KR101532925B1 - Apparatus for cutting printed circuit board - Google Patents

Abstract

The present invention relates to an image forming apparatus, A PC mounting part installed on the main body and having a plurality of PCs loaded from the outside, the PC mounting part being seated at a set position; A PCB fixing unit installed in the main body and fixing the plurality of PCBs; And a PCB cutting unit installed in the main body and sequentially cutting a predetermined cutting area of the fixed plurality of PCBs by applying a rotational force along the bottom of the PCB at the top of the PCB.

Description

{APPARATUS FOR CUTTING PRINTED CIRCUIT BOARD}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a PCB cutting apparatus, and more particularly, to a PCB cutting apparatus for mounting electronic components that can cut a plurality of PCBs to a predetermined standard.

In general, PCBs are fabricated as assemblies with a number of PCBs connected to each other to increase work efficiency and mobility.

The PCB assembly consists of a substrate, a dummy and a bridge. Conventionally, the operator breaks the bridge by hand and cuts each substrate into PCBs. Therefore, coarse sludge is generated on the fracture surface during cutting. Was essential.

In recent years, in order to solve the above-mentioned problems, there has been proposed a conveyor in which a PCB assembly is fixed to a jig and linearly fed, and a PCB assembly transferred by a conveyor is cut by a drill bit, A method of cutting a bridge which is a boundary of an area is used.

However, when the bridges are cut by being rotated sideways along the longitudinal direction of the PCB by using the grill bits, there is a problem that the cut surfaces are uneven and foreign matter generated at the time of cutting remains.

Prior art related to the present invention is Korean Patent Laid-Open Publication No. 10-2006-0121551 (published on November 29, 2006), and the prior art discloses a technique for cutting a PCB assembly.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a PCB cutting apparatus for mounting an electronic component which can cut a plurality of PCBs to a predetermined standard.

In a preferred aspect, the present invention provides a medical device comprising: a body; A PC mounting part installed on the main body and having a plurality of PCs loaded from the outside, the PC mounting part being seated at a set position; A PCB fixing unit installed in the main body and fixing the plurality of PCBs; And a PCB cutting unit installed in the main body and sequentially cutting a predetermined cutting area of the fixed plurality of PCBs by applying a rotational force along the bottom of the PCB at the top of the PCB.

Preferably, the PCB seating part includes a seating jig having a seating area where the plurality of PCBs are aligned and seated, and a first moving unit that moves the seating jig to a cutting position where the seating jig is cut by the PC cutting part.

At least one guide groove having a predetermined depth corresponding to a position of a boundary between the PC and the cut region is formed on the bottom surface of the seating jig.

The PCB fixing unit may include a fixing jig positioned at an upper end of the seating jig and a second moving unit moving the fixing jig to be positioned at an upper end of the seating jig.

It is preferable that at least one fixing member for fixing a plurality of PCBs which are seated on the seating jig is provided on the bottom surface of the fixing jig.

The fixing jig is positioned at the upper end of the seating jig so as to cover the upper portion of the seating jig.

The fixing jig preferably has at least one cutting edge guide hole aligned with the guide groove.

A cutting head mounted on the main body so as to be disposed at an upper portion of the cutting position, the cutting head having a disc-shaped cutting edge rotatably installed; A three-axis moving unit installed in the main body and moving the position along three axial directions so that the cutting edge is located in the cutting blade guide hole and the guide groove and cuts the boundary of the cut region of the PCB .

The guide groove and the cutting edge guide hole may be adjustable in width by adjusting the opening area.

The cutting blade is installed in parallel with the cutting head, and is provided in a plurality of independently openable and downwardly protruding portions.

The cutting head is provided with a cylinder having a stretchable cylinder axis.

Each of the plurality of cutting blades is provided on a cylinder axis of each of the plurality of cylinders and is projected and retracted in accordance with the expansion and contraction of the cylinder axis.

The thickness of the plurality of cutting edges is set in the controller.

The controller inputs the width of the guide groove and the cutting blade guide hole from the outside,

The controller drives the cylinder so that a cylinder axis connected to any one of the plurality of cutting blades having a thickness corresponding to the input width protrudes downward.

The seating jig is further provided with a thickness measuring sensor for measuring the thickness of the PCB that is seated on the seating jig.

