KR101878379B1 - Metal copper clad laminate manufacturing method for metal printed circuit board of chip on metal type and mpcb manufacturing method of com type using it - Google Patents

Abstract

There is provided a MCCL manufacturing method for a COM type metal PCB and a COM type metal PCB manufacturing method using the same. According to an embodiment of the present invention, there is provided a method for manufacturing a MCCL for a COM-type metal PCB, the method comprising: forming a first laminate by alternately laminating a copper foil and an insulating adhesive sheet; Removing the chip mounting region in the first stacking dummy to form a second stacking dummy; Forming a unit laminated sheet by laminating a copper foil and an insulating adhesive sheet on which the chip mounting area is removed from the second stacked dummy on a metal plate; And pressing the unit laminated sheet to form an MCCL.

Description

[0001] METHOD FOR MANUFACTURING MCCL FOR COM-TYPE METAL PCB AND METHOD FOR MANUFACTURING [0002] METHOD FOR COM-TYPE METAL PCB [0003] METHOD FOR MANUFACTURING < RTI ID = 0.0 >

The present invention relates to a method for manufacturing a MCCL for a COM-type metal PCB and a method for manufacturing a COM-type metal PCB using the same, and more particularly, to a method for manufacturing a MCCL for a COM-type metal PCB by effectively removing an insulating adhesive layer from a COM (Chip On Metal) The present invention relates to a method for manufacturing a MCCL for a COM type metal PCB and a method for manufacturing a COM type metal PCB using the same.

A metal PCB (MPCB) was fabricated by forming an insulating adhesive layer on a metal plate instead of a conventional FR4 or CEM substrate and then applying a copper foil to the MPCB substrate. Photo Resistor Coating and Photo Lithography , Development, Etching, and Strip process (collectively referred to as DES process). It is a high-tech component industry that is the basis for technological development of the electronics industry and the information and communication industry. It is a board that mounts electronic components such as LEDs, resistors, and capacitors on the circuit thus formed and electrically connects the components.

In particular, MPCB is an indispensable core part due to the spread of LEDs, and it is produced according to the order of LED lighting or BLU manufacturer from initial development stage to mass production. Thus, MPCB's performance and manufacturing costs have become key competitors in the LED and high-thermal-load packaging industries.

Generally, in LED lighting industry, LED package is mainly mounted on PCB or MPCB by SMT (Surface Mount Technology) method. FR4 or CEM series substrates have excellent electrical insulation but are too low in thermal conductivity to effectively dissipate the heat emitted from the LED to the exterior, thereby reducing the quality and life of the lighting.

As an alternative to this, an LED package can be mounted by the SMT method using a metal substrate that has excellent thermal conductivity instead of a resin-based substrate such as FR4 or CEM, or a ceramic substrate that is lower in thermal conductivity than a metal substrate do. This increases the cost of the product, but it is an indispensable factor in products where the heat emission effect takes precedence over the cost increase effect.

A more advanced technology has been commercialized as a chip-on-board (COB) type technology in which an LED chip is directly mounted on an MPCB instead of an LED package. This COB type MPCB has about twice the thermal resistance than the SMT type MPCB, and the heat radiation effect is doubled. However, the effect on heat release is still insufficient, mainly due to the large thermal resistance of epoxy-based insulating adhesives that function to insulate and bond metal boards and copper foil or Cu films.

In order to solve this problem, when the LED chip is directly bonded to the metal board where the insulating adhesive is removed and the metal board, for example, Al board, is used, the thermal resistance is reduced by about 4 times, . This is called COM (Chip On Metal) type.

Generally, a method for manufacturing a COM type metal PCB is to make a sheet of Cu foil on a BT resin by a general PCB manufacturing process for forming a product through an electrical wiring formation and a protective film coating process (PSR process) And a part where a chip is mounted is removed by a router or other mechanical or optical process so that the chip is fixed on a metal plate.

However, if these processes are performed, the productivity is lowered due to the manufacturing cost and the complexity of the process, which leads to a decrease in competitiveness.

