KR101849150B1 - 배향되는 전도성 채널의 표면 연결을 제공하기 위한 시스템 및 방법 - Google Patents
배향되는 전도성 채널의 표면 연결을 제공하기 위한 시스템 및 방법 Download PDFInfo
- Publication number
- KR101849150B1 KR101849150B1 KR1020157013154A KR20157013154A KR101849150B1 KR 101849150 B1 KR101849150 B1 KR 101849150B1 KR 1020157013154 A KR1020157013154 A KR 1020157013154A KR 20157013154 A KR20157013154 A KR 20157013154A KR 101849150 B1 KR101849150 B1 KR 101849150B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- delete delete
- adhesive material
- layer
- dielectric adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 18
- 239000002245 particle Substances 0.000 claims abstract description 55
- 239000004020 conductor Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 26
- 229910052799 carbon Inorganic materials 0.000 claims description 24
- 238000001962 electrophoresis Methods 0.000 claims description 17
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 13
- 238000004720 dielectrophoresis Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 abstract description 39
- 239000002131 composite material Substances 0.000 abstract description 29
- 239000010410 layer Substances 0.000 description 86
- 239000000203 mixture Substances 0.000 description 29
- 238000012360 testing method Methods 0.000 description 26
- 238000001994 activation Methods 0.000 description 11
- 230000004913 activation Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000000017 hydrogel Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 230000037361 pathway Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000013047 polymeric layer Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- -1 organo salt Chemical class 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 241000047428 Halter Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 241000143950 Vanessa Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000469 dry deposition Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/834,948 | 2013-03-15 | ||
| US13/834,948 US20150282312A1 (en) | 2013-03-15 | 2013-03-15 | Systems and methods for providing surface connectivity of oriented conductive channels |
| US14/209,213 US9775235B2 (en) | 2013-03-15 | 2014-03-13 | Systems and methods for providing surface connectivity of oriented conductive channels |
| US14/209,213 | 2014-03-13 | ||
| PCT/US2014/027622 WO2014152689A2 (en) | 2013-03-15 | 2014-03-14 | Systems and methods for providing surface connectivity of oriented conductive channels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150126341A KR20150126341A (ko) | 2015-11-11 |
| KR101849150B1 true KR101849150B1 (ko) | 2018-04-16 |
Family
ID=51522410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157013154A Active KR101849150B1 (ko) | 2013-03-15 | 2014-03-14 | 배향되는 전도성 채널의 표면 연결을 제공하기 위한 시스템 및 방법 |
Country Status (9)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9775235B2 (en) * | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
| GB2526268A (en) * | 2014-05-15 | 2015-11-25 | Richard Stone | Arc discharge assembly of dielectrophoretically aligned conductive particulates |
| JP2017057256A (ja) * | 2015-09-15 | 2017-03-23 | リンテック株式会社 | 導電性粘着シート |
| WO2020040726A1 (en) * | 2018-08-20 | 2020-02-27 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
| CN113260916B (zh) * | 2018-11-05 | 2024-07-09 | 哈里恩显示器公司 | 用于显示设备的电泳分散体中的化学实体的光学活化 |
| WO2021195332A1 (en) | 2020-03-25 | 2021-09-30 | Flexcon Company, Inc. | Isotropic non-aqueous electrode sensing material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008203256A (ja) * | 2007-02-16 | 2008-09-04 | Xerox Corp | 電界プローブおよびその製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US5082595A (en) | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
