AU2014239280B2 - Systems and methods for providing surface connectivity of oriented conductive channels - Google Patents
Systems and methods for providing surface connectivity of oriented conductive channels Download PDFInfo
- Publication number
- AU2014239280B2 AU2014239280B2 AU2014239280A AU2014239280A AU2014239280B2 AU 2014239280 B2 AU2014239280 B2 AU 2014239280B2 AU 2014239280 A AU2014239280 A AU 2014239280A AU 2014239280 A AU2014239280 A AU 2014239280A AU 2014239280 B2 AU2014239280 B2 AU 2014239280B2
- Authority
- AU
- Australia
- Prior art keywords
- conductive
- dielectric
- layer
- adhesive material
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000002131 composite material Substances 0.000 claims abstract description 86
- 239000002245 particle Substances 0.000 claims abstract description 79
- 239000003989 dielectric material Substances 0.000 claims abstract description 66
- 239000004020 conductor Substances 0.000 claims abstract description 60
- 230000008878 coupling Effects 0.000 claims abstract description 16
- 238000010168 coupling process Methods 0.000 claims abstract description 16
- 238000005859 coupling reaction Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 99
- 230000001070 adhesive effect Effects 0.000 claims description 91
- 239000000853 adhesive Substances 0.000 claims description 90
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 30
- 238000001962 electrophoresis Methods 0.000 claims description 28
- 229910052799 carbon Inorganic materials 0.000 claims description 27
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- 238000004720 dielectrophoresis Methods 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 230000005684 electric field Effects 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- 239000003522 acrylic cement Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 111
- 238000012360 testing method Methods 0.000 description 26
- 238000001994 activation Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 230000004913 activation Effects 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000017 hydrogel Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000976 ink Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 4
- 230000037361 pathway Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- -1 e.g. Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000013047 polymeric layer Substances 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000000469 dry deposition Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 238000002553 single reaction monitoring Methods 0.000 description 1
- 238000013426 sirius red morphometry Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/834,948 US20150282312A1 (en) | 2013-03-15 | 2013-03-15 | Systems and methods for providing surface connectivity of oriented conductive channels |
| US13/834,948 | 2013-03-15 | ||
| US14/209,213 | 2014-03-13 | ||
| US14/209,213 US9775235B2 (en) | 2013-03-15 | 2014-03-13 | Systems and methods for providing surface connectivity of oriented conductive channels |
| PCT/US2014/027622 WO2014152689A2 (en) | 2013-03-15 | 2014-03-14 | Systems and methods for providing surface connectivity of oriented conductive channels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2014239280A1 AU2014239280A1 (en) | 2015-04-02 |
| AU2014239280B2 true AU2014239280B2 (en) | 2017-08-31 |
Family
ID=51522410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2014239280A Active AU2014239280B2 (en) | 2013-03-15 | 2014-03-14 | Systems and methods for providing surface connectivity of oriented conductive channels |
Country Status (9)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9775235B2 (en) * | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
| GB2526268A (en) * | 2014-05-15 | 2015-11-25 | Richard Stone | Arc discharge assembly of dielectrophoretically aligned conductive particulates |
| JP2017057256A (ja) * | 2015-09-15 | 2017-03-23 | リンテック株式会社 | 導電性粘着シート |
| WO2020040726A1 (en) * | 2018-08-20 | 2020-02-27 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
| KR102816661B1 (ko) * | 2018-11-05 | 2025-06-04 | 할리온 디스플레이즈 인크. | 디스플레이 장치를 위한 전기영동 분산액에서의 화학 물질의 광학 활성화 |
