KR101874107B1 - Ceramic heater module for thermal process of substrate - Google Patents

Ceramic heater module for thermal process of substrate Download PDF

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Publication number
KR101874107B1
KR101874107B1 KR1020160004925A KR20160004925A KR101874107B1 KR 101874107 B1 KR101874107 B1 KR 101874107B1 KR 1020160004925 A KR1020160004925 A KR 1020160004925A KR 20160004925 A KR20160004925 A KR 20160004925A KR 101874107 B1 KR101874107 B1 KR 101874107B1
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South Korea
Prior art keywords
heater
tube
heater tube
support bar
coupled
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KR1020160004925A
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Korean (ko)
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KR20170085645A (en
Inventor
김병국
김현수
권오철
한맹군
장종일
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주식회사 비아트론
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Priority to KR1020160004925A priority Critical patent/KR101874107B1/en
Publication of KR20170085645A publication Critical patent/KR20170085645A/en
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Publication of KR101874107B1 publication Critical patent/KR101874107B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/54—Heating elements having the shape of rods or tubes flexible
    • H05B3/56—Heating cables

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)

Abstract

The heater unit includes a heater tube having a rectilinear portion and a connection portion alternately connected to form a zigzag shape, a heater wire disposed inside the heater tube, and a tube stopper coupled to an end of the heater tube. An inner support bar coupled to the straight portion and supporting the heater tube, and an outer support bar coupled to both ends of the inner support bar to support the inner support bar.

Description

Technical Field [0001] The present invention relates to a ceramic heater module for a substrate,

The present invention relates to a ceramic heater module for heat-treating a substrate used for a flat panel display panel or a solar cell.

In the manufacturing process of a liquid crystal display device, which is one of the flat panel display devices, a line for producing a liquid crystal display panel of 50 inches or more by inputting a large glass substrate of 2200 × 2500 mm or more is called an 8th generation production line. Manufacturers are expanding these 8G production lines to improve production yields. As the glass substrate becomes larger in size, the heat treatment apparatus for heat treatment of the glass substrate must also be enlarged. This also applies to a panel for an OLED display device or a solar cell panel which is one of the flat panel display devices.

The heat treatment apparatus generally comprises a process chamber in which the glass substrate is seated and a heating module for heating the glass substrate inside the process chamber. The heating module is formed of a heat ray module mounted on the inner wall of the process chamber or a flat plate heater module located below the respective glass substrates. As the glass substrate becomes larger, the flat heater module uses a ceramic heater module which is advantageous for uniformly heating the glass substrate. However, when the ceramic heater module is enlarged, there is a problem that the heat ray is not uniformly generated as a whole, or the temperature distribution is varied due to the side wall of the process chamber, so that the glass substrate is not uniformly heated as a whole. In addition, the ceramic heater module is formed of various parts to wrap the heat wire. The ceramic heater module tends to be thermally deformed or broken at a high temperature due to a difference in thermal expansion coefficient of each component, and foreign materials are likely to be generated due to use of various parts.

In order to carry the glass substrate out of the process chamber after the end of the heating process for heating the glass substrate to a predetermined temperature, the process of heat-treating the glass substrate is performed by cooling the inside of the process chamber including the glass substrate and the ceramic heater module The process is necessary. Since the ceramic heater module takes a long time to cool down, it takes a lot of time to cool the ceramic heater module, which increases the overall heat treatment process time.

The present invention provides a ceramic heater module for heat treatment of a substrate which can prevent thermal deformation and breakage due to a difference in thermal expansion coefficient of a heater tube and suppress foreign matter generation by providing a heat wire inside a heater tube of the same material as the whole .

It is another object of the present invention to provide a ceramic heater module for substrate heat treatment which can be rapidly cooled in a cooling process that is performed after a heating process of a glass substrate is completed, thereby shortening a heat treatment process time.

It is another object of the present invention to provide a ceramic heater module for substrate heat treatment capable of uniformly heating a substrate used in a flat panel display panel.

