KR102325254B1 - Mother plate and producing method of the same, and producing method of mask - Google Patents

Abstract

The present invention relates to a mother plate, a method for manufacturing a mother plate, and a method for manufacturing a mask. The mother plate according to the present invention is a mother plate 20 used when manufacturing a mask by electroforming, and one surface of the mother plate 20 is a plating part 21 on which a plating film is formed, and the mother plate 20 It is composed of an insulator 26 buried in the engraved pattern 23 formed in the , and characterized in that it includes an insulating portion 25 in which the plating film 15 is not formed.

Description

A bed sheet, a method for manufacturing a bed sheet, and a method for manufacturing a mask

The present invention relates to a mother plate, a method for manufacturing a mother plate, and a method for manufacturing a mask. More particularly, it relates to a mother plate capable of forming a plated film and at the same time forming a pattern on the plated film using an electro-pole plating method, a method of manufacturing the mother plate, and a method of manufacturing a mask.

Recently, in the manufacture of thin plates, research on an electroforming method has been conducted. The electroplating method immerses the anode body and the cathode body in an electrolyte, and applies power to electrodeposit a thin metal plate on the surface of the cathode body, so that an ultra-thin plate can be manufactured and mass production can be expected.

On the other hand, as a technology for forming a pixel in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used to deposit an organic material at a desired position by attaching a thin metal mask to the substrate.

1 and 2 are schematic views showing a conventional FMM (Fine Metal Mask) manufacturing process.

Referring to FIG. 1, in the conventional mask manufacturing method, a thin metal plate 1 to be used as a mask is prepared [FIG. Alternatively, after coating the PR(2) to have a pattern [FIG. 1(b)], the mask 3 having the pattern P was prepared by etching.

Referring to FIG. 2 , in the conventional mask manufacturing method using plating, a substrate 4 (FIG. 2 (a)) is prepared, and a PR 2 having a predetermined pattern is coated on the substrate 4 [FIG. 2 (b)]. Then, plating is performed on the substrate 4 to form a thin metal plate 3 (Fig. 2(c)). Next, the PR 2 is removed [FIG. 2(d)], and the mask 3 (or the thin metal plate 3) on which the pattern P is formed from the substrate 4 is separated [FIG. 2((d)] e)].

In the conventional FMM manufacturing process as described above, since a process of coating and etching a PR on a substrate each time is involved, there is a problem in that the process time and cost increase, and productivity is lowered.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and it is to provide a mother plate, a method for manufacturing a mother plate, and a method for manufacturing a mask, which can manufacture a mask having a pattern only by a plating process. The purpose.

In addition, according to the present invention, once a mother plate used as a cathode body is manufactured, it can be reused repeatedly in subsequent processes, thereby reducing process time and cost and improving productivity. and to provide a method for manufacturing a mask.

The above object of the present invention, as a mother plate (Mother Plate) used when manufacturing a mask by electroforming (Electroforming), one surface of the mother plate, a plating portion on which a plating film is formed; and an insulator embedded in an intaglio pattern formed on the mother plate, and comprising an insulating portion on which a plating film is not formed, achieved by the mother plate.

Formation of the plating film may be prevented by the insulating portion, so that the plating film may have a pattern.

The insulating portion may have a shape corresponding to the pattern of the plating layer.

The plating film having the pattern may be used as a fine metal mask (FMM).

The mother plate can be used as a cathode body in electroplating.

And, the above object of the present invention, as a mother plate (Mother Plate) used when manufacturing a mask by electroforming (Electroforming), one surface of the mother plate is divided into a conductive first region and a non-conductive second region, the first This is achieved by the mother plate, from which a mask is made by forming a plating film in the region.

And, the above object of the present invention, as a method of manufacturing a mother plate (Mother Plate) used when manufacturing a mask by electroforming (Electroforming), (a) providing a conductive substrate; (b) forming an intaglio pattern on the conductive substrate; and (c) embedding an insulator in the pattern to form an insulator.

(b) step, (b1) forming a mask layer having a masking pattern on the conductive substrate; and (b2) etching the conductive substrate between the masking patterns to form a pattern.

Step (b) may include forming a pattern by performing laser processing or mechanical cutting on the conductive substrate.

