CN217009124U

CN217009124U - Separation equipment for current detection chip

Info

Publication number: CN217009124U
Application number: CN202122941910.8U
Authority: CN
Inventors: 马士强; 赵显明
Original assignee: Jiale Technology Co ltd
Current assignee: Xiamen Seebest Technology Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-07-19
Anticipated expiration: 2031-11-26

Abstract

The utility model provides a separation device of a current detection chip, and belongs to the technical field of chip manufacturing. It has solved and has detached the wafer from the film inefficiency scheduling problem excessively. This splitter of current detection chip includes the workstation, set up the fixing base on the workstation, jacking device and transfer device, the through-hole is worn to be equipped with by the fixing base, the wafer is located the through-hole, jacking device is located the through-hole below, jacking device is used for the wafer jack-up that will be located the through-hole, the fixing base is provided with first mobile device, first mobile device is used for driving the fixing base and moves from beginning to end and from side to side, transfer device includes first drive arrangement and two suction means that are located a drive arrangement both sides, two suction means are connected through the connecting rod to first drive arrangement's output shaft, first drive arrangement is used for driving two suction means and prolongs the connecting rod rotatory, suction means is used for absorbing the wafer that is jacked up. The utility model has the advantages of accelerating the separation of the chip and the like.

Description

Separation equipment for current detection chip

Technical Field

The utility model belongs to the technical field of chip manufacturing, and particularly relates to a separation device of a current detection chip.

Background

In the manufacturing process of chips, a step of cutting a large wafer into a plurality of chips is generally included. To facilitate dicing, the wafer is first adhered to the film. Therefore, the cut chips are still adhered to the film and are arranged together in order, after the cutting is finished, the cut wafers are torn off from the film at one time, the separation device separates one chip firstly, after the chips are separated from the film, the wafers need to be moved to the packaging device by the separation device, and the efficiency of the existing separation and conveying device is low.

Disclosure of Invention

The present invention is directed to solving the above problems in the prior art, and provides a separation apparatus for a current detection chip.

The purpose of the utility model can be realized by the following technical scheme: the separation equipment of the current detection chip is characterized by comprising a workbench, wherein the workbench is provided with a fixed seat for fixing a wafer, a jacking device and a transfer device for transferring a chip to a packaging device, the fixed seat is provided with a through hole in a penetrating way, the wafer is positioned in the through hole, the jacking device is positioned below the through hole, the jacking device is used for jacking the wafer in the through hole, the fixed seat is provided with a first moving device, the first moving device is used for driving the fixed seat to move left and right and front and back, the transferring device comprises a first driving device and two suction devices positioned at two sides of the first driving device, the output shaft of the first driving device is connected with the two suction devices through a connecting rod, the first driving device is used for driving the two suction devices to rotate along the connecting rod, and the suction devices are used for sucking the jacked wafers.

The working principle of the utility model is as follows: after the wafer is cut, the wafer is fixed in the fixing base, the lifting device lifts the chip to separate the periphery of the chip from the film, the suction device sucks the chip, when the suction devices suck the wafer, the jacking device returns to the initial device to separate the wafer from the film, the first driving device drives the two suction devices to rotate, meanwhile, the first moving device drives the fixed seat to move, so that a new wafer is positioned above the jacking device, the suction device sucking the chip rotates to the packaging device, the other suction device moves to the upper part of the fixed seat, the suction device sucking the chip stops sucking the wafer, and (3) enabling the wafer to be positioned in the packaging device, jacking the wafer by the jacking device, enabling the other suction device to suck a new wafer, separating the new wafer from the film, and repeating the steps until all wafers enter the packaging device.

In the above separation apparatus for current detection chips, a connecting seat is provided at the bottom of the connecting rod, second moving devices are provided at two ends of the connecting seat, the second moving devices are connected to the suction devices, and when the first driving device drives the suction devices to rotate, the second moving devices drive the two suction devices to approach the connecting rod.

In the above-mentioned splitter of current detection chip, the connecting seat rotates and is connected with the fixed station, the fixed station fixed connection the workstation.

In the above separation device for the current detection chip, the connecting seat is provided with two slide rails, the slide rails are provided with a second driving device, the second moving device comprises a second moving plate and a first mounting block arranged on the second moving plate, the second moving plate is provided with a slide block, the second driving device is used for driving the slide block to move along the length direction of the slide rails, and the first mounting block is used for connecting the suction device.

