KR101889384B1 - Device for pitch free bump interposer - Google Patents

Abstract

The pitch pre-bump interposer of the present invention is an interposer for vertically connecting a conductive ball of a semiconductor device and a conductive connector of a test socket, the interposer comprising: a first film corresponding to the semiconductor device and having a first bump formed at fine pitch intervals; A second film corresponding to the test instrument and having a second bump formed at the fine pitch spacing, a pressurized conducting rubber filled between the first and second films, and a second film disposed on the pressurized conducting rubber, And a conductive powder for vertically connecting the second bumps. According to the configuration of the present invention as described above, there is no need to newly manufacture the interposer.

Description

A device for pitch free bump interposer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pitch pre-bump interposer and, more particularly, to a pitch pre-bump interposer, It is not necessary to newly manufacture the interposer and the conductive powder is vertically arranged even if the pitch and size of the conductive balls are changed according to specifications and specifications of the semiconductor device. To-pitch bump interposer in which the electric inspection yield is improved even when the pitch pre-bump enhances the density of the conductive particles in the upper or lower portion and does not apply sufficient pressure in the magnetic arrangement in the direction of the pitch.

In general, semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests.

Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, in order to electrically connect the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device to each other , A test socket is disposed between the semiconductor device and the test apparatus.

However, the test socket has a conductive connector (wire or spring, etc.) for contacting the terminals provided in the test apparatus.

The conductive connector of the test socket tends to be displaced without contacting the terminals of the test apparatus accurately. In particular, since the insulating silicone rubber supporting the conductive connector is constituted by one unit, there is a problem that it can not be elastically contacted with the terminal for each conductive connector. It is preferable that the conductive connector move up and down individually in the contact state, and the influence of the vertical movement of the neighboring conductive connector may be caused by a test failure.

On the contrary, when the conductive connector of the test socket is directly connected to the conductive ball of the semiconductor device to be inspected, the life of the conductive connector is shortened, and as a result, the life cycle of the entire product is reduced.

Therefore, it is necessary to improve the contact characteristics through the conductive buffer which improves the conductivity while absorbing the impact between the conductive connector and the conductive ball of the semiconductor device.

On the other hand, in semiconductor devices to be inspected, the pitch of the conductive balls may be changed according to specifications. In such a case, the conductive buffer connected to the conductive balls often has a pitch that is difficult to cope with. Therefore, there is a problem that a conductive buffer must be newly manufactured.

KR Patent Publication No. 10-2012-0138304

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a pitch pre-bum interposer for protecting a conductive connector of a test socket by covering an upper surface of a test socket.

Another object of the present invention is to provide a pitch-free bump interposer which can be freely used without changing even if the pitch or size of semiconductor devices to be inspected is changed.

It is still another object of the present invention to provide a pitch pre-bump interposer that allows conductive powders to be gathered in a longitudinal direction of an electric circuit without scattering when the conductive powder is magnetically arrayed using an external magnetic field.

According to an aspect of the present invention, there is provided an interposer for vertically connecting a conductive ball of a semiconductor device and a conductive connector of a test socket, the interposer comprising: A first film corresponding to the test device and corresponding to the test device, the second film corresponding to the test device and having a second bump formed at the fine pitch interval, a second film corresponding to the pressure applied to the first film and the second film, A conductive rubber, and conductive powder aligned on the pressure conductive rubber and vertically connecting the first and second bumps.

According to another aspect of the present invention, the pitch pre-bump interposer of the present invention is an interposer for electrically connecting a semiconductor device and a test socket and preventing a direct collision with the pitch pre-bump interposer, A first rubber formed on one surface of the middle film, a first conductive powder arranged on the first rubber and vertically connecting the pitch pre-bumps, a second rubber formed on the other surface of the middle film, And a second conductive powder aligned on the second rubber and vertically connecting the pitch pre-bumps.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, because the interposer protects the test socket and the semiconductor device in spite of repetitive inspections, and the size and pitch of the conductive balls are changed according to the specification of the semiconductor device, the bumps of the interposer are designed at a fine pitch. There is no need to be economical.

Second, since the conductive powder is magnetically arranged in the vertical direction by the pitch pre-bumps, the density of the conductive particles is strengthened and the inspection yield is greatly improved even if the excessive pressure is not provided.

Third, there is no limitation in designing the thickness of the interposer since a film having a pitch pre-bump can be used and the pressure-conducting rubber can be formed on one side or both sides.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing the configuration of a pitch-free bump interposer according to an embodiment of the present invention; FIG.
2 is a cross-sectional view showing the configuration of a pitch-free bump interposer according to another embodiment of the present invention;

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the pitch-free bump interposer according to the present invention will be described in detail with reference to the accompanying drawings.

The pitch free bump interposer of the present invention is used in test sockets for testing semiconductor devices. The pitch-free bump interposer is mounted on top of the test socket to connect the semiconductor device and the test socket vertically. However, it does not preclude the electrical connection between the test socket and the test device, which is installed at the bottom of the test socket. Shall be installed on the top of the test socket for convenience of explanation.

