KR101783355B1 - Method for manufacturing a metal printed circuit board - Google Patents

Method for manufacturing a metal printed circuit board Download PDF

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Publication number
KR101783355B1
KR101783355B1 KR1020160017538A KR20160017538A KR101783355B1 KR 101783355 B1 KR101783355 B1 KR 101783355B1 KR 1020160017538 A KR1020160017538 A KR 1020160017538A KR 20160017538 A KR20160017538 A KR 20160017538A KR 101783355 B1 KR101783355 B1 KR 101783355B1
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KR
South Korea
Prior art keywords
mounting portion
base substrate
wire bonding
copper foil
insulating adhesive
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KR1020160017538A
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Korean (ko)
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KR20170096312A (en
Inventor
전형일
이상면
임지순
Original Assignee
주식회사 씨알콤
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Priority to KR1020160017538A priority Critical patent/KR101783355B1/en
Publication of KR20170096312A publication Critical patent/KR20170096312A/en
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Publication of KR101783355B1 publication Critical patent/KR101783355B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A method of making a metal PCB is provided. A method of fabricating a metal PCB according to an embodiment of the present invention includes: providing a base substrate made of aluminum; Plating copper on one surface of the base substrate; Providing a laminated sheet in which an insulating adhesive sheet and a copper foil are laminated; Removing a portion on which the chip is mounted in the laminated sheet to form a mounting portion; Attaching a laminated sheet having the mounting portion to the copper-plated base substrate; Forming a circuit pattern on the copper foil of the laminated sheet; Forming a protective layer by applying PSR to the mounting portion, a wire bonding pad portion for wire bonding with the chip, and a power supply portion for supplying power; And plating at least one of gold and silver on one side of the mounting portion, the wire bonding pad portion, and the power supply portion, respectively.

Description

METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD

The present invention relates to a metal PCB manufacturing method, and more particularly, to a method of manufacturing a metal PCB having a high heat dissipation and a high reflection characteristic in a COM (Chip On Metal) type in which a chip is directly mounted on a metal plate.

A metal PCB (MPCB) was fabricated by forming an insulating adhesive layer on a metal plate instead of a conventional FR4 or CEM substrate and then applying a copper foil to the MPCB substrate. Photo Resistor Coating and Photo Lithography , Development, Etching, and Strip process (collectively referred to as DES process). It is a high-tech component industry that is the basis for technological development of the electronics industry and the information and communication industry. It is a board that mounts electronic components such as LEDs, resistors, and capacitors on the circuit thus formed and electrically connects the components.

In particular, MPCB is an indispensable core part due to the spread of LEDs, and it is produced according to the order of LED lighting or BLU manufacturer from initial development stage to mass production. Thus, MPCB's performance and manufacturing costs have become key competitors in the LED and high-thermal-load packaging industries.

Generally, in LED lighting industry, LED package is mainly mounted on PCB or MPCB by SMT (Surface Mount Technology) method. FR4 or CEM series substrates have excellent electrical insulation but are too low in thermal conductivity to effectively dissipate the heat emitted from the LED to the exterior, thereby reducing the quality and life of the lighting.

As an alternative to this, an LED package can be mounted by the SMT method using a metal substrate that has excellent thermal conductivity instead of a resin-based substrate such as FR4 or CEM, or a ceramic substrate that is lower in thermal conductivity than a metal substrate do. This increases the cost of the product, but it is an indispensable factor in products where the heat emission effect takes precedence over the cost increase effect.

A more advanced technology has been commercialized as a chip-on-board (COB) type technology in which an LED chip is directly mounted on an MPCB instead of an LED package. This COB type MPCB has about twice the thermal resistance than the SMT type MPCB, and the heat radiation effect is doubled. However, the effect on heat release is still insufficient, mainly due to the large thermal resistance of epoxy-based insulating adhesives that function to insulate and bond metal boards and copper foil or Cu films.

In order to solve this problem, when the LED chip is directly bonded to the metal board where the insulating adhesive is removed and the metal board, for example, Al board, is used, the thermal resistance is reduced by about 4 times, . This is called COM (Chip On Metal) type.

