KR101992711B1 - 마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법 - Google Patents

마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법 Download PDF

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KR101992711B1
KR101992711B1 KR1020167003193A KR20167003193A KR101992711B1 KR 101992711 B1 KR101992711 B1 KR 101992711B1 KR 1020167003193 A KR1020167003193 A KR 1020167003193A KR 20167003193 A KR20167003193 A KR 20167003193A KR 101992711 B1 KR101992711 B1 KR 101992711B1
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substrate
mask blank
mask
transfer
thin film
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Korean (ko)
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KR20160021899A (ko
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마사루 다나베
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호야 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/09—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Surface Treatment Of Glass (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Engineering (AREA)
KR1020167003193A 2013-06-21 2014-06-19 마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법 Active KR101992711B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013130443 2013-06-21
JPJP-P-2013-130443 2013-06-21
PCT/JP2014/066263 WO2014203961A1 (ja) 2013-06-21 2014-06-19 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024697A Division KR101597186B1 (ko) 2013-06-21 2014-06-19 마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법

Publications (2)

Publication Number Publication Date
KR20160021899A KR20160021899A (ko) 2016-02-26
KR101992711B1 true KR101992711B1 (ko) 2019-06-25

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KR1020167003193A Active KR101992711B1 (ko) 2013-06-21 2014-06-19 마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법
KR1020157024697A Active KR101597186B1 (ko) 2013-06-21 2014-06-19 마스크 블랭크용 기판, 마스크 블랭크, 전사용 마스크 및 이들의 제조방법, 그리고 반도체 디바이스의 제조방법

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US (2) US9690189B2 (https=)
JP (2) JP5690981B1 (https=)
KR (2) KR101992711B1 (https=)
TW (2) TWI611253B (https=)
WO (1) WO2014203961A1 (https=)

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JP6266286B2 (ja) * 2013-09-27 2018-01-24 Hoya株式会社 マスクブランク用基板の製造方法、マスクブランクの製造方法、転写用マスクの製造方法、及び半導体デバイスの製造方法
US20170363952A1 (en) * 2014-12-19 2017-12-21 Hoya Corporation Mask blank substrate, mask blank, and methods for manufacturing them, method for manufacturing transfer mask, and method for manufacturing semiconductor device
TWI694304B (zh) * 2015-06-08 2020-05-21 日商Ａｇｃ股份有限公司 Ｅｕｖ微影術用反射型光罩基底
JP6094708B1 (ja) * 2015-09-28 2017-03-15 旭硝子株式会社 マスクブランク
US10948814B2 (en) * 2016-03-23 2021-03-16 AGC Inc. Substrate for use as mask blank, and mask blank
JP6293986B1 (ja) * 2016-07-27 2018-03-14 Hoya株式会社 マスクブランク用基板の製造方法、マスクブランクの製造方法、転写用マスクの製造方法、半導体デバイスの製造方法、マスクブランク用基板、マスクブランク及び転写用マスク
EP3364247A1 (en) * 2017-02-17 2018-08-22 ASML Netherlands B.V. Methods & apparatus for monitoring a lithographic manufacturing process
JP6229807B1 (ja) * 2017-02-22 2017-11-15 旭硝子株式会社 マスクブランク
US10552569B2 (en) * 2017-09-11 2020-02-04 Globalfoundries Inc. Method for calculating non-correctable EUV blank flatness for blank dispositioning
JP6899080B2 (ja) 2018-09-05 2021-07-07 信越半導体株式会社 ウェーハ形状データ化方法
US10859905B2 (en) 2018-09-18 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Photomask and method for forming the same
CN112740106A (zh) * 2018-09-27 2021-04-30 Hoya株式会社 掩模坯料、转印用掩模及半导体器件的制造方法
JP2022551429A (ja) 2019-09-27 2022-12-09 コーニング インコーポレイテッド 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法
JP2023088773A (ja) * 2021-12-15 2023-06-27 キオクシア株式会社 描画方法、原版製造方法および描画装置
CN117784526A (zh) * 2022-09-20 2024-03-29 联华电子股份有限公司 掩模图案光学转移的最适化方法
JP2026018654A (ja) * 2024-07-25 2026-02-05 信越化学工業株式会社 マスクブランクス用基板及びその製造方法

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WO2012102313A1 (ja) 2011-01-26 2012-08-02 旭硝子株式会社 フォトマスクの製造方法

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JP2011242298A (ja) 2010-05-19 2011-12-01 Nippon Steel Corp 帯状体の形状測定装置、方法及びプログラム
WO2012102313A1 (ja) 2011-01-26 2012-08-02 旭硝子株式会社 フォトマスクの製造方法

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Publication number Publication date
US9690189B2 (en) 2017-06-27
JP6320944B2 (ja) 2018-05-09
JPWO2014203961A1 (ja) 2017-02-23
KR101597186B1 (ko) 2016-02-24
JP2015111283A (ja) 2015-06-18
WO2014203961A1 (ja) 2014-12-24
KR20160021899A (ko) 2016-02-26
US20160109797A1 (en) 2016-04-21
TWI611253B (zh) 2018-01-11
JP5690981B1 (ja) 2015-03-25
US20170248841A1 (en) 2017-08-31
TW201514613A (zh) 2015-04-16
KR20150119121A (ko) 2015-10-23
TWI591423B (zh) 2017-07-11
TW201732416A (zh) 2017-09-16
US10168613B2 (en) 2019-01-01

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