JP6165626B2 - 導電性粒子、導電材料及び接続構造体 - Google Patents

導電性粒子、導電材料及び接続構造体 Download PDF

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Publication number
JP6165626B2
JP6165626B2 JP2013503317A JP2013503317A JP6165626B2 JP 6165626 B2 JP6165626 B2 JP 6165626B2 JP 2013503317 A JP2013503317 A JP 2013503317A JP 2013503317 A JP2013503317 A JP 2013503317A JP 6165626 B2 JP6165626 B2 JP 6165626B2
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Japan
Prior art keywords
particles
conductive layer
conductive
weight
nickel
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JP2013503317A
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English (en)
Japanese (ja)
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JPWO2013108843A1 (ja
Inventor
暁舸 王
暁舸 王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2013503317A priority Critical patent/JP6165626B2/ja
Publication of JPWO2013108843A1 publication Critical patent/JPWO2013108843A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013503317A 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体 Active JP6165626B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013503317A JP6165626B2 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2012010197 2012-01-20
JP2012010197 2012-01-20
JP2012046993 2012-03-02
JP2012046993 2012-03-02
PCT/JP2013/050822 WO2013108843A1 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体
JP2013503317A JP6165626B2 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JPWO2013108843A1 JPWO2013108843A1 (ja) 2015-05-11
JP6165626B2 true JP6165626B2 (ja) 2017-07-19

Family

ID=48799266

Family Applications (1)

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JP2013503317A Active JP6165626B2 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体

Country Status (4)

Country Link
JP (1) JP6165626B2 (zh)
KR (1) KR101953938B1 (zh)
CN (1) CN103765527B (zh)
WO (1) WO2013108843A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108842A1 (ja) * 2012-01-20 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6696721B2 (ja) * 2013-09-09 2020-05-20 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体
JP6507552B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
WO2016068165A1 (ja) * 2014-10-29 2016-05-06 デクセリアルズ株式会社 導電材料
KR102410478B1 (ko) 2015-09-14 2022-06-17 삼성디스플레이 주식회사 표시 장치
CN111508635B (zh) * 2016-02-08 2021-12-28 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
US10510821B2 (en) 2016-06-10 2019-12-17 Innovation Counsel Llp Display device
WO2021206201A1 (ko) * 2020-04-10 2021-10-14 주식회사 씨앤씨머티리얼즈 니켈 금속층을 포함하는 전도성 폴리머 입자
WO2021206202A1 (ko) * 2020-04-10 2021-10-14 주식회사 씨앤씨머티리얼즈 은 금속층을 포함하는 전도성 폴리머 입자

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101131229B1 (ko) * 2004-01-30 2012-03-28 세키스이가가쿠 고교가부시키가이샤 도전성 미립자 및 이방성 도전 재료
JP4860163B2 (ja) * 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
KR20110019392A (ko) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 회로 접속 재료 및 회로 접속 구조체
JP4991666B2 (ja) 2008-09-19 2012-08-01 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP4957838B2 (ja) * 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
KR101704856B1 (ko) * 2010-03-08 2017-02-08 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 이방성 도전 재료 및 접속 구조체
JP2012004033A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5703836B2 (ja) * 2011-02-25 2015-04-22 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
WO2013108842A1 (ja) * 2012-01-20 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
CN103765527A (zh) 2014-04-30
WO2013108843A1 (ja) 2013-07-25
KR20140117340A (ko) 2014-10-07
CN103765527B (zh) 2017-12-19
KR101953938B1 (ko) 2019-03-04
JPWO2013108843A1 (ja) 2015-05-11

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