Generally, a method for manufacturing a COM type metal PCB is to make a sheet of Cu foil on a BT resin by a general PCB manufacturing process for forming a product through an electrical wiring formation and a protective film coating process (PSR process) And a part where a chip is mounted is removed by a router or other mechanical or optical process so that the chip is fixed on a metal plate.

For example, conventionally, an Al substrate is mechanically polished to form a mirror-like mirror surface, a high reflective substrate on which Ag is coated, a thin BT Resin substrate coated with RCC, or an FR4 substrate, , The COM-type MPCB product was fabricated through the lamination process of removing the chip mounting area and attaching it to the high reflection board using adhesive sheet.

This has been applied only to high-priced, high-reflectance, high-temperature products because it is not competitive in terms of productivity and cost because it is subjected to expensive mirror board and thin plate process.

Korean Patent Publication No. 2014-0136620 (Dec. 1, 2014) Republic of Korea public patent number 2012-0100303 (2012.12.12. Disclosure) Korean Registered Patent No. 0651474 (published on November 29, 2006)

SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a metal PCB by which a metal PCB having high heat dissipation and high reflection characteristics can be manufactured by a simplified process.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Plating copper on one surface of the base substrate; Providing a laminated sheet in which an insulating adhesive sheet and a copper foil are laminated; Removing a portion on which the chip is mounted in the laminated sheet to form a mounting portion; Attaching a laminated sheet having the mounting portion to the copper-plated base substrate; Forming a circuit pattern on the copper foil of the laminated sheet; Forming a protective layer by applying PSR to the mounting portion, a wire bonding pad portion for wire bonding with the chip, and a power supply portion for supplying power; And plating at least one of gold and silver on one side of the mounting portion, the wire bonding pad portion, and the power supply portion, respectively.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Plating copper on one surface of the base substrate; Plating at least one of gold and silver on one side of the copper plating; Providing a laminated sheet in which an insulating adhesive sheet and a copper foil are laminated; Removing a portion on which the chip is mounted in the laminated sheet to form a mounting portion; Attaching a laminated sheet having the mounting portion formed thereon to a base substrate on which at least one of gold or silver is plated on the copper plating; Forming a circuit pattern on the copper foil of the laminated sheet; Forming a protective layer by applying PSR to the mounting portion, a wire bonding pad portion for wire bonding with the chip, and a power supply portion for supplying power; And plating at least one of gold and silver on one side of the mounting portion, the wire bonding pad portion, and the power supply portion, respectively.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Providing a laminated sheet in which an insulating adhesive sheet and a copper foil are laminated; Removing a portion on which the chip is mounted in the laminated sheet to form a mounting portion; Attaching a laminated sheet having the mounting portion to the base substrate; Forming a circuit pattern on the copper foil of the laminated sheet; Forming a protective layer by applying PSR to the mounting portion, a wire bonding pad portion for wire bonding with the chip, and a power supply portion for supplying power; Plating the mounting portion, the wire bonding pad portion, and the power supply portion with copper; And plating at least one of gold and silver on one side of the mounting portion, the wire bonding pad portion, and the power supply portion, respectively.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Plating copper on one surface of the base substrate; Forming an insulating adhesive layer on a surface of the copper plating except a mounting portion on which a chip is mounted; Stacking a copper foil having a region corresponding to the mounting portion on one surface of the insulating adhesive layer; Forming a circuit pattern on the copper foil and forming a wire bonding pad portion to be wire-bonded to the chip on the copper foil; Forming a protective layer by applying PSR except for the mounting portion and the wire bonding pad portion; And plating at least one of gold and silver on one surface of the mounting portion and the wire bonding pad portion, respectively.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Plating copper on one surface of the base substrate; Plating at least one of gold and silver on one side of the copper plating; Forming an insulating adhesive layer on a surface of the copper plating except a mounting portion on which a chip is mounted; Stacking a copper foil having a region corresponding to the mounting portion on one surface of the insulating adhesive layer; Forming a circuit pattern on the copper foil and forming a wire bonding pad portion to be wire-bonded to the chip on the copper foil; Forming a protective layer by applying PSR except for the mounting portion and the wire bonding pad portion; And plating at least one of gold and silver on one surface of the wire bonding pad portion.