In the above separation apparatus for current detection chips, the suction device includes a lifting device, a third driving device and a suction nozzle, the lifting device is configured to drive the suction nozzle to ascend or descend, and the third driving device is configured to drive the suction nozzle to generate suction force on the wafer.

In the above separation apparatus for current detection chips, the lifting device includes a fourth driving device and a telescopic rod, the fourth driving device is used for driving the telescopic rod to extend or shorten, and the suction nozzle is located on the telescopic rod.

In the above-mentioned splitter of current detection chip, the fixing base includes base and grip block, the base is used for supplying the wafer to place, the grip block is used for the butt in the wafer top, grip block and base one end pivot are connected, grip block and base other end buckle are connected.

In the separation device for the current detection chip, the first moving device comprises two pairs of first lead screw driving devices and a first moving plate, the first lead screw driving devices are used for driving the first moving plate to move back and forth, the first moving plate is provided with a second lead screw driving device, the second lead screw driving device is connected with the fixed seat, and the second lead screw driving device is used for driving the fixed seat to move left and right.

In the above separation apparatus for current detection chips, the jacking device includes a fifth driving device and an air pump, the fifth driving device is provided with a second mounting block, the fifth driving device is used for driving the second mounting block to ascend or descend, the second mounting block is provided with a thimble and two air vents, the two air vents are both connected with the air pump through an air pipe, and when the thimble jacks up the wafer, the air pump sucks air through the two air vents.

In the above-mentioned separation apparatus for current detection chips, the ejector pin is located below the suction nozzle, and when the suction device sucks the wafer, the ejector pin is directly opposite to the suction nozzle.

Compared with the prior art, the utility model has the advantages of accelerating the separation of the chips and having high efficiency.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is a schematic view of the structure of the transfer device of the present invention;

FIG. 4 is a schematic diagram of a first mobile device according to the present invention;

fig. 5 is a schematic structural view of the jacking device of the utility model.

In the figure, 1, a workbench; 2. a fixed seat; 3. a jacking device; 4. a transfer device; 5. a through hole; 6. a first mobile device; 7. a first driving device; 8. a suction device; 9. a connecting seat; 10. a second mobile device; 11. a fixed table; 12. a slide rail; 13. a second driving device; 14. a second moving plate; 15. a first mounting block; 16. a lifting device; 17. a third driving device; 18. a suction nozzle; 19. a fourth drive device; 20. a telescopic rod; 21. a base; 22. a clamping plate; 23. a first lead screw drive device; 24. a first moving plate; 25. a second screw driving device; 26. an air tube; 27. a fifth driving device; 28. an air pump; 29. a second mounting block; 30. a thimble; 31. a vent hole; 32. a connecting rod; 33. a slide block.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

As shown in fig. 1-5, a separation apparatus for current detection chips comprises a worktable 1, a fixing base 2 for fixing a wafer is arranged on the worktable 1, jacking device 3 with be used for transferring the wafer to packaging hardware's transfer device 4, fixing base 2 is worn to be equipped with through-hole 5, the wafer is located through-hole 5, jacking device 3 is located through-hole 5 below, jacking device 3 is used for the wafer jack-up that will be located through-hole 5, fixing base 2 is provided with first mobile device 6, first mobile device 6 is used for driving fixing base 2 to control from beginning to end and moving, transfer device 4 includes first drive arrangement 7 and two suction means 8 that are located 7 both sides of first drive arrangement, two suction means 8 are connected through connecting rod 32 to the output shaft of first drive arrangement 7, first drive arrangement 7 is used for driving two suction means 8 rotatory, suction means 8 is used for absorbing the wafer by the jack-up.

In further detail, the bottom of the connecting rod 32 is provided with a connecting seat 9, two ends of the connecting seat 9 are provided with second moving devices 10, the second moving devices 10 are connected with the suction devices 8, and when the first driving device 7 drives the suction devices 8 to rotate, the second moving devices 10 drive the two suction devices 8 to approach the connecting rod.

The second moving device 10 is used to reduce the space required when the first driving device 7 drives the suction device 8 to rotate, and prevent the suction device 8 from colliding with the workbench 1 to cause damage.

In more detail, the connecting seat 9 is rotatably connected with a fixing table 11, and the fixing table 11 is fixedly connected with the workbench 1.

This arrangement serves to increase the stability when the first driving means 7 drives the suction means 8 to rotate, while preventing the transfer means 4 from falling.

