KR101943239B1 - Gantry device and control method - Google Patents

Gantry device and control method Download PDF

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KR101943239B1
KR101943239B1 KR1020177010971A KR20177010971A KR101943239B1 KR 101943239 B1 KR101943239 B1 KR 101943239B1 KR 1020177010971 A KR1020177010971 A KR 1020177010971A KR 20177010971 A KR20177010971 A KR 20177010971A KR 101943239 B1 KR101943239 B1 KR 101943239B1
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sensing element
distance
scanning galvanometer
substrate
gantry
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KR1020177010971A
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Korean (ko)
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KR20170091584A (en
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천양 한
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상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Abstract

A gantry apparatus and a control method are disclosed. The gantry device comprises: a support device; A gantry body (8) arranged on said support device via a gantry coupling mechanism; Sensing elements 2 and 50 and a scanning galvanometer 4 all disposed on the gantry body 8 and a sensing element 3 arranged on the supporting device 4 and a scanning galvanometer 4 and a gantry body 8 And a vertical agitator 6 configured to support the vertical movement of the scanning galvanometer 4. The combination of the gantry body 8 and the gantry coupling mechanism allows the gantry body to move horizontally and vertically The predetermined vertical value of the sensing element 5 for measuring the height of the scanning galvanometer 4 is determined based on the measurement results of the sensing elements 2, 3 and 5, and the scanning galvanometer 4 Is moved, and the optical focus of the scanning galvanometer 4 is adjusted to the target point.

Description

[0001] GANTRY DEVICE AND CONTROL METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical apparatus and a control method, and more particularly, to a gantry apparatus and a control method which are vertically movable.

With the development of flat panel display technology, increasingly larger substrates in lithographic equipment and measuring equipment for flat panel displays are placed on wafer stages, increasing the difficulty of vertical or horizontal movement of wafer stages and increasing the length of travel paths To be limited by substrate sizes. When compared to wafer stages, gantries have the advantage of a simple structure and a longer travel path. For this reason, the advantages of replacing wafer stages with gantries are becoming more and more pronounced.

Existing gantries are all horizontally controlled, and up to now there are no vertically controlled gantries. Typically, the vertical control for the lithography tool is achieved by moving the area measured through the closed-loop control made possible by the focusing and leveling sensors to an optimum focal plane. The control is performed in such a manner that the servo operation is performed until the preset height and tilt values of the focusing and leveling sensors are provided and the height and tilt values measured by the focusing and leveling sensors match the predefined values To position the region to be measured at the optimal focal plane. Figure 1 shows a vertical control mechanism according to the prior art, with the substrate being positioned on the wafer stage, the controller transmits a control command to the wafer stage actuator (motor), which, in response to the command, The focusing and leveling sensors measure the current position of the top surface of the substrate and negatively feed the current position to the controller to form a control loop. The controller then transmits an additional control command to the motor based on the feedback. This step is repeated until the substrate on the wafer stage is located in the optimal focus plane, i.e., the target plane.

This vertical control, however, made possible by a closed-loop control mechanism that requires the involvement of focusing and leveling sensors as well as feedback mechanisms, is time-consuming and the closed-loop control mechanism based on focusing and leveling sensors is relatively complex.

It is an object of the present invention to provide a gantry apparatus and control methods. The gantry device includes a gantry and a gantry guide rail, and is movable both horizontally and vertically. This allows the substrate to be adjusted to the optimal focus plane by closed-loop control without including focusing and leveling sensors, thereby reducing control difficulties and saving production costs.

The above object can be achieved by a gantry apparatus according to the present invention.