The ceramic heater module for heat treatment of a substrate according to an embodiment of the present invention includes a heater unit including a heater tube formed by alternately connecting a straight line portion and a connection portion and a hot line positioned inside the heater tube, An inner support bar supporting the heater tube, and an outer support bar coupled to the inner support bar to support the inner support bar.

The connecting portion of the heater tube may be formed in a " C "shape or a" C "shape so as to be coupled to an end portion of the straight portion, and the connecting portion and the straight portion may be formed of the same material, have. At this time, the straight portion and the connecting portion of the heater tube may be formed of quartz, alumina, silicon carbide, zirconia, silicon oxide, or a mixture thereof. The heater tube may be formed of nickel, chromium, stainless steel, Inconel, Coba alloy, tungsten, titanium, Hastelloy or a mixture thereof. The heater tube may further include an insulating layer or an insulating tube on the inner circumferential surface of the heater tube. have.

In addition, the heater tube may have a circular, square, or polygonal cross-sectional shape. The heater unit may further include a tube stopper coupled to an end of the heater tube. The tube stopper may include a through hole through which a power source line that supplies power to the hot wire passes, And a coupling groove formed on a surface of the heater tube to which the heater tube is coupled, the coupling groove being formed to have the same center axis as the through hole and to insert the end of the heater tube.

The heater unit may further include a cooling gas pipe coupled to the through-hole to supply a cooling gas to the inside of the heater tube or to provide a path for the cooling gas to flow out of the heater tube.

The inner supporting bar is formed in a bar shape having a length corresponding to the width of the heater unit and includes an upper inner body and a lower inner body, And a lower internal body, which is formed in a symmetrical shape and has an inner support groove formed at an upper end thereof and a straight line portion of the heater tube is coupled and supported. At this time, the upper inner body and the lower inner body may include inner engagement protrusions formed at both ends, and the outer support bar may include an outer engagement hole to which the inner engagement protrusions are coupled.

The heater unit may further include a fixing bracket coupled to the inner support bar and the outer support bar to fix the inner support bar and the outer support bar.

The plurality of heater units may be divided into a plurality of control regions, and the heater units may be independently controlled.

In the ceramic heater module for substrate heat treatment according to the present invention, heat rays are provided inside a heater tube formed of the same material including a linear portion and a connecting portion, thereby preventing thermal deformation and breakage due to a difference in thermal expansion coefficient between the heater tube and its surrounding components And there is an effect of suppressing the generation of foreign matter.

In the ceramic heater module for a substrate heat treatment according to the present invention, since the heating wire is cooled by the cooling gas injected into the tube to which the heating wire is mounted, the heating process of the glass substrate is rapidly cooled in the cooling process, Is shortened.

In the ceramic heater module for substrate heat treatment according to the present invention, since the heater tube with which the cooling gas is contacted is formed of the same material, deformation or breakage due to a difference in thermal expansion coefficient during cooling is prevented.

In addition, since the ceramic heater module for a substrate heat treatment of the present invention is divided into a plurality of independent control regions, the glass substrate is uniformly heated.

In addition, since the ceramic heater module for substrate heat treatment of the present invention does not have a separate upper or lower plate on the outside of the heater tube, the heat generated from the heating wire is more directly transferred to the substrate, thereby increasing the thermal efficiency.

1 is a perspective view of a ceramic heater module for substrate heat treatment according to an embodiment of the present invention.
2 is a plan view of the ceramic heater module for substrate heat treatment of FIG.
3 is an enlarged view of "A" in FIG.
Figure 4 is a vertical cross-sectional view of the heater tube and heat wire of Figure 1;
Fig. 5 is a left side view of Fig. 2; Fig.
6 is a right side view of Fig.
7 is a front view of the inner guide of Fig.
8 is a front view of the outer guide of Fig.
Fig. 9 is a perspective view of the fixing bracket of Fig. 2;
10 is a front view of the fixing bracket of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more faithful and complete, and will fully convey the scope of the invention to those skilled in the art.

In the following drawings, thickness and size of each layer are exaggerated for convenience and clarity of description, and the same reference numerals denote the same elements in the drawings. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used in this specification are taken to specify the presence of stated features, steps, numbers, operations, elements, elements and / Steps, numbers, operations, elements, elements, and / or groups.

