the present invention, Figures 9 to 10 of the cutting method using the automatic PCB cutting device according to the present invention An illustration of the operating state is shown.

PCB automatic cutting device to which the technology of the present invention is applied and a cutting method using the device by first configuring the automatic cutting device for automatically transporting and rotating the PCB forming a plurality of cutting ruled lines and cutting and discharging by folding method Note that the present invention relates to a technique for easily performing a series of cutting processes including a secondary cutting process.

PCB automatic cutting device of the present invention for this purpose comprises a first cutting module 100 and the second cutting module 200 as shown in Figures 1 to 2 largely as follows.

The present invention is configured to divide the PCB assembly forming the cutting rule line into the first and the second cutting process to be divided into four PCB pieces and the first cutting module 100 is configured to perform the first cutting process.

As shown in FIG. 3, the first cutting module 100 has a large first horizontal transfer unit 110, a first vertical transfer unit 120, a first cutting unit 130, and a second vertical unit. It is made of a transfer unit 140.

The first horizontal transfer unit 110 is configured to supply a PCB to the first vertical transfer unit 120 by horizontally driving the first rail means 111 for mounting the PCB.

The first rail means 111 is configured to face each other so as to seat both sides of the PCB and is driven horizontally in one direction or the other by a predetermined motor.

The first vertical transfer unit 120 is configured to raise and lower the PCB on one side of the first horizontal transfer unit 110 to supply the PCB to the first cutting unit 130.

The first vertical transfer part 120 is provided between the first horizontal transfer part 110 facing each other and is configured to lift the bottom surface of the PCB during horizontal transfer. The first vertical transfer part 120 is composed of a predetermined mounting base for mounting the bottom of the PCB, and a cylinder for lifting the mounting base.

The first cutting part 130 is configured to fold the PCB on the upper side of the first vertical transfer part 120 to make the first cut, and includes a cutting operation part 150 and a cutting moving part 160.

5 to 8, the cutting operation part 150 includes a first grip part 151 coupled to the foldable fixing part 154, and a second grip part 152 coupled to the foldable moving part 155. Is made of.

The first grip part 151 and the second grip part 152 grip both sides of the PCB, and after cutting is made, each of the divided PCB pieces is gripped.

The first grip part 151 is configured to grip both ends of one side and the other side PCB around the cutting ruled line.

Specifically, the first grip part 151 is coupled to both ends of the first cylinder 171 by symmetrically coupled to the grip body 172 and the grip means for hinge coupling to the lower end of the grip body 172 173 and a second cylinder 174 mounted to the grip body 172 and hinged to the lower end of the grip means 173 to adjust the angle of the grip means 173.

As shown in FIG. 6, the first cylinder 171 moves forward and backward at both ends at the same speed with respect to the center to adjust the distance between the upper grip body 172 according to the size of the PCB.

The second cylinder 174 is configured to allow both side grip means 173 to grip the PCB by moving forward and backward the other end coupled to the grip means 173 based on one end mounted on the grip body 172 at the same speed. .

The folding fixing unit 154 is coupled to the first grip unit 151 and configured to rotate the cutting operation unit 150 by 90 degrees as shown in FIG. 5 to FIG. 7 in conjunction with the rotating unit 153.

That is, the rotating unit 153 is provided to enable the cutting operation unit 150 to rotate and move by mounting the upper and lower ends on the cutting operation unit 150 and the cutting moving unit 160.

Like the first grip part 151, the second grip part 152 is also symmetrically coupled to both ends of the first cylinder 171 to adjust the mutual distance, and a hinge to the lower end of the grip body 172. Grip means 173 to be coupled, and the second body 174 is mounted to the grip body 172 and hinged to the lower end of the grip means 173 to adjust the angle of the grip means 173.

In particular, the folding movable portion 155 is configured to be coupled to the second grip portion 152 and axially coupled to one side of the folding fixing portion 154 to rotate at a predetermined angle.

Specifically, the folding movable part 155 is a third cylinder 181 hinged to the upper ends of each of the folding fixing part 154 and the folding moving part 155 as shown in Figure 8, the folding fixing part ( 154 and the folding shaft portion 155 includes a folding shaft portion 182 hinged to each other.