In the gantry device,

A support device for carrying a substrate;

A gantry body and a gantry coupling mechanism, the gantry body being arranged on the support device through the gantry coupling mechanism;

A vertical actuator disposed on the gantry body and movable in a vertical direction with respect to the gantry body;

A scanning galvanometer disposed on the vertical actuator;

A first sensing element disposed on the support device, the first sensing element detecting an optimum focal plane for the scanning galvanometer system by using a reference surface of the first sensing element detect;

A second sensing element disposed on the gantry body, the second sensing element configured to measure a first distance from a surface of the substrate to the reference surface of the first sensing element; And

A third sensing element disposed on the vertical actuator; and the third sensing element receives the first sensing element from the scanning galvanometer system on the reference surface of the first sensing element for detecting the best focus plane for the scanning galvanometer system, A second distance to the reference surface of the element;

Lt; / RTI >

Wherein the vertical actuator is configured such that the vertical distance between the scanning galvanometer and the surface of the substrate is equal to the sum of the first distance and the second distance, As shown in FIG.

In addition, the gantry coupling mechanism may include a gantry guide rail.

The gantry body may further include a first horizontal crossbeam and a second horizontal crossbeam, wherein the first horizontal crossbeam and the second horizontal crossbeam cross each other at right angles in a horizontal plane, And transports the scanning galvanometer system horizontally along the gantry guide rails.

Also, the third sensing element may be a profilometer.

The first sensing element may be an aberration sensor, a displacement sensor, or a leveling sensor.

Also, the second sensing element may be a grating scale, a linear variable differential transformer (LVDT), or an interferometer.

The support device may further comprise a wafer stage, a marble, a damper, and a ground base, wherein the substrate is disposed on the wafer stage, the wafer stage is disposed on the marble, Base.

The gantry device is also used for laser sealing of a glass substrate, wherein the substrate comprises an upper glass substrate and a lower glass substrate, wherein the surface of the substrate is a lower surface of the upper glass substrate to be.

Further, the gantry apparatus is used in an exposure apparatus, and the surface of the substrate is the top surface of the substrate.

The above object can be achieved by a gantry apparatus control method for using the above-mentioned gantry apparatus.

The method comprises:

1) moving the second sensing element over the first sensing element and measuring a first distance (Z_BF) from the second sensing element to the reference surface of the first sensing element by the second sensing element step;

2) moving the scanning galvanometer system over the first sensing element and causing the vertical actuator to move the vertical of the scanning galvanometer system until the reference surface of the first sensing element detects the optimal focal plane of the scanning galvanometer system. Detecting a second distance (Z_galBFref) from the zero plane of the third sensing element to the reference surface of the first sensing element by the third sensing element;

3) moving the second sensing element over the substrate and detecting a third distance (Z_mess) from the second sensing element to the surface of the substrate by the second sensing element;

4) calculating a fourth distance (Z_s) from the zero plane of the third sensing element to the surface of the substrate when the best focus plane of the scanning galvanometer system is adjusted to the surface of the substrate; The relationship between the fourth distance and the first distance, the second distance and the third distance is

Figure 112017039553894-pct00001
Same as; And

5) moving the best focus plane for the scanning galvanometer system to the surface of the substrate based on the fourth distance;

.

Also, in step 5), until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance (Z_s), the third sensing element (servo closed-loop control), and the vertical actuator drives the third sensing element and the scanning galvanometer to move vertically in synchronization with each other.

This object can be achieved by another gantry device control method for using the aforementioned gantry device.

The method comprises:

1) move the second sensing element directly above the first sensing element and measure a first distance (Z_BF) from the second sensing element to the reference surface of the first sensing element by the second sensing element ;

2) moving the scanning galvanometer system just above the first sensing element, until the reference surface of the first sensing element detects the optimal focal plane of the scanning galvanometer system, Adjusting a vertical position and detecting a second distance (Z_galBFref) from the zero plane of the third sensing element to the reference plane of the first sensing element by the third sensing element;

3) onto the substrate and to move said second sensing element, wherein the distance to a plurality of leveling points by the second sensing element on said surface of said substrate from the second sensing element (z 1, z 2, ..., z n );