Hereinafter, a ceramic heater module for substrate heat treatment according to an embodiment of the present invention will be described.

1 is a perspective view of a ceramic heater module for substrate heat treatment according to an embodiment of the present invention. 2 is a plan view of the ceramic heater module for substrate heat treatment of FIG. 3 is an enlarged view of "A" in FIG. Figure 4 is a vertical cross-sectional view of the heater tube and heat wire of Figure 1; Fig. 5 is a left side view of Fig. 2; Fig. 6 is a right side view of Fig. 7 is a front view of the inner guide of Fig. 8 is a front view of the outer guide of Fig. Fig. 9 is a perspective view of the fixing bracket of Fig. 2; 10 is a front view of the fixing bracket of Fig.

1 to 10, a ceramic heater module 100 for a substrate heat treatment according to an exemplary embodiment of the present invention includes a heater unit 110, an inner support bar 130, an outer support bar 150, (Not shown).

The ceramic heater module 100 is divided into at least three control areas 100a, 100b, and 100c, and a heater unit 110 is independently controlled in each control area. In the ceramic heater module 100, the heating temperature and the heating rate can be independently controlled in the three control regions 100a, 100b, and 100c, and thus various heat treatment profiles can be realized. 2, the ceramic heater module 100 includes a first control region 100a located on one side and a second control region 100b located on the other side and a third control region 100b located on the other side, 100c. In the meantime, the ceramic heater module 100 is shown to have three control regions, but the present invention is not limited thereto, and may be divided into a plurality of control regions according to the entire area.

The heater unit 110 includes a heater tube 111, a heat ray 113, and a tube stopper 115. Further, the heater unit 110 may further include a cooling gas pipe 117.

The heater units 110 are formed in a number corresponding to the number of control areas of the ceramic heater module 100, and may have the same or different planar shapes. When a plurality of the heater units 110 are combined, a specific shape is determined so as to form a plane shape corresponding to the substrate that is seated on the ceramic heater module 100. Meanwhile, although the heater units 110 have the same or different planar shapes, the basic structure of the heater unit 110 is the same as that described above.

The heater tube 111 may be formed in a hollow tube shape and may have a circular, square, or polygonal cross-sectional shape. The heater tube 111 includes a straight portion 111a and a connecting portion 111b and the straight portion 111a and the connecting portion 111b are alternately connected to form a zigzag shape as a whole. That is, the heater tube 111 is formed so that the linear portion 111a is spaced apart in the horizontal direction perpendicular to the longitudinal direction, and the connection portion 111b connects the ends of the two linear portions 111a adjacent to each other to form a zigzag shape . Here, the rectilinear section 111a may be formed in a straight line, and the connection section 111b may be formed to have a "C" shape or a "C" shape. The heater tube 111 is formed in a shape corresponding to the control region in which the heater unit is located. That is, the heater tube 111 may have a rectangular shape.

 The heater tube 111 is formed by joining a straight portion 111a formed by the same material and a connecting portion 111b by welding or heat welding. Therefore, the heater tubes 111 are integrally formed of the same material. Therefore, since the heater tube 111 has the same thermal expansion coefficient, generation of foreign matter due to breakage or cracking during heating or cooling is minimized. The straight portion 111a and the connecting portion 111b are formed to have the same diameter.

The heater tube 111 is made of anhydrous silicic acid (SiO 2 ) (quartz) having a purity of 99.99% or more and has a relatively small gas content. Therefore, the heater tube 111 is suitable for the semiconductor industry which is chemically stable and therefore requires stability at high temperatures. The heater tube 111 has a softening point of approximately 1683 캜 and can be used at a high temperature. Since the coefficient of thermal expansion (5 x 19 -7 cm / 占 폚) is small, the heater tube 111 is also resistant to quenching and rapid heat. In addition, the heater tube 111 is excellent in energy efficiency because it transmits not only ultraviolet light but also infrared light and wavelength light, as opposed to a general glass tube which does not transmit ultraviolet light. Moreover, the heater tube 111 has high electrical insulation property and very high acid resistance.