(b) step, (b1) forming a mask layer on the conductive substrate; (b2) irradiating a laser on the upper portion of the mask layer corresponding to the intaglio pattern; (b3) forming a masking pattern by developing the mask layer; and (b4) etching the conductive substrate between the masking patterns to form a pattern.

(c) step, (c1) coating an insulator on the conductive substrate; and (c2) removing the insulator coated on the conductive substrate by a chemical mechanical polishing (CMP) method to leave only the insulator buried in the intaglio pattern.

And, the above object of the present invention is a method of manufacturing a mask by electroforming, an insulating part is formed in which an insulator is embedded in an intaglio pattern formed on a cathode body, and the surface of the cathode body except for the insulating part This is achieved by a method of manufacturing a mask, in which a plating film is formed to constitute a mask body, and formation of a plating film is prevented on the surface on which the insulating portion of the cathode body is formed to constitute a mask pattern.

And, the above object of the present invention is a method of manufacturing a mask by electroforming, the insulating part is formed in which the insulator is embedded in the engraved pattern formed on the cathode body, and a plating film can be formed. A plating film is formed on the entire surface of the cathode body except for the predetermined portion on the insulating portion to which the electric field acts and the insulating portion to constitute the mask body, except for the predetermined portion on the insulating portion where the electric field capable of forming the plating film does not act. This is achieved by a method of manufacturing a mask, in which the formation of a plating film in the portion is prevented to constitute a mask pattern.

The plating layer may be made of an Invar material.

The insulating part may have a shape corresponding to the mask pattern.

The width of the mask pattern may be at least less than 30 μm.

The width of the insulator buried in the intaglio pattern may be greater than the width of the mask pattern.

In addition, the above object of the present invention is an OLED pixel deposition method using a mask manufactured by electroforming, comprising the steps of: (a) matching the mask manufactured using the mask manufacturing method to a target substrate; (b) supplying an organic material source to the target substrate through a mask; and (c) depositing the organic material source on the target substrate through the pattern of the mask.

According to the present invention configured as described above, there is an effect that a mask having a pattern can be manufactured only by a plating process.

In addition, according to the present invention, if a mother plate used as a cathode body is manufactured once, it can be reused repeatedly in subsequent processes, thereby reducing process time and cost, and improving productivity.

1 and 2 are schematic views showing a conventional FMM (Fine Metal Mask) manufacturing process.
3 is a schematic diagram illustrating an OLED pixel deposition apparatus using an FMM according to an embodiment of the present invention.
4 is a schematic diagram showing an electroplating apparatus according to an embodiment of the present invention.
5 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
Figure 6 is a schematic view showing the outer peripheral surface of the mother plate according to an embodiment of the present invention.
7 to 9 are schematic views showing a mask manufacturing process using a mother plate according to an embodiment of the present invention.
10 is a schematic diagram illustrating a mask manufacturing process using a mother plate according to another embodiment of the present invention.
11 is a schematic diagram illustrating a form in which a plating film is formed according to an embodiment of the present invention.
12 is a schematic view showing a method of manufacturing a mother plate according to the first embodiment of the present invention.
13 is a schematic view showing a method of manufacturing a mother plate according to a second embodiment of the present invention.
14 is a schematic view showing a method of manufacturing a mother plate according to a third embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description of the present invention set forth below refers to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description set forth below is not intended to be taken in a limiting sense, and the scope of the invention, if properly described, is limited only by the appended claims, along with all scope equivalents to those claimed. In the drawings, like reference numerals refer to the same or similar functions in various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, in order to enable those of ordinary skill in the art to easily practice the present invention, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic diagram illustrating an OLED pixel deposition apparatus 1 using the FMM 100 according to an embodiment of the present invention.

Referring to FIG. 3 , the OLED pixel deposition apparatus 1 includes a magnet plate 2 in which a magnet 3 is accommodated, a cooling water line 4 is disposed, and an organic material source 6 from a lower portion of the magnet plate 2 . ), and a deposition source supply unit 5 for supplying it.

A target substrate 9 such as glass on which the organic source 6 is deposited may be interposed between the magnet plate 2 and the source deposition unit 5 . The target substrate 9 may be disposed so that the FMM 100 that causes the organic material source 6 to be deposited for each pixel is in close contact with or very close to each other.