The thickness measuring sensor transmits the thickness measured by the controller.

In the controller, a rotational speed corresponding to the thickness of the PCB is preset, and the rotational speed is proportional to the thickness.

Preferably, the controller controls driving of the rotation motor to achieve a rotation speed corresponding to the measured thickness.

The cutting blade includes a central blade having a predetermined diameter and a plurality of outer blades provided on a circumference of the central blade and having different diameters and formed in a ring shape so as to be detachable from each other .

The present invention has an effect that a plurality of PCs can be cut so as to have a predetermined standard.

Further, according to the present invention, by cutting the boundary of the cutting area of the PCB by using the rotary disk-shaped cutting blade, foreign matter due to cutting caused at the boundary of the cutting area as compared with the method of grinding along the longitudinal direction of the conventional PCB It is possible to effectively prevent the remaining part from being lost.

In addition, the present invention has an effect of improving productivity by cutting a required portion in a state where a large number of PCBs are aligned and fixed in a large amount.

Further, the present invention has the effect of cutting a PC of various thicknesses in one apparatus by using a disc-shaped cutting edge having various thicknesses.

In addition, the present invention has an effect of increasing the cutting efficiency by allowing the user to immediately measure the thickness of the faced portion to be seated and to select the cutting edge which can easily cut the thickness.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a view showing a configuration of a laser beam cutting apparatus for mounting electronic parts according to the present invention; FIG.
2 is a view showing a seating jig according to the present invention.
3 is a view showing a PCB fixing portion according to the present invention.
4 is a view showing an example in which the PCBs are fixed by the fixing jig according to the present invention.
FIG. 5 is a view showing a PC cut part according to the present invention. FIG.
FIGS. 6 and 7 are views showing the process of cutting the PCBs.
FIGS. 8A and 8B are plan views showing examples of adjustable widths of guide grooves and cutting blade guide holes according to the present invention. FIG.
9 is a view showing an example in which a plurality of cutting edges according to the present invention are provided.
FIG. 10 is a block diagram showing a rotation speed control operation of a cutting edge by measuring the thickness of the PCB.
11 is a view showing another example of a cutting edge according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic component mounting apparatus for mounting an electronic component of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a view showing a configuration of a laser beam cutting apparatus for mounting electronic parts according to the present invention; FIG.

Referring to FIG. 1, a cutting apparatus for mounting an electronic component of the present invention includes a main body 100, a loading unit 200, a PCB seating unit 300, a PCB fixing unit 400, 500).

The loading unit 200,

The loading unit 200 is installed in the main body 100 and includes a conveyor belt 210 for conveying a plurality of PCBs 10 and PCBs 10 conveyed through the conveyor belt 210, And a gripper 220 for transferring the image to the seating part 300.

The gripper 220 picks up the transferred PCB 10 using a vacuum and transfers the PCB 10 to the PCB seating unit 300.

The PCB seating part 300 includes:

The PCB seating part 300 includes a seating jig 310 and a first moving unit 320 for moving the seating jig 310 to a cutting position where the PC cutting part 500 is disposed.

2 is a view showing a seating jig according to the present invention.

Referring to FIG. 2, the seating jig 310 is formed with a seating area 311 in which an upper portion is opened and a plurality of PCBs 10 are aligned and seated inside.

A guide groove 312 is formed in the bottom surface of the seating jig 310.

The guide grooves 312 are formed to have a predetermined depth corresponding to a position of the boundary B between the PC 10 and the cut region A. [

The guide grooves 312 are formed in parallel with each other along the longitudinal direction of the seating jig 310.

The first moving unit 320 is a device that receives power from the outside and moves the seating jig 310 to a cutting position. The first moving unit 320 may include a guide rail for guiding movement of the seating jig 310 and the seating jig 310 may be slid along the guide rail by driving the linear motor.

The PCB fixing portion 400

3 is a view showing a PCB fixing portion according to the present invention.

Referring to FIGS. 1 and 3, the PC fixing unit 400 includes a fixing jig 410 and a second moving unit 420.

The second moving unit 420 is a device for moving the fixing jig 410 to be positioned at the upper end of the seating jig 310. The second moving unit 420 may include an XY gantry that receives power from the outside to move the fixing jig 410 and a cylinder that is driven along the Z axis.

