KR101867273B1 - The apparatus of loading unit for electrical part and the method of controlling that - Google Patents

Abstract

The present invention relates to a load plate that is configured to load a carrier plate capable of accommodating a plurality of electronic components, a body portion configured to support the load plate, and a load plate, And a vibrating part configured to transmit vibration in a tilted direction to the rod plate so as to be aligned with the plate, and a control method thereof.
The electronic component loading unit and its control method according to the present invention can simplify the configuration and reduce the manufacturing cost, and can shorten the process time by a simplified process.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a loading unit for electronic parts and a control method thereof,

The present invention relates to a loading unit for an electronic part and a control method thereof, and more particularly to a unit for loading a plurality of electronic parts onto a carrier plate and a control method thereof.

Electronic devices such as TVs, smart phones and computers use chips for various electronic products such as transistors, switching elements and capacitors. Particularly, in recent years, in order to increase the circuit area efficiency of electronic devices, chips for electronic parts used in electronic devices are required to be miniaturized.

As such chips for electronic products are miniaturized, it is necessary to arrange them in accordance with necessary processes when mass-produced chips are miniaturized. At this time, it is necessary to align chips in a predetermined direction or arrangement.

For example, a plurality of chips must be aligned in a predetermined direction for post-processing or packaging of the chips. On the other hand, a conventional device for aligning chips for electronic parts is disclosed in " Korean Patent Laid-Open No. 10-2009-0114183 "

However, such a conventional technique requires much time for aligning a plurality of chips arranged on a load plate contacting a carrier plate on a carrier plate, and there is a problem that the configuration of the alignment unit is complicated, .

Korea Patent Publication No. 10-2009-0114183

An object of the present invention is to provide a loading unit for an electronic part and a control method thereof for solving the problem that the operation time of the conventional electronic part alignment apparatus is long and the manufacturing cost of the apparatus is increased due to a complicated configuration.

As a means for solving the above problems, there is provided a load plate, comprising: a load plate configured to load a carrier plate capable of accommodating a plurality of electronic components; a body unit configured to support the load plate; And a vibrating portion configured to transmit vibration in a tilted direction to the rod plate so as to be able to move and align with the carrier plate.

Here, the vibrating portion is composed of a plurality of vibrating portions, and each vibrating portion can be configured to transmit vibrations in different directions so that a plurality of electronic components can move in a plurality of directions on the rod plate.

The plurality of vibrating parts can be selectively driven so as to select the moving direction when moving the plurality of electronic parts.

At least one of the plurality of vibrating portions may be installed to be inclined in the first direction so that a plurality of the electronic components in the rod plate can move to the carrier plate in the first direction.

At least another of the plurality of vibrating portions may be inclined toward the second direction so as to move the plurality of electronic components in a second direction opposite to the first direction on the rod plate.

At this time, the plurality of vibrating parts are constituted by a pair, and a plurality of electronic parts can be installed to be inclined in opposite directions so as to be movable in opposite directions on the rod plate.

The rod plate may be configured so that the carrier plate is provided on the reciprocating path of the plurality of electronic parts so that the plurality of electronic parts can be loaded on the carrier plate while moving in the opposite direction.

The plurality of vibrating units may include a first vibrating unit installed at a predetermined angle to one side of the rod plate and a second vibrating unit installed at a predetermined angle to the other side of the rod plate.

At this time, the predetermined angle may be from 30 degrees to 60 degrees so that the plurality of electronic parts can be quickly moved and loaded on the carrier plate.

Further, the load plate may be provided in the horizontal direction.

The plurality of vibrating members are installed to be inclined in the longitudinal direction of the rod plate. The carrier plate is provided at the central portion of the rod plate. The plurality of electronic components are densely moved while moving in the longitudinal direction, The width of the center portion may be formed to be narrower than both ends.

The load plate may further include a plurality of elastic members connecting the body portion and the rod plate so that the vibrations of the vibrating portion may be transmitted while being transmitted.

In this case, the plurality of elastic members may be configured to include a curved surface portion or a bent portion so that vibration in a tilted direction of the vibrating portion can be transmitted while being transmitted to the rod plate.