The organic material sources 6 supplied from the deposition source supply unit 5 may pass through the pattern formed on the FMM mask 100 to be deposited on one side of the target substrate 9 . Deposits of organic material 6 corresponding to the pattern of FMM mask 100 can act as pixels 7 of the OLED.

4 is a schematic diagram showing an electroplating apparatus according to an embodiment of the present invention. 4(a) shows a flat electroplating apparatus and FIG. 4(b) shows a continuous electroplating apparatus, but the present invention is not limited to the form shown in FIG. 4 and can be applied to all known electroplating apparatuses. make it clear that

Referring to Figure 4 (a), the flat electroplating apparatus according to an embodiment of the present invention, a plating bath 10, a cathode body (Cathode body; 20), anode body (Anode body; 30), a power supply unit 40. In addition, means for moving the cathode body 20, means for separating the plating film 15 (or thin metal plate 15) to be used as a mask, from the cathode body 20, cutting It may further include means for doing so (not shown).

The plating solution 11 is accommodated in the plating bath 10 . The plating liquid 11 is an electrolyte, and may be a material of the plating film 15 to be used as a mask. For example, when an Invar sheet, which is an iron-nickel alloy, is manufactured as the plating film 15 , a mixed solution of a solution containing Ni ions and a solution containing Fe ions may be used as the plating solution 11 . Invar sheet is used as FMM (fine metal mask) and shadow mask in OLED manufacturing, and plays a role to accurately guide electron beams to phosphors. Also, since the Invar sheet has a very low coefficient of thermal expansion of about 1.0 ppm/° C., there is little concern that the pattern shape of the mask may be deformed by thermal energy, so it is mainly used in the manufacture of high-resolution OLEDs. In addition to this, the plating solution 11 for the desired plating film 15 may be used without limitation, and in the present specification, manufacturing the invar sheet 15 will be described as a main example.

The plating solution 11 may be supplied to the plating bath 10 from an external plating solution supply means (not shown), and a circulation pump (not shown) that circulates the plating solution 11 in the plating bath 10 , the plating solution 11 ) may be further provided with a filter (not shown) that removes impurities.

The negative electrode body 20 has a flat plate shape with one side flat, and the entire negative electrode body 20 can be immersed in the plating solution 11 . Although the form in which the negative electrode body 20 and the positive electrode body 30 are vertically arranged is shown in FIG. 4A , they may be arranged horizontally. In this case, the negative electrode body 20 in the plating solution 11 is At least some or all of it may be immersed.

The negative electrode body 20 may be made of a conductive material such as titanium (Ti), stainless steel (SUS), or the like that does not react with the plating solution 11 . A plating layer 15 may be electrodeposited on the surface of the cathode body 20 , and a pattern corresponding to the insulating portion 25 of the cathode body 20 may be formed on the plating layer 15 . Since the negative electrode body 20 of the present invention can form even a pattern during the production process of the plating film 15, the negative electrode body 20 is expressed as “mother plate” (20) or “mold” and used together. do. The specific configuration of the surface of the mother plate 20 (or the negative electrode body 20 ) will be described later.

The anode body 30 is spaced apart from the cathode body 20 by a predetermined distance to face the cathode body 20 , and has a flat plate shape with one side corresponding to the cathode body 20 , and the whole of the anode body 30 in the plating solution 11 . can be immersed. The anode body 30 may be made of an insoluble material such as titanium (Ti), iridium (Ir), or ruthenium (Ru). The anode body 20 and the anode body 30 may be installed to be spaced apart by several cm.

The power supply unit 40 may supply current required for electroplating to the cathode body 20 and the anode body 30 . The (-) terminal of the power supply unit 40 may be connected to the negative body 20 , and the (+) terminal may be connected to the positive body 30 .

Referring to (b) of FIG. 4 , the continuous electroplating apparatus according to an embodiment of the present invention includes a plating tank 10 , a cathode body 20 , an anode body 30 , and a power supply unit 40 . . In addition, a cleaning unit, a cutting unit, a winding unit, various rollers, etc. (not shown) may be further included for post-processing of the plating film 15 (or the thin metal plate 15 ) to be used as a mask. Since there is a difference only in the shapes of the cathode body 20 and the anode body 30 from the planar electropole plating apparatus shown in FIG. 4A , the description of the same configuration will be omitted.