The third cylinder 181 is configured to fold at a predetermined angle from the lower foldable shaft portion 182 of the foldable movable portion 155 by moving forward and backward one end coupled to the upper end of the foldable movable portion 155.

The folding shaft portion 182 corresponds to a cutting ruled line formed on the PCB gripped by the first grip part 151 and the second grip part 152 and is folded around the cutting ruled line at the same time as the folding operation of the folding movable part 155. Is cut.

On the other hand, the cutting moving part 160 is equipped with a vertical moving part 161 and a vertical moving part 161 for mounting the rotating part 153 of the folding fixing part 154 to elevate the cutting operation part 150. It consists of a horizontal moving unit 162 for driving the cutting operation unit 150 horizontally.

The vertical moving unit 161 is provided with a predetermined vertical rail means driven by a motor so that the cutting operation unit 150 is vertically elevated above the first vertical transfer unit 120 or the second vertical transfer unit 140. Configure it to work.

The horizontal moving part 162 also includes a predetermined horizontal rail means driven by a motor so that the cutting operation part 150 moves horizontally between the first vertical transfer part 120 or the second vertical transfer part 140. Configure this to be done.

The second vertical transfer part 140 is configured to individually lift and lift a plurality of PCBs divided by the first cut from the lower side of the first cutting part 130.

Specifically, as shown in FIG. 3 or FIG. 9, the second vertical transfer part 140 may include first lifting means 141 and first lifting means for seating and alternately lifting up a plurality of PCBs divided by primary cutting. Two lifting means 142 is provided.

That is, the PCB piece in the state of being gripped by the first grip part 151 is seated on the first lifting means 141, and the PCB in the state of being gripped by the second grip part 152 in the second lifting means 142. Configure the piece to rest. Each of the first elevating means 141 and the second elevating means 142 includes a predetermined seating base for seating the bottom of the PCB, and a cylinder for elevating the seating base.

Therefore, the second elevating means 142 and the first elevating means 141 are sequentially lowered so that the individual PCBs are sequentially seated on the second horizontal transfer part 210.

On the other hand, the lower side of the first cutting unit 130, the first dust collecting unit 190 having an intake hood 191 upwardly is configured.

As shown in FIG. 9, the first dust collecting unit 190 is positioned in the first cutting section Z1 where the first cutting is performed by the cutting operation unit 150, and is formed around the cutting rule of the PCB. The dust is installed so that the intake sud is immediately sucked in and collected.

As described above, the present invention is configured to divide the PCB assembly forming the cutting rule line into four PCB pieces by continuously inputting the primary and secondary cutting processes, the second cutting module 200 is a secondary cutting process It is configured to carry out.

As shown in FIG. 4, the second cutting module 200 has a large horizontal transfer unit 210, a third vertical transfer unit 220, a second cutting unit 230, and a fourth vertical unit. Consists of a transfer unit 240 and the third horizontal transfer unit 250.

The second horizontal transfer unit 210 is horizontally cut second rail means 211 for mounting the PCB that is first cut by the first cutting module 100 and then sequentially supplied by the second vertical transfer unit 140 Drive to configure the PCB to the third vertical transfer unit 220.

The second rail means 211 is configured to face each other to seat both sides of the PCB and is driven horizontally in one direction or the other by a predetermined motor.

The third vertical transfer part 220 is configured to seat and lift the PCB at one side of the second horizontal transfer part 210 to supply the PCB to the second cutting part 230.

The third vertical transfer part 220 is provided between the second horizontal transfer part 210 facing each other and is configured to lift the bottom surface of the PCB during horizontal transfer. The third vertical transfer part 220 is composed of a predetermined mounting base for mounting the bottom of the PCB, and a cylinder for lifting the mounting base.

The second cutting unit 230 is configured to fold the PCB on the upper side of the third vertical transfer unit 220 to cut the secondary, and comprises a cutting operation unit 150 and a cutting moving unit 160.

The cutting operation part 150 includes a first grip part 151 coupled to the foldable fixing part 154, and a second grip part 152 coupled to the foldable moving part 155.

