KR101988874B1 - 3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조 - Google Patents

3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조 Download PDF

Info

Publication number
KR101988874B1
KR101988874B1 KR1020177013663A KR20177013663A KR101988874B1 KR 101988874 B1 KR101988874 B1 KR 101988874B1 KR 1020177013663 A KR1020177013663 A KR 1020177013663A KR 20177013663 A KR20177013663 A KR 20177013663A KR 101988874 B1 KR101988874 B1 KR 101988874B1
Authority
KR
South Korea
Prior art keywords
intermediate structure
conductive
conductive trace
hollow
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020177013663A
Other languages
English (en)
Korean (ko)
Other versions
KR20170072931A (ko
Inventor
바벡 엘미에
사우라브 팔란
렉스 웬터스 크로센
알렉산더 자이스
Original Assignee
페이스북, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 페이스북, 인크. filed Critical 페이스북, 인크.
Publication of KR20170072931A publication Critical patent/KR20170072931A/ko
Application granted granted Critical
Publication of KR101988874B1 publication Critical patent/KR101988874B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G05B19/4099—Surface or curve machining, making three-dimensional [3D] objects, e.g. desktop manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
    • B29C2043/3668—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders destructible or fusible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0011—Moulds or cores; Details thereof or accessories therefor thin-walled moulds
    • B29C33/0016—Lost moulds, e.g. staying on the moulded object
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/448—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles destructible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/35—Nc in input of data, input till input file format
    • G05B2219/35134—3-D cad-cam
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49007—Making, forming 3-D object, model, surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Civil Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Computer Hardware Design (AREA)
KR1020177013663A 2014-10-23 2015-10-23 3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조 Expired - Fee Related KR101988874B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462067674P 2014-10-23 2014-10-23
US62/067,674 2014-10-23
PCT/US2015/057114 WO2016065260A1 (en) 2014-10-23 2015-10-23 Fabrication of intra-structure conductive traces and interconnects for three-dimensional manufactured structures

Publications (2)

Publication Number Publication Date
KR20170072931A KR20170072931A (ko) 2017-06-27
KR101988874B1 true KR101988874B1 (ko) 2019-06-14

Family

ID=55761628

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177013663A Expired - Fee Related KR101988874B1 (ko) 2014-10-23 2015-10-23 3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조

Country Status (11)