The negative electrode body 20 has a substantially cylindrical shape, a drum shape, a pipe shape, etc. with an empty interior, and at least a portion of the negative electrode body 20 may be immersed in the plating solution 11 . The cathode body 20 may be rotatably supported by being connected to a rotating means (not shown) such as a motor through a rotating shaft (not shown). The anode body 30 is spaced apart from the cathode body 20 to face the cathode body 20 , has a hemispherical shell shape, an arc shape, and the like, and the entire anode body 30 may be immersed in the plating solution 11 . The anode body 30 may be made of an insoluble material such as titanium (Ti), iridium (Ir), or ruthenium (Ru). The anode body 20 and the anode body 30 may be installed to be spaced apart by several cm.

The plating film 15 electrodeposited on the surface of the anode body 20 by electroplating may be separated from the cathode body 20 and transferred through a roller or the like. Thereafter, it may be wound and stored through subsequent processes such as washing and cutting.

5 is a schematic diagram illustrating a mask according to an embodiment of the present invention.

Referring to FIG. 5 , masks 100 and 200 manufactured using an electroplating apparatus including the mother plate 20 (or the cathode body 20 ) of the present invention are shown. The mask 100 shown in FIG. 5A is a stick-type mask, and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The mask 200 illustrated in FIG. 5B is a plate-type mask and may be used in a process of forming a pixel having a large area.

A plurality of display patterns DP may be formed on the body of the masks 100 and 200 . The display pattern DP is a pattern corresponding to one display such as a smartphone. When the display pattern DP is enlarged, a plurality of pixel patterns PP corresponding to R, G, and B may be identified. Numerous pixel patterns PP are grouped to form one display pattern DP, and a plurality of display patterns DP may be formed on the masks 100 and 200 .

That is, in the present specification, the display pattern DP is represented by a solid line, but it is not a concept representing one pattern represented by a solid line, and it should be understood as a concept in which a plurality of pixel patterns PP corresponding to one display are clustered. . In the present specification, "display pattern DP" and "insulation part 25" may correspond to the same scale, "pixel pattern PP" and "engraved pattern 23", or "engraved pattern 23" The insulator 26" embedded therein may correspond to the same scale.

The masks 100 and 200 of the present invention are characterized in that they are directly manufactured having a plurality of display patterns DP and pixel patterns PP without having to undergo a separate patterning process. In other words, the plating film 15 electrodeposited on the surface of the mother plate 20 (or the cathode body 20 ) in the electropole plating apparatus may be electrodeposited while the display pattern DP and the pixel pattern PP are formed. Hereinafter, the display pattern DP and the pixel pattern PP may be used interchangeably as a pattern.

6 is a schematic view showing the outer peripheral surface of the mother plate 20 according to an embodiment of the present invention. Fig. 6 (a) shows a flat plate-shaped mother plate 20 of a flat plate electroplating apparatus, and Fig. 6 (b) shows a columnar-shaped mother plate 20 of a continuous electric pole plating apparatus.

Referring to FIG. 6 , the outer peripheral surface (surface) of the mother plate 20 (or the cathode body 20 ) includes a plating portion 21 and an insulating portion 25 .

The plating portion 21 refers to a surface portion (first region) of the mother plate 20 generated by substantially electrodeposition of the plating film 15 (or the mask 15 ), and may have conductive properties. An electric field required for plating may be formed between the plating unit 21 and the anode body 30 , and the plating layer 15 may be electrodeposited between the plating unit 21 and the anode body.

In addition, the insulating portion 25 refers to a surface portion (second region) of the mother plate 20 that prevents the formation of the plating layer 15 , and may have insulating properties. In other words, the insulating portion 25 may refer to a surface portion of the mother plate 20 itself on which the plating film 15 is not electrodeposited. Similar to the display pattern DP described above in FIG. 5 , one insulating part 25 may correspond to one display.

