KR101862298B1 - 레이저 방사 수단에 의한 재료 가공 장치 - Google Patents

레이저 방사 수단에 의한 재료 가공 장치 Download PDF

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Publication number
KR101862298B1
KR101862298B1 KR1020177023993A KR20177023993A KR101862298B1 KR 101862298 B1 KR101862298 B1 KR 101862298B1 KR 1020177023993 A KR1020177023993 A KR 1020177023993A KR 20177023993 A KR20177023993 A KR 20177023993A KR 101862298 B1 KR101862298 B1 KR 101862298B1
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KR
South Korea
Prior art keywords
plate
shaped
optical system
laser
optical elements
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KR1020177023993A
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English (en)
Korean (ko)
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KR20170106475A (ko
Inventor
안드레아스 루돌프
마틴 쇤레버
Original Assignee
프레시텍 게엠베하 운트 코 카게
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Publication of KR20170106475A publication Critical patent/KR20170106475A/ko
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Publication of KR101862298B1 publication Critical patent/KR101862298B1/ko

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/02—Refractors for light sources of prismatic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0972—Prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G02B27/4255—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application for alignment or positioning purposes

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
KR1020177023993A 2015-01-28 2016-01-27 레이저 방사 수단에 의한 재료 가공 장치 KR101862298B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015101263.4A DE102015101263B4 (de) 2015-01-28 2015-01-28 Vorrichtung zur Materialbearbeitung mittels Laserstrahlung
DE102015101263.4 2015-01-28
PCT/EP2016/051702 WO2016120327A1 (de) 2015-01-28 2016-01-27 Vorrichtung zur materialbearbeitung mittels laserstrahlung

Publications (2)

Publication Number Publication Date
KR20170106475A KR20170106475A (ko) 2017-09-20
KR101862298B1 true KR101862298B1 (ko) 2018-06-29

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KR1020177023993A KR101862298B1 (ko) 2015-01-28 2016-01-27 레이저 방사 수단에 의한 재료 가공 장치

Country Status (10)

Country Link
US (1) US10444521B2 (de)
EP (1) EP3250958B1 (de)
JP (1) JP6347898B2 (de)
KR (1) KR101862298B1 (de)
CN (1) CN107646093B (de)
DE (1) DE102015101263B4 (de)
ES (1) ES2713184T3 (de)
PL (1) PL3250958T3 (de)
TR (1) TR201818898T4 (de)
WO (1) WO2016120327A1 (de)

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DE102017001658A1 (de) * 2017-02-21 2018-08-23 Precitec Gmbh & Co. Kg Vorrichtung zur materialbearbeitung mit einem laserstrahl entlang einer bearbeitungsrichtung und verfahren zur materialbearbeitung mit einem laserstrahl
EP3412400A1 (de) 2017-06-09 2018-12-12 Bystronic Laser AG Strahlformer und verwendung davon, vorrichtung zur laserstrahlbehandlung eines werkstücks und verwendung davon, verfahren zur laserstrahlbehandlung eines werkstücks
EP3450083B1 (de) * 2017-09-04 2021-04-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur materialbearbeitung
EP3517241A1 (de) 2018-01-29 2019-07-31 Bystronic Laser AG Optische vorrichtung zum formen eines elektromagnetischen wellenstrahls und verwendung davon, strahlbehandlungsvorrichtung und verwendung davon sowie strahlbehandlungsverfahren
DE102018205545A1 (de) * 2018-04-12 2019-10-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung, Laserbearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks
EP3708289A1 (de) 2019-03-11 2020-09-16 FRONIUS INTERNATIONAL GmbH Strahlformungs- und ablenkoptik für eine laserbearbeitungsvorrichtung und verfahren zur bearbeitung eines werkstücks mit hilfe eines laserstrahls
DE102019115554A1 (de) 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
DE102019122064A1 (de) 2019-08-16 2021-02-18 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks, Teilesatz für eine Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
DE102019217754A1 (de) * 2019-11-18 2021-05-20 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Laserschweißen eines Werkstücks, mit Strahlformung mittels eines Axicons, und optische Apparatur
TWI772937B (zh) * 2020-10-26 2022-08-01 財團法人工業技術研究院 雷射光束整形裝置、雷射加工系統以及雷射焊接互鎖結構
EP4056309A1 (de) 2021-03-09 2022-09-14 Bystronic Laser AG Vorrichtung und verfahren zum laserschneiden eines werkstücks und erzeugen von werkstückteilen
US20240207974A1 (en) 2021-05-04 2024-06-27 Powerphotonic Ltd. Beam Shaper Optic For Laser Material Processing
CN114740615B (zh) * 2022-04-11 2023-06-30 南京邮电大学 一种可调太赫兹衰减器及其制备方法

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US20050098260A1 (en) 2003-10-21 2005-05-12 Chen Jie W. Method and apparatus for heating plastics by means of laser beams

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Also Published As

Publication number Publication date
US20170371166A1 (en) 2017-12-28
ES2713184T3 (es) 2019-05-20
EP3250958A1 (de) 2017-12-06
KR20170106475A (ko) 2017-09-20
DE102015101263A1 (de) 2016-07-28
WO2016120327A1 (de) 2016-08-04
CN107646093B (zh) 2019-07-30
JP6347898B2 (ja) 2018-06-27
CN107646093A (zh) 2018-01-30
EP3250958B1 (de) 2018-12-05
US10444521B2 (en) 2019-10-15
DE102015101263B4 (de) 2016-12-15
JP2018505782A (ja) 2018-03-01
TR201818898T4 (tr) 2019-01-21
PL3250958T3 (pl) 2019-07-31

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