KR102010001B1 - Electroforming mother plate used in manufacturing oled picture element forming mask - Google Patents

Abstract

The present invention relates to a pre-plated base plate used in the manufacture of OLED pixel forming masks. The mother plate according to the present invention is a mother plate used when manufacturing a mask for forming an OLED pixel by electroforming, and is formed on one surface of the plated portion 21 and the mother plate 20 on which the plating film 15 is formed. And a plurality of insulation portions 25 formed in the intaglio pattern 28, and the mother plate 20 is a doped single crystal silicon material, and the intaglio pattern 28 becomes smaller in width from top to bottom. It is characterized by the shape.

Description

ELECTROFORMING MOTHER PLATE USED IN MANUFACTURING OLED PICTURE ELEMENT FORMING MASK

The present invention relates to a pre-plated base plate used in the manufacture of OLED pixel forming masks. More specifically, the present invention relates to a electroplating mother plate used in the manufacture of an OLED pixel formation mask capable of forming a plated film using the electroplating method and simultaneously forming a tapered pattern on the plated film.

Recently, studies on electroforming methods have been underway in thin plate manufacturing. The electroplating method is to immerse the positive electrode and the negative electrode in the electrolyte, and to apply the power to electrodeposit the metal thin plate on the surface of the negative electrode, it is possible to manufacture the ultra-thin plate, it is a method that can be expected to mass production.

Meanwhile, as a technology of forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method of depositing an organic material at a desired position by closely attaching a thin metal mask to a substrate is mainly used.

1 and 2 are schematic diagrams illustrating a conventional process of manufacturing a fine metal mask (FMM).

Referring to FIG. 1, a conventional mask manufacturing method includes preparing a metal thin plate 1 to be used as a mask (FIG. 1A), and performing patterning after coating PR (Photoresist; 2) on the metal thin plate 1. Alternatively, after the PR (2) coating to have a pattern (Fig. 1 (b)), through the etching to prepare a mask (3) having a pattern (P).

Referring to FIG. 2, a conventional mask manufacturing method using plating prepares a substrate 4 (FIG. 2A) and coats a PR 2 having a predetermined pattern on the substrate 4. (B) of FIG. 2. Subsequently, plating is performed on the substrate 4 to form the metal thin plate 3 (FIG. 2C). Next, the PR 2 is removed (FIG. 2D), and the mask 3 (or the metal thin plate 3) on which the pattern P is formed is separated from the substrate 4 (FIG. 2 ( e)].

In the conventional FMM manufacturing process as described above, the process of coating and etching the PR on the substrate every time, the process time, cost increases, there is a problem that the productivity is lowered.

3 is a schematic diagram showing a conventional OLED pixel forming process.

Referring to FIG. 3A, for the pixel forming process using the FMM method, first, the target substrate 9 and the shadow mask 3 in which the pattern is formed are brought into close contact with each other as much as possible. And the source 6, such as an organic substance and a low molecular weight, is deposited through the source supply means 5 which reciprocates a predetermined path | route. The pixels 8 are formed by sequentially depositing the R, G, and B sources 6 while aligning the shadow mask 3. However, as shown in FIG. 3A, an error E occurs in which the pixel 8 becomes thinner at both ends of the pixel 8 without having a uniform thickness along the pixel pattern F. As shown in FIG. This is due to the so-called shadow effect, due to the right angle pattern, where the straight source 6 is covered by the edge of the shadow mask 3 pattern.

Thus, as shown in FIG. 3B, the shadow mask 3 pattern is inclined in a taper shape so as to have a uniform thickness along the pixel pattern F, thereby causing an error. A method of minimizing (E) has been proposed. However, since a separate process is involved to make a tapered shape (T), there is a problem that process time, cost increases, and productivity is lowered.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, to provide a pre-plated base plate used in the manufacture of the OLED pixel forming mask, which can produce a mask having a pattern only by the plating process. For that purpose.

In addition, an object of the present invention is to provide a pre-plated base plate used in the manufacture of an OLED pixel forming mask, which can form a mask pattern having an inclined shape and a tapered shape only by a plating process without a separate process.

In addition, according to the present invention, once a mother plate used as a cathode body is manufactured, it can be repeatedly reused in a subsequent process, thereby reducing process time and cost, and improving productivity. It is an object of the present invention to provide a pre-plated base plate used for manufacturing.