When the insulating portion 25 is enlarged, a plurality of insulators 26 for forming a plurality of pixel patterns PP corresponding to R, G, and B can be seen. The plurality of insulators 26 may be embedded in the engraved pattern 23 (or the insulating pattern 23, see FIGS. 12 to 14 ), which is a groove of a predetermined depth that is engraved on the surface of the mother plate 20 . A plurality of insulators 26 buried in the intaglio pattern 23 by coating or the like may form a cluster to form the insulating portion 25 . That is, in the present specification, the insulating part 25 is represented by a solid line, but it does not mean that all of the region represented by the solid line is insulated, and the insulating part 25 is a group of a plurality of insulators 26 corresponding to one display. As a concept, it should be understood in the sense that a part of the insulator 26 is insulated. In other words, the insulators 26 filled in the intaglio pattern 23 are collectively referred to as an insulating part 25 , and the region between the insulator 26 and the insulator 26 is a region in which a plating film can be formed, and the plating part (21) can be referred to.

In order to facilitate the coating of the insulator 26 in the engraved pattern 23, the insulator may be a polymer insulator such as TEFLON, spin on glass (SOG), polymer, oxide, nitride, or the like. However, the present invention is not necessarily limited thereto, and as long as the insulating region can be formed in a specific portion of the mother plate 20, the intaglio pattern (insulation pattern), the insulator, and the like can be freely configured. For example, it is also possible to form the insulating part in the form of an insulator having a pattern by changing the material of the mother plate 20 without having to go through the process of forming an intaglio pattern and coating the insulator.

Since the insulating part 25 (or the insulator 26 ) has insulating properties, an electric field is not formed between the insulating part 25 (or the insulator 26 ) and the anode body 30 or plating is performed Only a weak electric field that is difficult to achieve is formed. Accordingly, the portion corresponding to the insulating portion 25 (or the insulator 26 ) in which the plating film 15 is not formed in the mother plate 20 constitutes a pattern, a hole, etc. of the plating film 15 . can do.

Specifically, a portion of the mother plate 20 corresponding to the insulator 26 may constitute the pixel pattern PP of the plating layer 15 . In addition, a portion corresponding to the insulating portion 25 that is an aggregate of the insulator 26 may constitute a display pattern DP that is an aggregate of the pixel patterns PP of the plating film 15 . In other words, the plating portion 21 , which is a portion of the mother plate 20 excluding the insulating portion 25 , constitutes the plating film 15 body, and corresponds to the insulation portion 25 (or the insulator 26 ). The portion may form a pattern (display pattern DP and pixel pattern PP) of the plating layer 15 .

Since the plating film 15 on which the display pattern DP and the pixel pattern PP are formed can be used as a shadow mask, the FMMs 100 and 200 (see FIG. 5 ) in the OLED pixel process, the width of the pixel pattern PP is It may be formed to be smaller than 30 μm to be suitable for high-resolution pixel deposition, and the pattern width of the intaglio pattern 23 may be formed to have the same width as the pixel pattern PP.

7 to 9 are schematic views showing a mask manufacturing process using the mother plate 20 according to an embodiment of the present invention. 7 to 9, the plate-shaped negative electrode body 20 and the positive electrode body 30 used in a general electropole plating method will be described.

First, referring to FIG. 7A , the positive electrode body 30 facing the mother plate 20 (or the negative electrode body 20 ) is prepared. The anode body 30 may be immersed in a plating solution (not shown), and the mother plate 20 may be fully or partially immersed in a plating solution (not shown). Due to the electric field formed between the mother plate 20 (or the cathode body 20 ) and the opposing anode body 30 , the plating film 15 may be electrodeposited on the surface of the mother plate 20 . However, the plating film 15 is generated only in the area of the plating portion 21 of the mother plate 20 , and the plating film 15 is not formed in the insulating portion 25 (or in the area). Figure 7 (b) shows a plan view of the mother plate (20). An assembly of insulators 26 buried in a plurality of intaglio patterns is shown as an insulating part 25 , and a region other than the insulating part 25 is denoted by a plating part 21 .