The pitch pre-bump interposer may correspond to a fine pitch. Accordingly, even if the conductive ball size or pitch of the semiconductor device is reduced due to the reduction of the design rule, it does not interfere with the inspection of the electrical characteristics of the semiconductor device. This is because the pitch-free bump interposer is in a one-to-many (1: N) correspondence with the conductive balls or conductive connectors by being designed with a fine pitch.

The pitch-free bump interposer corresponds to the top surface of the test socket and protects the conductive connector of the test socket. The conductive connector is repeatedly and repeatedly connected to the conductive ball at the time of inspection to deteriorate the conductive performance. In particular, in the test socket constituting the conductive connector with the conductive silicone rubber, the conductive particles are detached The contact tendency tends to deteriorate, and when the conductive wire is used, the elastic restoring force is weakened or the breakage tends to occur and the electrical signal is not transmitted. Therefore, the pitch-free bump interposer is likely to be deteriorated It is possible to perform a function of maintaining contact characteristics.

The pitch pre-bump interposer according to the present invention relates to an interposer in which a semiconductor device is used for testing a test socket and pitch pre-bumps smaller than the conductive ball size (or pitch) of the semiconductor device are arranged at regular intervals.

1, the test socket 100 includes an insulating body 110 disposed between a testing device (not shown) and a semiconductor device PKG, and a semiconductor device 110 formed on the insulating body 110, And a conductive connector 120 designed according to the specifications of the device PKG.

The insulating body 110 has a rectangular shape with a very wide width in comparison with the thickness, and a frame (not shown) may be provided at the edge thereof.

The conductive connector 120 may include a conductive rubber (OPR) or a conductive wire (OWR). Or a hybrid type (OWP) in which a conductive wire is coupled to a conductive rubber.

The conductive rubber (OPR) may be a silicone rubber formed by magnetically arranging conductive particles in a silicon-based rubber resin. Or an unoriented silicone rubber which is constituted by including a conductive powder and a platinum (Pt) catalyst in a silicon-based rubber resin.

The conductive wire OWR may be formed obliquely or zigzag so as to absorb the impact even when it is vertically installed on the insulating body 110 or pressurized by the semiconductor device PKG, while maintaining the electrical connection. The conductive wire may be plated with conductive gold (Au) or nickel (Ni).

1, the pitch pre-bump interposer 200 includes a first film 210 corresponding to the semiconductor device PKG and having a first bump 202 formed at a fine pitch interval, A second film 220 having second bumps 212 formed at fine pitch intervals, a pressurized conductive rubber 230 filled between the first and second films 210 and 220, and a pressurized conductive rubber 230, And a conductive powder 240 that is aligned on the first and second bumps 202 and 212 and connects the first and second bumps 202 and 212 vertically.

The first bump 202 is connected to the conductive ball B of the semiconductor device and the first bump 202 is connected to the conductive connector 120 of the test socket 100. The conductive powder 240 is connected to the semiconductor device An electrical circuit is formed between the conductive balls B of the test socket 100 and the conductive connectors 120 of the test socket 100.

Since the first and second bumps 202 and 212 are formed at fine pitch intervals, the first bumps 202 are not in a one-to-one (1: 1) relationship with the conductive balls B but in a one- have. In addition, since the second bumps 212 are formed at the fine pitch intervals, the second bumps 212 are in a one-to-many (1: N) correspondence relationship with the conductive connectors 120 in a one-to-one relationship.

The interposer 200 functions as a buffer for protecting the test socket 100 and buffering the semiconductor device PKG and the test socket 100 during the inspection process so that the semiconductor device PKG and the test socket 100 are not subjected to mutual impact. As described above, conductive connector 120 is a conductive silicone rubber, so conductive particles tend to be lost from the conductive silicone rubber, and thus may be covered.

On the other hand, since the first and second bumps 202 and 212 may separate from the first and second films 210 and 220 due to repeated inspection, the first and second films 210 and 210 And 220, respectively.

The first and second bumps 220a and 220c may be formed in an arch shape or a crown shape having an inclined surface or a round surface having a constant contact area for edge contact with the conductive ball B or the conductive connector 120, Or in the form of a corn.

The pressure-conducting rubber 230 may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber, and other elastic rubbers.

On the other hand, the conductive powder 240 is included in the pressurized conductive rubber 230 to form an electric circuit. For example, the conductive powder 240 may be made of small particles, so that the conductive rubber 240 has electric characteristics by the conductive powder 240.

The conductive powder 240 may include gold (Au) powder having excellent electrical conductivity. In addition, it may be composed of iron (Fe), nickel (Ne), cobalt (Co) or other magnetic metal alone, or may be composed of two or more alloys. At this time, the conductive powder 240 is not limited to a specific shape or shape in order to enhance contact characteristics through mutual coupling force.

A conductive path is formed by the conductive powder 240 in the vertical direction so that the conductive powder 240 exhibits conductive characteristics between the first and second bumps 202 and 212 with minimal pressure in the vertical direction during the inspection process.