According to another aspect of the present invention, there is provided a method of fabricating a metal PCB, comprising: providing a base substrate made of aluminum; Forming an insulating adhesive layer on a surface of the base substrate excluding a mounting portion on which chips are mounted; Stacking a copper foil having a region corresponding to the mounting portion on one surface of the insulating adhesive layer; Forming a circuit pattern on the copper foil and forming a wire bonding pad portion to be wire-bonded to the chip on the copper foil; Forming a protective layer by applying PSR except for the mounting portion and the wire bonding pad portion; Plating copper on the mounting portion and the wire bonding pad portion; And plating at least one of gold and silver on one surface of the mounting portion and the wire bonding pad portion, respectively.

The step of forming the insulating adhesive layer may include: patterning an insulating adhesive liquid on the upper portion of the base substrate except for the mounting portion; And forming the insulating adhesive layer by curing the insulating adhesive liquid.

Other specific details of the invention are included in the detailed description and drawings.

According to the present invention, it is possible to simplify the manufacturing process of the metal PCB having high heat dissipation and high reflection characteristics and reduce the cost.

In addition, it can improve product competitiveness and productivity.

1 is a flowchart of a method of manufacturing a metal PCB according to a first embodiment of the present invention.
2 is a cross-sectional view of a metal PCB manufactured by the metal PCB manufacturing method of FIG.
3 is a flowchart of a method of manufacturing a metal PCB according to a second embodiment of the present invention.
4 is a cross-sectional view of a metal PCB manufactured by the metal PCB manufacturing method of FIG.
5 is a flowchart of a method of manufacturing a metal PCB according to a third embodiment of the present invention.
6 is a cross-sectional view of a metal PCB manufactured by the metal PCB manufacturing method of FIG.
7 is a flowchart of a method of manufacturing a metal PCB according to a fourth embodiment of the present invention.
8 is a flowchart of a method of manufacturing a metal PCB according to a fifth embodiment of the present invention.
9 is a flowchart of a method of manufacturing a metal PCB according to a sixth embodiment of the present invention.
10A to 10C are conceptual diagrams showing a process of forming an insulating adhesive layer.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various elements, components and / or sections, it is needless to say that these elements, components and / or sections are not limited by these terms. These terms are only used to distinguish one element, element or section from another element, element or section. Therefore, it goes without saying that the first element, the first element or the first section mentioned below may be the second element, the second element or the second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a flowchart of a method of manufacturing a metal PCB according to a first embodiment of the present invention. 2 is a cross-sectional view of the metal PCB manufactured by the metal PCB manufacturing method of FIG.

1 and 2, a method of manufacturing a metal PCB according to a first embodiment of the present invention includes providing a base substrate 11 made of aluminum (S11), attaching a copper plating 13 to one surface of the base substrate, (S12), a laminated sheet 15 in which an insulating adhesive sheet 151 and a copper foil 152 are laminated is provided (S13), and a portion on which the chip C is mounted is removed from the laminated sheet 15, The laminate sheet 15 on which the mounting portion 153 is formed is attached to the base substrate 11 on which the copper plating 13 has been formed (S15). Then, a circuit pattern is formed on the copper foil 152 of the laminated sheet 15 (S16), and the mounting portion 153, the wire bonding pad portion 154 for wire bonding with the chip C, The PSR is applied to form the protective layer 16 (S17), and the mounting portion 153, the wire bonding pad portion 154, and the power supply portion (not shown) (17) at least one of gold (Au) and silver (Au). At this time, although not shown in the drawing, the power supply unit may be located at a rear side of the wire bonding pad unit 154, and a power terminal or the like may be positioned.

Here, when one surface of the base substrate 11 is plated with copper 13, one surface of the base substrate 11 has a high reflection characteristic like a mirror surface. In addition, by directly mounting the chip C on a metal plate laminated with aluminum, copper, gold, or the like, the heat generated from the light emitting element can be quickly and effectively dispersed when the chip C applies the LED or LED package as the light emitting element The lifetime of the light emitting element can be prolonged.

The base substrate 11 may be a metal plate having a predetermined size, and may be made of aluminum. Further, it may be made of a metal material such as iron (Fe) or copper (Cu), which has excellent thermal conductivity in addition to aluminum. The size and material of the base substrate 11 are not limited thereto and can be variously changed.