Country Link
US (1) US10039195B2 (https=)
EP (1) EP3209488B1 (https=)
JP (1) JP6505220B2 (https=)
KR (1) KR101988874B1 (https=)
CN (1) CN107107492B (https=)
AU (1) AU2015335727B2 (https=)
BR (1) BR112017008391A2 (https=)
CA (1) CA2965190A1 (https=)
IL (1) IL251758A0 (https=)
MX (1) MX365712B (https=)
WO (1) WO2016065260A1 (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156205B2 (en) * 2013-03-22 2015-10-13 Markforged, Inc. Three dimensional printer with composite filament fabrication
US9579851B2 (en) 2013-03-22 2017-02-28 Markforged, Inc. Apparatus for fiber reinforced additive manufacturing
US9688028B2 (en) 2013-03-22 2017-06-27 Markforged, Inc. Multilayer fiber reinforcement design for 3D printing
US10682844B2 (en) 2013-03-22 2020-06-16 Markforged, Inc. Embedding 3D printed fiber reinforcement in molded articles
US10953609B1 (en) 2013-03-22 2021-03-23 Markforged, Inc. Scanning print bed and part height in 3D printing
US9186846B1 (en) 2013-03-22 2015-11-17 Markforged, Inc. Methods for composite filament threading in three dimensional printing
US9694544B2 (en) 2013-03-22 2017-07-04 Markforged, Inc. Methods for fiber reinforced additive manufacturing
US11237542B2 (en) 2013-03-22 2022-02-01 Markforged, Inc. Composite filament 3D printing using complementary reinforcement formations
US9126365B1 (en) 2013-03-22 2015-09-08 Markforged, Inc. Methods for composite filament fabrication in three dimensional printing
US9186848B2 (en) 2013-03-22 2015-11-17 Markforged, Inc. Three dimensional printing of composite reinforced structures
US11981069B2 (en) 2013-03-22 2024-05-14 Markforged, Inc. Three dimensional printing of composite reinforced structures
CA3121870A1 (en) 2013-03-22 2014-09-25 Markforged, Inc. Three dimensional printing
US9815268B2 (en) 2013-03-22 2017-11-14 Markforged, Inc. Multiaxis fiber reinforcement for 3D printing
US9149988B2 (en) 2013-03-22 2015-10-06 Markforged, Inc. Three dimensional printing
CN107953572A (zh) 2013-06-05 2018-04-24 马克弗巨德有限公司 用于纤维增强添加制造的方法
US20170072640A1 (en) * 2015-09-11 2017-03-16 Caterpillar Inc. 3D Printing Portal for Crowd-Sourced Designs
WO2017074397A1 (en) * 2015-10-29 2017-05-04 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3d) printed electronics
HUE058865T2 (hu) * 2016-05-24 2022-09-28 Divergent Tech Inc Rendszerek és módszerek az adalékanyagok
WO2018017096A1 (en) * 2016-07-21 2018-01-25 Hewlett-Packard Development Company, L.P. Additively formed 3d object with conductive channel
US20190232552A1 (en) * 2016-10-24 2019-08-01 Signify Holding B.V. 3d printing method and product
US10457033B2 (en) 2016-11-07 2019-10-29 The Boeing Company Systems and methods for additively manufacturing composite parts
US11440261B2 (en) 2016-11-08 2022-09-13 The Boeing Company Systems and methods for thermal control of additive manufacturing
US10766241B2 (en) 2016-11-18 2020-09-08 The Boeing Company Systems and methods for additive manufacturing
US10843452B2 (en) * 2016-12-01 2020-11-24 The Boeing Company Systems and methods for cure control of additive manufacturing
US10135159B1 (en) 2017-05-22 2018-11-20 Rosemount Aerospace Inc. Board-to-board connectors and mounting structure
WO2019117967A1 (en) 2017-12-15 2019-06-20 Hewlett-Packard Development Company, L.P. Three-dimensional printing
US11267981B2 (en) * 2018-04-03 2022-03-08 Massachusetts Institute Of Technology 3-D printed devices formed with conductive inks and method of making
EP3562285A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Verbinden elektrischer bauelemente
CN110843206A (zh) * 2018-07-25 2020-02-28 中国科学院金属研究所 一种三维电子器件的制备方法和应用
US11426818B2 (en) 2018-08-10 2022-08-30 The Research Foundation for the State University Additive manufacturing processes and additively manufactured products
CN109618487B (zh) * 2019-01-22 2022-07-29 张雯蕾 带有内埋电路的立体基件及其制备方法
KR102179070B1 (ko) * 2019-04-10 2020-11-16 서울대학교 산학협력단 줄열 직접 가열을 이용한 전도성 섬유 복합재의 선택적 가열 경화 방법 및 이를 위한 장치
EP3962715A4 (en) 2019-04-29 2022-12-07 Hewlett-Packard Development Company, L.P. THREE-DIMENSIONAL PRINCIPAL PRESSURE ELEMENTS
WO2020227093A1 (en) 2019-05-06 2020-11-12 Massachusetts Institute Of Technology 3-d printed devices formed with magnetic inks and methods of making graded index structures
US12409496B2 (en) 2022-04-27 2025-09-09 The Boeing Company Pre-heating methods for performing electron beam powder bed fusion
US12485621B2 (en) 2022-08-25 2025-12-02 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods
US12343933B2 (en) 2022-08-25 2025-07-01 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods
