KR101759471B1 - Semiconductor package test socket and method for manufacturing the same - Google Patents

Semiconductor package test socket and method for manufacturing the same Download PDF

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Publication number
KR101759471B1
KR101759471B1 KR1020160023007A KR20160023007A KR101759471B1 KR 101759471 B1 KR101759471 B1 KR 101759471B1 KR 1020160023007 A KR1020160023007 A KR 1020160023007A KR 20160023007 A KR20160023007 A KR 20160023007A KR 101759471 B1 KR101759471 B1 KR 101759471B1
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KR
South Korea
Prior art keywords
mold
hole
test socket
semiconductor package
support plate
Prior art date
Application number
KR1020160023007A
Other languages
Korean (ko)
Inventor
유병덕
Original Assignee
(주) 테크웰
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Publication date
Application filed by (주) 테크웰 filed Critical (주) 테크웰
Priority to KR1020160023007A priority Critical patent/KR101759471B1/en
Application granted granted Critical
Publication of KR101759471B1 publication Critical patent/KR101759471B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A semiconductor package test socket and a method for fabricating the same are disclosed. A test socket according to the present invention includes a support plate having a plurality of first through-holes formed therein, a silicon support portion on a support plate, and a silicon support portion, and arranged to penetrate the first through-hole to form a conductive pattern And the upper portion of the pin is concave.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor package test socket,

The present invention relates to a semiconductor package test socket and a method of manufacturing the same.

Generally, a semiconductor package test socket is a connecting device for mounting a completed semiconductor package to a packaging process and connecting the semiconductor package to a test equipment. The semiconductor package test socket is a connection device for transferring an electrical signal from a test equipment to a semiconductor package, And is then passed back to the test equipment to test whether the semiconductor package is operating normally.

In view of the recent trend that the leads of semiconductor packages are miniaturized and multi-pinned, test leads such as semiconductor package leads and socket pins of the test socket are guaranteed to be sure, test socket is miniaturized, and semiconductor package for high frequency is tested These are important considerations when making sockets. It is also important to ensure that the socket pins of the test socket are strong enough to withstand the testing of semiconductor packages ranging from tens of thousands to hundreds of times.

Disclosure of Invention Technical Problem [8] The present invention provides a test socket for a semiconductor package and a method of manufacturing the same, wherein the pin is formed by metal fine particles to secure strength and silicone is used as an insulator support to provide an elastic force.

According to an aspect of the present invention, there is provided a test socket comprising: a support plate having a plurality of first through-holes formed therein; A silicon support on the support plate; And a plurality of fins penetrating the silicon support portion and arranged to penetrate the first through holes to form a conductive pattern, and the upper portion of the fins may be recessed.

In one embodiment of the present invention, the fin may be made of metal fine particles.

In one embodiment of the present invention, the height of the silicon support may be less than the height of the fin.

According to another aspect of the present invention, there is provided a method of manufacturing a test socket including a first mold portion having a first through hole formed at the center thereof, Preparing a mold including a second mold portion having a second through hole and a third mold portion having a third through hole at a position corresponding to the first through hole; Inserting a plurality of fins formed in the plurality of second through-holes into a diameter corresponding to the diameter of the second through-hole; Inserting a first magnetic block into the first through hole; Applying silicon to the third through hole while applying a magnetic field to the first magnetic block; Disposing a support plate on top of the silicon; Disposing a second magnetic block corresponding to the sizes of the first to third mold parts on the support plate; And applying a magnetic field to the second magnetic block and applying heat to a lower portion of the first magnetic block.

The manufacturing method of an embodiment of the present invention may further include a step of performing vacuum processing on the prepared mold.

In one embodiment of the present invention, the plurality of pins can be inserted while vibration is applied to the mold and the mold is subjected to vacuum processing.

In one embodiment of the present invention, the second through-hole may have a protrusion formed on the upper portion thereof.

In one embodiment of the present invention, the fin may be made of metal fine particles.

In one embodiment of the invention, the top of the pin may be recessed.

According to the present invention as described above, since the support made of silicon is formed and formed to be lower than the pin height, when the semiconductor element presses the test socket for energization between the terminal of the semiconductor element and the terminal of the test circuit board, It is possible to prevent the terminal of the element from being damaged.

Further, according to the present invention, the upper portion of the fin is recessed downward, thereby providing an effect of facilitating the electrical connection with the terminals of the semiconductor element.