4) on the basis of (the horizontal position of z 1, z 2, ..., z n) and the plurality of leveling points ((x1, y1), the distances, (x2, y2), ( x3, y3)), Calculating an average distance pz and slope coefficients pwx, pwy from the second sensing element to the surface of the substrate, wherein the calculation is: n is an integer, pwx and pwy are slope coefficients;

Figure 112017039553894-pct00002

5) Based on the average distance pz from the second sensing element to the surface of the substrate, the slope coefficients pwx, pwy and the preset horizontal position (x_aim, y_aim) of the target point, Calculating a height z_aim of the target point;

Figure 112017039553894-pct00003

6) calculating a fourth distance (Z_s) from the zero plane of the third sensing element to the surface of the substrate when the best focus plane of the scanning galvanometer system is adjusted to the surface of the substrate; A fourth distance, and a distance between the first distance, the second distance and the third distance as follows:

Figure 112017039553894-pct00004

And

7) moving the scanning galvanometer system just above the target point and moving the optimal focus plane for the scanning galvanometer system to a plane in which the target point is located along the fourth distance;

.

The third sensing element also performs servo closed-loop control until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance in step 7) The vertical actuator drives the third sensing element and the scanning galvanometer to move vertically to a synchronized state.

In addition, the number of the plurality of leveling points may be three.

Compared with the prior art, the present invention has the following advantages.

The present invention uses a gantry body and a gantry coupling mechanism as well as a wafer stage and the gantry body is coupled to the gantry coupling mechanism to move horizontally and vertically And enables a variety of additional options and applications; Further, by moving the scanning galvanometer system to closed loop control based on a predetermined vertical value of the sensing element, the optical focus of the scanning galvanometer system can be adjusted to the target point, and the first sensing element, the second sensing element, The height of the scanning galvanometer can be measured based on the measurement results of the third sensing element, thereby reducing the control difficulty and saving the production cost.

Figure 1 shows a vertical control mechanism according to the prior art.
2 is a schematic structural view of a vertical control apparatus for a gantry apparatus according to a first embodiment of the present invention.
3 is a schematic structural view of a system for laser sealing a glass package according to the first embodiment of the present invention.
4 shows a vertical control mechanism according to the first embodiment of the present invention.
5 is a view schematically showing a height adjustment for a scanning galvanometer according to the first embodiment of the present invention.
6A to 6C schematically illustrate a process for vertical control of a gantry device according to the present invention.
7 is a view schematically showing a height adjustment for a scanning galvanometer according to a second embodiment of the present invention.
In the drawings, reference numeral 1 denotes a light source; 2 is a first sensing element; 3 is a third sensing element; 4 is a scanning galvanometer; 5 is a second sensing element; 6 is a vertical actuator; 7 is a glass substrate; 7a is an upper glass substrate; 7b is a lower glass substrate; 8 is a gantry body; 9 is a gantry guide rail; 10 is a wafer stage; 11 is marble; 12 is a damper; 13 is ground-based; 14 is a zero plane for the second sensing element; 15 is a zero plane for the first sensing element; 16 is the top plane of the third sensing element; 17 is a top surface of an upper glass substrate; 18 is a lower surface of the upper glass substrate; 19 is a top surface of the lower glass substrate; 20 is a horizontal zero position; 21 is a first leveling point; 22 is a target point; 23 is a second leveling point; 24 is a third leveling point; A is solder; B means OLED die.

Specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features and advantages of the present invention become more apparent from the following detailed description and claims. It should be noted that the attached drawings are not necessarily to scale and are provided in a very simple form, and that the drawings are used for the purpose of illustrating the embodiments clearly and conveniently.

Example 1

2 is a schematic view of a structure of a vertical control device for a gantry device according to a first embodiment of the present invention. As shown in the drawings, the gantry apparatus includes the following.