In addition, the heater tube 111 may be formed of alumina, silicon carbide, zirconia, silicon oxide, or a mixture thereof. The heater tube 111 may be formed of stainless steel, inconel, cobalt alloy, tungsten, titanium, Hastelloy or a mixture thereof. At this time, the heater tube 111 may further include an insulating layer or an insulating tube (not shown) formed on the inner circumferential surface of a material such as alumina, silicon carbide, zirconia, silicon oxide, or a mixture thereof.

The heating line 113 is formed of a heating element, and generates heat by the supplied power source to heat the substrate. The heat ray 113 is inserted into the heater tube 111 and positioned one by one in the heater tube 111. Accordingly, the heat ray 113 is also bent in a zigzag shape inside the heater tube 111. The heating wires 113 are inserted into the heater tubes 111 located in the respective control areas and are independently supplied with power to be controlled.

The heat ray 113 is an Fe-Cr-Al-based electric resistance heating body, and can be used at the highest temperature among the heat resistance resistance alloys. In addition, the heat ray 113 may be formed of a NiCr alloy, titanium, a tungsten alloy, stainless steel, MoSi 2, or a mixture thereof.

In the drawing, reference numeral 114 denotes a power supply line for supplying power to the heat line 113.

The tube stopper 115 is formed in a circular block shape having a through hole 115a and a coupling groove 115b. The tube stopper 115 is coupled to the end of the heater tube 111 to shield the end of the heater tube 111. The tube stopper 115 is preferably formed of the same material as the heater tube 111 and is formed of quartz material. Accordingly, the tube stopper 115 has the same thermal expansion coefficient as that of the heater tube, and minimizes thermal deformation or breakage during the heat treatment process.

The through hole 115a is formed to penetrate from one surface to the other surface. The through hole 115a provides a path through which the power line 114 for supplying power to the heat line 113 passes. The through hole 115a also provides a path for the cooling gas to be supplied into the heater tube 111 or discharged from the heater tube 111. [ That is, the cooling gas pipe 117 is connected to the through-hole 115a. The cooling gas may be a gas such as nitrogen gas or argon gas, which is an inert gas.

The coupling groove 115b is formed at a predetermined depth to have the same center axis as the through hole 115a on the surface to which the heater tube 111 is coupled and the end of the heater tube 111 is inserted and coupled.

One end of the cooling gas pipe 117 is coupled to the through hole 115a and an external cooling gas supply pipe (not shown) or a cooling gas discharge pipe (not shown) is connected to the other end. The cooling gas pipe 117 supplies a cooling gas to the inside of the heater tube 111 or discharges the cooling gas from the heater tube 111. The cooling gas is supplied to the inside of the heater tube 111 during the cooling process, which is performed after the heat treatment of the substrate is completed in the heat treatment process, and the heat ray 113 and the heater tube 111 are rapidly cooled to be cooled in the heat treatment process .

The inner support bar 130 includes an upper inner body 131, a lower inner body 132, an inner support groove 133, an inner engagement protrusion 135, and an inner bracket hole 137. The inner support bar 130 is formed in a bar shape as a whole and is coupled to the linear portion 111a of the heater tube 111 at both sides perpendicular to the longitudinal direction of the linear portion 111a to support the heater tube 111 . Accordingly, the inner supporting bar 130 is preferably formed of at least two. The inner support bar 130 may be formed of three or more in order to more stably support the heater tube 111 when the straight portion 111a of the heater tube 111 is long.

The inner support bar 130 is formed by joining the upper inner body 131 and the lower inner body 132 to the upper and lower portions of the straight portion 111a of the heater tube 111, Keep the shape. The inner support bar 130 is coupled to the heater tube 111 on both sides of the straight portion 111a of the heater tube 111 to stably support the heater tube 111. [

The inner support bar 130 may be formed of one or a mixture thereof selected from the group consisting of stainless steel, inconel, cobalt alloy, tungsten, titanium, and Hastelloy. The inner support bar 130 may be formed of glass, neoceramic, alumina (Al 2 O 3 ), silicon carbide (SiC), zirconia (ZrO 2 ), quartz (Quartz) .

