KR101993950B1 - 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 - Google Patents

위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 Download PDF

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KR101993950B1
KR101993950B1 KR1020150167023A KR20150167023A KR101993950B1 KR 101993950 B1 KR101993950 B1 KR 101993950B1 KR 1020150167023 A KR1020150167023 A KR 1020150167023A KR 20150167023 A KR20150167023 A KR 20150167023A KR 101993950 B1 KR101993950 B1 KR 101993950B1
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South Korea
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substrate
light
mark
light receiving
unit
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Korean (ko)
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KR20160065019A (ko
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코이치 타무라
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020150167023A 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 Active KR101993950B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2014-242526 2014-11-28
JP2014242526 2014-11-28
JP2015171202A JP6590599B2 (ja) 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法
JPJP-P-2015-171202 2015-08-31

Publications (2)

Publication Number Publication Date
KR20160065019A KR20160065019A (ko) 2016-06-08
KR101993950B1 true KR101993950B1 (ko) 2019-06-27

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KR1020150167023A Active KR101993950B1 (ko) 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법

Country Status (4)

Country Link
JP (1) JP6590599B2 (enrdf_load_stackoverflow)
KR (1) KR101993950B1 (enrdf_load_stackoverflow)
CN (1) CN105652611B (enrdf_load_stackoverflow)
TW (1) TWI620039B (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2019007A (en) * 2016-06-13 2017-12-20 Asml Netherlands Bv Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6490771B1 (ja) * 2017-09-27 2019-03-27 株式会社アルバック 位置検出装置、位置検出方法、および、蒸着装置
CN109585351B (zh) * 2018-10-29 2021-06-22 苏州腾晖光伏技术有限公司 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法
CN111355541A (zh) * 2020-04-02 2020-06-30 Oppo广东移动通信有限公司 网络设备、搜寻网络信号的方法
JP7609676B2 (ja) 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法
CN118641478B (zh) * 2024-08-14 2024-11-05 江苏福拉特自动化设备有限公司 Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20090130784A1 (en) * 2007-09-06 2009-05-21 Vistec Semiconductor Systems Gmbh Method for determining the position of the edge bead removal line of a disk-like object

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US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
TWI250556B (en) * 2001-07-20 2006-03-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7626701B2 (en) * 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
SG124407A1 (en) * 2005-02-03 2006-08-30 Asml Netherlands Bv Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
CN102402127B (zh) * 2010-09-17 2014-01-22 上海微电子装备有限公司 一种硅片预对准装置及方法
JP5875335B2 (ja) * 2011-11-15 2016-03-02 キヤノン株式会社 位置検出装置および露光装置
TWI581055B (zh) * 2012-10-02 2017-05-01 聯華電子股份有限公司 形成光罩的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20090130784A1 (en) * 2007-09-06 2009-05-21 Vistec Semiconductor Systems Gmbh Method for determining the position of the edge bead removal line of a disk-like object

Also Published As

Publication number Publication date
KR20160065019A (ko) 2016-06-08
TW201621481A (zh) 2016-06-16
CN105652611B (zh) 2018-05-08
TWI620039B (zh) 2018-04-01
CN105652611A (zh) 2016-06-08
JP6590599B2 (ja) 2019-10-16
JP2016110066A (ja) 2016-06-20

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