KR101967853B1 - 시사각 밀 - Google Patents

시사각 밀 Download PDF

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Publication number
KR101967853B1
KR101967853B1 KR1020147006425A KR20147006425A KR101967853B1 KR 101967853 B1 KR101967853 B1 KR 101967853B1 KR 1020147006425 A KR1020147006425 A KR 1020147006425A KR 20147006425 A KR20147006425 A KR 20147006425A KR 101967853 B1 KR101967853 B1 KR 101967853B1
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South Korea
Prior art keywords
sample
computer
ion beam
image
angle
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Korean (ko)
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KR20140088074A (ko
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마이클 슈미트
클리프 버그
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에프이아이 컴파니
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020147006425A 2011-09-12 2012-09-11 시사각 밀 Active KR101967853B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161533769P 2011-09-12 2011-09-12
US61/533,769 2011-09-12
PCT/US2012/054626 WO2013039891A1 (en) 2011-09-12 2012-09-11 Glancing angle mill

Publications (2)

Publication Number Publication Date
KR20140088074A KR20140088074A (ko) 2014-07-09
KR101967853B1 true KR101967853B1 (ko) 2019-04-10

Family

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Family Applications (1)

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KR1020147006425A Active KR101967853B1 (ko) 2011-09-12 2012-09-11 시사각 밀

Country Status (6)

Country Link
US (2) US9941096B2 (https=)
EP (1) EP2756282A4 (https=)
JP (1) JP6174584B2 (https=)
KR (1) KR101967853B1 (https=)
CN (1) CN103797351B (https=)
WO (1) WO2013039891A1 (https=)

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KR102155834B1 (ko) 2012-10-05 2020-09-14 에프이아이 컴파니 높은 종횡비 구조 분석
TWI607498B (zh) * 2012-10-05 2017-12-01 Fei公司 使用帶電粒子束曝露樣品中所關注特徵的方法及系統
CN104685617B (zh) 2012-10-05 2018-11-30 Fei 公司 用于减少带电粒子束样品制备中的幕化的方法和系统
KR102148284B1 (ko) 2012-12-31 2020-08-26 에프이아이 컴파니 하전 입자 비임을 이용한 경사지거나 비스듬한 밀 작업들을 위한 기준 설계
US9064811B2 (en) * 2013-05-28 2015-06-23 Fei Company Precursor for planar deprocessing of semiconductor devices using a focused ion beam
CZ304824B6 (cs) 2013-07-11 2014-11-19 Tescan Orsay Holding, A.S. Způsob opracovávání vzorku v zařízení se dvěma nebo více částicovými svazky a zařízení k jeho provádění
JP6165643B2 (ja) * 2014-01-23 2017-07-19 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置、荷電粒子ビーム装置の制御方法及び断面加工観察装置
EP2899744A1 (en) * 2014-01-24 2015-07-29 Carl Zeiss Microscopy GmbH Method for preparing and analyzing an object as well as particle beam device for performing the method
KR101957007B1 (ko) * 2014-06-30 2019-03-11 가부시키가이샤 히다치 하이테크놀로지즈 패턴 측정 방법 및 패턴 측정 장치
US9378927B2 (en) * 2014-09-11 2016-06-28 Fei Company AutoSlice and view undercut method
US10249471B2 (en) * 2014-12-26 2019-04-02 Hitachi High-Technologies Corporation Composite charged particle beam apparatus and control method thereof
KR102410666B1 (ko) 2015-01-09 2022-06-20 삼성전자주식회사 반도체 소자의 계측 방법, 및 이를 이용한 반도체 소자의 제조방법
CN106226134A (zh) * 2016-07-29 2016-12-14 上海华力微电子有限公司 制备透射电子显微镜样品的方法
JP6867015B2 (ja) * 2017-03-27 2021-04-28 株式会社日立ハイテクサイエンス 自動加工装置
JP6925522B2 (ja) * 2018-05-25 2021-08-25 三菱電機株式会社 透過型電子顕微鏡試料の作製方法
WO2020100179A1 (ja) * 2018-11-12 2020-05-22 株式会社日立ハイテク 画像形成方法及び画像形成システム
US11573156B2 (en) * 2019-01-15 2023-02-07 Westinghouse Electric Company Llc Minimally invasive microsampler for intact removal of surface deposits and substrates
US11158487B2 (en) 2019-03-29 2021-10-26 Fei Company Diagonal compound mill
EP3809447A1 (en) * 2019-10-18 2021-04-21 FEI Company Method for large-area 3d analysis of samples using glancing incidence fib milling
JP7719089B2 (ja) 2020-03-13 2025-08-05 カール・ツァイス・エスエムティー・ゲーエムベーハー ウェハ中の検査ボリュームの断面画像化の方法
US11355313B2 (en) * 2020-06-30 2022-06-07 Fei Company Line-based endpoint detection
US11280749B1 (en) * 2020-10-23 2022-03-22 Applied Materials Israel Ltd. Holes tilt angle measurement using FIB diagonal cut
CN114689630B (zh) * 2020-12-30 2025-12-02 Fei公司 用于对三维特征进行成像的方法和系统
US12456186B2 (en) * 2022-05-13 2025-10-28 Fei Company Method and system for preparing wedged lamella
US20250124658A1 (en) * 2023-10-11 2025-04-17 Dell Products L.P. Systems and methods for cross-sectioning of circuit boards

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Publication number Publication date
US20180247793A1 (en) 2018-08-30
US20130186747A1 (en) 2013-07-25
EP2756282A4 (en) 2015-01-21
CN103797351A (zh) 2014-05-14
JP6174584B2 (ja) 2017-08-02
CN103797351B (zh) 2019-11-05
KR20140088074A (ko) 2014-07-09
EP2756282A1 (en) 2014-07-23
WO2013039891A1 (en) 2013-03-21
JP2014530346A (ja) 2014-11-17
WO2013039891A4 (en) 2013-05-16
US9941096B2 (en) 2018-04-10

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