| JPH0788971A (ja) | 1993-09-21 | 1995-04-04 | Tokai Rubber Ind Ltd | 半導電性シート |
| JPH08315883A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | コネクタおよびコネクタ付基板とそれらの製造方法 |
| JPH08315946A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | 基板の接続方法および接続装置 |
| US6121508A (en) | 1995-12-29 | 2000-09-19 | 3M Innovative Properties Company | Polar, lipophilic pressure-sensitive adhesive compositions and medical devices using same |
| US5800685A (en) | 1996-10-28 | 1998-09-01 | Cardiotronics Systems, Inc. | Electrically conductive adhesive hydrogels |
| JP3257433B2 (ja) | 1997-03-05 | 2002-02-18 | ジェイエスアール株式会社 | 異方導電性シートの製造方法および異方導電性シート |
| JP3873503B2 (ja) | 1999-02-15 | 2007-01-24 | Jsr株式会社 | 異方導電性シートおよびその製造方法 |
| US7651638B2 (en) | 2002-04-10 | 2010-01-26 | Flexcon Company, Inc. | Hydro-insensitive alternating current responsive composites |
| TWI220931B (en) * | 2003-04-23 | 2004-09-11 | Toppoly Optoelectronics Corp | Method of testing FPC bonding yield and FPC having testing pads thereon |
| US7620439B2 (en) * | 2005-08-04 | 2009-11-17 | 3M Innovative Properties Company | Conductive adhesives and biomedical articles including same |
| JP5151902B2 (ja) | 2008-10-21 | 2013-02-27 | 住友電気工業株式会社 | 異方導電性フィルム |
| JP4998520B2 (ja) * | 2009-06-15 | 2012-08-15 | 住友電気工業株式会社 | 電極の接続方法、電極の接続構造及び電子機器 |
| NO333507B1 (no) | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9818499B2 (en) | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
| CN107889344A (zh) * | 2012-08-15 | 2018-04-06 | 深圳迈辽技术转移中心有限公司 | 软性电路板装置 |
| US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
-
2014
- 2014-03-13 US US14/209,213 patent/US9775235B2/en active Active
- 2014-03-14 AU AU2014239280A patent/AU2014239280B2/en active Active
- 2014-03-14 IN IN2047DEN2015 patent/IN2015DN02047A/en unknown
- 2014-03-14 KR KR1020157013154A patent/KR101849150B1/ko active Active
- 2014-03-14 EP EP14721637.8A patent/EP2973607B1/en active Active
- 2014-03-14 JP JP2016502496A patent/JP2016519390A/ja active Pending
- 2014-03-14 CN CN201480003209.1A patent/CN104813413B/zh active Active
- 2014-03-14 CA CA2891945A patent/CA2891945A1/en not_active Abandoned
- 2014-03-14 WO PCT/US2014/027622 patent/WO2014152689A2/en active Application Filing
-
2017
- 2017-09-25 US US15/714,664 patent/US10499498B2/en active Active - Reinstated
-
2018
- 2018-01-12 JP JP2018003015A patent/JP2018092940A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008203256A (ja) * | 2007-02-16 | 2008-09-04 | Xerox Corp | 電界プローブおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104813413B (zh) | 2019-04-30 |
| US20180042108A1 (en) | 2018-02-08 |
| EP2973607A2 (en) | 2016-01-20 |
| CN104813413A (zh) | 2015-07-29 |
| JP2018092940A (ja) | 2018-06-14 |
| US20140262446A1 (en) | 2014-09-18 |
| US9775235B2 (en) | 2017-09-26 |
| CA2891945A1 (en) | 2014-09-25 |
| JP2016519390A (ja) | 2016-06-30 |
| IN2015DN02047A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-08-14 |
| WO2014152689A3 (en) | 2014-12-18 |
| KR20150126341A (ko) | 2015-11-11 |
| AU2014239280A1 (en) | 2015-04-02 |
| US10499498B2 (en) | 2019-12-03 |
| AU2014239280B2 (en) | 2017-08-31 |
| EP2973607B1 (en) | 2018-06-27 |
| WO2014152689A2 (en) | 2014-09-25 |
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| KR101966121B1 (ko) | 용량성으로 결합되는 생체 의료용 전극에 있어서 오버차지 보호를 제공하는 시스템 및 방법 | |
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| US20150282312A1 (en) | Systems and methods for providing surface connectivity of oriented conductive channels |
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