The copper plating 13 is formed on one surface of the base substrate 11, thereby making the base substrate 11 a mirror-like mirror surface. The base substrate 11 becomes a mirror-finished substrate through the copper plating 13, thereby improving high reflection characteristics.

The laminated sheet 15 on which the insulating adhesive sheet 151 and the copper foil 152 are laminated and the mounting portion 153 is formed is bonded to the base board 11 which is a mirror-finished board. After the laminated sheet 15 is laminated on the copper plating 13, a circuit pattern is formed on the copper foil 152 and the position of the wire bonding pad part 154 and the power supply part is determined by applying the PSR . The protective layer 16 is formed by applying PSR (Photo Solder Resist) except for the mounting portion 153, the wire bonding pad portion 154 and the power supply portion. As a result, the mounting portion 153 can be effectively formed in a COM (Chip On Metal) type in which the chip is directly mounted on the metal plate. In addition, expensive RCC (Resin Coated Copper) (resin coated copper foil), which is an insulating adhesive used for laminating on a metal plate, can be omitted, thereby reducing costs.

At this time, a circuit pattern of a desired shape can be formed by using a laser ablation process (a high power Deep UV laser, a microsecond-pulse laser, a picosecond-pulse laser, a femtosecond pulse laser, etc.). Laser ablation process can replace existing processes (Dry Film Lamination-> Exposure-> Development-> Corrosion-> Removal-> Cleaning and Drying) with a single laser ablation process Simplification and cost reduction through cost reduction and improvement of product competitiveness can be achieved.

The gold or silver plating 17 plated on the mounting portion 153, the wire bonding pad portion 154 and the power supply portion can further improve the reflection characteristic and improve the corrosion resistance and the adhesion. That is, the corrosion resistance of the base substrate 11 is improved, and various components such as a chip C, a wire W, and a power terminal to be mounted on the mounting portion 153, the wire bonding pad portion 154, Adhesion can be improved.

3 is a flowchart of a method of manufacturing a metal PCB according to a second embodiment of the present invention. 4 is a sectional view of the metal PCB manufactured by the metal PCB manufacturing method of FIG.

3 and 4, a method of fabricating a metal PCB according to a second embodiment of the present invention includes providing a base substrate 21 made of aluminum (S21) At least one of gold or silver is plated 25 on one side of the copper plating 23 in step S23 and the laminated sheet 25 on which the insulating adhesive sheet 271 and the copper foil 272 are laminated (S24), a portion where the chip C is mounted on the laminated sheet 15 is removed to form a mounting portion 153 (S25), and the gold or silver The laminated sheet 27 on which the mounting portion 273 is formed is attached to the base substrate 21 on which at least one of the electrodes 25 is plated 25 (S26). Then, a circuit pattern is formed on the copper foil 272 of the laminated sheet 27 (S27), and the mounting portion 273, the wire bonding pad portion 274 for wire bonding with the chip C, The PSR is applied to form a protective layer 28 (S28) except for a power supply part (not shown) for supplying the power supply part (not shown) to supply the power to the mounting part 273, the wire bonding pad part 274, At least one of gold and silver is plated (29) (S29).

Here, the copper plating 23 is formed on one surface of the base substrate 21, so that one surface of the base substrate has a high reflection characteristic like a mirror surface. In addition, by directly mounting the chip C on the base substrate 21 laminated with aluminum, copper, gold, or the like, the heat radiating effect can be maximized.

The base substrate 21 may be a metal plate having a predetermined size and may be made of a metal material such as iron (Fe) or copper (Cu) having excellent thermal conductivity in addition to aluminum. The size and material of the base substrate 21 But the present invention is not limited thereto and various changes can be made as described above.

The copper plating 23 is formed on one side of the base substrate 21, thereby enhancing the high reflection characteristics of the metal PCB by forming the base substrate 21 into a mirror-like mirror surface.

By directly applying the gold or silver plating 25 on the copper plating 23, the reflection characteristic can be further improved and corrosion of the base substrate 21 can be prevented. In addition, it is possible to improve the adhesiveness of the insulating adhesive sheet 271 and the chip C of the resin-coated copper foil 27.