Next, referring to FIG. 8A , the mother plate 20 (or the negative electrode body 20 ) is lifted out of the plating solution (not shown). Outside the plating solution, the plating film 15 is adhered only to the plating portion 21 region, and the plating film 15 is not formed on the insulating portion 25 , and the display pattern DP of the plating film 15 , The pixel pattern PP may be configured (refer to FIG. 8(c) ). FIG. 8B is a plan view of the mother plate 20 , and FIG. 8C is a plan view of the plating film 15 .

Next, as shown in FIG. 9A , when the plating film 15 and the mother plate 20 are separated, the portion where the plating film 15 is generated constitutes the masks 100 and 200 , and the plating film 15 is formed. ) are not generated to constitute the display pattern DP and the pixel pattern PP. 9B shows a plan view of the plating film 15 .

10 is a schematic diagram showing a mask manufacturing process using the mother plate 20 according to another embodiment of the present invention. In FIG. 10 , a cylindrical cathode body 20 used in a continuous electroplating method similar to a roll to roll method is assumed and described.

First, referring to (a) of FIG. 10 , the plating film 15 is formed between the mother plate 20 (or the cathode body 20 ) and the opposite anode body 30 due to the electric field formed between the mother plate 20 and the mother plate 20 . It can be produced by electrodeposition on a surface. However, the plating film 15 is generated only in the area of the plating portion 21 of the mother plate 20 , and the plating film 15 is not formed in the area of the insulating portion 25 .

Next, referring to FIG. 10B , as the mother plate 20 (or the cathode body 20 ) rotates, the plating film 15 is electrodeposited on the surface of the mother plate 20 to the outside of the plating solution 11 . can come out Outside the plating solution 11 , the plating film 15 is adhered only to the plating portion 21 , and the plating film 15 is not formed on the insulating portion 25 , and the display pattern ( DP) and the pixel pattern PP may be configured. When the mother plate 20 (or the cathode body 20) is further rotated and the plating film 15 and the mother plate 20 are separated while the plating film 15 is wound by a roller (not shown), the plating film ( A portion in which 15 ) is generated may constitute the masks 100 and 200 , and a portion in which the plating layer 15 is not formed may constitute a display pattern DP and a pixel pattern PP.

11 is a schematic diagram illustrating a form in which a plating film is formed according to an embodiment of the present invention.

Meanwhile, referring to FIG. 11A , the plating film 15 may be formed not only on the plating portion 21 but also on the edge of the insulating portion 25 (or the insulator 26 ). have. In other words, the plating film 15 is not precisely partitioned at the boundary between the plating portion 21 and the insulating portion 25 (or the insulator 26 ), and the insulating portion 25 (or the insulator 26 ) is not formed. ] may be generated by partially overlapping (OL).

The region of the electric field EF formed between the cathode body 20 and the anode body 30 needs to be precisely partitioned according to the shapes of the plating part 21 and the insulating part 25 (or the insulator 26 ). Yes (see Fig. 11 (b)). However, since the electric field EF actually has a gradient, when the electric field EF of a certain strength or more is formed, the electric field strength is zero near the edge of the insulating portion 25 (or the insulator 26 ). However, an electric field EF′ having a strength sufficient to form the plating layer 15 may exist. Thus, the plating layer 15 may be overlapped OL in the width direction on the insulating portion 25 (or the insulator 26 ) by a partial electric field EF′. In another view, the width of the insulating portion 25 (or the insulator 26 ) may be formed to be greater than the width of the pixel pattern PP (or the mask pattern). Of course, the plating film 15 is not electrodeposited on the portion in which an electric field is not formed on the insulating portion 25 (or the insulator 26 ) or only a weak electric field, which is difficult to perform plating, is formed, so that the plating film 15 is not formed. of the display pattern DP and the pixel pattern PP may be configured.

Since the overlapping portion OL may have an error with respect to the size of the originally designed pixel pattern PP, the strength of the electric field EF formed between the cathode body 20 and the anode body 30 is determined in consideration of this. need to control Alternatively, the size of the intaglio pattern 23 may be slightly larger than that of the pixel pattern PP on the premise that the overlapping portion OL is generated.

Hereinafter, a method of manufacturing the mother plate 20 according to various embodiments will be described. The method of manufacturing the mother plate 20 of the present invention comprises the steps of (a) providing a conductive substrate 20, (b) forming an intaglio pattern 23 on the conductive substrate 30, and (c) the pattern 23 ) by embedding the insulator 26 in the insulator to form the insulator 25 .