A loading step of loading a plurality of electronic parts chips on the load plate, a loading step of loading a plurality of electronic parts chips on the load plate, a loading step of loading a plurality of electronic parts chips on the load plate, A moving step of generating a tilted vibration on the rod plate to move a plurality of electronic parts in a horizontal direction while a part thereof is received in a carrier plate, a loading step of separating the carrier plate from the rod plate and transferring the carrier plate to the outside, A unit control method can be provided.

At this time, the loading step is carried on one side of the rod plate, and the moving step can move the plurality of electronic parts from one side to the other side of the rod plate via the carrier plate.

On the other hand, the combining step or the conveying step is repeatedly performed, and the loading step may load the electronic part on the rod plate in a number corresponding to the number of the electronic parts conveyed outward in the conveying step.

The method further includes a reception determining step of determining whether the carrier plate has been accommodated by a predetermined number or more after the movement step, and switching the vibration direction so that the moving direction is reversed when the number is less than a predetermined number , The moving step after the switching step can be performed again.

And a loading position determining step of determining whether there is remaining electronic parts on one side or the other side of the load plate after the combining step, and the loading step is configured to further load the electronic parts on the side where the remaining electronic parts are located .

On the other hand, the moving step can be performed by generating a vibration in a direction inclined by 30 to 60 degrees in a direction in which a plurality of electronic components move.

The electronic component loading unit and its control method according to the present invention can simplify the structure and reduce the manufacturing cost, and can shorten the time required for the process by a simplified process.

1 is a perspective view of a loading unit for an electronic part according to a first embodiment of the present invention.
2 is a side view of the first embodiment.
3 is an operational state diagram when the component is moved in the first direction.
4 is an operational state diagram when the component is moved in the second direction.
5 is a perspective view of the second embodiment.
6 is a flowchart of a loading unit control method for electronic parts according to a third embodiment of the present invention.

Hereinafter, a loading unit for an electronic part P and a control method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the embodiments, the names of the respective components may be referred to as other names in the art. However, if there is a functional similarity and an equivalence thereof, the modified structure can be regarded as an equivalent structure. In addition, reference numerals added to respective components are described for convenience of explanation. However, the contents of the drawings in the drawings in which these symbols are described do not limit the respective components to the ranges within the drawings. Likewise, even if the embodiment in which the structure on the drawing is partially modified is employed, it can be regarded as an equivalent structure if there is functional similarity and uniformity. Further, in view of the level of ordinary skill in the art, if it is recognized as a component to be included, a description thereof will be omitted.

It should be noted that the electronic products described below can be various kinds of electronic parts (P) used for mass production of semiconductor processes such as MLCC and electronic devices.

Hereinafter, a loading unit for an electronic part (P) according to a first embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4. FIG.

1 is a perspective view of a loading unit for an electronic part (P) according to a first embodiment of the present invention, and Fig. 2 is a side view of the first embodiment.

The loading unit for the electronic component P according to the first embodiment of the present invention includes a body 100, a fixed frame 200, a connecting part 230, a vibration part 500, a load plate 300, A carrier plate 400, a carrier plate clamp 220, a stopper 210, and a sensor unit 600.

The body part 100 is configured to support a loading unit for the electronic part P. [ The body 100 has a size similar to that of the fixed frame 200 and the rod plate 300 to be described later. The body 100 has a structure in which the lower side is fixed to the ground or an external structure Can be fixedly installed.

The fixed frame 200 is configured so as to transmit the vibration generated in the vibration unit 500 to a necessary place and not to be transmitted to unnecessary parts. The fixed frame 200 is positioned between the rod plate 300 and the body 100 and can be connected to the rod plate 300 and the body 100. The stationary frame 200 may include a vibration unit 500, a stopper 210, a carrier plate clamp 220, and the like, which will be described later. The fixed frame (200) and the body part (100) are connected by the vibrating part (500). One end of the vibration unit 500 is connected to the fixed frame 200 and the other end is connected to the body 100.