A glass substrate or a support device for transporting a substrate which is a sapphire substrate, in this embodiment a glass substrate 7;

The gantry body 8 and the gantry coupling mechanism, the gantry body 8, are disposed on the support device via a gantry coupling mechanism;

The scanning galvanometer 4 and the scanning galvanometer 4 arranged on the gantry body 8 enable a light beam to perform a scan along a predetermined trajectory and a three degree of freedom of movement degree of freedom of movement (X direction, Y direction and Z direction), the three degrees of freedom are configured with one vertical movement degree of freedom (Z direction) and two horizontal movement degrees of freedom (X direction and Y direction);

The light source 1 configured to emit a light beam to the scanning galvanometer 4, the scanning galvanometer 4 then causes the light beam to scan along a predetermined path, and the light source 1, in this embodiment, in the form of a laser;

The third sensing element 3 and the third sensing element 3 arranged on the support device are connected to the light source 3 by means of a scanning galvanometer 4 and a light beam formed by a light beam guided towards the third sensing element 3 Configured to measure the size and intensity of the light spot;

The first sensing element 2 and the first sensing element 2 are arranged on the gantry body 8 and the first sensing element 2 has a height of the surface of the substrate 7 and a height of the third sensing element 3. [ And the height of the third sensing element 3 is used to determine the optimal focus position for the scanning galvanometer 4, together with the size and intensity of the light spot;

A second sensing element (5), a second sensing element (5) are arranged on the gantry body (8) and are configured to measure the height of the scanning galvanometer (4); And

The vertical actuator 6 and the vertical actuator 6 are disposed between the scanning galvanometer 4 and the gantry body 8 and are configured to enable vertical movement of the galvanometer 4 so that the scanning galvanometer 4 Optimal focus is adjusted to the target point;

The gantry coupling mechanism comprises a gantry guide rail 9, wherein the gantry body 8 includes a first horizontal cross beam extending in the X direction and a second horizontal cross beam extending in the Y direction. The first and second horizontal cross beams cross each other vertically in the horizontal plane and carry the scanning galvanometer system 4 horizontally along the gantry guide rail 9. [ The first sensing element 2 may be referred to as a non-contact height sensor, the second sensing element 5 may be referred to as a scanning galvanometer height sensor, and the third sensing element 3 may be referred to as a roughness meter. The first sensing element 2 and the second sensing element 5 may be comprised of vertical meters and the first sensing element 2 may be at least Z of the target surface of the measured object without touching the object, - an aberration sensor, a displacement sensor or a focusing and leveling sensor capable of providing directional data. The second sensing element 5 measures the height of the scanning galvanometer 4 until the optimal focus of the scanning galvanometer 4 is moved to the target point and moves the scanning galvanometer 4 together with the vertical actuator 5 Loop control is performed. The third sensing element 3 is configured to measure the magnitude and intensity of the light spot formed by the laser light beam emerging from the scanning galvanometer 4. [ The supporting device includes a wafer stage 10, a marble 11, a damper 12, and a grounding base 13. [ The glass substrate 7 is disposed on the wafer stage 10 for supporting only the glass substrate 7 without need to move horizontally or vertically. Each of the roughing surface 3, the wafer stage 10 and the gantry guide rail 9 is connected to the ground base 13 via a damper 12. The laser is arranged on the ground base 13 and the laser is configured to emanate a laser light beam passing through the scanning galvanometer system 4 and the laser is irradiated onto the glass substrates 7, ).

The gantry device can be used to laser-seal the glass substrate 7. As shown in Fig. 3, the glass substrate 7 includes an upper glass substrate 7a and a lower glass substrate 7b. During laser sealing of the substrate 7, the light spot is aligned to cover the sealing solder A, i. E., To the bottom surface 18 of the upper glass substrate 7a. The propagation direction of the laser light beam is controlled by the scanning galvanometer 4 so that the light spot can be rapidly and periodically heated to a temperature higher than the softening point, the sealing line is scanned. Then, while the substrates adhere firmly together by the solder A disposed between the upper and lower glass substrates, the heating is not continued and the upper and lower glass substrates are cooled. As a result, a hermetic package is formed in which the OLED die B is encapsulated, as shown in Fig. In this case, the height of the surface of the substrate measured by the first sensing element 2 is the height of the bottom surface 18 of the upper glass substrate.