12 is a schematic diagram showing a method of manufacturing the mother plate 20 according to the first embodiment of the present invention.

First, referring to FIG. 12A , a conductive substrate 20 is prepared. The conductive substrate 20 is a material used as the negative electrode body 20 , and a metal substrate or the like may be used.

Next, referring to FIG. 12B , a mask layer ML having a masking pattern MP may be formed on the conductive substrate 20 . The mask layer ML may be used as a mask for etching in a subsequent process. As the mask layer ML, PR, an acid-resistant film, an acid-resistant tape, or the like may be used. The masking pattern MP has substantially the same shape as the portion where the insulating portion 25 will be formed later, the engraved pattern 23 , the display pattern PP of the plating layer 15 , and the pixel pattern PP will be formed. It can be a pattern.

Next, referring to FIG. 12C , an upper portion of the conductive substrate 20 exposed through the masking pattern MP may be etched (E). As the etching (E), dry etching and wet etching may be applied without limitation.

Next, referring to FIGS. 12 (d) and 12 (e), an intaglio pattern 23 may be formed on the conductive substrate 20 by etching (E). The intaglio pattern 23 may be formed to correspond to the pixel pattern PP of the plating layer 15 . Then, a polymer insulator such as Teflon (TEFLON), an insulator such as SOG (Spin on Glass), polymer, oxide, nitride, etc. are coated in the intaglio pattern 23, and after a planarization process such as CMP (Chemical Mechanical Polishing), plating Manufacturing of the mother plate 20 including the part 21 and the insulating part 25 may be completed.

13 is a schematic view showing a method of manufacturing the mother plate 20 according to the second embodiment of the present invention.

First, referring to FIG. 13A , a conductive substrate 20 is prepared. The conductive substrate 20 is a material used as the negative electrode body 20 , and a metal substrate or the like may be used.

Next, referring to FIG. 13B , the intaglio pattern 23 may be formed by performing processing (L, M) on the conductive substrate 20 . The intaglio pattern 23 may be formed to correspond to the pixel pattern PP of the plating layer 15 . As the processing method, laser processing (L) or mechanical processing (M) such as cutting and sanding may be performed. Laser processing (L) is preferable to generate a fine engraved pattern 23 by adjusting the size of the focus.

Next, referring to FIG. 13(c), a polymer insulator such as Teflon (TEFLON), an insulator such as SOG (Spin on Glass), polymer, oxide, nitride, etc., are coated in the intaglio pattern 23, and CMP (Chemical Through a planarization process such as mechanical polishing), the manufacture of the mother plate 20 including the plating part 21 and the insulating part 25 may be completed.

14 is a schematic view showing a method of manufacturing the mother plate 20 according to the third embodiment of the present invention.

First, referring to FIG. 14A , a conductive substrate 20 is prepared. The conductive substrate 20 is a material used as the negative electrode body 20 , and a metal substrate or the like may be used.

Next, referring to FIG. 14B , a mask layer ML may be formed on the entire upper surface of the conductive substrate 20 .

Next, referring to FIG. 14C , laser patterning irradiation LP may be performed. When the mask layer ML is positive PR, the laser patterning irradiated portion LP may act as a masking pattern MP after development, and when the mask layer ML is negative PR, the laser patterning irradiated (LP) portion A portion other than the portion may act as the masking pattern MP after development. It is advantageous to form a fine masking pattern MP by the laser patterning irradiation LP.

Next, referring to FIG. 14D , an upper portion of the conductive substrate 20 exposed through the masking pattern MP may be etched (E). As the etching (E), dry etching and wet etching may be applied without limitation.

Next, referring to FIGS. 14E and 14F , an intaglio pattern 23 may be formed on the conductive substrate 20 by etching (E). The intaglio pattern 23 may be formed to correspond to the pixel pattern PP of the plating layer 15 . Then, in the intaglio pattern 23 (or the entire surface of the conductive substrate 20), a polymer insulator such as TEFLON, an insulator such as SOG (Spin on Glass), a polymer, an oxide, or a nitride is coated and , a planarization process such as CMP (Chemical Mechanical Polishing) may be performed. Then, only the insulator 26 is filled in the intaglio pattern 23 , so that the manufacture of the mother plate 20 including the plating part 21 and the insulating part 25 can be completed.