In more detail, two slide rails 12 are arranged on the connecting seat 9, the slide rails 12 are provided with a second driving device 13, the second moving device 10 includes a second moving plate 14 and a first mounting block 15 arranged on the second moving plate 14, the second moving plate 14 is provided with a slider 37, the second driving device 13 is used for driving the slider 37 to move along the length direction of the slide rails 12, and the first mounting block 15 is used for connecting the suction device 8.

When the first driving device 7 drives the suction devices 8 to rotate, the second driving device 13 drives the sliding block 37 to move, so that the two suction devices 8 move towards the connecting rod, the space required by the first driving device 7 for driving the suction devices 8 to rotate is reduced, and when the suction devices 8 rotate to be close to the fixed seat 2 or the packaging device, the second driving device 13 drives the sliding block 37 to move, so that the two suction devices 8 move towards the direction far away from the connecting rod 32.

In further detail, the suction device 8 comprises a lifting device 16, a third driving device 17 and a suction nozzle 18, wherein the lifting device 16 is used for driving the suction nozzle 18 to ascend or descend, and the third driving device 17 is used for driving the suction nozzle 18 to generate suction force to the wafer.

When the suction nozzle 18 is required to suck the wafer, the lifting device 16 drives the suction nozzle 18 to descend so that the suction nozzle 18 abuts on the wafer, the third driving device 17 drives the suction nozzle 18 to generate suction force to suck the wafer on the suction nozzle 18, and then the lifting device 16 drives the suction nozzle 18 to ascend so that the wafer is separated from the film.

In more detail, the lifting device 16 includes a fourth driving device 19 and a telescopic rod 20, the fourth driving device 19 is used for driving the telescopic rod 20 to extend or contract, and the suction nozzle 18 is located on the telescopic rod 20.

When the suction nozzle 18 needs to be lowered, the fourth driving device 19 drives the telescopic rod 20 to extend so that the suction nozzle 18 abuts on the wafer, and when the suction nozzle 18 needs to be raised, the fourth driving device 19 drives the telescopic rod 20 to shorten so that the suction nozzle 18 is raised to return to the initial position.

In further detail, the fixing base 2 includes a base 21 and a clamping plate 22, the base 21 is used for placing a wafer, the clamping plate 22 is used for abutting against the upper side of the wafer, the clamping plate 22 is connected with a rotating shaft at one end of the base 21, and the clamping plate 22 is connected with a buckle at the other end of the base 21.

The wafer is placed on the base 21, the clamping plate 22 rotates along the rotating shaft, the other end of the clamping plate 22 is connected with the other end of the base 21 in a buckled mode, the clamping plate 22 is matched with the base 21 to fix the wafer, and the wafer fixing device is simple in structure.

In a further detail, the first moving device 6 includes two pairs of first lead screw driving devices 23 and a first moving plate 24, the first lead screw driving devices 23 are used for driving the first moving plate 24 to move back and forth, a second lead screw driving device 25 is arranged on the first moving plate 24, the upper portion of the second lead screw driving device 25 is connected with the fixed seat 2, and the second lead screw driving device 25 is used for driving the fixed seat 2 to move left and right.

The initial device fixing seat 2 is aligned with the suction nozzle 18 and the jacking device 3 most at the center, when a wafer leaves from the film, the first screw rod driving device 23 is matched with the second screw rod driving device 25 to drive the fixing seat 2 to move, so that the new wafer is positioned between the suction nozzle 18 and the jacking device 3, the new wafer is jacked up by the jacking device 3 to be sucked by the suction nozzle 18, and the steps are repeated, so that all wafers are separated from the film.

In more detail, the jacking device 3 comprises a fifth driving device 27 and an air pump 28, the fifth driving device 27 is provided with a second mounting block 29, the fifth driving device 27 is used for driving the second mounting block 29 to ascend or descend, the second mounting block 29 is provided with a thimble 30 and two vent holes 31, the two vent holes 31 are both connected with the air pump 28 through the air pipe 26, and when the thimble 30 jacks up the wafer, the air pump 28 sucks air through the two vent holes 31.

When the fifth driving device 27 drives the second mounting block 29 to ascend, the air pump 28 sucks air into the two air holes 31 through the air pipe, so that the air sucking holes suck air into the film, the film is made to approach the second mounting block 29, and the film near the ejector pin 30 moves downward and is separated from the wafer.

In more detail, the ejector pin 30 is located below the suction nozzle 18, and when the suction device 8 sucks the wafer, the ejector pin 30 is opposite to the suction nozzle 18.