Additionally, the gantry device may also be used in an exposure device with handles, typically a single substrate. In this case, the height of the surface of the substrate measured by the first sensing element 2 is the height of the top surface of the substrate.

4 schematically shows a vertical control mechanism according to the first embodiment of the present invention, in which the controller performs a control command, and the vertical control actuator 6 (motor) controls the position of the scanning galvanometer 4 Displace and form a control loop while negatively feeding the current position to the controller. The preset vertical value is calculated using mathematical models established from the data obtained from the measurements performed by the first sensing element 2, the second sensing element 5 and the third sensing element 3 do. The mathematical models include a first mathematical model and a second mathematical model. The difference between the preset vertical value and the current position is input to the controller, and the current position is controlled to approach and finally arrive at a predetermined vertical value, that is, the difference becomes zero.

5 is a view schematically showing the height adjustment of the scanning galvanometer according to the first embodiment of the present invention. The optical focus of the scanning galvanometer 4 is adjusted to the target point by field-wise measurement and focusing. The vertical control is performed in the manner described below.

1. As shown in FIG. 6A, the first sensing element 2 is moved just above the third sensing element 3, and then the first sensing element 2 is moved to the top surface 16 of the third sensing element 3 Measure the height (Z_BF) of the sensing element (2).

6b, the scanning galvanometer 4 is moved just above the third sensing element 3 and after the light beam has passed the scanning galvanometer 4 from the light source 1, the third sensing element 3). The vertical actuator 6 adjusts the vertical position of the scanning galvanometer 4 until the light spot detected by the third sensing element 3 has both the maximum magnitude and the maximum intensity (Meaning that the top surface 16 of the third sensing element 3 is aligned with the optimal focus position for the scanning galvanometer 4). The distance from the scanning galvanometer 4 to the top surface 16 of the third sensing element 3 at this time is the optimum focal length for the scanning galvanometer 4. That is, the point on the top surface 16 of the third sensing element 3 is at the optimum focus for the scanning galvanometer 4. [ The vertical distance from the scanning galvanometer system 4 to the top surface 16 of the third sensing element 3 can be indirectly controlled by the scanning galvanometer 4 and the second sensing element 5, Can be expressed by the vertical distance Z_galBFref from the zero plane 14 of the second sensing element 5 to the top surface 16 of the third sensing element 3. While the vertical position of the scanning galvanometer 4 is adjusted by the vertical actuator 6 without any change in both the vertical positions of the first sensing element 2 and the third sensing element 3, The scanning galvanometer 5 and the scanning galvanometer 4 can move synchronously.

3. The first sensing element 2 moves directly above the substrate 7 and measures the height Z_mes of the first sensing element 2 relative to the target point on the substrate surface, I.e. the height of the measured position (i.e., target point 22) on the lower surface 18 of the upper glass substrate. Target point 22 is not shown in FIG.

4. When the optical focal point of the scanning galvanometer system 4 is adjusted to the target point 22, the zero point of the zero plane 14 of the second sensing element 5 with respect to the plane 18 on which the target point 22 is located, The height Z_s can be calculated by the following equation:

Figure 112017039553894-pct00005
(One)

Equation (1) represents the first mathematical model described above.

5. As shown in FIG. 6C, the scanning galvanometer 4 is moved directly above the target point 22, and the optical focus of the scanning galvanometer 4 is moved to the target point 22 based on a preset height. Servo closed loop control is performed on the basis of the second sensing element 5 so that the vertical actuator 6 drives the second sensing element 5 and the scanning galvanometer 4 and the second sensing element 5, The second sensing element 5 and the scanning galvanometer 4 move synchronously and vertically until the vertical distance from the zero plane 14 to the target point 22 is equal to the preset height Z_s. As a result, the target point 22 is located at the optical focus of the scanning galvanometer 4. [

Example 2

Structural schematics of the vertical control device and the vertical control mechanism for the gantry device according to the second embodiment are shown in FIGS. 2 and 4, respectively. The gantry apparatus of FIG. 2 and the vertical control mechanism of FIG. 4 are the same as those described in the first embodiment, and therefore the description thereof is omitted here.