| WO2021195332A1 (en) | 2020-03-25 | 2021-09-30 | Flexcon Company, Inc. | Isotropic non-aqueous electrode sensing material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040212386A1 (en) * | 2003-04-23 | 2004-10-28 | Chia-Cheng Lin | Method of testing FPC bonding yield and FPC having testing pads thereon |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US5082595A (en) | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
| JPH0788971A (ja) | 1993-09-21 | 1995-04-04 | Tokai Rubber Ind Ltd | 半導電性シート |
| JPH08315883A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | コネクタおよびコネクタ付基板とそれらの製造方法 |
| JPH08315946A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | 基板の接続方法および接続装置 |
| US6121508A (en) | 1995-12-29 | 2000-09-19 | 3M Innovative Properties Company | Polar, lipophilic pressure-sensitive adhesive compositions and medical devices using same |
| US5800685A (en) | 1996-10-28 | 1998-09-01 | Cardiotronics Systems, Inc. | Electrically conductive adhesive hydrogels |
| JP3257433B2 (ja) | 1997-03-05 | 2002-02-18 | ジェイエスアール株式会社 | 異方導電性シートの製造方法および異方導電性シート |
| JP3873503B2 (ja) | 1999-02-15 | 2007-01-24 | Ｊｓｒ株式会社 | 異方導電性シートおよびその製造方法 |
| WO2003087250A1 (en) | 2002-04-10 | 2003-10-23 | Flexcon Company, Inc. | Hydro-insensitive alternating current responsive composites |
| US7620439B2 (en) | 2005-08-04 | 2009-11-17 | 3M Innovative Properties Company | Conductive adhesives and biomedical articles including same |
| US7518376B2 (en) | 2007-02-16 | 2009-04-14 | Xerox Corporation | Electric field probe |
| JP5151902B2 (ja) * | 2008-10-21 | 2013-02-27 | 住友電気工業株式会社 | 異方導電性フィルム |
| JP4998520B2 (ja) * | 2009-06-15 | 2012-08-15 | 住友電気工業株式会社 | 電極の接続方法、電極の接続構造及び電子機器 |
| NO333507B1 (no) | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9818499B2 (en) * | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
| CN103596352B (zh) * | 2012-08-15 | 2018-02-06 | 江苏润阳物流器械科技有限公司 | 软性电路板装置及相机模组 |
| US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
-
2014
- 2014-03-13 US US14/209,213 patent/US9775235B2/en active Active
- 2014-03-14 EP EP14721637.8A patent/EP2973607B1/en active Active
- 2014-03-14 AU AU2014239280A patent/AU2014239280B2/en active Active
- 2014-03-14 WO PCT/US2014/027622 patent/WO2014152689A2/en active Application Filing
- 2014-03-14 KR KR1020157013154A patent/KR101849150B1/ko active Active
- 2014-03-14 CA CA2891945A patent/CA2891945A1/en not_active Abandoned
- 2014-03-14 CN CN201480003209.1A patent/CN104813413B/zh active Active
- 2014-03-14 IN IN2047DEN2015 patent/IN2015DN02047A/en unknown
- 2014-03-14 JP JP2016502496A patent/JP2016519390A/ja active Pending
-
2017
- 2017-09-25 US US15/714,664 patent/US10499498B2/en active Active - Reinstated
-
2018
- 2018-01-12 JP JP2018003015A patent/JP2018092940A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040212386A1 (en) * | 2003-04-23 | 2004-10-28 | Chia-Cheng Lin | Method of testing FPC bonding yield and FPC having testing pads thereon |
Non-Patent Citations (1)
| Title |
|---|
| RAMKUMAR, S. M. et al., 'Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly', Electronics Components and Technology Conf, 2008 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140262446A1 (en) | 2014-09-18 |
| KR101849150B1 (ko) | 2018-04-16 |
| EP2973607A2 (en) | 2016-01-20 |
| CN104813413B (zh) | 2019-04-30 |
| CN104813413A (zh) | 2015-07-29 |
| KR20150126341A (ko) | 2015-11-11 |
| US10499498B2 (en) | 2019-12-03 |
| CA2891945A1 (en) | 2014-09-25 |
| US9775235B2 (en) | 2017-09-26 |
| EP2973607B1 (en) | 2018-06-27 |
| US20180042108A1 (en) | 2018-02-08 |
| WO2014152689A3 (en) | 2014-12-18 |
| IN2015DN02047A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-08-14 |
| JP2018092940A (ja) | 2018-06-14 |
| JP2016519390A (ja) | 2016-06-30 |
| WO2014152689A2 (en) | 2014-09-25 |
| AU2014239280A1 (en) | 2015-04-02 |
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| Publication | Publication Date | Title |
|---|---|---|
| US10499498B2 (en) | Systems and methods for providing surface connectivity of oriented conductive channels | |
| AU2016202342B2 (en) | Electrically conductive materials formed by electrophoresis | |
| CA2987188C (en) | Systems and methods for providing overcharge protection in capacitive coupled biomedical electrodes | |
| US20150282312A1 (en) | Systems and methods for providing surface connectivity of oriented conductive channels |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) |