As described above, the present invention has the effect of manufacturing the masks 15a and 15b having the pattern P only by the process of forming the plating film 15 in the electro-pole plating process. In addition, since the mother plate 20 (or the cathode body 20 ) including the plating part 21 and the insulating part 25 can be reused, the process time and cost can be reduced, and the effect of improving productivity have. In addition, since the pattern of the insulating portion 25 of the mother plate 20 can be formed finely, there is an effect that the pattern of the FMM of the OLED can be formed finely.

Although the present invention has been illustrated and described with reference to preferred embodiments as described above, it is not limited to the above-described embodiments and is not limited to the above-described embodiments, and various methods can be made by those of ordinary skill in the art to which the invention pertains without departing from the spirit of the present invention. Transformation and change are possible. Such modifications and variations are intended to fall within the scope of the present invention and the appended claims.

10: plating bath
11: Plating amount
15: plating film
20: anode body, mother plate, conductive substrate
21: plating part
23: engraved pattern
25: insulation
26: insulator
30: anode body
40: power supply
100, 200: Mask, Shadow Mask, FMM (Fine Metal Mask)
EF: electric field
DP: display pattern
PP: pixel pattern
ML: mask layer
MP: masking pattern

Claims (18)

As a mother plate used for mask manufacturing by electroforming, one side of the mother plate is
a plating part on which a plating film is formed; and
Insulation part composed of an insulator embedded in the engraved pattern formed on the mother plate, and no plating film is formed
including,
The embedding of the insulator in the engraved pattern,
(1) coating an insulator on the mother plate on which the intaglio pattern is formed; and
(2) removing the insulator coated on the mother plate by a CMP (Chemical Mechanical Polishing) method, leaving only the insulator buried in the intaglio pattern;
, which is carried out through the bedrock. According to claim 1,
The mother plate, in which the formation of the plating film is prevented by the insulating portion and the plating film has a pattern. 3. The method of claim 2,
The insulating portion has a shape corresponding to the pattern of the plating film, the mother plate. delete delete delete As a method of manufacturing a mother plate used in manufacturing a mask by electroforming,
(a) providing a conductive substrate;
(b) forming an intaglio pattern on the conductive substrate; and
(c) forming an insulator by embedding an insulator in the pattern;
including,
(c) step,
(c1) coating an insulator on the conductive substrate; and
(c2) removing the insulator coated on the conductive substrate by a CMP (Chemical Mechanical Polishing) method, leaving only the insulator buried in the intaglio pattern;
A method for producing a bed comprising a. 8. The method of claim 7,
(b) step,
(b1) forming a mask layer having a masking pattern on the conductive substrate; and
(b2) forming a pattern by etching the conductive substrate between the masking patterns
A method for producing a bed comprising a. 8. The method of claim 7,
(b) step,
Method for producing a mother plate, which is a step of forming a pattern by performing laser processing or mechanical cutting on a conductive substrate 8. The method of claim 7,
(b) step,
(b1) forming a mask layer on the conductive substrate;
(b2) irradiating a laser on the upper portion of the mask layer corresponding to the intaglio pattern;
(b3) forming a masking pattern by developing the mask layer; and
(b4) forming a pattern by etching the conductive substrate between the masking patterns
A method for producing a bed comprising a. delete A method of manufacturing a mask by electroforming, comprising:
The mother plate manufactured through the method of manufacturing the mother plate of claim 7 is used as a cathode body,
A plating film is formed on the surface except for the insulating part of the cathode body to constitute a mask body,
A method of manufacturing a mask, wherein the formation of a plating film is prevented on a surface on which an insulating portion of the cathode body is formed to constitute a mask pattern. delete delete delete delete delete An OLED pixel deposition method using a mask manufactured by electroforming, comprising:
(a) matching the mask manufactured using the method of claim 12 to the target substrate;
(b) supplying an organic material source to the target substrate through a mask; and
(c) depositing the organic material source on the target substrate through the pattern of the mask
Including, OLED pixel deposition method.

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