1 is a cross-sectional view of a semiconductor package test socket of an embodiment of the present invention.
2 is a perspective view of a semiconductor package test socket of an embodiment of the present invention.
3 is a cross-sectional view illustrating a state in which a semiconductor package test socket according to an embodiment of the present invention is used.
4A to 4I are cross-sectional views illustrating a manufacturing process of a semiconductor package test socket according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a semiconductor package test socket of an embodiment of the present invention, and FIG. 2 is a perspective view of a semiconductor package test socket of an embodiment of the present invention. 3 is a cross-sectional view illustrating a state in which a semiconductor package test socket according to an embodiment of the present invention is used. 3 is simplified for convenience of explanation.

As shown in the drawings, the semiconductor package test socket 1 of an embodiment of the present invention may include a support plate 10 and a test socket 20. [

The support plate 10 can support the test socket 10 so that the test socket 20 can move up and down. Each of the corners of the support plate 10 is formed with a through hole 10a. The support plate 10 may be made of, for example, polyimide (PI). The PI is suitable as the support plate 10 because it has excellent heat resistance, less change in characteristics with changes in temperature, good impact resistance, and excellent electric characteristics. However, it should be understood that the present invention is not limited thereto.

The test socket 20 may include a support portion 21 and a plurality of pin-type sockets 22. The support portion 21 may be made of, for example, silicon as an insulator. However, this is an exemplary one and may be made of a plastic material having elasticity. When the semiconductor element 3 presses the test socket 20 for energization between the terminal 3a of the semiconductor element 3 and the terminal 5a of the test circuit board 5, Can be prevented from being damaged. The height of the support portion 21 may be lower than the height of the plurality of fins 22. [

A plurality of pins (22) forming a conductive pattern of the test socket (20) may be formed through the support portion (21). The fin 22 may be made of a conductive material, for example, metal fine particles. The upper portion of the pin 22 may be concave toward the lower side so as to be easily connected to the terminal 3a of the semiconductor element 3. [

The support plate 10 has a plurality of holes 22 penetrated by the plurality of pins 22 so that the plurality of pins 22 can be connected to the terminals 5a of the circuit board 5, And may be formed corresponding to the region to be disposed.

4A to 4I are cross-sectional views illustrating a manufacturing process of a semiconductor package test socket according to an embodiment of the present invention.

As shown in FIG. 4A, for the manufacture of a test socket of an embodiment of the present invention, the mold 30 can be assembled. The mold 30 for manufacturing the test socket has a first mold section 31 at the lowermost part, a second mold section 32 at the top of the first mold section 31 and a third mold section 32 at the top of the second mold section 32. [ And may include a mold part 33.

A through hole 31a may be formed in the center of the first mold part 31. [ A magnetic block for applying a magnetic field may be disposed in the through hole 31a. At each corner of the first mold part 31, a cylindrical rod 32 may be formed. This corresponds to the position where the through hole 10a of the support plate of Fig. 1 is formed. Accordingly, through holes may also be formed in the second mold portion 33 and the third mold portion 34 corresponding to the position of the engaging rod 32. [

A plurality of through holes 33a in which a plurality of fins 22 are seated may be formed at the center of the second mold portion 33 in correspondence with the positions of the through holes 31a of the first mold portion 31 . The size of the plurality of through holes (33a) may correspond to the diameter of the pin (22). The ends of the plurality of through holes 33a may be formed with protrusions 33b in order to prevent the pins 22 from descending. Alternatively, a preventive plate may be disposed between the first mold part 31 and the second mold part 32 to prevent the pin 22 from descending.

The through hole 34a may be formed in the center of the third mold part 34 in correspondence with the position of the through hole 31a of the first mold part 31. [ The through hole 34a corresponds to the position where the support portion 21 is formed.

Further, a fourth mold part 35 having a large through-hole formed therein may be further formed on the upper portion of the third mold part 34. [ The through holes of the fourth mold part 35 correspond to the positions where the support plate 10 is formed.

The height of the second mold part 33 and the height of the third mold part 34 may be the same or similar. Whereby the height of the silicon support 21 is lower than the height of the fins 22 and may be about half of the height of the fins 22.

4B, the mold 30 of the present invention can be vacuum-treated to prevent the mold parts of the mold 30 from being separated from each other.

Thereafter, as shown in FIG. 4C, a plurality of etching pins 22 can be inserted. At this time, the vibration can be applied by the vibration providing portion (not shown) so as to facilitate the insertion of the pin 22, and the vacuum processing can be maintained. The fin 22 may have a cylindrical shape with an upper portion concave downward and may be composed of metal fine particles. It is possible to prevent the pin 22 from descending by the projecting portion 33b of the end portion of the through hole 33a of the second mold portion 33. [

4D, the first magnetic block 40 having a shape corresponding to the through-hole 31a of the first mold part 31 can be inserted from the lower part of the first mold part 31. As shown in FIG.