The connecting portion 230 is configured to stably maintain the posture of the stationary frame 200, the rod plate 300, and the like even if vibration occurs. The connection part 230 is connected to the body part 100 at an outer angle of the fixed frame 200. At this time, a connection part 230 connecting the body part 100 is provided around the fixed frame 200. At this time, the connection part 230 includes a curved part or a bent part so that the stationary frame 200 stably maintains its posture even if vertical and horizontal vibrations occur. The connection part 230 may be formed of a plate spring having a predetermined width.

The load plate 300 is configured such that a plurality of electronic parts P are stacked on one side and can be accommodated in the receiving space 410 of the rod plate 300. The load plate 300 is provided on the uppermost side, and the moving surface of the electronic part P may be flat without being inclined. The rod plate 300 may have an elongated shape in the longitudinal direction, and a carrier plate 400, which will be described later, may be coupled to the center of the rod plate 300 to form one moving surface. At this time, the first area 310 may be provided on one side of the carrier plate 400, and the loading space of the second area 320 may be provided on the other side.

The electronic component P on the rod plate 300 can be moved from the first region 310 to the second region 320 through the region of the carrier plate 400 by driving the vibrating portion 500 . Conversely, the second region 320 may be moved to the first region 310 after passing through the carrier plate 400 region.

The moving surface of the rod plate 300 can be configured by minimizing the top and step of the mesh type separating wall partitioning the receiving space 410 when the carrier plate 400 is fastened. At this time, when the electronic parts P move from the rod plate 300 to the carrier plate 400 side or vice versa, the phenomenon of being caught by the step when moving from the carrier plate 400 side to the rod plate 300 side can be minimized, .

The carrier plate 400 is provided to align a plurality of electronic components P randomly loaded in the first area 310 or the second area 320 of the load plate 300. The carrier plate 400 is configured such that a part of the carrier plate 400 is inserted into the groove of the rod plate 300 formed at the center of the rod plate 300 so that the plurality of electronic parts P are received and accommodated in the accommodation space 410. The carrier plate 400 may be configured such that the receiving space 410 is divided by the sorting wall formed in a mesh shape and one electronic part P is accommodated in each receiving space 410. When the carrier plate 400 is mounted, the load plate 300 moves in the lateral direction from the lower side of the load plate 300 and is seated on the stationary frame 200. After the seating, the rod plate 300 is lowered and engaged with the carrier plate 400. Then, when the electronic part P is accommodated in all the accommodating spaces 410, it is detached from the load plate 300 and moved to the outside of the loading unit for the next process.

The carrier plate clamp 220 is configured to engage the carrier plate 400 with the load plate 300. The carrier plate clamp 220 is configured to lift the entire load plate 300 using an actuator provided in a vertical direction. The carrier plate clamp 220 can be lowered to engage the carrier plate 400 after the carrier plate 400 is pulled into the locked position. That is, although the fixed frame 200 and the carrier plate 400 are connected to each other, the distance between them can be adjusted by an actuator. Since the carrier plate clamp 220 may be a generally known structure such as pneumatic, hydraulic, or electromagnetic type, detailed description thereof will be omitted.

The stopper 210 is configured to be fixed at a desired position when the carrier plate 400 is retracted. The carrier plate 400 is provided at four positions around the rim of the carrier plate 400 so that the carrier plate 400 can be engaged with the rod plate 300 at a predetermined position. Each of the stoppers 210 may include an inclined portion 330 at an upper end thereof so that the carrier plate 400 can be brought into a predetermined position when the carrier plate 400 is disposed at a wrong position.

The structure of the carrier plate clamp 220 and the stopper 210 is merely an example and may be variously configured to couple the carrier plate 400 and the rod plate 300. The carrier plate 400 400 to a predetermined position.

The vibrating unit 500 is configured to generate vibrations and is configured to transmit vibration by being fixedly installed between the fixed frame 200 and the body 100 as described above. The vibration unit 500 may have various configurations such as a vibrator using an electromagnetic coil and an actuator using a fluid so as to generate vibration. The vibration unit 500 may include a first vibration unit 510 and a second vibration unit 520.

The first vibrating part 510 moves the plurality of electronic parts P in the first direction d1 which is the longitudinal direction of the rod plate 300 moving from the first area 310 to the second area 320 Respectively.