The success rate of the suction device 8 for sucking the wafer is increased.

The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the utility model as defined in the appended claims.

Although a large number of terms are used herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to the spirit of the present invention.

Claims

1. The separation equipment for the current detection chip is characterized by comprising a workbench (1), wherein a fixed seat (2) for fixing a wafer, a jacking device (3) and a transfer device (4) for transferring the wafer to a packaging device are arranged on the workbench (1), a through hole (5) is arranged in the fixed seat (2) in a penetrating manner, the wafer is positioned in the through hole (5), the jacking device (3) is positioned below the through hole (5), the jacking device (3) is used for jacking the wafer positioned in the through hole (5), the fixed seat (2) is provided with a first moving device (6), the first moving device (6) is used for driving the fixed seat (2) to move left and right around, the transfer device (4) comprises a first driving device (7) and two suction devices (8) positioned at two sides of the first driving device (7), the output shaft of the first driving device (7) is connected with the two suction devices (8) through a connecting rod (32), the first driving device (7) is used for driving the two suction devices (8) to rotate along the connecting rod, and the suction devices (8) are used for sucking the jacked wafer.

2. The separation apparatus for current detection chip according to claim 1, wherein the bottom of the connecting rod is provided with a connecting seat (9), two ends of the connecting seat (9) are provided with second moving devices (10), the second moving devices (10) are connected with the suction devices (8), and when the first driving device (7) drives the suction devices (8) to rotate, the second moving devices (10) drive the two suction devices (8) to approach the connecting rod.

3. The separation device for the current detection chip as claimed in claim 2, wherein the connecting base (9) is rotatably connected with a fixing table (11), and the fixing table (11) is fixedly connected with the workbench (1).

4. The current detection chip separation apparatus according to claim 2, wherein two slide rails (12) are disposed on the connecting base (9), the slide rails (12) are provided with a second driving device (13), the second moving device (10) includes a second moving plate (14) and a first mounting block (15) disposed on the second moving plate (14), the second moving plate (14) is provided with a slider (37), the second driving device (13) is configured to drive the slider (37) to move along a length direction of the slide rails (12), and the first mounting block (15) is configured to connect the suction device (8).

5. A current detection chip separation apparatus according to claim 1, wherein the suction device (8) comprises a lifting device (16), a third driving device (17) and a suction nozzle (18), the lifting device (16) is used for driving the suction nozzle (18) to ascend or descend, and the third driving device (17) is used for driving the suction nozzle (18) to generate suction force on the wafer.

6. The separation apparatus for current detection chip as claimed in claim 5, wherein said lifting device (16) comprises a fourth driving device (19) and a telescopic rod (20), said fourth driving device (19) is used for driving said telescopic rod (20) to extend or contract, said suction nozzle (18) is located on said telescopic rod (20).

7. The separation apparatus for current detection chips according to claim 1, wherein the fixing base (2) includes a base (21) and a clamping plate (22), the base (21) is used for placing a wafer, the clamping plate (22) is used for abutting on the wafer, the clamping plate (22) is connected with one end of the base (21) through a rotating shaft, and the clamping plate (22) is connected with the other end of the base (21) through a snap-fit connection.

8. The separation apparatus of a current detection chip according to claim 1, wherein the first moving device (6) comprises two pairs of first screw driving devices (23) and a first moving plate (24), the first screw driving devices (23) are used for driving the first moving plate (24) to move back and forth, a second screw driving device (25) is arranged on the first moving plate (24), the second screw driving device (25) is connected with the fixed seat (2), and the second screw driving device (25) is used for driving the fixed seat (2) to move left and right.

9. The separation apparatus of the current detection chip as claimed in claim 6, wherein the jacking device (3) comprises a fifth driving device (27) and an air pump (28), the fifth driving device (27) is provided with a second mounting block (29), the fifth driving device (27) is used for driving the second mounting block (29) to ascend or descend, the second mounting block (29) is provided with a thimble (30) and two vent holes (31), both of the vent holes (31) are connected with the air pump (28) through an air pipe (26), and when the thimble (30) jacks up the wafer, the air pump (28) sucks air through the two vent holes (31).

10. The apparatus for separating current sense die as claimed in claim 9, wherein said ejector pin (30) is located below said suction nozzle (18), said ejector pin (30) facing said suction nozzle (18) when said suction means (8) sucks the wafer.