KR101698249B1 - 노광 장치, 노광 방법 및 디바이스 제조 방법 - Google Patents
노광 장치, 노광 방법 및 디바이스 제조 방법 Download PDFInfo
- Publication number
- KR101698249B1 KR101698249B1 KR1020147011607A KR20147011607A KR101698249B1 KR 101698249 B1 KR101698249 B1 KR 101698249B1 KR 1020147011607 A KR1020147011607 A KR 1020147011607A KR 20147011607 A KR20147011607 A KR 20147011607A KR 101698249 B1 KR101698249 B1 KR 101698249B1
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- South Korea
- Prior art keywords
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- wafer
- measurement
- substrate
- stage
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161581293P | 2011-12-29 | 2011-12-29 | |
| US201161581360P | 2011-12-29 | 2011-12-29 | |
| US61/581,360 | 2011-12-29 | ||
| US61/581,293 | 2011-12-29 | ||
| JP2012248419 | 2012-11-12 | ||
| JPJP-P-2012-248419 | 2012-11-12 | ||
| US13/727,286 US9207549B2 (en) | 2011-12-29 | 2012-12-26 | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
| US13/727,286 | 2012-12-26 | ||
| PCT/JP2012/084310 WO2013100202A1 (en) | 2011-12-29 | 2012-12-28 | Exposure apparatus, exposure method, and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140107186A KR20140107186A (ko) | 2014-09-04 |
| KR101698249B1 true KR101698249B1 (ko) | 2017-02-01 |
Family
ID=48697662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147011607A Active KR101698249B1 (ko) | 2011-12-29 | 2012-12-28 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9207549B2 (https=) |
| JP (1) | JP6016200B2 (https=) |
| KR (1) | KR101698249B1 (https=) |
| TW (1) | TWI639057B (https=) |
| WO (1) | WO2013100202A1 (https=) |
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| US8832916B2 (en) * | 2011-07-12 | 2014-09-16 | Lam Research Corporation | Methods of dechucking and system thereof |
| NL2009533A (en) * | 2011-10-27 | 2013-05-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
| EP2950328A4 (en) | 2012-11-30 | 2017-01-25 | Nikon Corporation | Suction apparatus, carry-in method, conveyance system, light exposure device, and device production method |
| CN103207529B (zh) * | 2013-03-22 | 2015-04-29 | 京东方科技集团股份有限公司 | 曝光方法及曝光设备 |
| DE102013016065B4 (de) * | 2013-09-27 | 2016-02-18 | Mecatronix Ag | Positioniervorrichtung und Verfahren |
| US9529280B2 (en) | 2013-12-06 | 2016-12-27 | Kla-Tencor Corporation | Stage apparatus for semiconductor inspection and lithography systems |
| IN2014CH00782A (https=) | 2014-02-19 | 2015-08-28 | Kennametal India Ltd | |
| US9977348B2 (en) | 2014-08-15 | 2018-05-22 | Asml Netherlands B.V. | Lithographic apparatus and method |
| US9694545B2 (en) | 2014-12-18 | 2017-07-04 | Stratasys, Inc. | Remotely-adjustable purge station for use in additive manufacturing systems |
| KR102688211B1 (ko) | 2015-02-23 | 2024-07-24 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법 |
| TWI840811B (zh) * | 2015-02-23 | 2024-05-01 | 日商尼康股份有限公司 | 基板處理系統及基板處理方法、以及元件製造方法 |
| HK1246871A1 (en) * | 2015-02-23 | 2018-09-14 | Nikon Corporation | Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method |
| WO2017057583A1 (ja) * | 2015-09-30 | 2017-04-06 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
| US10268121B2 (en) * | 2015-09-30 | 2019-04-23 | Nikon Corporation | Exposure apparatus and exposure method, and flat panel display manufacturing method |
| JP6656728B2 (ja) * | 2015-10-01 | 2020-03-04 | 学校法人 中村産業学園 | 相関顕微鏡 |
| CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺系统 |
| KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
| CN113504712B (zh) * | 2016-09-30 | 2023-09-19 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、以及元件制造方法 |
| JP6981170B2 (ja) * | 2017-10-20 | 2021-12-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| KR102070756B1 (ko) * | 2018-03-15 | 2020-01-29 | 이노6 주식회사 | 다축 구조 스테이지 |
| WO2020164868A1 (en) * | 2019-02-11 | 2020-08-20 | Asml Netherlands B.V. | Lithographic apparatus and method with a thermal control system |
| US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| CN110411381B (zh) * | 2019-08-06 | 2021-07-13 | 许昌学院 | 一种适用电机定子的自动校正平整度多点检测设备 |
| KR102897291B1 (ko) * | 2020-02-06 | 2025-12-09 | 에이에스엠엘 네델란즈 비.브이. | 듀얼 스테이지 리소그래피 장치를 사용하는 방법 및 리소그래피 장치 |
| CN112835269B (zh) * | 2021-01-19 | 2024-04-12 | 上海集成电路装备材料产业创新中心有限公司 | 一种光刻装置及曝光方法 |
| WO2022215692A1 (ja) * | 2021-04-09 | 2022-10-13 | 株式会社ニコン | 露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法 |
| CN118576903A (zh) * | 2024-06-07 | 2024-09-03 | 广州天力能医疗器械有限公司 | 一种仿生红外往复仪及远红外场效应生成方法 |
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-
2012
- 2012-12-26 US US13/727,286 patent/US9207549B2/en active Active
- 2012-12-28 TW TW101150758A patent/TWI639057B/zh active
- 2012-12-28 WO PCT/JP2012/084310 patent/WO2013100202A1/en not_active Ceased
- 2012-12-28 KR KR1020147011607A patent/KR101698249B1/ko active Active
- 2012-12-28 JP JP2014520850A patent/JP6016200B2/ja active Active
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|---|---|
| WO2013100202A1 (en) | 2013-07-04 |
| TW201341966A (zh) | 2013-10-16 |
| US20130183623A1 (en) | 2013-07-18 |
| JP6016200B2 (ja) | 2016-10-26 |
| KR20140107186A (ko) | 2014-09-04 |
| JP2015505154A (ja) | 2015-02-16 |
| US9207549B2 (en) | 2015-12-08 |
| TWI639057B (zh) | 2018-10-21 |
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