It is also an object of the present invention to provide a pre-plated base plate used in the manufacture of an OLED pixel forming mask, which can produce a base plate used as a cathode body in a simple process.

The above object of the present invention is a mother plate used in the manufacture of a mask for forming an OLED pixel by electroforming, and includes: a plating portion in which a plating film is formed; And a plurality of insulating parts formed on one surface of the mother plate and including an intaglio pattern, wherein the mother plate is a doped single crystal silicon material, and the intaglio pattern has a shape that becomes smaller in width from top to bottom. Is achieved.

The plating film may be formed in the intaglio pattern, and the formation of the plating film on the insulating part may be prevented so that the plating film may have a pattern.

The insulating part may have a shape corresponding to the pattern of the plating film.

The side cross-sectional shape of the intaglio pattern may be an inverse taper shape.

The angle between the mother plate and the intaglio pattern side may be 55 ° to 59 °.

The thickness of the insulation portion may be 10 μm.

An electric field may be formed to form a plating film in the plating portion and the intaglio pattern.

The insulating part may be a material including spin on glass (SOG).

The plating film having a pattern may be used as a fine metal mask (FMM).

The mother plate can be used as a cathode body in electroplating.

Even if the electroplating is repeatedly performed, the insulation may remain on one surface of the mother plate.

The adhesion between one surface of the mother plate and the insulation may be stronger than the adhesion between the plating and the plating film.

In addition, the above object of the present invention is a mother plate used in the manufacture of a mask for forming an OLED pixel by electroforming, wherein the mother plate is a doped single crystal silicon material, and one side of the mother plate is conductive. It is divided into a first region and a second region in which an insulating portion is disposed on one surface of the mother plate to have a non-conductivity, and a mask is manufactured by forming a plating film in the first region, and a plating film can be formed in the intaglio pattern formed on the insulating portion. An electric field is achieved, which is achieved by the bedrock.

In addition, the above object of the present invention, as a mother plate used in the manufacture of a mask for forming an OLED pixel by electroforming, the mother plate is a doped single crystal silicon material, from top to bottom on one side of the mother board A plurality of insulators having a shape that gradually increases in width are formed, and is achieved by a mother plate in which a plating film is formed in the remaining region except the region where the insulator of the mother plate is disposed.

According to the present invention configured as described above, there is an effect that can produce a mask having a pattern only by the plating process.

In addition, according to the present invention, the present invention also has the effect of forming a mask pattern having an inclined shape and tapered shape only by the plating process, without a separate process.

In addition, according to the present invention, once the mother plate used as the cathode body (Cathode Body) once manufactured, can be reused repeatedly in the subsequent process, there is an effect that can reduce the process time, cost, and improve the productivity.

In addition, according to the present invention, there is an effect that can be produced in a simple process the mother plate used as a cathode body (Cathode Body).

1 and 2 are schematic diagrams illustrating a conventional process of manufacturing a fine metal mask (FMM).
3 is a schematic diagram showing a conventional OLED pixel forming process.
4 is a schematic diagram illustrating an OLED pixel deposition apparatus using an FMM according to an embodiment of the present invention.
5 is a schematic view showing the electroplating apparatus according to an embodiment of the present invention.
6 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
Figure 7 is a schematic diagram showing the outer surface of the mother plate according to an embodiment of the present invention.
8 is a schematic view showing a method of manufacturing a mother plate according to an embodiment of the present invention.
9 to 11 are schematic views illustrating a method of forming a tilted photoresist pattern according to various embodiments of the present disclosure.
12 to 14 is a schematic diagram showing a mask manufacturing process using a mother plate according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

4 is a schematic diagram illustrating an OLED pixel deposition apparatus 200 using the FMM 100 according to an embodiment of the present invention.

Referring to FIG. 4, the OLED pixel deposition apparatus 200 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The FMM 100 may be disposed on the target substrate 900 to be in close contact with or very close to the organic material 600. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may pass through a pattern formed in the FMM mask 100 to target the substrate. It may be deposited on one side of the (900). The deposited organic source 600 that has passed through the pattern of the FMM mask 100 may act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixel 700 by the shadow effect, the pattern of the FMM mask 100 may be formed to be inclined S (or formed into a tapered shape S). Since the organic sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited as a whole.

5 is a schematic view showing the electroplating apparatus 10 according to an embodiment of the present invention. Although the flat electroplating apparatus 10 is shown in FIG. 5, the present invention is not limited to the form shown in FIG. 4, and the present invention can be applied to all known electroplating apparatuses such as a flat electroplating apparatus and a continuous electroplating apparatus. Put it.

