KR101666797B1 - Fe-P-Cr ALLOY SHEET AND METHOD OF MANUFACTURING THE SAME - Google Patents

Abstract

The present invention relates to a Fe-P-Cr alloy thin plate and a manufacturing method thereof.
One embodiment of the present invention provides a Fe-P-Cr alloy sheet in which the alloy comprises 6.0-13.0% P, 0.002-0.1% Cr, balance Fe and other unavoidable impurities in weight percent.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a Fe-P-Cr alloy thin sheet,

An embodiment of the present invention relates to a Fe-P-Cr alloy thin plate and a manufacturing method thereof.

An embodiment of the present invention relates to a high-frequency Fe-P-Cr alloy having excellent magnetic properties and a method of manufacturing the same. The Fe-P-Cr alloy has a magnetic property of 6.0-13.0 wt% P-Cr alloy having a thickness of 100 占 퐉 or less, which contains 0.1% by weight of Cr and remarkably improves high-frequency characteristics compared with normal non-directional properties, and a method for producing the same.

A steel sheet containing silicon is generally called an electrical steel sheet because it is often used in electrical equipment. Recently, renewable energy, electric vehicles and high-performance electric appliances are widely used, and iron core materials having high-frequency characteristics are required. In order to improve high-frequency characteristics, there is a method of adding a resistivity increasing element such as silicon, thinning the thickness, and minimizing impurities.

Among them, the most effective method of increasing the resistivity is a method of adding an alloy element such as Si or P. Normally, when Si is added in an amount of 3.5 wt% or more and P is added in an amount of 0.1 wt% or more, cold rolling can not be performed, and therefore there is a limitation in increasing iron loss by increasing the amount of a resistivity alloy element.

Instead of adding Si at the steelmaking stage, a Si layer is formed on the rolled steel sheet by CVD (Chemical Vapor Deposition) using SiCl ₄ gas, and then the entire steel sheet is subjected to a high- (Japanese Patent Laid-Open Publication No. 62-227079). Although this method is commercially produced, SiCl ₄ , which is a pollutant, is used, and a chemical vapor deposition process and a diffusion process are added, .

In addition to this, there is a method of thinning the thickness. However, when a large amount of a non-resistive element is included, it is extremely difficult to manufacture an extremely thin plate having a thickness of 100 m or less due to a decrease in rolling property, and the production cost is increased sharply and commercial mass production is difficult. Minimizing the impurities in the steel sheet is also complicated and costly to manufacture.

Accordingly, in one embodiment of the present invention, in order to efficiently improve the high-frequency characteristics, P, which has a higher resistivity increasing effect than Si, Mn, and Al, is used, and an additional additive element Cr is used instead of a complicated and low- And an object of the present invention is to provide a method of easily manufacturing an ultra thin plate having an excellent magnetic property with a thickness of 100 탆 or less by using an electroforming molding process.

With respect to the Fe-P plating, U.S. Patent No. 4,101,389 discloses a copper plating film having a pH range of 1.0-2.2 under a current density of 3-20 A / dm ² , an iron salt (0.3-1.7M) at 30-50 ° C, (0.07-0.42M) solution of Fe-P or Fe-P-Cu on a copper substrate. There is no mention of Fe-P-Cr here, and there is no mention of the production of independent forms of thin plates other than the plating layer.

T. Osaka et al., Co-authors, describe the preparation of electrodeposited Fe-P thin films by electrodeposition of "electrodeposited Fe-P thin films and their soft magnetic properties" [Periodicals Vol.18, Appendix, No.S1 (1994) , And most suitable Fe-P alloy thin films exhibit a minimum coercivity of 0.2 Oe and a high saturation flux density of 1.4 T at a P content of 27 at%. Likewise, there is no mention of Fe-P-Cr, and no production of independent thin plates other than the plating layer is described at all.

In addition, K. Suzuki et al., "High saturation magnetization and soft magnetic properties of bcc Fe-Zr-B alloys with ultrafine grain structure", Mater Trans. JIM. Vol. 3, pp. 743-746 (1990) reported that the saturation flux density is improved by the nanocrystalline contained in the amorphous phase, but there is no mention of Fe-P-Cr here.

As an iron alloy element, P is an element having a resistivity increasing effect with respect to the same addition amount of Si, Al, and Mn, but it is an element which can not be added by 0.1 wt% or more due to a decrease in rolling resistance due to segregation when a conventional rolling process is used. However, when the electroforming process is used, there is no lowering of the rolling property. Therefore, it is possible to easily manufacture an ultra thin plate having a P content of 6% by weight or more and a Cr content of 0.002% by weight or more, It is confirmed that improvement is possible.

Fe-P-Cr alloy thin plate and a manufacturing method thereof.