Here, the fixing jig 410 is formed to cover the upper end of the seating jig 310.

At the upper end of the seating jig 310, cutting blade guide holes 411 matching the positions of the guide grooves 312 are formed.

Here, the lengths of the guide grooves 312 and the cutting edge guide holes 411 may be substantially equal to each other.

4 is a view showing an example in which the PCBs are fixed by the fixing jig according to the present invention.

Referring to FIG. 4, at least one fixing member 412 for fixing a plurality of PCBs 10 to be mounted on the seating jig 310 may be installed on the bottom surface of the fixing jig 410.

Here, the cutting blade guide holes 411 are holes through which a cutting blade 510, which will be described later, penetrates.

The PC cut-

FIG. 5 is a view showing a PC cut part according to the present invention. FIG.

1 and 5, the PC cutter 500 is installed on the main body 100 so as to be disposed above the cut position, and a disk-shaped cutter blade 510 is installed upright in a rotatable state. A rotary motor 530 mounted on the cutting head 520 for rotating the cutting blade 510 and a cutting blade 510 installed on the main body 100 to cut the cutting blade 510, A cutting blade guide hole 411 and a guide groove 312 for moving the position along the triaxial direction so as to cut the boundary B of the cutting area A of the PCB 10, (540).

The three-axis moving unit 540 may include an XY gantry and a cylinder driven along the Z axis to move the cutting head 520, as in the above-described example.

Next, the operation of the PC cutter for mounting electronic parts of the present invention will be described with the above-described configuration.

FIGS. 6 and 7 are views showing the process of cutting the PCBs.

The configuration reference in the following description refers to the above-mentioned Fig. 1 to Fig. 5.

The conveyor belt 210 sequentially transfers a plurality of PCBs 10. Then, the gripper 220 sequentially picks up the PCB 10 to be transferred, and places it in the seating area 311 of the seating jig 310 waiting.

The PCBs 10 may be arranged in alignment with each other in the seating area 311 of the seating jig 310.

6, when the PCB 10 is fully seated in the seating jig 310, the first moving unit 320 moves the seating jig 310 to the cutting position.

Here, although not shown in the drawing, when all the PCBs 10 are seated in the seating jig 310, the sensor for sensing the seating of the PCB 10 generates a signal, and the first moving unit 320 senses .

7, the second moving unit 420 places the fixing jig 410 in close contact with the upper end of the seating jig 310 so as to cover the upper portion of the seating jig 310. As shown in Fig.

Here, the moving coordinates of the fixing jig 410 are set in advance, and the second moving unit 420 moves and positions the fixing jig 410 so as to be positioned at a preset moving coordinate.

At this time, the guide grooves 312 formed on the bottom surface of the seating jig 310 and the cutting edge guide holes 411 formed on the upper end of the fixing jig 410 are aligned with each other.

This position is preferably the cut region boundary B of the PCB 10. Here, the boundary B of the cut region is a line substantially cut by the cutting edge 510.

The fixing members 420 formed on the bottom surface of the fixing jig 410 may physically contact and fix the PCBs 10 mounted on the seating jig 310.

Then, the PC cut portion 500 cuts the cut region boundary B of the fixed PC chips 10 as described above.

First, the rotation motor 530 receives power from the outside and rotates the cutting blade 510 at a predetermined rotation speed.

The three-axis moving unit 540 moves the cutting head 520 so that the cutting edge 510 passes through the cutting edge guide hole 411 formed in the fixing jig 410 and the lowermost end thereof is positioned in the guide groove 312, .

Therefore, when the cutting edge 510 is positioned as described above, a part of the cut region boundary B of the PCB 10 at the corresponding position can be cut.

The three-axis moving unit 540 can move the cutting head 520 at a uniform speed so as to move the cutting blade 510 to be rotated along the cutting blade guide holes 411.

Accordingly, the cutting region boundary B of the plurality of PCBs 10 can be cut by the cutting blade 510 which is rotated and moved.

After the fixing jig 410 is returned to its original position, the PCB 10 having been cut off can be unloaded from the seating jig 310 through a separate unloading device.

FIGS. 8A and 8B are plan views showing examples of adjustable widths of guide grooves and cutting blade guide holes according to the present invention. FIG.