The second vibrating unit 520 is configured to be movable in a second direction d2 which is the opposite direction of the first direction d1.

The first vibrating unit 510 and the second vibrating unit 520 may be installed at a predetermined distance in the longitudinal direction of the rod plate 300. The first vibrating part 510 may be installed to be inclined at a predetermined angle in the longitudinal direction so that the direction of vibration may include the vector in the first direction d1. That is, the first vibrating unit 510 and the second vibrating unit 520 may be symmetrically configured with respect to a plane perpendicular to the rod plate 300. That is, the direction of the vibration may be connected to the fixed frame 200 at a predetermined angle.

The second vibrating unit 520 may be installed on the fixed frame 200 at a predetermined angle in a direction opposite to the first vibrating unit 510.

The vibration state of the vibration unit 500 will be described in detail with reference to FIGS. 3 to 4. FIG.

The sensor unit 600 may include an electronic part (P) detection sensor 610 and an accommodation part detection sensor 620. The electronic part P sensing sensor 610 can determine whether the electronic part P is loaded in the first area 310 or the second area 320 on the rod plate 300. [ The sensor unit 600 may include an acceptance sensor 620 and may determine whether the electronic components P are accommodated in all the accommodating spaces 410 of the carrier plate 400. The sensor unit 600 may include an infrared sensor, a video camera, and the like.

Hereinafter, the operation of the loading unit for the electronic part P will be described with reference to Figs. 3 and 4. Fig.

Fig. 3 shows a state in which the electronic part P is moved in the first direction d1, and Fig. 4 shows the state when the electronic part P is moved in the second direction d2.

As shown in the figure, the first vibration unit 510 and the second vibration unit 520, which are inclined in the longitudinal direction when they are moved in the respective directions, are driven.

The first vibrating unit 510 installed in a tilted state in the direction in which the first vibrating unit 510 is installed in the first direction d1 vibrates, The applied force has a vector in the z direction and a vector in the y direction. Accordingly, such vibration is transmitted to the rod plate 300, and as the vibration is continuously transmitted, the plurality of electronic parts P are gradually moved from the first area 310 to the second area 320 side. At this time, as the electronic component P moves, the receiving space 410 located in the left side of the receiving space 410 of the carrier plate 400 is sequentially accommodated. When vibration is continuously applied to all the electronic parts P in the second area 320, the sensor part 600 senses the vibration and stops the vibration.

Conversely, when the electronic part P is moved from the second area 320 to the first area 310, the operating state of the second vibrating part 520 is opposite to the moving direction of the electronic part P in the first direction d1, . The first vibrating part 510 is configured to transmit a vibration inclined at a predetermined angle to the longitudinal direction of the rod plate 300, that is, toward the first direction d1, It is configured to be capable of transmitting a vibration inclined at a predetermined angle to the side opposite to the eccentric portion 510, that is, toward the second direction d2. At this time, the predetermined angle may be 30 ° to 60 ° with the fixed frame 200. At this time, the moving speed of the electronic component P is determined on the rod plate 300 according to the angle, and the distance of movement of the electronic component P is set smaller than the length of one receiving space 410 of the carrier plate 400 . The inclined angle of the first vibrating part 510 and the second vibrating part 520 may be 45 degrees so that the electronic part P can be accommodated in the accommodating space 410 while moving at an appropriate speed.

The sensor unit 600 senses the position where the electronic component P is currently mounted and detects the position of the first vibrating unit 510 when the first component 310 is in the second region 320. [ The second vibrating unit 520 may be driven to move to the first region 310 when it is sensed that the second region 320 is present.

On the other hand, when the electronic part P is accommodated in all the accommodating spaces 410 by one movement in the first direction d1 or the second direction d2, the movement of the electronic part P is completed, Can be performed.

However, if it is not accommodated in all the accommodating spaces 410 by a single movement, it is detected whether the carrier plate 400 is fully loaded using the accommodating portion detecting sensor 620, and if the empty accommodating space 410 is present, P may be moved in the other direction to be received within a predetermined range of the pre-accommodation space 410, and then the carrier plate 400 may be removed. At this time, it is deemed that the case of accepting 98% or more in the entire accommodating space 410 is satisfied, and when the amount is 98% or less, the electronic part P can be moved backward so as to fill the empty accommodating space 410 . On the other hand, the acceptance range of 98% is an example, and can be set to various values depending on the case.