The first grip part 151 and the second grip part 152 grip both sides of the PCB, and after the secondary cutting is performed, the divided PCB pieces are gripped, respectively.

The first grip part 151 is configured to grip both ends of one side and the other side of the PCB, respectively.

Specifically, the first grip part 151 is coupled to both ends of the first cylinder 171 by symmetrically coupled to the grip body 172 and the grip means for hinge coupling to the lower end of the grip body 172 173 and a second cylinder 174 mounted to the grip body 172 and hinged to the lower end of the grip means 173 to adjust the angle of the grip means 173.

The first cylinder 171 is moved forwards and backwards at the same speed with respect to the center of the center to adjust the distance between the two grip body 172 phase according to the size of the PCB.

The second cylinder 174 is configured to allow both side grip means 173 to grip the PCB by moving forward and backward the other end coupled to the grip means 173 based on one end mounted on the grip body 172 at the same speed. .

The folding fixing unit 154 is configured to rotate the cutting operation unit 150 by 90 degrees in combination with the first grip unit 151 and in conjunction with the rotating unit 153.

That is, the rotating unit 153 is provided with both ends of the cutting operation unit 150 and the cutting moving unit 160 to rotate and move the cutting operation unit 150.

Like the first grip part 151, the second grip part 152 is also symmetrically coupled to both ends of the first cylinder 171 to adjust the mutual distance, and a hinge to the lower end of the grip body 172. Grip means 173 to be coupled, and the second body 174 is mounted to the grip body 172 and hinged to the lower end of the grip means 173 to adjust the angle of the grip means 173.

In particular, the folding movable portion 155 is configured to be coupled to the second grip portion 152 and axially coupled to one side of the folding fixing portion 154 to rotate at a predetermined angle.

Specifically, the folding movable portion 155, the third cylinder 181 hinged to the upper end of each of the folding fixing portion 154 and the folding movable portion 155, the folding fixing portion 154 and the folding movable portion ( 155) includes a folding shaft portion 182 hinged to each of the lower ends.

The third cylinder 181 is configured to fold at a predetermined angle from the lower foldable shaft portion 182 of the foldable movable portion 155 by moving forward and backward one end coupled to the upper end of the foldable movable portion 155.

The folding shaft portion 182 corresponds to a cutting ruled line formed on the PCB gripped by the first grip part 151 and the second grip part 152 and is folded around the cutting ruled line at the same time as the folding operation of the folding movable part 155. Is cut.

On the other hand, the cutting moving part 160 is equipped with a vertical moving part 161 and a vertical moving part 161 for mounting the rotating part 153 of the folding fixing part 154 to elevate the cutting operation part 150. It consists of a horizontal moving unit 162 for driving the cutting operation unit 150 horizontally.

The vertical moving unit 161 is provided with a predetermined vertical rail means driven by a motor so that the cutting operation unit 150 is vertically elevated above the first vertical transfer unit 120 or the second vertical transfer unit 140. Configure it to work.

The horizontal moving part 162 also includes a predetermined horizontal rail means driven by a motor so that the cutting operation part 150 moves horizontally between the first vertical transfer part 120 or the second vertical transfer part 140. Configure this to be done.

The fourth vertical transfer part 240 is configured to individually lift up and down a plurality of PCBs divided by secondary cutting at the lower side of the second cutting part 230.

Specifically, as shown in FIG. 4 or FIG. 10, the fourth vertical transfer part 240 includes first lifting means 241 and a first lifting means 241 for individually seating and alternately lifting up a plurality of PCBs divided by secondary cutting. Two lifting means 242 is provided.

That is, the PCB piece in the state of being gripped by the first grip part 151 is seated on the first lifting means 241, and the PCB in the state of being gripped by the second grip part 152 in the second lifting means 242. Configure the piece to rest. Each of the first elevating means 241 and the second elevating means 242 includes a predetermined seating base for seating the bottom of the PCB, and a cylinder for elevating the seating base.

Therefore, the second elevating means 242 and the first elevating means 241 are sequentially lowered so that the individual PCBs are sequentially seated on the fourth horizontal transfer part.

On the other hand, below the second cutting portion 230, the second dust collecting portion 260 having an intake hood upwards is provided and configured.