The upper inner body 131 is formed in a bar shape and has a length corresponding to the width of the heater unit 110 to be coupled. For example, the upper inner main body 131 may have a length corresponding to the width of the first control area 100a shown in FIG. More specifically, when the linear portions 111a of the heater unit 110 are spaced apart from each other in the horizontal direction, the upper internal body 131 is larger than the distance between the straightest portions 111a located at the outermost positions . The upper inner body 131 may have a width greater than the entire width of the second control area 100b and the third control area 100c.

The lower inner body 132 is formed in a bar shape having the same length as that of the upper inner body 131, and is preferably formed in a shape symmetrical to the upper inner body 131.

The inner support groove 133 is formed in a arc shape on the lower surface of the upper inner body 131 and the upper surface of the lower inner body 132, respectively. The inner support groove 133 is formed in a shape of arc having a radius corresponding to the radius of the heater tube 111. The inner support groove 133 formed on the lower surface of the upper inner body 131 and the upper surface of the lower inner body 132 forms a circle corresponding to the outer diameter of the heater tube 111 as a whole. The inner support groove 133 is coupled to the outer peripheral surface of the linear portion 111a of the heater tube 111 and supports the heater tube 111. [

The inner coupling protrusions 135 protrude from both ends of the upper inner body 131 and the lower inner body 132. The inner engaging protrusion 135 is engaged with the outer supporting bar 150 to fix the inner supporting bar 130 to the outer supporting bar 150. One or at least two of the inner engaging projections 135 may be arranged vertically.

The inner bracket hole 137 is formed through the other surface of the upper inner body 131. The inner bracket holes 137 are formed on or between the inner support grooves 133 on both sides of the upper inner body 131. A bolt (not shown) for fixing the fixing bracket 170 is coupled to the inner bracket hole 137. The inner bracket hole 137 may be omitted when the fixing bracket 170 is coupled to the upper inner main body 131 by welding or the like. In addition, the inner bracket holes 137 may be formed in the lower internal body 132 in accordance with the direction in which the fixing brackets 170 are coupled.

The external support bar 150 is formed to include an external coupling hole 151 and a bracket groove 153. The external support is formed in a bar shape and has a length corresponding to the length of the ceramic heater module 100. The outer support bar 150 is located on both sides of the ceramic heater module 100 and is coupled to an end of the inner support bar 130 to support the inner support bar 130.

The outer support bar 150 may be formed of one or a mixture thereof selected from the group consisting of stainless steel, inconel, cobalt alloy, tungsten, titanium, and Hastelloy. The outer support bar 150 may be made of glass, neoceramic, alumina (Al 2 O 3 ), silicon carbide (SiC), zirconia (ZrO 2 ), or quartz .

The outer coupling hole 151 is formed in a hole shape penetrating from one surface to the other surface and is formed in a number corresponding to the inner coupling protrusion 135 formed on the inner supporting bar 130. For example, one or at least two of the external coupling holes 151 are formed in the external supporting bar 150 so as to be vertically arranged. In addition, the outer engaging groove 115b is formed in a shape corresponding to the shape of the inner engaging projection 135. For example, when the inner coupling protrusions 135 are formed in a square pillar shape or a cylindrical shape, the outer coupling holes 151 are formed in a hole shape having a rectangular or circular cross section. The inner coupling protrusion 135 of the inner supporting bar 130 is coupled to the outer coupling hole 151.

The bracket groove 153 may be formed to have a predetermined depth in the downward direction from the upper end, and may be formed to penetrate from the front surface to the rear surface. That is, the bracket groove 153 may be formed as a hole that opens to the upper end when viewed from the front side. The bracket groove 153 is formed on both sides of the outer support bar 150 and is formed at a position where the inner support bar 130 located at the outermost position is engaged. That is, the bracket groove 153 is formed in place of the position where the outermost coupling hole 151 is formed. Accordingly, the inner engaging protrusion 135 of the inner support bar 130 may be engaged with the bracket groove 153. In the bracket groove 153, a fixing bracket 170 is coupled to the bracket groove 153. The external engaging groove 115b is formed to have a size corresponding to a portion where the fixing bracket 170 is engaged. Meanwhile, the bracket groove 153 may be omitted when the fixing bracket 170 is coupled to the outer support bar 150 by welding or the like.