5, the electroplating apparatus 10 according to an embodiment of the present invention, the plating bath 11, the cathode body (20), the anode body (30), the power supply unit 40 ). In addition, a means for moving the cathode body 20, a means for separating the plated film 15 (or the metal thin plate 15) to be used as a mask from the cathode body 20, a means for cutting, etc. C) may be further included.

The plating liquid 12 is accommodated in the plating tank 11. The plating solution 12 may be a material of the plating film 15 to be used as a mask as an electrolyte solution. As an example, when an Invar thin plate made of iron nickel alloy is manufactured as the plating film 15, a mixed solution of a solution containing Ni ions and a solution containing Fe ions may be used as the plating solution 12. In another embodiment, in the case of manufacturing a super invar thin plate made of iron nickel cobalt alloy as the plating film 15, for example, a solution containing Ni ions, a solution containing Fe ions, and a solution containing Co ions May be used as the plating liquid 12. Inva thin plate, super inva thin plate is used as a fine metal mask (FMM), a shadow mask (Shadow Mask) in the manufacturing of OLED, and serves to accurately guide the electron beam to the phosphor. And, the Invar sheet has a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃, the super Inba sheet has a coefficient of thermal expansion of about 1.0 X 10 ^-7 / ℃ Since it is so low, there is little possibility that the pattern shape of a mask is deformed by thermal energy, and it is mainly used in high-resolution OLED manufacturing. In addition, the plating solution 12 for the target plating film 15 may be used without limitation, and in the present specification, the manufacturing of the Inba thin plate 15 will be described as a main example.

The plating liquid 12 may be supplied from an external plating liquid supply means (not shown) to the plating tank 11, and a circulation pump (not shown) and a plating liquid 12 circulating the plating liquid 12 in the plating tank 11. A filter (not shown) may be further provided to remove impurities.

The negative electrode body 20 may have a flat plate shape on one side thereof, and the entirety of the negative electrode body 20 may be immersed in the plating solution 12. Although the form in which the negative electrode body 20 and the positive electrode body 30 are vertically disposed is illustrated in FIG. 5, the negative electrode body 20 and the positive electrode body 30 may be disposed vertically. In this case, at least some or all of the negative electrode body 20 in the plating solution 12 may be disposed. Can be submerged.

The negative electrode body 20 may be made of a conductive material such as titanium (Ti), stainless steel (SUS), doped silicon, or ITO coated on a substrate, which does not react with the plating solution 12. Among the doped silicon, in particular, the doped single crystal silicon, there is no defect (Defect), there is an advantage that the uniform plating film 15 can be generated due to the formation of a uniform electric field on the entire surface during pre-plating . In the case of metal or polycrystalline silicon, a uniform electric field may not be applied due to impurities such as metal oxides, inclusions, or defects such as grain boundaries, so that a part of the plating film 15 may be unevenly formed. An additional process may be performed to remove and eliminate the problem.

The plating film 15 may be electrodeposited on the surface of the anode body 20, and a pattern corresponding to the insulating portion 25 of the cathode body 20 may be formed on the plating film 15. Since the negative electrode body 20 of the present invention can be formed up to a pattern in the process of forming the plating film 15, the negative electrode body 20 is referred to as "mother plate" or "mold" and used in parallel. do. The specific structure of the surface of the base plate 20 (or negative electrode body 20) is mentioned later.

The positive electrode body 30 is spaced apart from each other by a predetermined interval so as to face the negative electrode body 20, and one side corresponding to the negative electrode body 20 has a flat plate shape or the like, and the whole of the positive electrode body 30 is formed in the plating solution 12. Can be submerged. The anode body 30 may be made of an insoluble material such as titanium (Ti), iridium (Ir), ruthenium (Ru), or the like. The negative electrode body 20 and the positive electrode body 30 may be spaced apart from each other by a few cm.

The power supply unit 40 may supply a current required for electroplating to the cathode body 20 and the anode body 30. The negative terminal of the power supply unit 40 may be connected to the negative electrode body 20, and the positive terminal may be connected to the positive electrode body 30.

6 is a schematic diagram illustrating a mask 100 (100a, 100b) according to an embodiment of the present invention.