7 schematically shows the height adjustment of the scanning galvanometer according to the second embodiment of the present invention. During use of the glass substrate, there is generally a tilt in the bottom surface of the upper glass substrate. Unlike the first embodiment in which the tilt is not taken into consideration, in this embodiment, the influence of the bottom surface inclination of the upper glass substrate on the predetermined height is evaluated. The optical focal point of the scanning galvanometer 4 is adjusted to the target point by field unit G and focusing. The vertical control is performed in the manner described below.

1. As shown in FIG. 6A, the first sensing element 2 is moved just above the third sensing element 3, and then the first sensing element 2 is moved to the top surface 16 of the third sensing element 3 Measure the height (Z_BF) of the sensing element (2).

6b, the scanning galvanometer 4 is moved just above the third sensing element 3 and after the light beam has passed the scanning galvanometer 4 from the light source 1, the third sensing element 3). The vertical actuator 6 adjusts the vertical position of the scanning galvanometer 4 until the light spot detected by the third sensing element 3 has both the maximum magnitude and the maximum intensity (Meaning that the top surface 16 of the third sensing element 3 is aligned with the optimal focus position for the scanning galvanometer 4). The distance from the scanning galvanometer 4 to the top surface 16 of the third sensing element 3 at this time is the optimum focal length for the scanning galvanometer 4. That is, the point on the top surface 16 of the third sensing element 3 is at the optimum focus for the scanning galvanometer 4. [ The vertical distance from the scanning galvanometer system 4 to the top surface 16 of the third sensing element 3 can be indirectly controlled by the scanning galvanometer 4 and the second sensing element 5, Can be expressed by the vertical distance Z_galBFref from the zero plane 14 of the second sensing element 5 to the top surface 16 of the third sensing element 3. While the vertical position of the scanning galvanometer 4 is adjusted by the vertical actuator 6 without any change in both the vertical positions of the first sensing element 2 and the third sensing element 3, The scanning galvanometer 5 and the scanning galvanometer 4 can move synchronously.

3. The first sensing element 2 is moved directly above the substrate 7 and the heights z 1 , z 2 , ..., z n for multiple leveling points on the substrate surface, as shown in Figure 6c , n is an integer). In this embodiment, the first sensing element 2 is arranged on the lower surface 18 of the upper glass substrate of the substrate 7, which is supported on the wafer stage 10, (z 1), the second height for the leveling point (23), (z 2), the third measures the height (z 3) of the leveling point 24.

4. The overall height and slope of the upper glass substrate is calculated based on the heights of the three leveling points. The calculation of height and slope requires setting of three unknowns defined herein as pz, pwx and pwy. The lower surface 18 of the upper glass substrate can then be described using the following equation:

Figure 112017039553894-pct00006
(2)

The positions of the first leveling point 21, the second leveling point 23 and the third leveling point 24 with respect to the horizontal zero position are (x1, y1), (x2, y2) and (x3 , substituting the above position with a defined as y3), and the heights of the three leveling point for the sensing element (2) (z 1, z 2, z 3) in equation (2) can be obtained, and then :

Figure 112017039553894-pct00007

Figure 112017039553894-pct00008

Figure 112017039553894-pct00009
(3)

The unknowns pz, pwz and pwy can be obtained from equation (3).

5. The height of the target point 22 is calculated. Defining the horizontal position of the target point 22 as (x_aim, y_aim), defining the height of the target point 22 as z_aim, and assigning it to equation (2), the following can be obtained.

Figure 112017039553894-pct00010
(4)

z_aim can be obtained from equation (4).