The fixing bracket 170 includes a bracket body 171, an external engaging portion 173, an internal engaging portion 175, and a fixing bracket hole 177. The fixing bracket 170 is coupled to the inner support bar 130 and the outer support bar 150 to firmly fix the inner support bar 130 and the outer support bar 150.

The fixing bracket 170 may be formed of one or a mixture of stainless steel, inconel, cobalt alloy, tungsten, titanium, and Hastelloy. Also, the fixing bracket 170 is glass, neo-ceramic (Neoceramic), alumina (Al 2 O 3), silicon carbide (SiC), zirconia (ZrO 2), or quartz (kwojjeu, Quartz) or formed of a mixture thereof .

The bracket body 171 is formed in a plate shape having a length and a width and is formed to extend from the outer surface of the outer support bar 150 to the upper portion of the inner support bar 130. The bracket body 171 is coupled to the upper surface of the inner support bar 130 so that the lower surface thereof contacts the upper surface of the inner support bar 130. Further, the bracket body 171 is inserted into the bracket groove 153 of the outer support bar 150 and is engaged.

The outer engaging portion 173 is formed in a plate shape extending downward from an outer end of the bracket body 171. The outer engaging portion 173 is supported such that its inner side is in contact with the outer surface of the outer supporting bar 150 and the fixing bracket 170 is not separated from the outer supporting bar 150.

The inner engaging portion 175 is formed in a plate shape extending downward from the other end of the inner side of the bracket body 171. The inner engaging part 175 is held on one side or the other side of the inner supporting bar 130 so that the fixing bracket 170 is not separated from the inner supporting bar 130.

The fixing bracket hole 177 is formed at a position corresponding to the inner bracket hole 137 of the inner support bar 130 when the fixing bracket 170 is coupled to the inner support bar 130. A separate bolt (not shown) is fastened to the fixing bracket hole 177 and the inner bracket hole 137 to connect the fixing bracket 170 and the inner supporting bar 130. The fixing bracket hole 177 may be omitted when the fixing bracket 170 is coupled by welding or the like.

The ceramic heater module 100 for heat treatment of a substrate according to the present invention is installed inside a process chamber of a heat treatment apparatus, and is disposed at an upper portion or a lower portion of a substrate to be heat treated. The ceramic heater module 100 for heating the substrate heats the substrate positioned above or below the substrate using heat generated from the heating wire 113. Since the ceramic heater module 100 for heat-treating a substrate does not have a separate upper or lower plate on the outside of the heater tube 111, the heat generated by the heat 113 is more directly transferred to the substrate, The substrate can be more uniformly heated.

In the ceramic heater module 100 for heating the substrate, a plurality of heater units 110 are arranged in the horizontal direction and independently controlled to uniformly heat the glass substrate used in the flat panel display panel.

The ceramic heater module 100 for heating the substrate may be formed of the same material as the heater tube 111 surrounding the heating wire 113 and may be integrally formed so that there is no difference in thermal expansion coefficient and thermal deformation due to a difference in thermal expansion coefficient Breakage is prevented, and generation of foreign matter is suppressed.

In addition, since the cooling gas is supplied to the inside of the heater tube 111, the ceramic heater module 100 for substrate heat treatment according to the present invention is cooled more rapidly in the cooling process after the heat treatment process for the substrate is completed, do. In addition, since the heater tube 111 contacting with the cooling gas is made of the same material, the ceramic heater module 100 for heat treatment of a substrate according to the present invention can be prevented from deformation or breakage due to a difference in thermal expansion coefficient during the cooling process.