Referring to FIG. 6, a mask 100 (100a, 100b) manufactured using the electroplating apparatus 10 including the mother plate 20 (or the cathode body 20) of the present invention is shown. The mask 100a illustrated in FIG. 6A is a stick-type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100b shown in FIG. 6B is a plate-type mask and may be used in a large area pixel forming process. FIG. 6C is an enlarged side sectional view taken along the line A-A 'of FIGS. 6A and 6B.

A plurality of display patterns DP may be formed in the bodies of the masks 100a and 100b. The display pattern DP is a pattern corresponding to one display such as a smartphone. When the display pattern DP is enlarged, the plurality of pixel patterns PP corresponding to R, G, and B may be confirmed. The pixel patterns PP may have an inclined side and a taper shape (see FIG. 6C). A large number of pixel patterns PP are clustered to form one display pattern DP, and a plurality of display patterns DP may be formed on the masks 100: 100a and 100b.

That is, in the present specification, the display pattern DP is not a concept representing one pattern, and should be understood as a concept in which a plurality of pixel patterns PP corresponding to one display are clustered. In the present specification, the "display pattern DP" and the "insulation part 25" may correspond to the same scale, and the patterned unit insulator in the region of the "pixel pattern PP" and the "insulation part 25" ( 26) may correspond on the same scale.

The mask 100 of the present invention is manufactured without having a separate patterning process, but directly having a plurality of display patterns DP and pixel patterns PP. And the mask 100 of this invention is characterized by being manufactured with a taper-shaped pattern (pixel pattern PP), without going through a separate taper formation process. In other words, in the electroplating apparatus, the plating film 15 that is electrodeposited on the surface of the mother plate 20 (or the cathode body 20) is electrodeposited while the display pattern DP and the tapered pixel pattern PP are formed. Can be. Hereinafter, the display pattern DP and the pixel pattern PP may be mixed and used as a pattern.

7 is a schematic view showing an outer surface of the mother plate 20 according to an embodiment of the present invention. FIG. 7A is a plan view showing the plate-shaped base plate 20 of the flat plate electroplating apparatus 10, and FIG. 7B is an enlarged side cross-sectional view taken along line B-B 'of FIG.

Referring to FIG. 7A, the outer surface (surface) of the mother plate 20 (or the negative electrode body 20) includes a plating portion 21 and an insulating portion 25.

The plating portion 21 may refer to a surface portion (first region) of the mother plate 20 formed by substantially depositing the plating film 15 (or the mask 100) and may have conductive properties. An electric field required for plating may be formed between the plating part 21 and the anode body 30, and the plating film 15 may be electrodeposited between the plating part 21 and the anode body.

The insulating portion 25 is a portion formed to protrude (in relief) on one surface of the mother plate 20 so as to prevent generation of the plating film 15. Alternatively, the insulating part 25 may refer to an area (second area) in which the plurality of patterned unit insulators 26 are clustered.

Referring to FIG. 7B, the insulating part 25 may include an intaglio pattern 28, and the intaglio pattern 28 may have a shape in which the width thereof becomes smaller from the top to the bottom. For example, the side cross-sectional shape of the intaglio pattern 28 may be an inverse taper shape, and the side surface of the intaglio pattern 28 may have an inclined shape S so that the width thereof becomes smaller from the top to the bottom. . In addition, if the intaglio pattern 28 satisfies that the width decreases from the top to the bottom, the side surface may be rounded or a step may be formed. Since the unit insulator 26 is a form in which the intaglio pattern 28 is inverted, if the intaglio pattern 28 has a shape in which the width becomes smaller from the top to the bottom, the unit insulator 26 is formed from the top (a) to the bottom ( 26b) may have a shape that increases in width.

The angle between the mother plate 20 and the side surface of the intaglio pattern 28, that is, the taper angle of the intaglio pattern 28 may be about 45 ° to 70 °. Considering, 55-59 ° may be ideal. The thickness of the insulation portion 25 (or the unit insulator 26) may be about 10 μm, but is not limited thereto.

The insulating portion 25 (or the unit insulator 26) may be formed of a material having insulating properties. The insulating part 25 may be made of a material including spin on glass (SOG), borophosphosilicate glass (BPSG), and phosphosilicate glass (PSG). When using SOG or the like, an organic-inorganic composite may be mixed with SOG so as to advantageously form a thickness of about 10 μm or more.