As shown in FIG. 10, the second dust collecting part 260 is located in the second cutting section Z2 where the second cutting is performed by the cutting operation part 150, and is formed around the cutting rule of the PCB during cutting. A predetermined dust is installed so that the intake sud is immediately sucked in and collected.

In addition, one side of the fourth vertical transfer part 240 is provided with a third horizontal transfer part 250 for horizontally driving the third rail means 251 for mounting the PCB to sequentially finalize the second cut individual PCB. Configure to drain.

As shown in FIG. 4, the third horizontal transfer unit 250 is opposed to each other in configuring the third rail means 251 unlike the first horizontal transfer unit 110 and the second horizontal transfer unit 210. An additional rail is provided between both rails. Therefore, it is configured to reflect the size of both ends of the secondary cut PCB and to perform horizontal transfer and discharge.

Looking at the operation process according to an embodiment of the cutting method using the automatic PCB cutting device applied to the technology of the present invention made of a configuration as described above are as follows. The following description is to be given by the preferred embodiment of the present invention, the present invention is not limited by the following examples and it will be obvious that various modifications can be provided within the scope without departing from the scope of the invention. .

PCB automatic cutting method using the automatic PCB cutting device of the present invention comprises a first cutting process (S10) and a second cutting process (S20).

The first cutting process (S10) is a process of cutting a PCB assembly around one side of a cutting ruled line, dividing it into two PCB pieces, and then supplying the second cutting module 200.

First, a step (S11) of entering the PCB forming the plurality of cutting ruled lines into the first horizontal transfer unit 110 of the first cutting module 100 is performed.

The PCB is placed in the first vertical transfer part 120 to rise to the first cutting part 130 (S12).

That is, the PCB which is horizontally transported because both ends are settled in the first horizontal transfer part 110 is lifted from the first horizontal transfer part 110 in a state where the bottom is settled by the rise of the first vertical transfer part 120. It is supplied to the first cutting portion 130 located in.

The first grip part 151 and the second grip part 152 of the first cutting part 130 to grip the PCB and to move to the first cutting section Z1 provided with the first dust collecting part 190 (S13). Is carried out.

That is, the first grip part 151 and the second grip part 152 move backward with respect to the first cylinder 171 to move the grip body 172 to correspond to the lengths of both ends of the PCB, and to move the second cylinder 174. Advance to operate the grip means 173 gripping the PCB.

When the cutting operation unit 150 of the first cutting unit 130 grips the PCB, the cutting moving unit 160 of the first cutting unit 130 vertically lifts the vertical moving unit 161 to allow the first vertical Lifting the PCB from the sending unit 120, the cutting moving unit 160 moves the horizontal moving unit 162 horizontally to move the cutting operation unit 150 to the first cutting section to wait for the first cutting.

The first cutting unit 130 is rotated forward by 90 degrees and the folding movable unit 155 is rotated by a predetermined angle to perform the primary cutting step (S14).

That is, when the cutting moving unit 160 of the first cutting unit 130 rotates the rotating unit 153 forward by 90 degrees to rotate the cutting operation unit 150, the cutting ruled line 182 and the cutting ruled line and the first cutting of the PCB are rotated. The first dust collector 190 located in the section is located on the same line.

The cutting operation unit 150 advances the third cylinder 181 and rotates the folding movable part 155 at an angle from the folding fixing part 154 based on the folding shaft part 182 by the first grip part 151 and the second. Both sides of the PCB held by the grip unit 152 are cut and divided based on the cutting ruled line.

The first cutting part 130 is moved to the second vertical transfer part 140, and the second grip part 152 is released to place one PCB among the plurality of first cut PCBs in the second lifting means 142. Step S15 is performed.

That is, in a state in which the first grip part 151 and the second grip part 152 hold the divided PCB pieces, the horizontal moving part 162 of the cutting moving part 160 moves the cutting operation part 150 to the second. It moves to the upper side of the vertical transfer unit 140, and lowers the vertical transfer unit 161. At this time, the second grip part 152 releases the grip means 173 first, and then places one side PCB piece held by the second grip part 152 in the second lifting means 142 of the second vertical transfer part 140. To rise.