The laminated sheet 27 in which the insulating adhesive sheet 271 and the copper foil 272 are laminated and the mounting portion 273 is formed is more easily laminated by gold or silver plating 25 plated on the base substrate 21 . A circuit pattern is formed on the copper foil 272 after the laminated sheet 27 is laminated on the gold or silver plating 25 and the mounting portion 273 and the wire bonding pad portion 274 and the power supply portion The protective layer 28 is formed by applying PSR (Photo Solder Resist). Here, by applying the PSR except for the wire bonding pad portion 274 and the power supply portion, the positions of the wire bonding pad portion 274 and the power supply portion are determined. This makes it possible to effectively form the mounting portion 273 in the COM (Chip On Metal) type in which the chip is directly mounted on the metal plate. In addition, expensive RCC (Resin Coated Copper) (resin coated copper foil), which is an insulating adhesive used for laminating on a metal plate, can be omitted, thereby reducing costs.

At this time, a circuit pattern of a desired type can be formed by using a laser ablation process (high power Deep UV laser, microsecond-pulse laser, picosecond-pulse laser, femtosecond pulse laser, etc.) as described above.

The gold or silver plating 29 plated on the wire bonding pad portion 274 and the power supply portion can further improve the reflection characteristics and improve the corrosion resistance and adhesion. Here, gold or silver plating 29 may be formed on the gold or silver plating 25, like the wire bonding pad portion 274 and the power supply portion, even if gold or silver plating 25 is already provided in the mounting portion 273. [ You may. That is, the mounting portion 273 can be double-plated with gold plating and / or silver plating. As a result, the reflection characteristic of the mounting portion 273 is remarkably improved, and the corrosion resistance and adhesion can be greatly improved.

5 is a flowchart of a method of manufacturing a metal PCB according to a third embodiment of the present invention. 6 is a cross-sectional view of the metal PCB manufactured by the metal PCB manufacturing method of FIG.

5 and 6, a method of manufacturing a metal PCB according to a third embodiment of the present invention includes providing a base substrate 31 made of aluminum (S31), attaching an insulating adhesive sheet 331 and a copper foil 332, The mounting portion 333 is formed by removing the portion on which the chip C is mounted in the laminated sheet 33 (S14), and the base substrate 31 The laminated sheet 33 on which the mounting portion 333 is formed is attached (S15). Then, a circuit pattern is formed on the copper foil 332 of the laminated sheet 33 (S16), and the mounting portion 333, the wire bonding pad portion 334 for wire bonding with the chip C, The PSR is applied to form a protective layer 34 (S17) except for a power supply part (not shown) for supplying the PSR to the mounting part 333, the wire bonding pad part 334 and the power supply part (S37). At least one of gold (Au) and gold (Au) is plated on one surface of the mounting portion 333, the wire bonding pad portion 334 and the power supply portion (S38).

Here, when copper plating 35 is applied to a region corresponding to the mounting portion 333 of one side of the base substrate 31, only a predetermined region of the base substrate 31 has a high reflection characteristic like a mirror surface. In addition, by directly mounting the chip C on the base substrate 31 laminated with aluminum, copper, gold, or the like, the heat radiation effect can be maximized.

The base substrate 31 may have a predetermined size as a metal plate and may be made of a metal such as iron (Fe) or copper (Cu) having excellent thermal conductivity in addition to aluminum. The size and material of the base substrate 31 But the present invention is not limited thereto and various changes can be made as described above.

The laminated sheet 33 on which the insulating adhesive sheet 331 and the copper foil 332 are laminated and the mounting portion 333 is formed can be directly laminated on the base board 31. [ A circuit pattern is formed on the copper foil 332 after the stacked sheets 33 are laminated on the base substrate 31 and are attached to each other and the mounting portion 333, the pad portion 334, and the power supply portion are removed A protective layer 34 is formed by applying a PSR (Photo Solder Resist). As a result, the mounting portion 153 can be effectively formed in a COM (Chip On Metal) type in which the chip is directly mounted on the metal plate. In addition, expensive RCC (Resin Coated Copper) (resin coated copper foil), which is an insulating adhesive used for laminating on a metal plate, can be omitted, thereby reducing costs.

At this time, a circuit pattern of a desired type can be formed by using a laser ablation process (high power Deep UV laser, microsecond-pulse laser, picosecond-pulse laser, femtosecond pulse laser, etc.) as described above.

