KR101901041B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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Publication number
KR101901041B1
KR101901041B1 KR1020167027296A KR20167027296A KR101901041B1 KR 101901041 B1 KR101901041 B1 KR 101901041B1 KR 1020167027296 A KR1020167027296 A KR 1020167027296A KR 20167027296 A KR20167027296 A KR 20167027296A KR 101901041 B1 KR101901041 B1 KR 101901041B1
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South Korea
Prior art keywords
substrate
holding
mold
adsorption
resin
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Korean (ko)
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KR20160130802A (ko
Inventor
병진 최
안슈만 체랄라
젱마오 예
시아오밍 루
강 루오
노부토 가와하라
요시카즈 미야지마
Original Assignee
캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H01L21/027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205—Particular pressure exerting means for making definite articles
    • B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3652—Elastic moulds or mould parts, e.g. cores or inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5866—Measuring, controlling or regulating ejection of moulded articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020167027296A 2014-04-09 2015-04-07 임프린트 장치 및 물품 제조 방법 Active KR101901041B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-079980 2014-04-09
JP2014079980A JP6333031B2 (ja) 2014-04-09 2014-04-09 インプリント装置および物品の製造方法
PCT/JP2015/001970 WO2015155988A1 (en) 2014-04-09 2015-04-07 Imprint apparatus and article manufacturing method

Publications (2)

Publication Number Publication Date
KR20160130802A KR20160130802A (ko) 2016-11-14
KR101901041B1 true KR101901041B1 (ko) 2018-09-20

Family

ID=54287573

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167027296A Active KR101901041B1 (ko) 2014-04-09 2015-04-07 임프린트 장치 및 물품 제조 방법

Country Status (6)

Country Link
US (1) US10335984B2 (enExample)
JP (1) JP6333031B2 (enExample)
KR (1) KR101901041B1 (enExample)
CN (1) CN106165064A (enExample)
SG (1) SG11201607890SA (enExample)
WO (1) WO2015155988A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
US11104057B2 (en) 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
US10654216B2 (en) * 2016-03-30 2020-05-19 Canon Kabushiki Kaisha System and methods for nanoimprint lithography
JP6762853B2 (ja) * 2016-11-11 2020-09-30 キヤノン株式会社 装置、方法、及び物品製造方法
US20190259648A1 (en) * 2018-02-20 2019-08-22 Applied Materials, Inc. Patterned vacuum chuck for double-sided processing
JP7132739B2 (ja) * 2018-04-06 2022-09-07 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7033994B2 (ja) * 2018-04-11 2022-03-11 キヤノン株式会社 成形装置及び物品の製造方法
JP7218114B2 (ja) * 2018-07-12 2023-02-06 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP7204457B2 (ja) * 2018-12-06 2023-01-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
DE102019128667B3 (de) * 2019-10-23 2020-09-10 Semikron Elektronik Gmbh & Co. Kg Sinterpresse und Drucksinterverfahren zur Herstellung einer Sinterverbindung mittels der Sinterpresse
CN115648532B (zh) * 2022-10-31 2025-11-25 长电科技管理有限公司 半导体封装注塑模具、注塑装置及半导体封装注塑方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120274006A1 (en) 2011-04-28 2012-11-01 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method for producing device
US20130056904A1 (en) 2011-09-07 2013-03-07 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method using same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置
JP3332425B2 (ja) * 1992-11-10 2002-10-07 キヤノン株式会社 基板保持装置、並びにこれを用いた露光装置と半導体デバイス製造方法
JP4490539B2 (ja) * 2000-02-15 2010-06-30 東京エレクトロン株式会社 ウエハチャック及び半導体ウエハの検査方法
US6746318B2 (en) * 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
TWI302228B (en) * 2002-11-13 2008-10-21 Molecular Imprints Inc A chucking system and method for modulating shapes of substrates
SG116533A1 (en) * 2003-03-26 2005-11-28 Toshiba Kk Semiconductor manufacturing apparatus and method of manufacturing semiconductor device.
JP3956135B2 (ja) * 2003-03-28 2007-08-08 ブラザー工業株式会社 画像形成装置及びそれに使用する吸引式用紙受け台
JP2005024807A (ja) * 2003-07-01 2005-01-27 Hitachi Ltd 投射型映像表示装置
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
WO2006083518A2 (en) 2005-01-31 2006-08-10 Molecular Imprints, Inc. Chucking system for nano-manufacturing
EP2007566A4 (en) * 2006-04-03 2010-10-13 Molecular Imprints Inc ASSEMBLY SYSTEM WITH AN ARRANGEMENT FROM PRINT BOXES
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
DE102006042026B4 (de) * 2006-09-07 2016-08-04 Infineon Technologies Ag Vorrichtung zum Halten eines Substrats und Verfahren zur Behandlung eines Substrats
NL2003380A (en) * 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
JP2010269580A (ja) * 2009-05-25 2010-12-02 Canon Inc インプリント装置及び物品の製造方法
JP5810517B2 (ja) * 2010-12-02 2015-11-11 富士電機株式会社 吸着装置および吸着方法
SG185838A1 (en) * 2011-05-12 2012-12-28 Semiconductor Technologies And Instr Pte Ltd A component pane handler configured to handle component panes of multiple sizes
CN106941084B (zh) * 2011-08-12 2020-05-19 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的装置和方法
JP6021606B2 (ja) 2011-11-28 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法、およびインプリント方法
CN102866582B (zh) * 2012-09-29 2014-09-10 兰红波 一种用于高亮度led图形化的纳米压印装置和方法
JP5521066B1 (ja) * 2013-01-25 2014-06-11 東京エレクトロン株式会社 接合装置及び接合システム
JP6306830B2 (ja) * 2013-06-26 2018-04-04 キヤノン株式会社 インプリント装置、および物品の製造方法
KR102294035B1 (ko) * 2013-11-08 2021-08-27 캐논 나노테크놀로지즈 인코퍼레이티드 향상된 오버레이 보정을 위한 저접촉 임프린트 리소그래피 템플레이트 척킹 시스템
CN105917459A (zh) * 2014-02-07 2016-08-31 应用材料公司 用于dsa上弯曲晶片的夹持能力

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120274006A1 (en) 2011-04-28 2012-11-01 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method for producing device
US20130056904A1 (en) 2011-09-07 2013-03-07 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method using same

Also Published As

Publication number Publication date
JP6333031B2 (ja) 2018-05-30
JP2015201556A (ja) 2015-11-12
WO2015155988A1 (en) 2015-10-15
SG11201607890SA (en) 2016-10-28
CN106165064A (zh) 2016-11-23
US10335984B2 (en) 2019-07-02
US20170028598A1 (en) 2017-02-02
KR20160130802A (ko) 2016-11-14

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