The second lifting means 142 is lowered to the second horizontal transfer unit 210 to enter the one side PCB into the second cutting module 200 (S16).

In step S17, the first grip part 151 of the first cutting part 130 is released to place the other PCB among the plurality of first cut PCBs in the first lifting means 141.

That is, the one-side PCB piece is placed in the second lifting means 142 of the second vertical transfer part 140, and then the vertical moving part 161 in the raised state is lowered again, and the first grip part 151 is the grip means ( 173 is released and the other PCB piece held by the first grip part 151 is placed in the first lifting means 141 of the second vertical transfer part 140 and then raised.

The first lifting means 141 is lowered to the second horizontal transfer part 210 to enter the other PCB into the second cutting module 200 (S18).

The above-described series of steps are repeated by performing the step S19 of returning the first cutting part 130 to the upper side of the first vertical transfer part 120 and rotating backward 90 degrees.

The secondary cutting process (S20) is a process of receiving a PCB assembly divided in two through the first cutting process in sequence, cutting the other cutting ruled line to divide the final four PCB pieces and then discharged.

First, a step (S21) of entering the first cut PCB into the second horizontal transfer unit 210 of the second cutting module 200 is performed.

The PCB is placed in the third vertical transfer part 220 to lift up the second cutting part 230 (S22).

That is, the PCB which is horizontally transported because both ends are settled in the second horizontal transfer part 210 is lifted from the second horizontal transfer part 210 in a state where the bottom is settled by the rise of the third vertical transfer part 220 and the upper side thereof. It is supplied to the second cutting portion 230 located at.

The first grip part 151 and the second grip part 152 of the second cutting part 230 grip the PCB and move to the second cutting section Z2 provided with the second dust collecting part 260 (S23). Is carried out.

That is, the first grip part 151 and the second grip part 152 move backward with respect to the first cylinder 171 to move the grip body 172 to correspond to the lengths of both ends of the PCB, and to move the second cylinder 174. Advance to operate the grip means 173 gripping the PCB.

When the cutting operation unit 150 of the first cutting unit 130 grips the PCB, the cutting movement unit 160 of the first cutting unit 130 vertically lifts the vertical movement unit 161 to allow a third vertical movement. Lifting the PCB from the sending unit 220, the cutting moving unit 160 moves the horizontal moving unit 162 horizontally to move the cutting operation unit 150 to the second cutting section to wait for the second cutting.

The second cutting part 230 is rotated forward by 90 degrees and the folding movable part 155 is rotated at an angle to perform the second cutting of the PCB (S24).

That is, when the cutting moving unit 160 of the second cutting unit 230 rotates the rotating unit 153 forward by 90 degrees to rotate the cutting operation unit 150, the cutting ruled line 182 and the cutting ruled line and the second cutting of the PCB are rotated. The second dust collector 260 positioned in the section is positioned on the same line.

The cutting operation unit 150 advances the third cylinder 181 and rotates the folding movable part 155 at an angle from the folding fixing part 154 based on the folding shaft part 182 by the first grip part 151 and the second. Both sides of the PCB held by the grip unit 152 are cut and divided based on the cutting ruled line.

The second cutting part 230 is moved to the fourth vertical transfer part 240, and the second grip part 152 is released to place one PCB among the plurality of second cut PCBs in the second lifting means 142. Step S25 is performed.

That is, in a state in which the first grip part 151 and the second grip part 152 hold the divided PCB pieces, the horizontal moving part 162 of the cutting moving part 160 moves the cutting operation part 150 to the fourth. It moves to the upper side of the vertical transfer unit 240, and lowers the vertical transfer unit 161. At this time, the second grip part 152 releases the grip means 173 first, and then places one PCB piece held by the second grip part 152 on the second lifting means 242 of the fourth vertical transfer part 240. To rise.

The second lifting means 242 is lowered to the third horizontal transfer part 250 to discharge the one side PCB (S26).

The first grip part 151 of the second cutting part 230 is released to place the other PCB among the plurality of second-cut PCBs in the first lifting means 141 (S27).