The copper plating 35 is formed in a predetermined region of the base substrate 31 so that the required amount of copper can be reduced and the copper plating 35 can be easily performed on the mounting portion 333. [ Since the copper plating 35 is formed in a predetermined area of the laminated sheet 33, it is possible to reduce the required amount of copper and to facilitate plating and accuracy, and the copper plating 35 is coated on the wire bonding pad portion 334 and the power supply portion with copper plating (35) can be facilitated.

The gold or silver plating 37 plated on the mounting portion 333, the pad portion 334 and the power supply portion can further improve the reflection characteristic and improve the corrosion resistance and adhesion. That is, the corrosion resistance of the base substrate 31 is improved and the adhesiveness of various components such as the chip C, the wire W, and the power source element mounted on the mounting portion 333 and the pad portion 334 is improved Is as described above.

7 is a flowchart of a method of manufacturing a metal PCB according to a fourth embodiment of the present invention. 8 is a flowchart of a method of manufacturing a metal PCB according to a fifth embodiment of the present invention. 9 is a flowchart of a method of manufacturing a metal PCB according to a sixth embodiment of the present invention.

Referring to FIG. 7, a method of fabricating a metal PCB according to a fourth embodiment of the present invention includes: providing a base substrate made of aluminum (S41); plating copper on one surface of the base substrate (S42) (S43), and a circuit pattern is formed on the copper foil by forming a circuit pattern on the copper foil having a region corresponding to the mounting portion on one side of the insulating bonding layer (S44) Forming a wire bonding pad portion to be wire-bonded to the chip on the copper foil (S45); applying a PSR to the mounting portion and the wire bonding pad portion (S46) to form a protective layer (S46) At least one of gold and silver is plated on one surface of the wire bonding pad portion (S47).

8, a method of fabricating a metal PCB according to a fifth embodiment of the present invention includes providing a base substrate made of aluminum (S51), plating copper on one side of the base substrate (S52) (S54), and a step of forming an insulating adhesive layer (S54) on the one side of the insulating adhesive layer except for the mounting area where the chip is mounted on one side of the copper plating (S54) (S55), a circuit pattern is formed on the copper foil, and a wire bonding pad portion to be wire-bonded to the chip is formed on the copper foil (S56). Then, the mounting portion and the wire bonding pad (S57). At least one of gold and silver is plated on one side of the wire bonding pad (S58).

9, a method of manufacturing a metal PCB according to a sixth embodiment of the present invention includes: providing a base substrate made of aluminum (S61); inserting a chip (S62), a copper foil having a region corresponding to the mounting portion is laminated on one surface of the insulating adhesive layer (S63), a circuit pattern is formed on the copper foil, and a circuit pattern is formed on the copper foil (S65), and the wire bonding pad portion is coated with copper (S66), and then the PSR is applied to the wire bonding pad portion (S64) , Plating at least one of gold and silver on one side of the mounting portion and the wire bonding pad portion (S67).

The method for fabricating the metal PCB according to the fourth to sixth embodiments of the present invention is different from the method for fabricating the metal PCB according to the first to third embodiments of the present invention only in the process of forming the insulating adhesive layer and the copper foil, And other processes are similar. Specifically, the insulating adhesive layer is formed by patterning an insulating adhesive liquid on the upper portion of the base substrate, excluding the mounting portion, and curing the insulating adhesive liquid. Then, a copper foil having an area corresponding to the mounting portion is laminated.

Therefore, only the process of forming the insulating adhesive layer and the copper foil will be described below.

10A to 10C are conceptual diagrams showing a process of forming an insulating adhesive layer.

10A to 10C, the insulating adhesive liquid S is patterned on the base substrate B except for the land area L where the chip is mounted, and the insulating adhesive liquid S is cured to form an insulating adhesive layer The copper foil F is laminated on one surface of the insulating adhesive layer I and the copper foil F is bonded to the insulating adhesive layer I.

10A, when the insulating adhesive liquid S is patterned on the base substrate B except for the land area L on which the chip is mounted, the chip is mounted using the inkjet printer 110, the screen printer, The insulating adhesive liquid S is directly patterned in a pattern in which the mounting portion is removed. It is possible to control the discharge pressure and the discharge amount by patterning the insulating adhesive liquid S directly on the base substrate B by using the inkjet printer 110 or the like and by applying the insulating resin directly to the base substrate B The thickness and thermal conductivity of the insulating resin can be adjusted to meet the requirements.