Meanwhile, reception of the measurement value of the sensor unit 600 and control of the vibration unit 500 may be performed by a separate control unit (not shown).

5 is a perspective view of the second embodiment.

As shown in the figure, the carrier plate 400 is coupled to the center portion of the rod plate 300 and the inclined portion 330 may be provided on both sides of the carrier plate 400.

The inclined portion 330 may be configured to have a narrower width from the both sides of the rod plate 300 to the side of the carrier plate 400 and may be configured to be equal to or slightly larger than the width of the carrier plate 400. The inclined portion 330 allows the plurality of electronic components P to be densely packed so that the inclined portion 330 can be easily accommodated in the accommodating space 410 when the plurality of electronic components P are moved toward the carrier plate 400. [

6 is a flowchart of a loading unit control method for an electronic part (P) according to a third embodiment of the present invention.

The control method of the loading unit for the electronic part P according to the third embodiment of the present invention includes the combining step S100, the loading step S200, the shifting step S300, the acceptance determining step S400, A switching step S500, a transferring step S600, and a loading position determining step S700.

The coupling step SlOO corresponds to a step of moving the carrier plate 400 so that the empty carrier plate 400 transferred from the outside can be engaged with the load plate 300. [ At this time, when the carrier plate 400 moves to a predetermined position, the carrier plate 400 and the load plate 300 are fixed using the carrier plate clamp 220.

The carrier plate 400 may be disposed in a predetermined position by entering the width direction of the rod plate 300 and may be structurally supported on the rod plate 300 in the longitudinal direction when engaged. At this time, the stopper 210 or the support pin may be raised to restrict the movement in the width direction to prevent the detachment in the width direction.

The loading step S200 corresponds to a step of loading a plurality of electronic parts P on one side of the rod plate 300 in a state where the carrier plate 400 is coupled to the rod plate 300. [ A plurality of electronic components P supplied from outside are randomly stacked on the load plate 300.

 The moving step S300 corresponds to the step of moving the plurality of electronic parts P in the horizontal direction by generating vibration in an inclined direction on the rod plate 300. [ The plurality of electronic components P loaded on one side of the rod plate 300 are moved gradually from the upper side of the accommodation space 410 of the carrier plate 400 while being moved The component P is received and the remaining electronic component P passes through the carrier plate 400 and moves to the other side of the rod plate 300. In the moving step S300, the moving path of the plurality of electronic parts P varies depending on the direction of the generated vibration. Therefore, it can be performed by selectively driving the plurality of vibration units 500 installed in different directions so as to generate a plurality of vibrations.

The acceptance judgment step S400 judges whether the electronic part P has been accommodated in the accommodation space 410 in an appropriate number after the movement step S300. At this time, even if there is the empty accommodation space 410 of about 1 to 2%, it can be judged that it is accommodated in the entire accommodation space 410 for shortening the entire process time.

The switching step S500 may move the plurality of electronic parts P in the opposite direction to the moving step S300 if the predetermined acceptance rate is not satisfied in the acceptance judgment step S400 To another vibrating unit 500 so that the driving force is transmitted to the other vibrating unit 500. After the switching step S500, the moving step S300 and the acceptance judgment step S400 may be performed again. And can be repeatedly performed until the predetermined accommodation rate is satisfied. When the electronic component P is moved in the moving step S300, it is performed by generating vibration in a tilted direction with respect to the rod plate 300, and the tilted angle may be from 30 degrees to 60 degrees.

The transfer step S600 corresponds to the step of separating the carrier plate 400 from the load plate 300 in a state where a plurality of electronic parts P are accommodated in the accommodating space 410 and transferring the carrier plate 400 to the outside. The carrier plate 400 is transferred in a state in which the electronic parts P are aligned so that the next process can be used.

