DE112017002178A5 - Lasermodul mit einem optischen bauteil - Google Patents

Lasermodul mit einem optischen bauteil Download PDF

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Publication number
DE112017002178A5
DE112017002178A5 DE112017002178.2T DE112017002178T DE112017002178A5 DE 112017002178 A5 DE112017002178 A5 DE 112017002178A5 DE 112017002178 T DE112017002178 T DE 112017002178T DE 112017002178 A5 DE112017002178 A5 DE 112017002178A5
Authority
DE
Germany
Prior art keywords
optical component
laser module
laser
module
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017002178.2T
Other languages
English (en)
Inventor
Roland Enzmann
Peter Jander
Markus Keidler
Josip Maric
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112017002178A5 publication Critical patent/DE112017002178A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0428—Electrical excitation ; Circuits therefor for applying pulses to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
DE112017002178.2T 2016-04-26 2017-04-26 Lasermodul mit einem optischen bauteil Pending DE112017002178A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016107715.1A DE102016107715A1 (de) 2016-04-26 2016-04-26 Lasermodul mit einem optischen Bauteil
DE102016107715.1 2016-04-26
PCT/EP2017/059989 WO2017186818A1 (de) 2016-04-26 2017-04-26 Lasermodul mit einem optischen bauteil

Publications (1)

Publication Number Publication Date
DE112017002178A5 true DE112017002178A5 (de) 2019-01-03

Family

ID=58672576

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016107715.1A Withdrawn DE102016107715A1 (de) 2016-04-26 2016-04-26 Lasermodul mit einem optischen Bauteil
DE112017002178.2T Pending DE112017002178A5 (de) 2016-04-26 2017-04-26 Lasermodul mit einem optischen bauteil

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016107715.1A Withdrawn DE102016107715A1 (de) 2016-04-26 2016-04-26 Lasermodul mit einem optischen Bauteil

Country Status (4)

Country Link
US (1) US20190131766A1 (de)
JP (2) JP6989517B2 (de)
DE (2) DE102016107715A1 (de)
WO (1) WO2017186818A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016107715A1 (de) * 2016-04-26 2017-10-26 Osram Opto Semiconductors Gmbh Lasermodul mit einem optischen Bauteil
CN206773352U (zh) * 2017-06-16 2017-12-19 京东方科技集团股份有限公司 一种光源组件、背光模组及显示装置
DE102017124147A1 (de) 2017-10-17 2019-04-18 Osram Opto Semiconductors Gmbh Licht emittierendes Bauelement
CN109143752A (zh) * 2018-09-08 2019-01-04 深圳阜时科技有限公司 一种光学组件、光学投影模组、感测装置及设备
CN109449726A (zh) * 2018-12-03 2019-03-08 江苏欧密格光电科技股份有限公司 一种含有安全监测功能的红外激光投射器件
JP7370753B2 (ja) * 2019-07-18 2023-10-30 古河電気工業株式会社 光源ユニット、光源装置および光ファイバレーザ
CN114667652A (zh) * 2019-11-28 2022-06-24 三菱电机株式会社 半导体激光装置
CN113540959B (zh) * 2020-04-21 2022-06-10 山东华光光电子股份有限公司 一种边发射半导体激光器封装结构及其制作方法
DE102020114371A1 (de) 2020-05-28 2021-12-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
DE102022100008B4 (de) 2022-01-03 2024-01-18 Schott Ag Strukturierter Wafer und damit hergestelltes optoelektronisches Bauteil
WO2024028376A1 (en) * 2022-08-05 2024-02-08 Ams-Osram International Gmbh Optical device, optoelectronic device and method for manufacturing an optical device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293826A (en) * 1979-04-30 1981-10-06 Xerox Corporation Hybrid semiconductor laser/detectors
JPS60196710A (ja) * 1984-03-19 1985-10-05 Fujitsu Ltd 光結合器
US5486923A (en) * 1992-05-05 1996-01-23 Microe Apparatus for detecting relative movement wherein a detecting means is positioned in the region of natural interference
US5793785A (en) * 1994-03-04 1998-08-11 Matsushita Electronics Corporation Semiconductor laser device
JP3520594B2 (ja) * 1995-03-02 2004-04-19 ソニー株式会社 複合光学装置
JPH11214797A (ja) * 1998-01-22 1999-08-06 Toshiba Electronic Engineering Corp レーザー発光装置、レーザー発光受光装置及び光ピックアップ装置
WO2003079338A2 (en) * 2002-03-20 2003-09-25 Matsushita Electric Industrial Co., Ltd. Control method for focus and tracking in pickup apparatus
JP2004128273A (ja) * 2002-10-03 2004-04-22 Sharp Corp 発光素子
JP4439313B2 (ja) * 2004-03-31 2010-03-24 三洋電機株式会社 光学モジュールの製造方法
DE102004050118A1 (de) * 2004-07-30 2006-03-23 Osram Opto Semiconductors Gmbh Halbleiterlaserbauelement, optische Vorrichtung für ein Halbleiterlaserbauelement und Verfahren zur Herstellung einer optischen Vorrichtung
JP2008508559A (ja) * 2004-07-30 2008-03-21 ノバラックス，インコーポレイティド 投射型ディスプレイ装置、システムおよび方法
EP2061122B1 (de) * 2007-11-16 2014-07-02 Fraunhofer USA, Inc. Hochleistungs-Laserdiodenanordnung mit mindestens einem Hochleistungsdiodenlaser, Laserlichtquelle damit und Herstellungsverfahren dafür
DE102010012604A1 (de) * 2010-03-24 2011-09-29 Osram Opto Semiconductors Gmbh Halbleiterlaserlichtquelle
JP2011228137A (ja) * 2010-04-20 2011-11-10 Panasonic Corp 照明装置及び表示装置
DE102010063938A1 (de) * 2010-12-22 2012-06-28 Hilti Aktiengesellschaft Optisches System zur Strahlformung eines Laserstrahls sowie Lasersystem mit einem solchen optischen System
US8933391B2 (en) * 2011-02-01 2015-01-13 SiFotonics Technologies Co, Ltd. Monolithic optical coupling module based on total internal reflection surfaces
DE102011089557A1 (de) * 2011-12-22 2013-06-27 Hilti Aktiengesellschaft Lasersystem zur Erzeugung einer linienförmigen Lasermarkierung
JP2013254889A (ja) * 2012-06-08 2013-12-19 Idec Corp 光源装置および照明装置
JP6183544B2 (ja) * 2014-04-11 2017-08-23 株式会社島津製作所 レーザダイオードの駆動回路及びレーザ装置
DE102014114618A1 (de) * 2014-10-08 2016-04-14 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
US20160359296A1 (en) * 2015-06-05 2016-12-08 Lumentum Operations Llc Reflector and a laser diode assembly using same
DE102016107715A1 (de) * 2016-04-26 2017-10-26 Osram Opto Semiconductors Gmbh Lasermodul mit einem optischen Bauteil

Also Published As

Publication number Publication date
JP7261857B2 (ja) 2023-04-20
US20190131766A1 (en) 2019-05-02
DE102016107715A1 (de) 2017-10-26
WO2017186818A1 (de) 2017-11-02
JP6989517B2 (ja) 2022-01-05
JP2022031843A (ja) 2022-02-22
JP2019515487A (ja) 2019-06-06

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R016 Response to examination communication