US20250280500A1 (en) * 2024-03-01 2025-09-04 PCB Automation Inc. Methods and systems for configuring conductive paths in a printed circuit board assembly (pcba) for enhanced power distribution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156414A (ja) * 1999-11-30 2001-06-08 Yazaki Corp 導電性ペースト及び回路形成方法
US20100314041A1 (en) 2008-02-20 2010-12-16 Agency For Science, Technology And Research Method of making a multilayer substrate with embedded metallization
US20110045577A1 (en) 2005-05-18 2011-02-24 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
JP2012028545A (ja) * 2010-07-23 2012-02-09 Ngk Spark Plug Co Ltd 配線基板の製造方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1834123A (en) * 1930-06-25 1931-12-01 Anstenal Lab Inc Method of making swaged denture-bases and dies for the same
JPS61145889A (ja) * 1984-12-19 1986-07-03 アロン化成株式会社 プリント基板の製造方法
US6100178A (en) 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
TW507514B (en) 2000-11-27 2002-10-21 Matsushita Electric Works Ltd Multilayer circuit board and method of manufacturing the same
US6784656B2 (en) * 2001-08-30 2004-08-31 Teradyne, Inc. Hybrid conductor-board for multi-conductor routing
KR20050058404A (ko) * 2002-08-20 2005-06-16 익스트루드 혼 코포레이션 주조 공정 및 이를 수행하기 위한 물품
JP4744200B2 (ja) * 2005-06-20 2011-08-10 シーメット株式会社 平滑化した造形端面を有する立体造形物
US7520740B2 (en) 2005-09-30 2009-04-21 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7516437B1 (en) 2006-07-20 2009-04-07 Xilinx, Inc. Skew-driven routing for networks
DE102006037927A1 (de) * 2006-08-11 2008-02-14 Karl Hehl Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen Gegenstandes sowie Verwendung einer kunststofftechnischen Einheit zu dessen Herstellung
CN102982716B (zh) * 2008-03-28 2015-01-21 泰尔茂株式会社 生物体组织立体模型及其制造方法
US8033014B2 (en) 2008-07-07 2011-10-11 Unimicron Technology Corp. Method of making a molded interconnect device
US8770260B2 (en) * 2008-07-09 2014-07-08 Borg Warner Inc. Method for rapid generation of multiple investment cast parts such as turbine or compressor wheels
US8298914B2 (en) 2008-08-19 2012-10-30 International Business Machines Corporation 3D integrated circuit device fabrication using interface wafer as permanent carrier
TWI394506B (zh) 2008-10-13 2013-04-21 Unimicron Technology Corp 多層立體線路的結構及其製作方法
US20120065755A1 (en) 2010-08-13 2012-03-15 Sensable Technologies, Inc. Fabrication of non-homogeneous articles via additive manufacturing using three-dimensional voxel-based models
US8668859B2 (en) 2010-08-18 2014-03-11 Makerbot Industries, Llc Automated 3D build processes
US8916085B2 (en) * 2011-06-02 2014-12-23 A. Raymond Et Cie Process of making a component with a passageway
US10518490B2 (en) * 2013-03-14 2019-12-31 Board Of Regents, The University Of Texas System Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
US9308726B2 (en) * 2012-02-16 2016-04-12 Xerox Corporation Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes
US20150077215A1 (en) * 2012-04-26 2015-03-19 Northeastern University Device and Method to Additively Fabricate Structures Containing Embedded Electronics or Sensors
US9026962B2 (en) 2012-05-30 2015-05-05 Gumstix, Inc. Integrated electronic design automation system
CN103568323A (zh) * 2012-08-09 2014-02-12 上海科斗电子科技有限公司 光固化三维打印机及其打印方法
US8816513B2 (en) 2012-08-22 2014-08-26 Texas Instruments Incorporated Electronic assembly with three dimensional inkjet printed traces
US9216544B2 (en) 2012-12-21 2015-12-22 Stratasys, Inc. Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof
DE102013203936A1 (de) * 2013-03-07 2014-09-11 Airbus Operations Gmbh Generatives Schichtaufbauverfahren zur Herstellung eines dreidimensionalen Objekts und dreidimensionales Objekt
US9406969B2 (en) 2013-03-15 2016-08-02 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form three-dimensional biocompatible energization elements
CN103495734B (zh) * 2013-09-03 2015-07-22 广州中国科学院先进技术研究所 一种基于3d打印技术具有环形水路的冷却装置
WO2015077262A1 (en) * 2013-11-19 2015-05-28 Guill Tool & Engineering Coextruded, multilayered and multicomponent 3d printing inputs
JP2017515678A (ja) 2014-02-20 2017-06-15 ディーエムジー モリ アドバンスト ソリューションズ デベロップメントＤｍｇ Ｍｏｒｉ Ａｄｖａｎｃｅｄ Ｓｏｌｕｔｉｏｎｓ Ｄｅｖｅｌｏｐｍｅｎｔ ハイブリッド付加・除去加工センタの処理ヘッド
CN103847102B (zh) * 2014-03-05 2017-01-18 大连理工大学 一种覆膜粉末材料激光壳型失效快速成型方法
JP6298343B2 (ja) * 2014-04-01 2018-03-20 日本特殊陶業株式会社 配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156414A (ja) * 1999-11-30 2001-06-08 Yazaki Corp 導電性ペースト及び回路形成方法
US20110045577A1 (en) 2005-05-18 2011-02-24 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
US20100314041A1 (en) 2008-02-20 2010-12-16 Agency For Science, Technology And Research Method of making a multilayer substrate with embedded metallization
JP2012028545A (ja) * 2010-07-23 2012-02-09 Ngk Spark Plug Co Ltd 配線基板の製造方法