That is, the one-side PCB piece is placed in the second lifting means 242 of the fourth vertical transfer part 240, and then the vertical moving part 161 in the raised state is lowered again, and the first grip part 151 is grip means ( 173 is released and the other PCB piece held by the first grip part 151 is placed in the first lifting means 241 of the fourth vertical transfer part 240 and then raised.

The first lifting means 241 is lowered to the third horizontal transfer part 250 to discharge the other PCB (S28).

By returning the second cutting unit 230 to the upper side of the third vertical transfer unit 220 and performing a reverse rotation 90 degrees (S29), the PCB assembly first introduced through the first cutting process and the second cutting process is 4 The parting cuts sequentially eject each PCB piece individually.

PCB automatic cutting device and a cutting method using the device according to the present invention as described above PCB cutting operation by providing a PCB automatic cutting device to perform a whole series of processes for cutting and dividing the PCB assembly into a plurality of pieces automatically This results in more efficient and significantly improves workability and productivity.

In particular, the present invention transfers the PCB forming the cutting ruled line and rotates according to the forming direction of the cutting ruled line and then cut firstly by the folding method, and the cut individual PCBs are sequentially re-entered into the secondary cutting process and the second cut again. The advantage is that the PCB assembly can be automatically cut non-stop into multiple pieces by mounting a series of configurations.

In addition, in an embodiment of the present invention, the first cutting module 100 and the second cutting module 200 are configured to cut the PCB into the final quadrant pieces, but it is very easy to additionally configure the cutting module as necessary. As such, the device's scalability and utility are expected to increase industrial applicability.

100: first cutting module 110: the first horizontal transfer unit
111: first rail means 120: first vertical transfer part
130: first cutting portion 140: second vertical transfer portion
141, 142: first and second lifting means 150: cutting operation portion
151: first grip part 152: second grip part
153: rotating part 154: folding and fixing
155: folding moving part 160: cutting moving part
161: vertical moving part 162: horizontal moving part
171: first cylinder 172: grip body
173: grip means 174: second cylinder
181: third cylinder 182: folding shaft portion
190: first dust collecting unit 191: intake hood
200: second cutting module 210: second horizontal transfer unit
211: second rail means 220: third vertical conveying unit
230: second cutting portion 240: fourth vertical transfer portion
241,242: first and second lifting means 250: third horizontal transfer unit
251: third rail means 260: second dust collecting unit

Claims (7)