The mixture of the pressurized conductive rubber 230 and the conductive powder 240 is filled between the first and second films 210 and 220 in a liquid silicone form and when the conductive powder 240 is magnetized, do. For example, when the first bump 202 is magnetized to the N pole and the second bump 212 is magnetized to the S pole, a constant magnetic field is formed from the top to the bottom (or vice versa). The surrounding conductive powder 240 is gathered along this magnetic field, and the conductive powder 240 is arranged in the longitudinal direction to form a conductive path in the vertical direction.

Particularly, the conductive powder 240 mixed between the pressurized conductive rubber 230 is vertically increased in its conductive density by the magnetic field formed by the first and second bumps 202 and 212, The anisotropy can be enhanced in the vertical direction to provide high conductivity characteristics even with a small pressure at the time of pressurization.

On the other hand, in order for the pitch-free bump interposer 200 to perform electrical inspection while absorbing the impact between the test socket 100 and the semiconductor device PKG, the thickness of the entire interposer should be 2.0 mm or more, There is a limit to increase the height of the entire interposer by the method of filling the pressurized conductive rubber 230 between the first and second films 210 and 220. The longer the conductive path, the higher the electrical resistance and the lower the electrical performance.

≪ Embodiment 2 >

2, the pitch pre-bump interposer 300 includes a middle film 310 in which the pitch pre-bumps 302 are formed at fine pitch intervals, a first rubber 320 formed on one surface of the middle film 310, A first conductive powder 322 aligned on the first rubber 320 and vertically connecting the pitch pre-bump 302, a second rubber 330 formed on the other surface of the middle film 310, And a second conductive powder 332 that is aligned on the rubber 330 and connects the pitch pre-bumps 302 vertically.

The first conductive powder 322 arranged on the pitch pre-bump 302 is connected to the conductive ball B of the semiconductor device PKG and the second conductive powder 332 arranged on the lower side is connected to the test socket 100, To form the electrical circuit for connecting the first and second conductive powders 322 and 322 and the pitch pre-bump 302. [

Accordingly, it is possible to form the electric circuit that leads to the first conductive powder 322, 332 and the pitch pre-bump 302, and thus various types of pitch pre-bump interposer 300 can be designed without being limited by the thickness .

In addition, since one conductive connector 120 corresponds to a set of at least one conductive powder 322 and 332, even if the conductive connector 120 is changed according to the specification of the semiconductor device PKG to be inspected, 300) can be used without exchange.

As described above, according to the present invention, a film having bumps of pitch free spacing is coupled to both surfaces of a pressure-conducting rubber, and electrical circuits are formed by arranging conductive powder between upper and lower bumps, , The inspection performance is enhanced by forming an electric path in the vertical direction even with a small pressure, and it is understood that the conductive bump of the pitch free spacing is a technical idea that can be used without changing the specification of the semiconductor device without replacement have. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: Test socket 110: Insulated body
120: conductive connector 200: interposer
210: first film 220: second film
230: Pressurized conductive rubber 240: Conductive powder

Claims (5)

An interposer for vertically connecting a conductive ball of a semiconductor device and a conductive connector of a test socket,
A first film corresponding to the semiconductor device and having first bumps formed at fine pitch intervals;
A second film corresponding to the test socket and having a second bump formed at the fine pitch interval;
A pressurized conductive rubber filled between the first and second films; And
And a conductive powder arranged on the pressurized conductive rubber and vertically connecting the first and second bumps,
Wherein the fine pitch is such that the first bumps are in a one-to-many (1: N) correspondence with the conductive balls or the conductive connectors,
If the size or pitch of the conductive ball is reduced as the design rule is reduced, the number of the first bumps corresponding to the conductive ball is reduced. Similarly, if the conductive connector is reduced in size or pitch as the design rule is reduced, Even if the number of the second bumps corresponding to the conductive connector is reduced, the conductive powder forms an electrical circuit between the conductive ball and the conductive connector, and there is no problem in checking the electrical characteristics of the semiconductor device. Wherein the first and second bumps are not changed or replaced even if the semiconductor device and the test socket are changed or replaced. delete delete The method according to claim 1,
Wherein the conductive powder comprises gold (Au) powder so that the conductive powder forms a conductive path between the first and second bumps with minimal pressure in the vertical direction during the testing process. Poser. An interposer for electrically connecting a semiconductor device and a test socket and preventing direct impact,
A middle film in which the pitch pre-bumps are formed at fine pitch intervals;
A first rubber formed on one surface of the middle film;
A first conductive powder aligned on the first rubber and vertically connecting the pitch pre-bumps;
A second rubber formed on the other surface of the middle film; And
And a second conductive powder aligned on the second rubber and vertically connecting the pitch pre-bumps,
The fine pitch is such that the first conductive powder is in a one-to-many (1: N) correspondence with the conductive balls of the semiconductor device or the conductive connectors of the test socket,
When the conductive balls are reduced in size or pitch as the design rule is reduced, the number of the first conductive powders corresponding to the conductive balls is reduced. Similarly, when the conductive connectors are reduced in size or pitch as the design rule is reduced , The first and second conductive powders form an electrical circuit between the conductive balls and the conductive connector even when the number of the second conductive powders corresponding to the conductive connector is reduced, The first and second conductive powders are not changed or replaced even if the semiconductor device and the test socket are changed or replaced.

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