TR201818898T4 - Lazer işinlama vasitasi i̇le materyal i̇şleme i̇çi̇n ci̇haz. - Google Patents
Lazer işinlama vasitasi i̇le materyal i̇şleme i̇çi̇n ci̇haz. Download PDFInfo
- Publication number
- TR201818898T4 TR201818898T4 TR2018/18898T TR201818898T TR201818898T4 TR 201818898 T4 TR201818898 T4 TR 201818898T4 TR 2018/18898 T TR2018/18898 T TR 2018/18898T TR 201818898 T TR201818898 T TR 201818898T TR 201818898 T4 TR201818898 T4 TR 201818898T4
- Authority
- TR
- Turkey
- Prior art keywords
- material processing
- laser illumination
- focusing
- shaped
- sector
- Prior art date
Links
- 238000005286 illumination Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/02—Refractors for light sources of prismatic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0972—Prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
- G02B27/4255—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application for alignment or positioning purposes
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Buluş, bir lazer ışınının (14) bir iş parçası üzerine (18) odaklanması için bir odaklama optiğine (15) ve sektör şekilli perdahlı yüzeylerden meydana gelen bir dairesel desene sahip olan bir yüzeyi içeren en azından bir plaka şekilli optik eleman (10) ile yoğunluk dağılımının ayarlanması için bir ayarlama optiğine (20) sahip cihaz ile ilgilidir.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015101263.4A DE102015101263B4 (de) | 2015-01-28 | 2015-01-28 | Vorrichtung zur Materialbearbeitung mittels Laserstrahlung |
Publications (1)
Publication Number | Publication Date |
---|---|
TR201818898T4 true TR201818898T4 (tr) | 2019-01-21 |
Family
ID=55299439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TR2018/18898T TR201818898T4 (tr) | 2015-01-28 | 2016-01-27 | Lazer işinlama vasitasi i̇le materyal i̇şleme i̇çi̇n ci̇haz. |
Country Status (10)
Country | Link |
---|---|
US (1) | US10444521B2 (tr) |
EP (1) | EP3250958B1 (tr) |
JP (1) | JP6347898B2 (tr) |
KR (1) | KR101862298B1 (tr) |
CN (1) | CN107646093B (tr) |
DE (1) | DE102015101263B4 (tr) |
ES (1) | ES2713184T3 (tr) |
PL (1) | PL3250958T3 (tr) |
TR (1) | TR201818898T4 (tr) |
WO (1) | WO2016120327A1 (tr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017001658A1 (de) * | 2017-02-21 | 2018-08-23 | Precitec Gmbh & Co. Kg | Vorrichtung zur materialbearbeitung mit einem laserstrahl entlang einer bearbeitungsrichtung und verfahren zur materialbearbeitung mit einem laserstrahl |
EP3412400A1 (en) | 2017-06-09 | 2018-12-12 | Bystronic Laser AG | Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece |
EP3450083B1 (de) | 2017-09-04 | 2021-04-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und verfahren zur materialbearbeitung |
EP3517241A1 (en) | 2018-01-29 | 2019-07-31 | Bystronic Laser AG | Optical device for shaping an electromagnetic wave beam and use thereof, beam treatment device and use thereof, and beam treatment method |
DE102018205545A1 (de) * | 2018-04-12 | 2019-10-17 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung, Laserbearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks |
EP3708289A1 (de) | 2019-03-11 | 2020-09-16 | FRONIUS INTERNATIONAL GmbH | Strahlformungs- und ablenkoptik für eine laserbearbeitungsvorrichtung und verfahren zur bearbeitung eines werkstücks mit hilfe eines laserstrahls |
DE102019115554A1 (de) | 2019-06-07 | 2020-12-10 | Bystronic Laser Ag | Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks |
DE102019122064A1 (de) | 2019-08-16 | 2021-02-18 | Bystronic Laser Ag | Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks, Teilesatz für eine Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks |
DE102019217754A1 (de) * | 2019-11-18 | 2021-05-20 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Laserschweißen eines Werkstücks, mit Strahlformung mittels eines Axicons, und optische Apparatur |
TWI772937B (zh) * | 2020-10-26 | 2022-08-01 | 財團法人工業技術研究院 | 雷射光束整形裝置、雷射加工系統以及雷射焊接互鎖結構 |
EP4056309A1 (de) | 2021-03-09 | 2022-09-14 | Bystronic Laser AG | Vorrichtung und verfahren zum laserschneiden eines werkstücks und erzeugen von werkstückteilen |