6. When the optical focus of the scanning galvanometer system 4 is adjusted to the target point 22, a vertical advance of the zero plane 14 of the second sensing element 5 relative to the plane 18 on which the target point 22 is located The set height Z_s can be calculated by the following equation:

Figure 112017039553894-pct00011
(5)

Equations 2, 3, 4 and 5 represent the second mathematical model described above.

7, the scanning galvanometer 4 is moved just above the target point 22 and the optical focus of the scanning galvanometer 4 is moved to the target point 22 based on the preset height. Servo closed loop control is performed on the basis of the second sensing element 5 so that the vertical actuator 6 drives the second sensing element 5 and the scanning galvanometer 4 and the second sensing element 5, The second sensing element 5 and the scanning galvanometer 4 move synchronously and vertically until the vertical distance from the zero plane 14 to the target point 22 is equal to the preset height Z_s. As a result, the target point 22 is located at the optical focus of the scanning galvanometer 4. [

In summary, the control apparatus and methods for the gantry apparatus according to the above-described embodiments of the present invention use the gantry body 8 and the gantry coupling mechanism as well as the wafer stage. The gantry body 8 is coupled with the gantry coupling mechanism and thus is movable horizontally and vertically. This enables additional options and diversification of applications. The optical focal point of the scanning galvanometer 2 can also be determined based on the preset vertical values of the scanning galvanometer height sensor 5 calculated from the measurements of the scanning galvanometer height sensor 5 and the non- The target point 22 can be adjusted by moving the scanning galvanometer 4 using the scanning galvanometer 4. This can reduce control difficulties and reduce production costs.

The foregoing description merely sets forth some preferred embodiments of the invention and does not in any way limit its scope. All equivalents and modifications by those skilled in the art to the subject matter disclosed and the details disclosed herein without departing from the scope of the present invention are within the scope of the present invention and are still within the scope of the present invention.

Claims (14)