Also Published As

Publication number Publication date
BR112017008391A2 (pt) 2017-12-19
JP2018509747A (ja) 2018-04-05
MX2017005294A (es) 2018-04-30
US10039195B2 (en) 2018-07-31
IL251758A0 (en) 2017-06-29
WO2016065260A1 (en) 2016-04-28
AU2015335727A1 (en) 2017-05-18
KR20170072931A (ko) 2017-06-27
CN107107492B (zh) 2021-04-20
MX365712B (es) 2019-06-10
EP3209488A1 (en) 2017-08-30
EP3209488B1 (en) 2021-10-06
AU2015335727B2 (en) 2018-12-06
EP3209488A4 (en) 2018-06-20
CA2965190A1 (en) 2016-04-28
US20160120040A1 (en) 2016-04-28
CN107107492A (zh) 2017-08-29
JP6505220B2 (ja) 2019-04-24

Similar Documents

Publication Publication Date Title
KR101988874B1 (ko) 3차원으로 제조되는 구조체용 기반-구조 전도성 트레이스 및 인터커넥트의 제조
MacDonald et al. Multiprocess 3D printing for increasing component functionality
KR102207849B1 (ko) ３ｄ 구조들, 구조적 구성요소들, 및 구조적 전자, 전자기 및 전기기계 구성요소들／디바이스들에 필라멘트들을 내장하기 위한 방법들 및 시스템
US20130170171A1 (en) Extrusion-based additive manufacturing system for 3d structural electronic, electromagnetic and electromechanical components/devices
EP2974567B1 (en) Methods and system for connecting inter-layer conductors and components in 3d structures, structural components or structural electronic electromagnetic and electromechanical components/devices
Carranza et al. Design and hybrid additive manufacturing of 3-D/volumetric electrical circuits
Goh et al. Additively manufactured multi-material free-form structure with printed electronics
US7419630B2 (en) Methods and systems for rapid prototyping of high density circuits
KR102216349B1 (ko) 회로 보드를 만들기 위한 친환경적 방법
Periard et al. Printing embedded circuits
KR20140069021A (ko) 프리 폼 다중 재료 마이크로 컴포넌트의 적층식 제조방법
Wittkopf et al. 3D printed electronics with multi jet fusion
CN106457689A (zh) 机电组件的增材制造系统和方法
CN106863770A (zh) 基于熔融沉积成形技术的结构电路一体化部件的制作方法
O'Donnell et al. All-printed smart structures: a viable option?
CN107430152B (zh) 用于制造触点间距转换器的方法以及触点间距转换器
US9736944B2 (en) Structure, wireless communication device and method for manufacturing structure
JP2022526373A (ja) 側部取付された構成部品を有する付加製造電子（ａｍｅ）回路
CN112074396B (zh) 用于打印的方法和设备、以及机器可读存储介质
KR20180002305A (ko) 3d 프린팅 구조물에 대한 전도 패턴 형성 방법
US10974443B2 (en) 3D volumetric circuits and associated methods
Roberson et al. Ohmic curing of three-dimensional printed silver interconnects for structural electronics
JP2018029157A (ja) 三次元成形回路部材並びにその成形方法及び装置
US10569464B2 (en) Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning
KR101541732B1 (ko) 전자회로가 일체로 형성된 플라스틱 전자부품 제조방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20220603

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240608

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240608