WO2022233873A1 (en) | 2021-05-04 | 2022-11-10 | Powerphotonic Ltd | Beam shaper optic for laser material processing |
CN114740615B (zh) * | 2022-04-11 | 2023-06-30 | 南京邮电大学 | 一种可调太赫兹衰减器及其制备方法 |
Family Cites Families (21)
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JPS5023617B1 (tr) * | 1970-03-02 | 1975-08-08 | ||
US3726595A (en) * | 1970-01-07 | 1973-04-10 | Canon Kk | Method for optical detection and/or measurement of movement of a diffraction grating |
JPS5023617A (tr) | 1973-06-29 | 1975-03-13 | ||
DE2821883C2 (de) | 1978-05-19 | 1980-07-17 | Ibm Deutschland Gmbh, 7000 Stuttgart | Vorrichtung zur Materialbearbeitung |
WO1995018984A1 (en) * | 1994-01-07 | 1995-07-13 | Coherent, Inc. | Apparatus for creating a square or rectangular laser beam with a uniform intensity profile |
US5548444A (en) * | 1994-07-06 | 1996-08-20 | Hughes Danbury Optical Systems, Inc. | Optical beam homogenizing apparatus and method |
DE4430220C2 (de) | 1994-08-25 | 1998-01-22 | Fraunhofer Ges Forschung | Verfahren zur Steuerung der Laserstrahlintensitätsverteilung auf der Oberfläche zu bearbeitender Bauteile |
JP3686317B2 (ja) * | 2000-08-10 | 2005-08-24 | 三菱重工業株式会社 | レーザ加工ヘッド及びこれを備えたレーザ加工装置 |
DE50304494D1 (de) * | 2003-10-21 | 2006-09-14 | Leister Process Tech | Verfahren und Vorrichtung zum Erwärmen von Kunststoffen mittels Laserstrahlen |
US7637639B2 (en) * | 2005-12-21 | 2009-12-29 | 3M Innovative Properties Company | LED emitter with radial prismatic light diverter |
JP2007245194A (ja) * | 2006-03-16 | 2007-09-27 | Ricoh Opt Ind Co Ltd | 光溶着用光学ユニットおよび光溶着装置および光溶着方法 |
JP5158439B2 (ja) * | 2006-04-17 | 2013-03-06 | 株式会社ニコン | 照明光学装置、露光装置、およびデバイス製造方法 |
US8237085B2 (en) | 2006-11-17 | 2012-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, and laser irradiation method |
EP2478289B1 (en) * | 2009-09-18 | 2013-06-05 | Koninklijke Philips Electronics N.V. | Luminaire and optical component |
DE102011113980A1 (de) | 2011-09-21 | 2013-03-21 | Karlsruher Institut für Technologie | Linsensystem mit veränderbarer Refraktionsstärke |
CN104136952B (zh) | 2011-12-09 | 2018-05-25 | 朗美通运营有限责任公司 | 用于改变激光束的光束参数积的光学器件和方法 |
DE102012008940B4 (de) | 2012-05-08 | 2022-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Fügen von mindestens zwei Werkstücken |
JP6159513B2 (ja) | 2012-09-04 | 2017-07-05 | 株式会社アマダホールディングス | レーザ加工ヘッド |
EP2705812A1 (de) | 2012-09-05 | 2014-03-12 | Universität zu Lübeck | Vorrichtung zum Laserschneiden innerhalb transparenter Materialien |
DE102013102442B4 (de) * | 2013-03-12 | 2014-11-27 | Highyag Lasertechnologie Gmbh | Optische Vorrichtung zur Strahlformung |
DE102014105941A1 (de) | 2013-05-27 | 2014-11-27 | Scansonic Mi Gmbh | Laserstrahlschweißverfahren zur Reduktion thermomechanischer Spannungen |
-
2015
- 2015-01-28 DE DE102015101263.4A patent/DE102015101263B4/de not_active Expired - Fee Related
-
2016
- 2016-01-27 EP EP16702682.2A patent/EP3250958B1/de active Active
- 2016-01-27 US US15/547,036 patent/US10444521B2/en active Active
- 2016-01-27 KR KR1020177023993A patent/KR101862298B1/ko active IP Right Grant
- 2016-01-27 JP JP2017539636A patent/JP6347898B2/ja active Active
- 2016-01-27 TR TR2018/18898T patent/TR201818898T4/tr unknown
- 2016-01-27 PL PL16702682T patent/PL3250958T3/pl unknown
- 2016-01-27 WO PCT/EP2016/051702 patent/WO2016120327A1/de active Application Filing
- 2016-01-27 ES ES16702682T patent/ES2713184T3/es active Active
- 2016-01-27 CN CN201680017716.XA patent/CN107646093B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170106475A (ko) | 2017-09-20 |
KR101862298B1 (ko) | 2018-06-29 |
DE102015101263B4 (de) | 2016-12-15 |
PL3250958T3 (pl) | 2019-07-31 |
ES2713184T3 (es) | 2019-05-20 |
US10444521B2 (en) | 2019-10-15 |
WO2016120327A1 (de) | 2016-08-04 |
EP3250958A1 (de) | 2017-12-06 |
CN107646093A (zh) | 2018-01-30 |
DE102015101263A1 (de) | 2016-07-28 |
EP3250958B1 (de) | 2018-12-05 |
JP2018505782A (ja) | 2018-03-01 |
CN107646093B (zh) | 2019-07-30 |
JP6347898B2 (ja) | 2018-06-27 |
US20170371166A1 (en) | 2017-12-28 |
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