10B, in the case of forming the insulating adhesive layer I by curing the insulating adhesive liquid S, the wiring metal for the electric wiring represented by the subsequent copper foil F is thermally cured or photo- The insulating adhesive layer (I) can be formed. For example, as shown in FIG. 10B, a light emitting device 120 having at least one light emitting device is provided on a base substrate B, and a light emitting device 120 is patterned on the upper surface of the base substrate B The insulating adhesive liquid (S) can be cured by irradiating light such as ultraviolet rays to the insulating adhesive liquid (S). Alternatively, a heating device (not shown) may be provided, and the insulating adhesive layer I may be formed by soft baking the insulating adhesive liquid S in the heating device.

10C, when the copper foil F is laminated on one surface of the insulating adhesive layer I, the copper foil F having a region corresponding to the land region L can be laminated. That is, the copper foil F from which the mounting portion, which is a chip mounting region, is removed so as to form a region corresponding to the land region L at the time of laminating the copper foil C can be laminated. For example, as shown in Fig. 10C, two modules capable of adsorbing the copper foil F can be provided on the multilayer compression bonding apparatus 130. [ Specifically, the multilayer compression bonding apparatus 130 can vacuum-adsorb a pair of copper foils F to move to the insulating bonding layer I, and thereafter, the copper foil F can be laminated on the upper surface of the insulating bonding layer I. After that, the stacked copper foil F can be thermo-pressed with a hot press. For example, as shown in FIG. 10C, the laminated copper foil F can be thermally bonded using two modules by using the multilayer compression bonding apparatus 130. The copper foil F is pressed and laminated on the upper surface of the insulating adhesive layer I so that the difficulty in controlling the thickness of the adhesive layer can be overcome.

It is possible to fabricate metal printed circuit board (MPCB) by using insulating adhesive liquid (S) in liquid form, and it is possible to control the thickness and thermal conductivity of insulating resin so that it can cope with customers' have. Such a metal PCB is excellent in heat resistance, heat resistance and corrosion resistance, and has a high reflection characteristic. When a LED or a LED package, which is a light emitting device, is applied, heat generated from the light emitting device is quickly and effectively dispersed, It is possible to improve light emission efficiency by reflecting light well.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

11: base substrate 13: copper plating
15: laminated sheet 17: gold or silver plating
21: base substrate 23: copper plating
25: gold or silver plating 27: laminated sheet
29: Gold or silver plating
31: base substrate 33: laminated sheet
35: Copper plating 37: Gold or silver plating

Claims (7)

delete delete delete delete delete Providing a base substrate made of aluminum;
A step of patterning a liquid insulating adhesive liquid except a mounting portion on which a chip is mounted on one surface of the base substrate;
Forming an insulating adhesive layer by curing the insulating adhesive liquid;
Stacking a copper foil having a region corresponding to the mounting portion on one surface of the insulating adhesive layer;
Pressing the copper foil to the insulating adhesive layer side;
Forming a circuit pattern on the copper foil and forming a wire bonding pad portion to be wire-bonded to the chip on the copper foil;
Forming a protective layer by applying PSR except for the mounting portion and the wire bonding pad portion;
Plating copper on the mounting portion and the wire bonding pad portion; And
And gold plating on one surface of the mounting portion and the wire bonding pad portion, respectively. delete
KR1020160017538A 2016-02-16 2016-02-16 Method for manufacturing a metal printed circuit board KR101783355B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100976607B1 (en) * 2008-09-10 2010-08-17 주식회사 코스모인 LED packagee of COM type, LED module using the same and method of manufacturing thereof
KR101101297B1 (en) * 2011-03-03 2012-01-05 (주)참빛 Metal printed circuit board for high heat radiation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100976607B1 (en) * 2008-09-10 2010-08-17 주식회사 코스모인 LED packagee of COM type, LED module using the same and method of manufacturing thereof
KR101101297B1 (en) * 2011-03-03 2012-01-05 (주)참빛 Metal printed circuit board for high heat radiation

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