On the other hand, the combining step (S100) to the transferring step (S600) may be repeatedly performed. On the other hand, the loading step (S200) may load the electronic part (P) adjacent to the number taken out together with the carrier plate (400) to the load plate by the transfer step (S600) from the second iteration. At this time, if the electronic component P is repeatedly loaded, the remaining electronic components P may accumulate to the outside of the load plate 300, and if it is too small, the number of electronic components P to be aligned with the carrier plate 400 becomes smaller. Therefore, the number of the accommodating spaces 410 provided in the carrier plate 400 can be further increased.

In the stacking position determination step S700, the number of iterations of the movement step S300 is variously determined and the positions of the remaining electronic components P are selectively located. Therefore, ) Is loaded on the board. The stacking position determination step S700 may be performed from the second iteration if the entire step is repeated. Depending on the number of times the entire process is performed, the position where the remaining plurality of electronic parts P are positioned may be one side on the rod plate 300 or the other side. At this time, a plurality of additional electronic components P to be loaded corresponds to the step of sensing the position where the remaining electronic components P are positioned so as to be stacked together where the remaining electronic components P are located.

On the other hand, the above-mentioned one side is an example, and can be directly loaded on the carrier plate 400. [ In this case, since the movement starting point of the plurality of electronic parts P becomes the carrier plate 400 in the moving step S300, a plurality of electronic parts P can be accommodated in the plurality of accommodating spaces 410 simultaneously with the start .

The above-described loading unit for the electronic part P and the control method thereof include the vibration unit 500 capable of generating the vibration in the tilted direction to move the load plate 300 itself without tilting, P can be accommodated in the accommodating space 410, simplifying the equipment, and simplifying the vibration unit 500 to be accommodated only by horizontally moving, thereby shortening the processing time.

100: Body part 200: Fixed frame
210: stopper,
220: Carrier plate clamp
230: Connection
500: vibration section 510: first vibration section 520: second vibration section
300: load plate
310: first region 320: second region 330: inclined portion
d1: first direction d2: second direction
400: carrier plate
410: accommodation space 600: sensor part
610: Electronic part detection sensor 620: Accepted part detection sensor
P: Electronic parts
S100: Coupling step
S200: Loading step
S300:
S400: Acceptance determination step
S500: Switching step
S600: Transfer step S700: Load position determination step

Claims (19)

A load plate configured to load a carrier plate capable of accommodating a plurality of electronic components;
A fixed frame configured to support the load plate;
A body portion configured to support the fixed frame; And
And a vibrating portion configured to transmit vibration in a tilted direction to the rod plate so that the plurality of electronic components move on the rod plate and can be aligned with the carrier plate,
The vibrating unit may include:
A first vibrating part and a second vibrating part, one side of which is connected to the fixed frame, and the other side of which is connected to the body part,
The first vibrating unit is installed to be inclined toward the first direction so as to move the plurality of electronic parts in the first direction,
Wherein the second vibrating unit is installed to be inclined toward the second direction so as to move the plurality of electronic components in a second direction opposite to the first direction,
And a plurality of connection portions constituted by plate springs configured to connect the fixed frame and the body portion and bent at least partially in the first direction or the second direction. delete delete delete delete delete The method according to claim 1,
Wherein the rod plate includes:
Wherein the carrier plate is provided on a reciprocating path of the plurality of electronic parts so that the plurality of electronic parts can be loaded on the carrier plate during movement in the opposite direction. 8. The method of claim 7,
Wherein an inclined angle of the first oscillating part is symmetrical with an inclined angle of the second oscillating part. 9. The method of claim 8,
The angle of inclination of the first vibrating part
Wherein the plurality of electronic parts are 30 to 60 degrees so that the plurality of electronic parts can be quickly moved and loaded on the carrier plate. The method according to claim 1,
And the load plate is provided in a horizontal direction. 11. The method of claim 10,
Wherein the carrier plate is provided at a central portion of the rod plate,
Wherein the width of the central portion of the load plate is narrower than that of both ends so that the plurality of electronic components can be densely moved while being moved in the longitudinal direction and moved and stacked on the carrier plate. delete 11. The method of claim 10,
Wherein the plurality of connection portions are spaced apart from each other in the longitudinal direction of the rod plate and are installed in parallel to each other. delete delete delete delete delete delete

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