KR101895819B1 - 취성 기판의 분단 방법 및 스크라이브 장치 - Google Patents

취성 기판의 분단 방법 및 스크라이브 장치 Download PDF

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Publication number
KR101895819B1
KR101895819B1 KR1020167036171A KR20167036171A KR101895819B1 KR 101895819 B1 KR101895819 B1 KR 101895819B1 KR 1020167036171 A KR1020167036171 A KR 1020167036171A KR 20167036171 A KR20167036171 A KR 20167036171A KR 101895819 B1 KR101895819 B1 KR 101895819B1
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KR
South Korea
Prior art keywords
blade
brittle substrate
line
blade tip
sliding
Prior art date
Application number
KR1020167036171A
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English (en)
Korean (ko)
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KR20170007478A (ko
Inventor
히로시 소야마
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20170007478A publication Critical patent/KR20170007478A/ko
Application granted granted Critical
Publication of KR101895819B1 publication Critical patent/KR101895819B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020167036171A 2014-06-26 2015-05-18 취성 기판의 분단 방법 및 스크라이브 장치 KR101895819B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014131092 2014-06-26
JPJP-P-2014-131092 2014-06-26
PCT/JP2015/064162 WO2015198748A1 (ja) 2014-06-26 2015-05-18 脆性基板の分断方法およびスクライブ装置

Publications (2)

Publication Number Publication Date
KR20170007478A KR20170007478A (ko) 2017-01-18
KR101895819B1 true KR101895819B1 (ko) 2018-09-07

Family

ID=54937846

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167036171A KR101895819B1 (ko) 2014-06-26 2015-05-18 취성 기판의 분단 방법 및 스크라이브 장치

Country Status (5)

Country Link
JP (1) JP6304375B2 (ja)
KR (1) KR101895819B1 (ja)
CN (1) CN106470814B (ja)
TW (1) TWI651182B (ja)
WO (1) WO2015198748A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715718B (zh) * 2016-02-26 2021-01-11 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
DE102018131179A1 (de) * 2018-12-06 2020-06-10 Schott Ag Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung
JP2023123189A (ja) * 2022-02-24 2023-09-05 株式会社デンソー 半導体装置の製造方法
CN116238058B (zh) * 2023-05-12 2023-07-11 山东理工大学 一种脆性材料高效低损加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183040A (ja) * 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
JP2012250351A (ja) * 2011-05-31 2012-12-20 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003246209A1 (en) * 2002-07-01 2004-01-19 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing substrate of brittle material
CN100528507C (zh) * 2002-11-06 2009-08-19 三星钻石工业股份有限公司 划线形成设备和划线形成方法
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
JP5121055B2 (ja) * 2008-02-21 2013-01-16 ＡｖａｎＳｔｒａｔｅ株式会社 スクライブ装置
TWI494284B (zh) * 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
JP2013071871A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置
JP5447478B2 (ja) * 2011-09-28 2014-03-19 三星ダイヤモンド工業株式会社 スクライブ装置
TWI483911B (zh) * 2011-09-28 2015-05-11 Mitsuboshi Diamond Ind Co Ltd 劃線裝置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183040A (ja) * 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
JP2012250351A (ja) * 2011-05-31 2012-12-20 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法

Also Published As

Publication number Publication date
CN106470814A (zh) 2017-03-01
KR20170007478A (ko) 2017-01-18
JPWO2015198748A1 (ja) 2017-04-20
WO2015198748A1 (ja) 2015-12-30
TW201603981A (zh) 2016-02-01
JP6304375B2 (ja) 2018-04-04
TWI651182B (zh) 2019-02-21
CN106470814B (zh) 2019-02-12

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