KR101968798B1 - 진공 증착 장치 - Google Patents

진공 증착 장치 Download PDF

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Publication number
KR101968798B1
KR101968798B1 KR1020150131559A KR20150131559A KR101968798B1 KR 101968798 B1 KR101968798 B1 KR 101968798B1 KR 1020150131559 A KR1020150131559 A KR 1020150131559A KR 20150131559 A KR20150131559 A KR 20150131559A KR 101968798 B1 KR101968798 B1 KR 101968798B1
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South Korea
Prior art keywords
film
organic material
film thickness
crystal
evaporation
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KR1020150131559A
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English (en)
Korean (ko)
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KR20160038746A (ko
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히로유키 다무라
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캐논 톡키 가부시키가이샤
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Publication of KR20160038746A publication Critical patent/KR20160038746A/ko
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    • H01L51/56
    • H01L21/203
    • H01L51/001
    • H01L2251/56

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  • Physical Vapour Deposition (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020150131559A 2014-09-30 2015-09-17 진공 증착 장치 KR101968798B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014200860A JP6448279B2 (ja) 2014-09-30 2014-09-30 真空蒸着装置
JPJP-P-2014-200860 2014-09-30

Publications (2)

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KR20160038746A KR20160038746A (ko) 2016-04-07
KR101968798B1 true KR101968798B1 (ko) 2019-04-12

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KR1020150131559A KR101968798B1 (ko) 2014-09-30 2015-09-17 진공 증착 장치

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JP (1) JP6448279B2 (zh)
KR (1) KR101968798B1 (zh)
CN (1) CN105463377B (zh)
TW (1) TWI681066B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018077388A1 (en) * 2016-10-25 2018-05-03 Applied Materials, Inc. Measurement assembly for measuring a deposition rate, evaporation source, deposition apparatus, and method therefor
US10763143B2 (en) * 2017-08-18 2020-09-01 Applied Materials, Inc. Processing tool having a monitoring device
KR101870581B1 (ko) * 2017-09-29 2018-06-22 캐논 톡키 가부시키가이샤 수정진동자의 수명 판정방법, 막두께 측정장치, 성막방법, 성막장치, 및 전자 디바이스 제조방법
JP7301578B2 (ja) * 2019-03-29 2023-07-03 キヤノントッキ株式会社 成膜装置及び成膜方法
CN109930112A (zh) * 2019-04-15 2019-06-25 湖畔光电科技(江苏)有限公司 一种蒸镀腔体结构
TWI701641B (zh) * 2019-10-01 2020-08-11 龍翩真空科技股份有限公司 無線傳輸薄膜厚度監控裝置
WO2021079589A1 (ja) * 2019-10-21 2021-04-29 株式会社アルバック 成膜装置
CN111829428B (zh) * 2020-06-17 2022-02-15 华中科技大学 一种双石英晶振膜厚控制仪及误差校正方法
KR20220011924A (ko) * 2020-07-22 2022-02-03 주식회사 엘지화학 실리콘계 코팅 조성물 및 이를 포함하는 실리콘계 이형필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005325400A (ja) * 2004-05-13 2005-11-24 Seiko Epson Corp 真空蒸着装置及び薄膜形成方法
JP2014065942A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp 真空蒸着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4233644B2 (ja) 1998-09-22 2009-03-04 株式会社アルバック 膜厚モニター用水晶振動子
KR20120023273A (ko) * 2010-09-01 2012-03-13 (주)알파플러스 셔터를 이용하는 진공증착막의 두께 모니터링 방법 및 이 방법을 채용하는 진공증착장치
JP5854731B2 (ja) * 2010-11-04 2016-02-09 キヤノン株式会社 成膜装置及びこれを用いた成膜方法
TW201337013A (zh) * 2012-03-12 2013-09-16 Hitachi High Tech Corp 蒸發源裝置及真空蒸鍍裝置及有機el顯示裝置之製造方法
JP2014070238A (ja) * 2012-09-28 2014-04-21 Hitachi High-Technologies Corp 真空蒸着装置及びその蒸着方法
CN103469172B (zh) * 2013-08-31 2015-08-05 上海膜林科技有限公司 石英晶体镀膜厚度控制方法及石英晶体镀膜装置
JP6223275B2 (ja) * 2014-05-15 2017-11-01 キヤノントッキ株式会社 水晶発振式膜厚計

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005325400A (ja) * 2004-05-13 2005-11-24 Seiko Epson Corp 真空蒸着装置及び薄膜形成方法
JP2014065942A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp 真空蒸着装置

Also Published As

Publication number Publication date
JP2016069694A (ja) 2016-05-09
CN105463377A (zh) 2016-04-06
CN105463377B (zh) 2019-08-23
KR20160038746A (ko) 2016-04-07
TW201627514A (zh) 2016-08-01
JP6448279B2 (ja) 2019-01-09
TWI681066B (zh) 2020-01-01

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