Korean Patent Publication No. 2014-0136620 (Dec. 1, 2014) Republic of Korea public patent number 2012-0100303 (2012.12.12. Disclosure) Korean Registered Patent No. 0651474 (published on November 29, 2006)

In order to solve the above problems, the present invention provides a method for manufacturing a MCCL for a COM type metal PCB and a COM type metal PCB using the same, ≪ / RTI >

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a method for manufacturing a MCCL for a COM type metal PCB, the method comprising: stacking a copper foil and an insulating adhesive sheet alternately to form a first stacked pile; Removing the chip mounting region in the first stacking dummy to form a second stacking dummy; Forming a unit laminated sheet by laminating a copper foil and an insulating adhesive sheet on which the chip mounting area is removed from the second stacked dummy on a metal plate; And pressing the unit laminated sheet to form an MCCL.

The step of forming the first stacked dummy may include a step of alternately laminating the copper foil and the insulating adhesive sheet at least five times or more.

Further, the step of forming the second stacking dummy may include a step of removing the chip mounting area at a time using a mold press or a router.

The step of forming the unit laminated sheet may include a step of laminating an insulating adhesive sheet from which the chip mounting area is removed on the upper surface of the metal plate and laminating the copper foil on which the chip mounting area is removed .

In the step of forming the unit laminated sheet, an insulating adhesive sheet from which the chip mounting area is removed is laminated on both surfaces of the metal plate, and the copper foil on which the chip mounting area is removed is stacked on the laminated insulating adhesive sheet, .

According to another aspect of the present invention, there is provided a method for manufacturing a MCCL for a COM-type metal PCB, the method comprising: patterning an insulating adhesive liquid on a metal plate except a land area where chips are mounted; Forming an insulating adhesive layer by curing the insulating adhesive liquid; Stacking a copper foil on one surface of the insulating adhesive layer; And pressing the copper foil to form an MCCL.

The step of laminating the copper foil may include a step of laminating a copper foil having a region corresponding to the land region.

According to another aspect of the present invention, there is provided a method of manufacturing a COM-type metal PCB, comprising: preparing an MCCL manufactured by a method for manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention; And forming a wiring pattern on the copper foil of the MCCL by laser ablation.

Other specific details of the invention are included in the detailed description and drawings.

According to the present invention, by effectively removing the insulating adhesive layer from the COM (Chip On Metal) type in which the chip is directly mounted on the metal plate, the manufacturing process of the metal PCB can be simplified and the cost can be reduced.

In addition, it can improve product competitiveness and productivity.

1 is a flowchart of a method for manufacturing a MCCL for a COM type metal PCB according to an embodiment of the present invention.
FIGS. 2A to 2D are conceptual diagrams illustrating a method of manufacturing a MCCL for a COM type metal PCB according to an embodiment of the present invention.
3 is a flowchart of a method for manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention.
4A to 4D are conceptual diagrams illustrating a method of manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention.
5 is a flowchart of a method of manufacturing a COM type metal PCB according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a flowchart of a method for manufacturing a MCCL for a COM type metal PCB according to an embodiment of the present invention. 2A to 2D are conceptual diagrams illustrating a method of manufacturing a MCCL for a COM type metal PCB according to an embodiment of the present invention.

Referring to FIG. 1, a method for manufacturing a MCCL for a COM-type metal PCB according to an embodiment of the present invention includes forming a first stacked stack by alternately stacking a copper foil and an insulating adhesive sheet (S11) (S13), a unit laminated sheet is formed by laminating the copper foil and the insulating adhesive sheet from which the chip mounting area has been removed in the second stacked dummy on a metal sheet, respectively (S15 ), And the MCCL is formed by pressing the unit laminated sheet (S17).

2A, when the first stacked dummy 11 is formed (S11), the copper foil C and the insulating adhesive sheet I are separately prepared, and the copper foil C and the insulating adhesive sheet I are alternately . Here, the copper foil C and the insulating adhesive sheet I can be alternately laminated at least five times or more. That is, at least five copper foil C and at least five insulating adhesive sheets I are prepared and alternately stacked to form a first stacked dummy of five or more layers comprising a set of the copper foil C and the insulating adhesive sheet I 11 can be formed.

Referring to FIG. 2B, when the second stacked dummy 12 is formed (S13), the second stacked dummy 12 can be formed by removing the chip mounting area H from the first stacked dummy 11 . Here, at the time of forming the second stacked dummy 12, the chip mounting area H can be removed at a time by a mechanical method. For example, the second laminated dummy 12 can be formed by removing the chip mounting area H at once by using a die press or a router in the first laminated dummy 11.