While the electroplating is repeatedly performed, the insulating part 25 may remain integrated with the base plate 20 on one surface of the base plate 20. That is, even after the plating film 15 is electrodeposited on the base plate 20, the insulating part 25 is physically or chemically formed even in a series of processes such as separating the plated film 15 from the base plate 20 and cleaning the base plate 20. It may remain on one surface of the base plate 20 without being removed, damaged, or separated. Therefore, it is called as a mother board, a mold, a cathode body, etc. including the insulating part 25. FIG.

In other respects, the adhesion between one surface of the mother plate 20 and the insulating portion 25 is stronger than the adhesion between one surface of the mother plate 20 (or the plating portion 21) and the electrodeposited plating film 15. can do. Thus, even if the plating film 15 is electrodeposited and then the process of separating from one surface of the mother plate 20 is performed, it is not separated or damaged like the plating film 15 and is still adhered to one surface of the mother plate 20. May remain.

As described above, the present invention may remain in the repeated process of the insulating portion 25, so that the base plate 20 (or the negative electrode body 20, the mold () including the plating portion 21 and the insulating portion 25 20)] once manufactured has the advantage that it can be reused continuously. This can be directly related to process time, cost reduction and productivity improvement.

Similar to the display pattern DP described above with reference to FIG. 6, one insulation unit 25 may correspond to one display.

When the insulator 25 is enlarged, the insulator 25 includes an intaglio pattern 28, and the plurality of unit insulators 26 patterned by the intaglio pattern 28 are arranged. The plurality of unit insulators 26 are formed for forming a plurality of pixel patterns PP corresponding to R, G, and B of the mask 100 manufactured through the mother plate 20 (or the cathode body 20). will be. The plurality of unit insulators 26 may have a shape in which the width of the unit insulators 26 increases from the upper portion 26a to the lower portion 26b on the surface of the mother plate 20 and may protrude. A plurality of unit insulators 26 may be grouped to constitute the insulator 25.

That is, in the present specification, although the insulating part 25 is represented by a solid line, it does not mean that all of the regions represented by the solid line are insulated, and the insulating part 25 includes a plurality of unit insulators 26 corresponding to one display. As a concept, it should be understood that a part of the unit insulator 26 is insulated. In other words, the unit insulators 26 formed on the surface of the base plate 20 are referred to as the insulator 25, and the intaglio pattern 28, which is an area between the unit insulator 26 and the unit insulator 26, is referred to as an insulator 25. The region on the surface of the base plate 20, on which the unit insulator 26 is not formed, may be referred to as a plating portion 21 as a region where a plating film may be formed.

Since the insulator 25 (or the insulator 26) has an insulating property, no electric field is formed between the insulator 25 (or the insulator 26) and the positive electrode 30, or plating is performed. Only a weak electric field is formed that is unlikely. Therefore, the portion corresponding to the insulating portion 25 (or the unit insulator 26) in which the plating film 15 is not formed in the mother plate 20 is formed by patterning, hole, etc. of the plating film 15. Can be configured.

Specifically, the portion of the mother plate 20 corresponding to the insulator 26 may constitute the pixel pattern PP of the plating film 15. Since the unit insulator 26 has a shape that increases in width from the upper portion 26a to the lower portion 26b, a tapered shape, and the like, the pixel pattern PP may also have a shape corresponding to that of the insulator 26. The portion corresponding to the insulator 25, which is an aggregate of the unit insulators 26, may constitute the display pattern DP, which is an aggregate of the pixel patterns PP of the plating film 15. In other words, the plating portion 21, which is the remaining portion of the mother plate 20 except for the insulation portion 25, forms the body of the plating film 15, and corresponds to the insulation portion 25 (or the unit insulator 26). The portion to be formed can form a pattern (display pattern DP and pixel pattern PP) of the plating film 15.

Since the plating film 15 having the display pattern DP and the pixel pattern PP formed thereon can be used as a shadow mask and FMMs 100: 100a and 100b (see FIG. 6) in the OLED pixel process, the pixel pattern PP may be formed. The width may be formed to be smaller than 30 μm to be suitable for high resolution pixel deposition, and the pattern width of the insulation portion 25 may also be formed to have the same width as the pixel pattern PP.

8 is a schematic diagram showing a manufacturing method of the mother plate 20 according to an embodiment of the present invention.