A first horizontal transfer part 110 for horizontally driving the first rail means 111 for seating the PCB;
A first vertical transfer part 120 that lifts and lifts the PCB from one side of the first horizontal transfer part 110,
A first cutting part 130 that first cuts the PCB by folding the PCB on the upper side of the first vertical transfer part 120;
A first cutting module 100 formed of a second vertical transfer part 140 that individually seats and lifts a plurality of PCBs divided by primary cutting at a lower side of the first cutting part 130;
A second horizontal transfer part 210 for horizontally driving the second rail means 211 for mounting the PCB on one side of the second vertical transfer part 140;
A third vertical transfer part 220 that lifts and lifts the PCB from one side of the second horizontal transfer part 210;
A second cutting part 230 which folds the PCB on the upper side of the third vertical transfer part 220 to cut the second part;
A fourth vertical transfer part 240 which individually seats and lifts a plurality of PCBs divided by the second cutting on the lower side of the second cutting part 230,
And a second cutting module 200 including a third horizontal transfer part 250 for horizontally driving the third rail means 251 for mounting the PCB at one side of the fourth vertical transfer part 240. PCB automatic cutting device. The method of claim 1,
The first cutting portion 130 and the second cutting portion 230,
A first grip part 151 and a second grip part 152 each holding both ends of one side and the other side of the PCB around the cutting ruled line;
A folding fixing part 154 coupled to the first grip part 151 and rotating the cutting operation part 150 by 90 degrees in association with the rotating part 153,
A cutting operation unit 150 which is combined with the second grip unit 152 and axially coupled to one side of the folding fixing unit 154 to be rotated by a predetermined angle;
A vertical moving part 161 for mounting the rotating part 153 of the folding fixing part 154 to elevate the cutting operation part 150;
Mounting the vertical moving unit 161, the automatic PCB cutting device, characterized in that it comprises a cutting moving unit 160 consisting of a horizontal moving unit 162 for driving the cutting operation unit 150 horizontally. The method of claim 2,
The first grip part 151 and the second grip part 152,
A grip body 172 coupled to both ends of the first cylinder 171 to be symmetrical to adjust a mutual distance;
Grip means 173 hinged to the lower end of the grip body 172,
A second cylinder 174 mounted to the grip body 172 and hinged to the lower end of the grip means 173 to adjust the angle of the grip means 173;
The folding movable part 155,
A third cylinder 181 hinged to both ends of each of the folding fixing parts 154 and the folding moving parts 155,
PCB automatic cutting device, characterized in that it comprises a folding shaft portion 182 for hinge-bonding the lower end of each of the folding and fixing portion 154 and the folding movable portion 155. The method of claim 1,
The second vertical transfer unit 140 and the fourth vertical transfer unit 240,
The second horizontal transfer unit 210 or the first lifting means (141, 241) and the second lifting means (142, 242) for seating and alternately lifting up a plurality of PCB divided by the primary or secondary cutting, 3 Automatic PCB cutting device, characterized in that configured to be seated on the horizontal transfer unit 250, the individual PCB sequentially. The method of claim 1,
The first dust collecting unit 190 and the second dust collecting unit 260 having an intake hood 191 upwardly are formed below the first cutting unit 130 and the second cutting unit 230. PCB automatic cutting device. In the PCB automatic cutting method for performing the first cutting process (S10) and the second cutting process (S20) using the automatic PCB cutting device manufactured by any one of claims 1 to 5,
The primary cutting process (S10),
Step (S11) of entering the PCB forming the plurality of cutting ruled lines into the first horizontal transfer part 110 of the first cutting module 100;
Placing the PCB on the first vertical transfer part 120 and ascending to the first cutting part 130 (S12);
The first grip part 151 and the second grip part 152 of the first cutting part 130 grips the PCB and moves to the first cutting section Z1 provided with the first dust collecting part 190 (S13). Wow,
Rotating the first cutting unit 130 by 90 degrees and rotating the folding movable unit 155 at a predetermined angle to cut the PCB first (S14);
The first cutting part 130 is moved to the second vertical transfer part 140, and the second grip part 152 is released to place one PCB among the plurality of first cut PCBs in the second lifting means 142. Step S15,
Lowering the second lifting means 142 to the second horizontal transfer part 210 to enter the one side PCB into the second cutting module 200 (S16);
Releasing the first grip part 151 of the first cutting part 130 and placing the other PCB among the plurality of first cut PCBs in the first lifting means 141 (S17);
Lowering the first elevating means 141 to the second horizontal transfer part 210 to enter the other PCB into the second cutting module 200 (S18);
Returning to the upper side of the first vertical transfer unit 120, the first cutting unit 130, the reverse rotation 90 degrees (S19) comprising the automatic cutting method comprising the. The method of claim 6,
The secondary cutting process (S20),
Entering the first cut PCB into the second horizontal transfer part 210 of the second cutting module 200 (S21);
Placing the PCB on the third vertical transfer part 220 and raising the second cutting part 230 (S22);
The first grip part 151 and the second grip part 152 of the second cutting part 230 grip the PCB and move to the second cutting section Z2 provided with the second dust collecting part 260 (S23). Wow,
Rotating the second cutting unit 230 by 90 degrees and rotating the folding movable unit 155 at a predetermined angle to cut the PCB secondly (S24);
The second cutting part 230 is moved to the fourth vertical transfer part 240, and the second grip part 152 is released to seat one PCB among the plurality of second cut PCBs in the second lifting means 242. Step S25,
Discharging the one side PCB by lowering the second lifting means 242 to the third horizontal transfer part 250 (S26);
Releasing the first grip part 151 of the second cutting part 230 and placing the other PCB among the plurality of second cut PCBs in the first lifting means 241 (S27);
Lowering the first elevating means 241 to the third horizontal transfer part 250 to discharge the other PCB (S28);
Returning the second cutting portion 230 to the upper side of the third vertical transfer unit 220 to rotate 90 degrees reverse (S29), characterized in that the automatic PCB cutting method.

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