The Fe-P-Cr alloy thin plate according to one embodiment of the present invention comprises Fe-P-Cr-Al alloy thin sheet containing 6.0-13.0% of P, 0.002-0.1% of Cr, balance Fe and other unavoidable impurities, Cr alloy thin plate can be provided.

Wherein the Fe-P-Cr alloy sheet further comprises 0.5-5.0% Ni by weight.

The Vickers hardness value of the thin plate is 600 HV or less.

And the saturated magnetic flux density of the thin plate is 1.5 T or more.

The thin plate may be a thin Fe-P-Cr alloy sheet having a thickness of 1-100 mu m.

The Fe-P-Cr alloy thin plate may be a mixture of amorphous and crystal grains.

The Fe-P-Cr alloy thin plate having a grain size of 100 nm or less.

And the grain size of the crystal grains is 0.1 or more and 100 nm or less.

The crystal grains may provide a Fe-P-Cr alloy thin plate having a volume fraction of 1-10% for an amorphous matrix.

The method for manufacturing a Fe-P-Cr alloy thin plate according to an embodiment of the present invention includes the steps of: forming a plating solution containing an iron compound, a phosphorus compound, and a chromium compound; Applying a current to the plating solution; Electrodepositing an Fe-P-Cr alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities, in weight percent, to the cathode plate using the current; And peeling the Fe-P-Cr alloy layer from the negative electrode plate to obtain a Fe-P-Cr alloy thin plate; Wherein the Fe-P-Cr alloy thin sheet is manufactured by a method comprising the steps of:

The Fe-P-Cr alloy thin plate may have a thickness of 1-100 mu m.

Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; Comprising the steps of: forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; The Fe-P-Cr alloy thin sheet can be obtained.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; Wherein the concentration of the iron compound in the plating solution is 0.5-4.0M.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; In the iron compound may provide _{FeSO 4, Fe (SO 3 NH} 2) 2, FeCl 2, or a Fe-Cr-P alloy thin plate manufacturing method comprises a combination of the two.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; Wherein the concentration of the phosphorus compound in the plating solution is 0.01 to 3.0M.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; , The phosphorus compound may include NaH ₂ PO ₂ , H ₃ PO ₂ , H ₃ PO ₃ , or a combination thereof.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; , The concentration of the chromium compound in the plating solution is 0.001 to 2.0M.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; Wherein the chromium compound comprises CrCl ₃ , Cr ₂ (SO ₄ ) ₃ , CrO ₃ , or a combination thereof.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; , The concentration of the nickel compound in the plating solution is 0.1-3.0M.

Forming a plating solution containing an iron compound, a phosphorus compound, a chromium compound, and a nickel compound; In the nickel compound it can provide a NiSO _4, NiCl _2, or a Fe-Cr-P alloy thin plate manufacturing method comprises a combination of the two.

Forming a plating solution containing the iron compound, the phosphorus compound, the chromium compound, and the nickel compound; Forming a plating solution further comprising the iron compound, the phosphorus compound, the chromium compound, the nickel compound and the additive; The Fe-P-Cr alloy thin sheet can be obtained.

And the concentration of the additive is 0.001-0.1 M in the plating solution.

Wherein the additive comprises glycolic acid, saccharin, beta-alanine, DL-alanine, succinic acid, or a combination thereof.

Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; , Wherein the pH range of the plating solution is 1-4.

Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; , The temperature of the plating solution is 30-100 ° C.

Applying a current to the plating solution; , Wherein the current is a direct current or a pulse current.

Applying a current to the plating solution; , The current density is 1-100 A / dm < ² >.

Electrodepositing an Fe-P-Cr alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities, in weight percent, to the cathode plate using the current; Cr-Fe-Cr-Fe-Cr-Fe-Cr-Fe-Cr-Fe-Fe-Fe-Fe-Fe-Fe-Fe-Fe-Fe- Electrodepositing the Ni alloy layer; The Fe-P-Cr alloy thin sheet can be obtained.

Peeling the Fe-P-Cr alloy layer from the negative electrode plate to obtain an Fe-P-Cr alloy thin plate; Wherein the negative electrode plate material comprises stainless steel, titanium, or a combination thereof. The present invention also provides a method of manufacturing an Fe-P-Cr alloy thin plate.

According to one embodiment of the present invention, there is provided an Fe-P alloy containing, in terms of% by weight, P: 6.0-13.0%, Cr: 0.002-0.1%, balance Fe and other unavoidable impurities, -Cr alloy thin plate, which can have a saturation magnetic flux density of 1.5 T or more and a lower high frequency iron loss due to the effect of amorphous and crystal grain mixing produced by the addition of Cr compared to a conventional Fe-P alloy thin plate. In the case of Fe-P-Cr-Ni alloy, the hardness is lowered by addition of Ni, and the workability is very easy. In addition, it is possible to provide an extremely thin plate having an excellent magnetic property with a thickness of 100 탆 or less by using the addition of P, which is superior in resistivity increasing effect to Si, Mn and Al, and an electroforming process.