2C, when the unit laminated sheet 14 is formed (S15), the copper foil C and the insulating adhesive sheet I, from which the chip mounting area H is removed from the second stacked dummy 12, And the unit laminated sheet 14 can be formed by laminating them on the laminated sheet M, respectively.

At this time, a plurality of unit laminated sheets 14 may be formed according to the number of the copper foil C and the insulating adhesive sheet I of the second stack dummy 12 and the lamination method. For example, as shown in FIG. 2C, an insulating adhesive sheet I having the chip mounting area H removed therefrom is laminated on the upper surface of the metal plate M, and the chip mounting area H is removed thereon The unit laminated sheet 14 can be formed by laminating the copper foil C. Alternatively, although not shown in the drawing, an insulating adhesive sheet I in which the chip mounting area H is removed on both sides of the metal plate M is laminated, and a copper foil C, on which the chip mounting area H is removed, The unit laminated sheet 14 can be formed. Alternatively, not only the copper foil C and the insulating adhesive sheet I are laminated on one surface and / or both surfaces of the metal sheet M, but may be laminated in at least one other area, Layer, but may be laminated in multiple layers.

Here, the metal plate M may have a predetermined size (for example, 500 mm x 600 mm) and may be made of a metal material such as aluminum (Al), iron (Fe), copper (Cu) . The size and material of the metal plate (M) are not limited thereto and can be variously changed. For example, the metal plate M may be an Al-coated Al plate, thereby improving corrosion resistance and adhesion. The thickness of the metal plate M is generally in the range of about 0.1 to 200 mm. However, the present invention is not limited thereto.

2D, when the unit laminated sheet 14 is pressed to form a metal copper clad laminate (MCCL) 15 (S17), the MCCL 15 can be formed by pressing the unit laminated sheet have. Here, the insulating adhesive sheet (I) and / or the copper foil (C) laminated on the metal sheet (M) can be hot-pressed by a hot press. The MCCL 15, which is the original plate of the metal substrate (MPCB), is completed by thermocompression bonding.

According to the method for manufacturing a MCCL for a COM type metal PCB according to an embodiment of the present invention, the insulating adhesive layer can be effectively removed from a COM (Chip On Metal) type in which a chip is directly mounted on a metal plate. In addition, since the MCCL 15 can be manufactured without using an expensive RCC (Resin Coated Copper), which is an insulating adhesive laminated on a metal plate, which is conventionally required for the production of a metal CCL, .

3 is a flowchart of a method for manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention. 4A to 4D are conceptual diagrams illustrating a method of manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention.

Referring to FIG. 3, a method for manufacturing a MCCL for a COM-type metal PCB according to another embodiment of the present invention includes patterning an insulating adhesive liquid on a metal plate except a land area where chips are mounted (S21) (S23), a copper foil is laminated on one side of the insulating adhesive layer (S25), and the copper foil is pressed to form an MCCL (S27).

4A, when the insulating adhesive liquid S is patterned on the metal plate M except for the land area L on which the chip is mounted (S21), the ink jet printer 21, the screen printer, The insulating adhesive liquid (S) is directly patterned in a shape in which the mounting portion on which the mounting substrate is mounted is removed. It is possible not only to control the discharge pressure and discharge amount by patterning the insulating adhesive liquid S directly on the metal plate M by using the ink jet printer 21 or the like but also to apply the insulating resin directly to the metal plate M The thickness and thermal conductivity of the insulating resin can be controlled.

Referring to FIG. 4B, in the case of forming the insulating adhesive layer I by curing the insulating adhesive liquid S (S23), electrical wiring represented by a subsequent Cu foil or Cu film is thermally cured or photo- An insulating adhesive layer (I) can be formed so as to form a wiring metal for a semiconductor device. For example, as shown in FIG. 4B, a light emitting device 22 having at least one light emitting device is provided on a top of a metal plate M, and an insulating adhesive 22, which is patterned on the top surface of the metal plate M, The insulating adhesive liquid S can be cured by irradiating the liquid S with light such as ultraviolet rays. Alternatively, a heating device (not shown) may be provided, and the insulating adhesive layer I may be formed by soft baking the insulating adhesive liquid S in the heating device.