The method of manufacturing a mother plate of the present invention is a method of manufacturing a mother plate (20) used in manufacturing a mask by electroforming, (a) providing a conductive substrate 21, (b) a conductive substrate Forming a photoresist pattern 23 having a shape that decreases from top to bottom on one surface of (21), (c) an insulating layer on the conductive substrate 21 and the photoresist pattern 23 27), (d) removing the insulating layer 27 by a predetermined thickness to expose the photoresist pattern 23, and (e) removing the photoresist pattern 23. Once the mother board 20 is manufactured, it can be repeatedly reused in the subsequent process, since the mother board 20 can be manufactured in a simple process, it has the advantage of reducing the process time, cost and improve productivity.

Specifically, first, referring to FIG. 8A, the conductive substrate 21 is prepared. The conductive substrate 21 is a material used as the cathode body 20, and may be a metal such as titanium (Ti) or stainless steel (SUS), a doped silicon substrate, or the like. Since the plating film 15 may be formed except for the portion where the insulating portion 25 is formed on the surface of the conductive substrate 21, the conductive substrate 21 (except the insulating portion 25) and the plating portion ( 21) is used interchangeably.

Next, a photoresist pattern 23 may be formed on one surface of the conductive substrate 21, the width of which decreases from top to bottom. The photoresist pattern 23 may be formed to have an inclined side surface or to have an inverse tapered shape. The photoresist pattern 23 may have a thickness of about 10 μm. Hereinafter, various embodiments of forming the photoresist pattern 23 will be described.

9 to 11 are schematic views illustrating a method of forming a tilted photoresist pattern according to various embodiments of the present disclosure. In the following examples, the photoresist is described using a negative photoresist, but a positive photoresist may be used.

In a first embodiment, a double exposure is performed.

Referring to FIG. 9A, the photoresist layer 22 may be formed on one surface of the conductive substrate 21.

Next, referring to FIG. 9B, the first exposure L1 may be performed on a region corresponding to the width of the photoresist pattern 23 to be formed. That is, the first exposure L1 may be performed using the first mask M1 having a pattern having the same width as that of the photoresist pattern 23.

The first exposure L1 may use light having an appropriate amount of light so as to transmit light from the upper surface of the photoresist layer 22 by a predetermined depth. Transmitting light by a predetermined depth may refer to an intensity of light that does not reach the bottom surface of the photoresist, or an intensity of light such that the negative photoresist existing below does not cause chemical change. The first region R1 on the photoresist layer 22 may be exposed by the first exposure L1.

Next, referring to FIG. 9C, the second exposure L2 may be performed on a region corresponding to a width smaller than the width of the photoresist pattern 23 to be formed. That is, the second exposure L2 may be performed by using the first mask M2 having a pattern smaller than the width of the photoresist pattern 23. The second exposure l2 may use light having a stronger intensity than the light used in the first exposure L1 so as to transmit light from the upper surface to the lower surface of the photoresist layer 22. The second region R2 under the photoresist layer 22 (under the first region R1) may be exposed by the second exposure l1.

Next, referring to FIG. 9D, portions of the photoresist layer 22 except for the portions exposed to the first exposure L1 and the second exposure L2 may be removed. The photoresist of the first region R1 and the second region R2 may remain without being removed to form the photoresist patterns 23: 23a. By the sum of the first region R1 and the second region R2, the photoresist pattern 23 that is substantially the same as or similar to the inverse tapered shape may be formed.

In a second embodiment, a light scattering unit (Diffuser: DF) is used to scatter light to perform exposure.

Referring to FIG. 10A, the photoresist layer 22 may be formed on one surface of the conductive substrate 21.

Next, referring to FIG. 10B, the light scattering unit DF may be attached to at least one surface of the exposure mask M. Referring to FIG. The light scattering unit DF may use a known diffuser without limitation as a transparent film to allow light to be transmitted to be scattered.

Next, exposure L is performed. As the light L passing through the light scattering part DF is scattered and spreads radially, the exposure L ′ may be performed in a wider area than the pattern of the exposure mask M. FIG. By the exposure L ′ through the scattered light, the region R similar to the semicircle shape and the ellipse shape may be exposed based on the upper surface of the photoresist layer 22.

Next, referring to FIG. 10C, portions of the photoresist layer 22 except for the exposed portion L ′ may be removed. The photoresist in the exposure area R is left without being removed, and the photoresist patterns 23: 23b can be formed. It is possible to form the photoresist pattern 23 substantially the same or similar to the inverse tapered shape.

In a third embodiment, a method of adjusting the tone of exposure is performed.