8A and 8B, in the case of the guide groove 312, it may be formed as a groove forming a downward trough. The guide groove 312 forms a predetermined depth.

The example of adjusting the width of the guide groove 312 produces blocks 312a having guide grooves having different widths.

Any one of the blocks 312a may be fixed to the block fixing groove 310a formed on the bottom surface of the seating jig 310 by fixing the blocks 312a.

In the case of the cutting edge guide hole 411, a sliding hole 410a is formed on both sides of the cut surface of the fixing jig 410 forming the cutting edge guide hole 411, The sliding plate 430 is inserted and slidably moved.

The first positioning holes P1 are formed at equal intervals in the fixing jig 410 along the width of the sliding hole 410a

Next, a second positioning hole P2 is formed in the sliding plate 430. [

Therefore, after the second positioning hole P2 is positioned to coincide with any one of the first positioning holes P1, the first and second positioning holes P1 and P2 are fixed through a bolt The width of the cutting blade guide hole 411 can be variably controlled.

9 is a view showing an example in which a plurality of cutting edges according to the present invention are provided.

Referring to FIG. 9, cutting blades 510, 510 ', and 510' having different thicknesses t1, t2, and t3 are installed at the lower ends of the cutting head 520 according to the present invention.

That is, at the lower end of the cutting head 520, the cylinders 550 are arranged in parallel with each other at intervals.

Each of the cylinders 550 includes a cylinder shaft 551 and the cylinder shaft 551 is provided at an end thereof with a respective cutting edge 510 for rotation.

As the cylinder shaft 551 moves up and down, the cutting blade 510 is operated to project downward.

The thickness of the plurality of cutting blades 510 is set in the controller 560 and the width of the guide groove 312 and the cutting blade guide hole 411 is input from the outside of the controller 560.

Accordingly, the controller 560 drives the cylinder 550 so that the cylinder shaft 551 connected to any one of the plurality of cutting blades 510 having the thickness corresponding to the input width protrudes downward It is possible.

FIG. 10 is a block diagram showing a rotation speed control operation of a cutting edge by measuring the thickness of the PCB.

10, the seating jig 310 according to the present invention is further provided with a thickness measuring sensor 330 for measuring the thickness of the PCB 10 that is seated in the seating jig 310. The thickness measuring sensor may use a distance sensor or an optical sensor.

The thickness measuring sensor 330 transmits the thickness measured by the controller 560. [

In the controller 560, a rotational speed corresponding to the thickness of the PCB 10 is set in advance, and the rotational speed is set to be proportional to the thickness.

The controller 560 may control driving of the rotation motor 530 so as to achieve a rotation speed corresponding to the measured thickness.

Therefore, when the thickness of the PCB 10 is increased, it is possible to prevent a cutting error from occurring by increasing the rotation speed of the cutting edge 410, and to effectively prevent a delay in the operation time due to an increase in thickness have.

11 is a view showing another example of a cutting edge according to the present invention.

The cutting blade 600 according to the present invention comprises a central blade 610 having a predetermined diameter and a center of rotation and fixed to the circumference of the central blade 610 through bolts and having different diameters, And a plurality of outer blades 620 and 630 formed to be detachable from each other. D1, D2 and D3 are diameters.

According to the configuration of the present invention, the outermost outer blade 630 is damaged due to long-term use, and only the damaged outer blade 630 is removed, and the other outer blade 620 exposed thereby, . ≪ / RTI >

Through the above-described constitution and operation, the embodiment according to the present invention can cut a plurality of PCs to a predetermined standard.

Further, the embodiment according to the present invention is characterized in that, by cutting the boundary of the cut region of the PCB by using the rotary disc-shaped cutter blade, It is possible to effectively prevent the foreign matter from remaining due to the foreign matter.

In addition, the embodiment according to the present invention can improve productivity by cutting a required portion in a state where a large number of PCBs are aligned and fixed in a large amount.

Further, an embodiment according to the present invention is characterized in that: By using a disk-shaped cutting blade having various thicknesses, it is possible to cut the PCB of various thicknesses in one apparatus.

In addition, in the embodiment according to the present invention, the cutting operation can be performed by selecting the cutting edge that can readily measure the thickness of the faced portion that is seated and easily cut the thickness, thereby increasing the cutting efficiency.

