KR101805931B1 - 주연부 도포 장치, 주연부 도포 방법 및 기억 매체 - Google Patents

주연부 도포 장치, 주연부 도포 방법 및 기억 매체 Download PDF

Info

Publication number
KR101805931B1
KR101805931B1 KR1020120090019A KR20120090019A KR101805931B1 KR 101805931 B1 KR101805931 B1 KR 101805931B1 KR 1020120090019 A KR1020120090019 A KR 1020120090019A KR 20120090019 A KR20120090019 A KR 20120090019A KR 101805931 B1 KR101805931 B1 KR 101805931B1
Authority
KR
South Korea
Prior art keywords
substrate
coating liquid
wafer
nozzle
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120090019A
Other languages
English (en)
Korean (ko)
Other versions
KR20130029332A (ko
Inventor
고지 다카야나기
고우스케 요시하라
도모히로 노다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20130029332A publication Critical patent/KR20130029332A/ko
Application granted granted Critical
Publication of KR101805931B1 publication Critical patent/KR101805931B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR1020120090019A 2011-09-14 2012-08-17 주연부 도포 장치, 주연부 도포 방법 및 기억 매체 Active KR101805931B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011200968A JP5682521B2 (ja) 2011-09-14 2011-09-14 周縁部塗布装置、周縁部塗布方法及び記憶媒体
JPJP-P-2011-200968 2011-09-14

Publications (2)

Publication Number Publication Date
KR20130029332A KR20130029332A (ko) 2013-03-22
KR101805931B1 true KR101805931B1 (ko) 2017-12-06

Family

ID=48179319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120090019A Active KR101805931B1 (ko) 2011-09-14 2012-08-17 주연부 도포 장치, 주연부 도포 방법 및 기억 매체

Country Status (2)

Country Link
JP (1) JP5682521B2 (https=)
KR (1) KR101805931B1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6002115B2 (ja) 2013-11-18 2016-10-05 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP6439766B2 (ja) 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
JP6820767B2 (ja) * 2017-03-02 2021-01-27 東京エレクトロン株式会社 周縁塗布装置及び周縁塗布方法
JP6765009B2 (ja) * 2017-05-12 2020-10-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6597872B2 (ja) * 2018-11-13 2019-10-30 東京エレクトロン株式会社 基板処理方法
JP7469145B2 (ja) * 2020-05-29 2024-04-16 株式会社Ｓｃｒｅｅｎホールディングス 周縁部塗布装置および周縁部塗布方法
JP7499652B2 (ja) 2020-09-04 2024-06-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7608106B2 (ja) 2020-10-05 2025-01-06 キオクシア株式会社 半導体製造装置
TWI905353B (zh) * 2021-01-12 2025-11-21 日商東京威力科創股份有限公司 塗佈處理裝置、塗佈處理方法及電腦記憶媒體
JP7536671B2 (ja) 2021-01-29 2024-08-20 キオクシア株式会社 基板処理装置
JP7547247B2 (ja) * 2021-03-09 2024-09-09 キオクシア株式会社 半導体製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211057A (ja) 2002-01-28 2003-07-29 Dainippon Ink & Chem Inc 液状物体の塗布方法及び塗布装置と円板状物体の貼り合わせ方法及び貼り合わせ装置
JP2007058200A (ja) 2005-07-28 2007-03-08 Hoya Corp マスクブランクの製造方法及び露光用マスクの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5395803A (en) * 1993-09-08 1995-03-07 At&T Corp. Method of spiral resist deposition
JP2005111295A (ja) * 2003-10-02 2005-04-28 Tokyo Electron Ltd 塗布膜形成方法及び塗布膜形成装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211057A (ja) 2002-01-28 2003-07-29 Dainippon Ink & Chem Inc 液状物体の塗布方法及び塗布装置と円板状物体の貼り合わせ方法及び貼り合わせ装置
JP2007058200A (ja) 2005-07-28 2007-03-08 Hoya Corp マスクブランクの製造方法及び露光用マスクの製造方法

Also Published As

Publication number Publication date
KR20130029332A (ko) 2013-03-22
JP5682521B2 (ja) 2015-03-11
JP2013062436A (ja) 2013-04-04

Similar Documents

Publication Publication Date Title
KR101805931B1 (ko) 주연부 도포 장치, 주연부 도포 방법 및 기억 매체
US9687873B2 (en) Coating film forming apparatus having ring-shaped baffle member movable between processing position and retreated position
US11508589B2 (en) Substrate processing method, substrate processing apparatus and recording medium
KR101612574B1 (ko) 도포 처리 방법, 컴퓨터 기억 매체 및 도포 처리 장치
US8871301B2 (en) Coating treatment apparatus, coating treatment method, and non-transitory computer storage medium
US20120238106A1 (en) Coating method and coating apparatus
TWI544516B (zh) 基板處理方法、基板處理裝置及記憶媒體
TWI495514B (zh) Coating method and coating device
TWI540613B (zh) 塗布膜形成方法、塗布膜形成裝置、基板處理裝置及記憶媒體
US10707098B2 (en) Substrate processing apparatus, substrate processing method and memory medium
JP2005046694A (ja) 塗布膜形成方法及び塗布装置
CN109494174A (zh) 基片处理装置、基片处理方法和计算机存储介质
US10459340B2 (en) Developing method, computer-readable storage medium and developing apparatus
JP6432644B2 (ja) 塗布膜形成装置、塗布膜形成方法、記憶媒体
KR102837432B1 (ko) 도포막 형성 방법 및 도포막 형성 장치
JP2020170851A (ja) 塗布膜形成装置及び塗布膜形成方法
JP2015216168A (ja) 塗布膜形成装置、塗布膜形成方法、記憶媒体
JP7445021B2 (ja) 塗布処理装置、塗布処理方法及びコンピュータ記憶媒体
JP2015213887A (ja) 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20201119

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20211118

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20221102

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000