Referring to FIG. 11A, the photoresist layer 22 may be formed on one surface of the conductive substrate 21.

Next, referring to FIG. 11B, the exposure mask M3 and the tone control mask M4 may be disposed. The tone control mask M4 may be arranged to overlap with the exposure mask M3, or may be integrally formed with the exposure mask M3.

The exposure mask M3 may use a mask having a very low light transmittance, such as a chromium (Cr) mask. The tone control mask M4 is a mask having a higher light transmittance than the exposure mask M3, and a semi-transmissive mask through which a part of light can pass may be used. In addition, the exposure mask M3 may have a first pattern width, and the tone control mask M4 may have a second pattern width smaller than the first pattern width. The difference between the pattern width and the light transmittance can be used to distinguish the exposed area.

When the exposure L is performed, the light L2 passing through the second pattern of the tone control mask M4 may be irradiated to the photoresist layer 22 with strong intensity. In addition, the light L1 passing through the first pattern of the exposure mask M3 and simultaneously passing through the tone control mask may be irradiated to the photoresist layer 22 with a weaker intensity than the light L2.

Light L1 may transmit light R1 to a predetermined depth from an upper surface of photoresist layer 22, and light L2 may transmit light R2 to reach a lower surface of photoresist. .

Next, referring to FIG. 11C, portions of the photoresist layer 22 except for the portions exposed to the exposures L1 and L2 may be removed. The photoresist in the regions R1 and R2 is not removed and can form the photoresist patterns 23: 23c. By the sum of the regions R1 and R2, the photoresist pattern 23 substantially the same as or similar to the inverse tapered shape can be formed.

Referring back to FIG. 8B, after the photoresist pattern 23 is formed on the conductive substrate 21, the insulating layer 27 is formed on the conductive substrate 21 and the photoresist pattern 23. Can be formed. The insulating layer 27 may be coated to have a thickness of about 20 μm using a material including spin on glass (SOG), but is not limited thereto. The coating may be spin coating, dip coating, spray coating, doctor blade, or the like.

Subsequently, referring to FIG. 8C, the insulating layer 27 may be removed by a predetermined thickness to expose the photoresist pattern 23. Since the photoresist pattern 23 is about 10 μm and the insulating layer 27 is about 20 μm thick, the upper portion of the photoresist pattern 23 may be exposed by removing about 10 μm from the top of the insulating layer 27. Can be.

Subsequently, referring to FIG. 8D, the photoresist pattern 23 may be removed. A known etchant that can remove only the photoresist pattern 23 can be used without limitation. Then, the insulating layer 26 may have a shape inverted from that of the photoresist pattern 23 and may remain on the conductive substrate 21. That is, the remaining insulating layer 26 may constitute an insulator 26 having a shape in which the width decreases from the top to the bottom. The insulator 26 may have an inclined shape S, a tapered shape, and the like.

12 to 14 are schematic views showing a mask manufacturing process using the mother plate 20 according to an embodiment of the present invention. In FIGS. 12-14, the plate-shaped negative electrode body 20 and the positive electrode body 30 used for the general planar electroplating system are assumed and demonstrated.

First, referring to FIG. 12A, a cathode body 30 facing the mother plate 20 (or an anode body 20) is prepared. The positive electrode 30 may be immersed in a plating liquid (not shown), and all or part of the mother plate 20 may be immersed in a plating liquid (not shown). Due to the electric field formed between the base plate 20 (or the cathode body 20) and the opposite anode body 30, the plating film 15 may be electrodeposited on the surface of the substrate 20. However, the plating film 15 is generated only in the plating portion 21 region and the intaglio pattern 28 of the mother plate 20, and the plating film 15 is formed in the insulation portion 25 (or the unit insulator 26) region. ) Is not created. FIG. 12B shows a plan view of the mother plate 20. The aggregate of the unit insulators 26 is shown by the insulator part 25, and the area | region other than the insulator part 25 is shown by the plating part 21 area | region.

Next, referring to FIG. 13A, the mother plate 20 (or the negative electrode body 20) is lifted out of the plating liquid (not shown). Outside the plating liquid, the plating films 15: 15a and 15b are bonded to the plating portion 21 region 15b and the cathode pattern 28 15a, and the insulating portion 25 has the plating film 15 attached thereto. The display pattern DP and the pixel pattern PP of the plating film 15 can be configured (see FIGS. 13B and 13C) without being generated. FIG. 13B is a plan view of the plating film 15, and FIG. 13C shows an enlarged side cross-sectional view of the plating film 15. As shown in FIG.