Although the present invention has been described with respect to specific embodiments of the PC cutter for mounting electronic components, it is apparent that various modifications can be made without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

10: PC 100: Body
200: loading section 210: conveyor belt
220: gripper 300:
310: seating jig 311: seating area
312: guide groove 320: first mobile unit
400: PCB fixing portion 410: Fixing jig
411: cutting blade guide hole 420: fixing member
430: sliding plate 500:
510, 510 ', 510 ": cutting blade 520; cutting head
530; Rotation motor 540: 3-axis moving unit
550; Cylinder 551; Cylinder axis
560: Controller A: cutting area
B: Cutting area boundary

Claims (9)

main body;
A PC mounting part installed in the main body and having a plurality of PCs loaded from the outside,
A PCB fixing unit installed in the main body and fixing the plurality of PCBs; And
And a PCB cutting unit installed in the main body and sequentially cutting a predetermined cut region of the fixed plurality of PCBs by applying a rotational force along the bottom of the PCB at an upper end thereof,
The PC cut-
A cutting head installed in the main body so that the PCB is disposed at an upper portion of a cutting position where the PCB is cut by the PCB cutting portion,
A rotating motor installed on the cutting head for rotating the cutting head; And
And a three-axis moving unit installed in the main body, the three-axis moving unit moving the position along the three-axis direction so as to cut the boundary of the cut-
PCB cutting device for electronic parts mounting.
The method according to claim 1,
The PC mounting portion includes:
A seating jig having a seating area in which the plurality of PCBs are aligned and seated; And
And a first moving unit moving the seating jig to a cutting position where the PCB is cut by the PCB cutting unit,
Wherein at least one guide groove having a predetermined depth corresponding to a position forming a boundary between the PC and the cut region is formed on the bottom surface of the seating jig.
PCB cutting device for electronic parts mounting.
3. The method of claim 2,
The PC fixing unit includes:
A fixing jig positioned at an upper end of the seating jig; And
And a second moving unit for moving the fixing jig to be positioned at an upper end of the seating jig,
Wherein at least one fixing member for fixing a plurality of PCBs seated on the seating jig is provided on a bottom surface of the fixing jig.
PCB cutting device for electronic parts mounting.
The method of claim 3,
The fixing jig is positioned at the upper end of the seating jig so as to cover the upper portion of the seating jig,
Wherein at least one cutting edge guide hole is formed in the fixing jig so as to be aligned with the guide groove.
PCB cutting device for electronic parts mounting.
5. The method of claim 4,
Wherein the three-axis moving unit moves the position of the PC cut part along the three axial directions so that the cutting edge is located in the cutting edge guide hole and the guide groove to cut the boundary of the cut area of the PC.
PCB cutting device for electronic parts mounting.
6. The method of claim 5,
Wherein the guide groove and the cutting edge guide hole are adjustable in width by adjusting the opening area.
PCB cutting device for electronic parts mounting.
The method according to claim 6,
Wherein the cutting blade is installed in parallel with the cutting head,
The cutting head is provided with a cylinder having a stretchable cylinder axis,
Wherein each of the plurality of cutting blades is provided on a cylinder axis of each of the plurality of cylinders and is projected and retracted in accordance with the expansion and contraction of the cylinder axis,
The thickness of the plurality of cutting edges is set in the controller,
The controller inputs the width of the guide groove and the cutting blade guide hole from the outside,
Wherein the controller drives the cylinder so that a cylinder axis connected to any one of the plurality of cutting blades having a thickness corresponding to the input width protrudes downward.
PCB cutting device for electronic parts mounting.
5. The method of claim 4,
The seating jig is further provided with a thickness measuring sensor for measuring the thickness of the PCB that is seated on the seating jig,
The thickness measuring sensor transmits the thickness measured by the controller,
Wherein the controller sets a rotational speed corresponding to the thickness of the PCB in advance, the rotational speed is proportional to the thickness,
Wherein the controller controls driving of the rotation motor to achieve a rotation speed corresponding to the measured thickness.
PCB cutting device for electronic parts mounting.
6. The method of claim 5,
The cutting blade
A central blade forming the center of rotation and having a predetermined diameter; And
And a plurality of outer blades installed in the circumference of the central blade and having different diameters and formed in a ring shape and detachably attached to each other.
PCB cutting device for electronic parts mounting.

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