Thereafter, as shown in FIG. 4E, the silicon 21a can be applied to the through-hole 33a of the second mold part 33. [ A magnetic field can be applied to prevent the pin 22 from being twisted and to maintain the linearity when the silicone 21a is applied. When a magnetic field is applied, a magnetic field is applied to the first magnetic block 40, thereby preventing the pin 22 from being tilted and maintaining straightness. The application of the magnetic field may be achieved by disposing the magnet at the bottom.

Thereafter, as shown in Fig. 4F, the support plate 10 can be seated so as to correspond to the through-hole of the fourth mold part 35. Fig. It is already described that the support plate 10 can be, for example, polyimide (PI). The support plate 10 may have a first through hole 10a corresponding to the coupling rod 32 and a plurality of second through holes 10b corresponding to the plurality of pins 22 . The magnetic field can be applied to the first magnetic block 40 even in the process of mounting the support plate 10.

Then, as shown in FIG. 4G, the second magnetic block 50 can be disposed on the upper portion. The second magnetic block 50 may correspond to the size of the mold 30 and a recess corresponding to the coupling rod 32 may be formed to facilitate coupling.

Then, as shown in FIG. 4H, a magnetic field can be applied to the upper portion and heat can be applied to the lower portion. That is, a magnetic field may be applied to the upper portion of the magnet, and a heat source may be disposed to the lower portion to apply heat to the lower portion. The linearity of the fin 22 is maintained by the magnetic field applied to the upper portion, and the silicon 21a can be thermally cured by the heat applied to the lower portion.

Then, as shown in FIG. 4I, when the mold 30 and the magnetic blocks 40 and 50 are all removed, the molding of the semiconductor package test socket 1 of the embodiment of the present invention can be completed.

The semiconductor package test socket 1 of this embodiment of the present invention can provide elasticity by securing strength by providing a pin made of metal fine particles and using silicon as an insulator support.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

10: support plate 20: test socket
30: mold 40, 50: magnetic block

Claims (9)

delete delete delete A first mold portion having a first through hole at the center, a second mold portion having a plurality of second through holes at positions corresponding to the first through holes, and a second mold portion having a third through hole at a position corresponding to the first through hole, Preparing a mold including a third mold part in which a through hole is formed;
Inserting a plurality of fins formed in the plurality of second through-holes into a diameter corresponding to the diameter of the second through-hole;
Inserting a first magnetic block into the first through hole;
Applying silicon to the third through hole while applying a magnetic field to the first magnetic block;
Disposing a support plate on top of the silicon;
Disposing a second magnetic block corresponding to the sizes of the first to third mold parts on the support plate; And
Applying a magnetic field to the second magnetic block, and applying heat to a lower portion of the first magnetic block.
5. The method of claim 4,
Further comprising the step of vacuum-treating the prepared mold.
The test socket manufacturing method according to claim 4, wherein the plurality of pins are inserted while vibration is applied to the mold and the mold is vacuum-processed.
The test socket manufacturing method according to claim 4, wherein the second through hole is formed with a protrusion on an upper portion thereof.
5. The connector according to claim 4,
A method of manufacturing a test socket comprising metal fine particles.
5. The method of claim 4, wherein the top of the pin is recessed.
KR1020160023007A 2016-02-26 2016-02-26 Semiconductor package test socket and method for manufacturing the same KR101759471B1 (en)

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Application Number Priority Date Filing Date Title
KR1020160023007A KR101759471B1 (en) 2016-02-26 2016-02-26 Semiconductor package test socket and method for manufacturing the same

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KR101759471B1 true KR101759471B1 (en) 2017-07-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102315536B1 (en) * 2021-08-31 2021-10-21 하병호 Inspection socket and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043104A (en) * 2001-08-01 2003-02-13 Matsushita Electric Ind Co Ltd Inspection device for semiconductor device
KR100952712B1 (en) * 2007-12-27 2010-04-13 주식회사 아이에스시테크놀러지 Silicone Contactor for Semi-conductor Device Test including Plate Type Powder
KR101468586B1 (en) 2013-07-16 2014-12-03 주식회사 아이에스시 Conductive connector and manufacturing method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043104A (en) * 2001-08-01 2003-02-13 Matsushita Electric Ind Co Ltd Inspection device for semiconductor device
KR100952712B1 (en) * 2007-12-27 2010-04-13 주식회사 아이에스시테크놀러지 Silicone Contactor for Semi-conductor Device Test including Plate Type Powder
KR101468586B1 (en) 2013-07-16 2014-12-03 주식회사 아이에스시 Conductive connector and manufacturing method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102315536B1 (en) * 2021-08-31 2021-10-21 하병호 Inspection socket and manufacturing method thereof

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