Next, as shown in FIG. 14A, when the plating film 15 and the mother plate 20 are separated, a portion where the plating film 15 is formed constitutes a mask 100 (or a mask body). The portion where the plating film 15 is not formed may constitute a display pattern DP and a pixel pattern PP (or a mask pattern). FIG. 14B is a plan view of the plating film 15, and FIG. 14C is an enlarged side cross-sectional view of the plating film 15. As shown in FIG.

As described above, the present invention has the effect of manufacturing a mask 100 having a pattern only by the process of forming the plating film 15 in the electroplating process. In addition, the present invention has the effect that it is possible to form a mask pattern having an inclined shape (S), a tapered shape only by a plating process without a separate process. In addition, once the mother plate 20 (or the negative electrode body 20) including the plating part 21 and the insulating part 25 is manufactured, it can be repeatedly reused later, thereby reducing process time and cost, There is an effect that can improve the productivity. In addition, there is an effect that the base plate 20 used as the cathode body 20 can be manufactured in a simple process. In addition, since the pattern of the insulating portion 25 of the mother plate 20 can be finely formed, there is an effect that the pattern of the FMM of the OLED can be finely formed.

Although the present invention has been illustrated and described with reference to the preferred embodiments as described above, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

10: electric pole plating device
11: plating bath
12: Plating solution
15: plating film
20: cathode, bed plate
21: conductive substrate, plating part
22: photoresist layer
23: photoresist pattern
25: insulation
26: module insulator
28: cathode pattern
30: bipolar
40: power supply
100: mask, shadow mask, fine metal mask (FMM)
200: OLED pixel deposition apparatus
DP: display pattern
PP: pixel pattern

Claims (14)

As a mother plate used in manufacturing a mask for forming an OLED pixel by electroforming,
A plating part in which a plating film is formed; And
A plurality of insulating parts formed on one surface of the mother plate and including an intaglio pattern;
Including;
The matrix is made of doped monocrystalline silicon,
The intaglio pattern is a shape that decreases in width from top to bottom.
A uniform electric field is formed on the entire surface of the single crystal silicon exposed through the intaglio pattern to form a plating film, and the formation of the plating film on the insulating part is prevented so that the plating film has a pattern, and the plating film having the pattern is a FMM (Fine Metal Mask). Bedding). delete The method of claim 1,
The insulator has a shape corresponding to the pattern of the plating film. The method of claim 1,
The side section shape of the intaglio pattern is an inverted taper shape. The method of claim 1,
The platen, wherein the angle between the platen and the intaglio pattern side is 55 ° to 59 °. The method of claim 1,
The base plate whose thickness of an insulation part is 10 micrometers. The method of claim 1,
The mother plate to which an electric field which can form a plating film in a plating part and an intaglio pattern acts. The method of claim 1,
Insulation is a mother board, which is a material containing SOG (Spin On Glass). delete The method of claim 1,
The mother plate is used as a cathode body in electroplating. The method of claim 1,
A substrate having an insulating portion remaining on one side of the mother board even after repeated electroplating. The method of claim 1,
A mother board having a stronger adhesive force between one side of the mother board and the insulator than the adhesive force between the plating part and the plating film. As a mother plate used in manufacturing a mask for forming an OLED pixel by electroforming,
The matrix is a doped monocrystalline silicon material,
One side of the bed
A first region having conductivity and a second region having an insulating portion disposed on one surface of the base plate to have non-conductivity,
A uniform electric field is formed on the entire surface of the single crystal silicon exposed through the intaglio pattern formed in the first region and the insulating portion to form a plating film, and the formation of the plating film on the insulating portion is prevented so that the plating film has a pattern. The plate which the plating film to have becomes FMM (Fine Metal Mask). As a mother plate used in manufacturing a mask for forming an OLED pixel by electroforming,
The matrix is a doped monocrystalline silicon material,
A plurality of insulators are formed on one surface of the mother plate, the shape of the width is increased from the top to the bottom,
A uniform electric field is formed on all of the surfaces of the single crystal silicon exposed in the remaining regions except for the region where the insulator of the mother plate is disposed to form a plating film, and the formation of the plating film on the insulator is prevented so that the plating film has a pattern. The plated film becomes the FMM (Fine Metal Mask).

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