In a gantry device,
A support device for transporting the substrate;
A gantry body and a gantry coupling mechanism, the gantry body being arranged on the support device through the gantry coupling mechanism;
A vertical actuator disposed on the gantry body and movable in a vertical direction with respect to the gantry body;
A scanning galvanometer disposed on the vertical actuator;
A first sensing element disposed on the support device, the first sensing element configured to detect an optimal focus plane for the scanning galvanometer system by using a reference surface of the first sensing element;
A second sensing element disposed on the gantry body, the second sensing element configured to measure a first distance from a surface of the substrate to a reference surface of the first sensing element; And
A third sensing element disposed on the vertical actuator; and the third sensing element receives the first sensing element from the scanning galvanometer system on the reference surface of the first sensing element for detecting the best focus plane for the scanning galvanometer system, A second distance to the surface of the element;
Lt; / RTI >
Wherein the vertical actuator is configured to detect a vertical position of the scanning galvanometer based on the first distance and the second distance such that a vertical distance between the scanning galvanometer and the surface of the substrate is equal to a sum of the first distance and the second distance, Of the gantry device.
The method according to claim 1,
Wherein the gantry coupling mechanism comprises a gantry guide rail.
3. The method of claim 2,
Wherein the gantry body includes a first horizontal cross beam and a second horizontal cross beam,
Wherein the first horizontal crossbeam and the second horizontal crossbeam intersect at right angles in a horizontal plane and carry the scanning galvanometer system horizontally along the gantry guide rails.
The method according to claim 1,
Wherein the first sensing element is a rough surface.
The method according to claim 1,
Wherein the second sensing element is an aberration sensor, a displacement sensor or a focusing and leveling sensor.
The method according to claim 1,
Wherein the third sensing element is a lattice scale, a linear variable displacement transducer or an interferometer.
The method according to claim 1,
Wherein the support device comprises a wafer stage, a marble, a damper and a ground base,
Wherein the substrate is disposed on the wafer stage,
Wherein the wafer stage is disposed on the marble,
And the marbles are connected to the ground base through the damper.
The method according to claim 1,
The gantry device is used for laser sealing of a glass substrate,
Wherein the substrate comprises an upper glass substrate and a lower glass substrate,
Wherein the surface of the substrate is a lower surface of the upper glass substrate.
The method according to claim 1,
The gantry apparatus is used in an exposure apparatus,
Wherein the surface of the substrate is the top surface of the substrate.
A gantry apparatus control method for use with the gantry apparatus according to claim 1,
1) moving the second sensing element over the first sensing element and measuring a first distance (Z_BF) from the second sensing element to the reference surface of the first sensing element by the second sensing element step;
2) moving the scanning galvanometer system over the first sensing element and causing the vertical actuator to move the vertical of the scanning galvanometer system until the reference surface of the first sensing element detects the optimal focal plane of the scanning galvanometer system. Detecting a second distance (Z_galBFref) from the zero plane of the third sensing element to the reference surface of the first sensing element by the third sensing element;
3) moving the second sensing element over the substrate and detecting a third distance (Z_mes) from the second sensing element to the surface of the substrate by the second sensing element
4) calculating a fourth distance (Z_s) from the zero plane of the third sensing element to the surface of the substrate when the best focus plane of the scanning galvanometer system is adjusted to the surface of the substrate; The relationship between the fourth distance and the first distance, the second distance and the third distance is
Figure 112017039553894-pct00012
Same as; And
5) moving the best focus plane for the scanning galvanometer system to the surface of the substrate based on the fourth distance;
And the gantry device control method.
11. The method of claim 10,
In step 5), until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance Z_s,
Wherein the third sensing element performs servo closed loop control such that the vertical actuator drives the third sensing element and the scanning galvanometer to move vertically in a synchronized state.
A gantry apparatus control method for use with the gantry apparatus according to claim 1,
1) move the second sensing element directly above the first sensing element and measure a first distance (Z_BF) from the second sensing element to the reference surface of the first sensing element by the second sensing element ;
2) moving the scanning galvanometer system just above the first sensing element, until the reference surface of the first sensing element detects the optimal focal plane of the scanning galvanometer system, Adjusting a vertical position and detecting a second distance (Z_galBFref) from the zero plane of the third sensing element to the reference surface of the first sensing element by the third sensing element;
3) onto the substrate and to move said second sensing element, wherein the distance to a plurality of leveling points by the second sensing element on said surface of said substrate from the second sensing element (z 1, z 2, ..., z n );
4) on the basis of (the horizontal position of z 1, z 2, ..., z n) and the plurality of leveling points ((x1, y1), the distances, (x2, y2), ( x3, y3)), Calculating an average distance pz and slope coefficients pwx, pwy from the second sensing element to the surface of the substrate, wherein the calculation is: n is an integer, pwx and pwy are slope coefficients;
Figure 112017039553894-pct00013

5) Based on the average distance pz from the second sensing element to the surface of the substrate, the slope coefficients pwx, pwy and the preset horizontal position (x_aim, y_aim) of the target point, Calculating a height (z_aim) of the point, the calculation is as follows;
Figure 112017039553894-pct00014

6) calculating a fourth distance (Z_s) from the zero plane of the third sensing element to the surface of the substrate when the best focus plane of the scanning galvanometer system is adjusted to the surface of the substrate; A fourth distance, and a distance between the first distance, the second distance and the third distance as follows:
Figure 112017039553894-pct00015

And
7) moving the scanning galvanometer system just above the target point and moving the optimal focus plane for the scanning galvanometer system to a plane in which the target point is located along the fourth distance;
And the gantry device control method.
13. The method of claim 12,
In step 7), until the vertical distance from the zero plane of the third sensing element to the surface of the substrate is equal to the fourth distance Z_s,
Wherein the third sensing element performs servo closed loop control such that the vertical actuator drives the third sensing element and the scanning galvanometer to move vertically in a synchronized state.
13. The method of claim 12,
Wherein the number of the plurality of leveling points is three.
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