Referring to FIG. 4C, when the copper foil C is laminated on one side of the insulating adhesive layer I (S25), the copper foil C having the region corresponding to the land region L can be laminated. That is, the copper foil C having the chip mounting area removed is laminated so as to form a region corresponding to the land area L at the time of laminating the copper foil C, or a pair of copper foils C) may be laminated. For example, as shown in FIG. 4C, two modules capable of adsorbing the copper foil C can be provided on the multilayer compression bonding machine 23. Specifically, the multilayer compression bonding apparatus 23 can deposit the copper foil C on the upper surface of the insulating adhesive layer I after vacuum-chucking the pair of copper foils C to move to the insulating bonding layer I side.

Referring to FIGS. 4C and 4D, when the MCCL 25 is formed by pressing the copper foil C (S27), the stacked copper foil C can be hot-pressed by hot pressing. For example, as shown in Fig. 4C, the laminated copper foil C can be thermocompression-bonded using two modules by using the multilayer press apparatus 23. Fig. The copper foil C is pressed and laminated on the upper surface of the insulating adhesive layer I to complete the MCCL which is the original plate of the metal substrate MPCB and to use the well-established process of the existing MCCL, The difficulty of regulation can be overcome.

According to another method of manufacturing a MCCL for a COM type metal PCB according to another embodiment of the present invention, the insulating adhesive layer can be effectively removed from a COM (Chip On Metal) type in which chips are directly mounted on a metal plate. In addition, it is possible to use an insulating adhesive liquid S in liquid form without using an expensive RCC (Resin Coated Copper), which is an insulating adhesive laminated on a metal plate, which is conventionally required for the production of a metal CCL The MCCL (15) can be manufactured to control the thickness and thermal conductivity of the insulating resin, so that it can meet the requirements of customers and reduce the manufacturing cost.

The metal PCB manufactured by using the MCCLs 15 and 25 is excellent in heat dissipation, heat resistance, and corrosion resistance, and can quickly and effectively disperse heat generated from the light emitting device when the LED or the LED package, The life can be extended.

5 is a flowchart of a method of manufacturing a COM type metal PCB according to an embodiment of the present invention.

Referring to FIG. 5, a method for manufacturing a COM-type metal PCB according to an embodiment of the present invention includes an MCCL 25 manufactured by a method for manufacturing a MCCL for a COM-type metal PCB according to another embodiment of the present invention (S51), and a wiring pattern can be formed on the copper foil C of the MCCL 25 by laser ablation (S53). Here, a Cu wiring of a desired shape can be formed by using a laser ablation process (a high-power Deep UV laser, a microsecond-pulse laser, a picosecond-pulse laser, or a femtosecond pulse laser).

Laser ablation process can be used to replace existing processes of forming Cu wiring (Dry Film Lamination-> Exposure-> Development-> Corrosion-> Dry Film Removal-> Cleaning and Drying) This can improve product competitiveness, such as cost reduction and productivity improvement, by simplifying the process and reducing material costs.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

11: first stacking pile 12: second stacking pile
14: Unit laminated sheet 15, 25: MCCL

Claims (1)

A method of manufacturing a MCCL for a COM-type metal PCB, which can manufacture an MCCL (Metal Copper Clad Laminate) without using a RCC (Resin Coated Copper) in a COM (Chip On Metal) type in which a chip is directly mounted on a metal plate,
The copper foil and the insulating adhesive sheet are alternately laminated six times to form a first stacked pile;
Removing the chip mounting area in the first stacking dummy at once using a mold press or a router to form a second stacking dummy;
A copper foil and an insulating adhesive sheet from which the chip mounting area has been removed in the second stacked pile are laminated on an Al metal plate coated with Ag with a size of 500 mm x 600 mm and a thickness of 0.1 mm to form a unit laminated sheet, An insulating adhesive sheet on which the chip mounting area has been removed is laminated, a copper foil on which the chip mounting area is removed is laminated thereon, and an insulating adhesive sheet and a copper foil are stacked as a single layer, An insulating adhesive sheet from which the chip mounting area is removed is laminated on the lower surface of the metal plate, and a copper foil on which the chip mounting area is removed is laminated on the insulating adhesive sheet. The insulating adhesive sheet and the copper foil are laminated as a single layer, Forming a unit laminated sheet on both sides of the metal sheet by laminating copper foil; And
And pressing a unit laminated sheet formed on both sides of the metal sheet to form an MCCL.

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