KR101953938B1 - 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents

도전성 입자, 도전 재료 및 접속 구조체 Download PDF

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Publication number
KR101953938B1
KR101953938B1 KR1020147001316A KR20147001316A KR101953938B1 KR 101953938 B1 KR101953938 B1 KR 101953938B1 KR 1020147001316 A KR1020147001316 A KR 1020147001316A KR 20147001316 A KR20147001316 A KR 20147001316A KR 101953938 B1 KR101953938 B1 KR 101953938B1
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KR
South Korea
Prior art keywords
particles
conductive
conductive layer
nickel
resin
Prior art date
Application number
KR1020147001316A
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English (en)
Korean (ko)
Other versions
KR20140117340A (ko
Inventor
시아오게 왕
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20140117340A publication Critical patent/KR20140117340A/ko
Application granted granted Critical
Publication of KR101953938B1 publication Critical patent/KR101953938B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020147001316A 2012-01-20 2013-01-17 도전성 입자, 도전 재료 및 접속 구조체 KR101953938B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012010197 2012-01-20
JPJP-P-2012-010197 2012-01-20
JPJP-P-2012-046993 2012-03-02
JP2012046993 2012-03-02
PCT/JP2013/050822 WO2013108843A1 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
KR20140117340A KR20140117340A (ko) 2014-10-07
KR101953938B1 true KR101953938B1 (ko) 2019-03-04

Family

ID=48799266

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147001316A KR101953938B1 (ko) 2012-01-20 2013-01-17 도전성 입자, 도전 재료 및 접속 구조체

Country Status (4)

Country Link
JP (1) JP6165626B2 (zh)
KR (1) KR101953938B1 (zh)
CN (1) CN103765527B (zh)
WO (1) WO2013108843A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108842A1 (ja) * 2012-01-20 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6696721B2 (ja) * 2013-09-09 2020-05-20 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP6507552B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
WO2016068165A1 (ja) * 2014-10-29 2016-05-06 デクセリアルズ株式会社 導電材料
KR102410478B1 (ko) 2015-09-14 2022-06-17 삼성디스플레이 주식회사 표시 장치
CN111508635B (zh) * 2016-02-08 2021-12-28 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
US10510821B2 (en) 2016-06-10 2019-12-17 Innovation Counsel Llp Display device
WO2021206201A1 (ko) * 2020-04-10 2021-10-14 주식회사 씨앤씨머티리얼즈 니켈 금속층을 포함하는 전도성 폴리머 입자
WO2021206202A1 (ko) * 2020-04-10 2021-10-14 주식회사 씨앤씨머티리얼즈 은 금속층을 포함하는 전도성 폴리머 입자

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996696A (zh) * 2009-08-06 2011-03-30 日立化成工业株式会社 导电性微粒及各向异性导电材料
JP2012004033A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101131229B1 (ko) * 2004-01-30 2012-03-28 세키스이가가쿠 고교가부시키가이샤 도전성 미립자 및 이방성 도전 재료
JP4860163B2 (ja) * 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
KR20110019392A (ko) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 회로 접속 재료 및 회로 접속 구조체
JP4991666B2 (ja) 2008-09-19 2012-08-01 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
KR101704856B1 (ko) * 2010-03-08 2017-02-08 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 이방성 도전 재료 및 접속 구조체
JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5703836B2 (ja) * 2011-02-25 2015-04-22 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
WO2013108842A1 (ja) * 2012-01-20 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996696A (zh) * 2009-08-06 2011-03-30 日立化成工业株式会社 导电性微粒及各向异性导电材料
JP2012004033A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体

Also Published As

Publication number Publication date
CN103765527A (zh) 2014-04-30
WO2013108843A1 (ja) 2013-07-25
KR20140117340A (ko) 2014-10-07
JP6165626B2 (ja) 2017-07-19
CN103765527B (zh) 2017-12-19
JPWO2013108843A1 (ja) 2015-05-11

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