As described above, the present invention is not limited to the above-described embodiments, but can be applied to a ceramic heater module for heat treatment of a substrate according to the present invention It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

100; Ceramic heater module for substrate heat treatment
110; Heater unit
111; Heater tube 113; thermic rays
115; A tube stopper 117; Cooling gas pipe
130; Inner supporting bar
131; An upper inner body 132; The lower internal body
133; Inner support groove 135; Inner engaging projection
137; Inner bracket hole
150; External supporting bar
151; Outer coupling hole 153: Bracket groove
170; fixed bracket
171; A bracket body 173; [0031]
175; Inner coupling portion 177; Fixed Bracket Hole

Claims (11)

A heater unit including a heater tube formed by alternately connecting a rectilinear section and a connection section, and a heat line positioned inside the heater tube;
An inner support bar coupled to the heater tube to support the heater tube,
And an outer support bar coupled to the inner support bar to support the inner support bar,
The heater unit further includes a tube cap coupled to an end of the heater tube,
Wherein the tube stopper includes a through hole through which a power source line for supplying power to the heating wire passes,
The heater unit
Further comprising a cooling gas pipe coupled to the through-hole to supply a path through which the cooling gas is supplied to the inside of the heater tube or flows out from the heater tube. The method according to claim 1,
The connecting portion of the heater tube is formed in a " C "shape or a" C "shape and is coupled to an end portion of the straight portion,
Wherein the connecting portion and the straight portion are formed of the same material and are integrally joined by welding. 3. The method of claim 2,
Wherein the straight portion and the connecting portion of the heater tube are formed of quartz, alumina, silicon carbide, zirconia, silicon oxide, or a mixture thereof. 3. The method of claim 2,
The heater tube is formed of nickel, chromium, stainless steel, inconel, cobalt alloy, tungsten, titanium, Hastelloy or a mixture thereof,
Further comprising an insulating layer or an insulating tube on an inner peripheral surface of the heater tube. The method according to claim 1,
Wherein the heater tube has a circular, rectangular or polygonal cross-sectional shape. The method according to claim 1,
Wherein the tube stopper includes an engaging groove formed in a surface of the surface to which the heater tube is coupled to have the same center axis as the through hole and into which the end of the heater tube is inserted. delete The method according to claim 1,
The inner support bar
An upper inner body formed in a bar shape having a length corresponding to the width of the heater unit and having a straight line portion of the heater tube coupled to an inner support groove formed at a lower end thereof,
And a lower internal body formed in a shape symmetrical with the upper internal body and having the internal support groove formed at an upper end thereof and coupled with a straight line portion of the heater tube. 9. The method of claim 8,
Wherein the upper inner body and the lower inner body include inner engagement protrusions formed at both side ends thereof,
Wherein the outer supporting bar includes an outer engaging hole to which the inner engaging projection is engaged. 9. The method of claim 8,
The heater unit
Further comprising: a fixing bracket coupled to the inner support bar and the outer support bar to fix the inner support bar and the outer support bar. The method according to claim 1,
The heater unit is divided into a plurality of control regions,
Wherein the heater units are controlled independently of each other.
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CN109195238A (en) * 2018-10-15 2019-01-11 江苏东方电热器制造有限公司 A kind of High-strength compression resistant type electric heater

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KR102280342B1 (en) * 2019-01-04 2021-07-21 주식회사 비아트론 Planar Heater for Thermal Process of Substrate
KR102346328B1 (en) * 2020-04-12 2022-01-04 주식회사 비아트론 Planar Heater for Thermal Process of Substrate

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KR20040080692A (en) * 2003-03-13 2004-09-20 (주)한경시화공장 sealing structure of sheath heater for defrosting
KR20110131560A (en) * 2010-05-31 2011-12-07 주식회사 테라세미콘 Boat for processing a substrate

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KR20040080692A (en) * 2003-03-13 2004-09-20 (주)한경시화공장 sealing structure of sheath heater for defrosting
KR200344847Y1 (en) * 2003-12-11 2004-03-18 (주)한진테크 Heater assembly for floor heated electrically
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195238A (en) * 2018-10-15 2019-01-11 江苏东方电热器制造有限公司 A kind of High-strength compression resistant type electric heater
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