Therefore, the high-frequency low iron loss ultra-thin Fe-P-Cr alloy can be used as a soft magnetic material such as a motor core, an inverter, and a converter. In addition, it can mass-produce Fe-P-Cr alloy thin sheet, which is more inexpensive and simpler than conventional 6.5% Si steel, which is the highest grade nonoriented electrical steel, and has better high frequency characteristics.

Fig. 1 shows the results of XRD analysis of an Fe-11 wt% P material.
FIG. 2 is a result of XRD analysis of Fe-11 weight% P-0.0023 weight% Cr material produced according to one embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. However, it is to be understood that the present invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It is intended that the disclosure of the present invention be limited only by the terms of the appended claims. Like reference numerals refer to like elements throughout the specification.

Thus, in some embodiments, well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention. Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Whenever a component is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, not the exclusion of any other element, unless the context clearly dictates otherwise. Also, singular forms include plural forms unless the context clearly dictates otherwise.

The Fe-P-Cr alloy thin sheet according to an embodiment of the present invention comprises Fe-P-Cr, which contains 6.0-13.0% of P, 0.002-0.1% of Cr, the balance of Fe and other unavoidable impurities, It is an alloy sheet.

The thin plate may be an Fe-P-Cr alloy thin plate, which further comprises 0.5-5.0% Ni by weight.

The reasons for limiting the components in one embodiment of the present invention will be described below.

P plays a role of lowering the iron loss by increasing the nonstationary.

As the amount of P added increases, the resistivity increases. However, when it is produced by the electroforming method, an amorphous phase is not formed when it is less than 6% by weight, so that it is difficult to expect an additional resistivity increasing effect. In the case of adding more than 13% by weight, the workability is decreased, so that commercial use becomes difficult.

Cr plays a role of reducing high-frequency iron loss by the formation of crystal grains.

When the Cr content is less than 0.002% by weight, the properties of forming the crystal grains deteriorate, so that the amorphous-crystal grain composite phase can not be formed. Therefore, it may be difficult to reduce the high-frequency iron loss, and when it exceeds 0.1% by weight, the workability is deteriorated.

When the content of Cr is 0.002 wt% or more, the saturation magnetic flux density is improved through the formation of the amorphous-crystal grain composite phase, and the saturation magnetic flux density can be 1.5T or more, which is easy to use as a material for a driving motor and the like.

Thus, the thin plate containing Cr may be a mixture of amorphous and crystal grains, and the volume fraction of crystal grains to an amorphous matrix may be 1-10%. When the above range is satisfied, the saturation magnetic flux density can be improved.

The grain size of the crystal grains in the thin plate may be 0.1 or more and 100 nm or less.

When the nanocrystals of the size range are mixed in the amorphous state as described above, the saturation magnetic flux density can be improved as compared with the amorphous single phase. Therefore, when the grain size is 100 nm or more, the iron loss reduction and the effect of improving the saturation magnetic flux density can be reduced.

The particle diameter refers to the particle diameter or size, and the particle diameter disclosed in one embodiment of the present invention or below is defined as diameter.

The particle diameters of the crystal grains disclosed in this specification are calculated by substituting Scherrer's quation for the diffraction angle and the intensity of the diffraction beam of data obtained by using XRD analysis.

Ni serves to improve workability by lowering the hardness.

When the content of Ni is 0.5 wt% or more and 5.0 wt% or less, the hardness can be lowered and the workability can be improved remarkably.

However, when it exceeds 5.0 wt%, the saturation magnetic flux density is reduced to less than 1.5 T, and the use thereof as a material for a driving motor and the like can be restricted. Therefore, Ni is in the above range and the saturation magnetic flux density can be 1.5T or more because the possibility of industrial use becomes low. The higher the saturation magnetic flux density, the more the saturation magnetic flux density in this specification may be 1.5 or more and 2.0 T or less.

In addition, the Vickers hardness value of the Ni-containing thin plate may be 600 HV or less. When the Vickers hardness value is in the above range, the workability of the thin plate can be improved. More specifically, the Vickers hardness value may be 300 or more and 600 HV or less.

The thickness of the Fe-P-Cr alloy thin plate may be 1-100 mu m.

The above range is a general range of the thin plate, and the present invention is not limited to the above range.

Hereinafter, an Fe-P-Cr alloy according to an embodiment of the present invention The manufacturing method of the thin plate will be described.

Fe-P-Cr alloy The manufacturing method of the thin plate provides a step of first forming a plating solution containing an iron compound, a phosphorus compound, and a chromium compound.

The step of forming the plating solution containing the iron compound, the phosphorus compound, and the chromium compound may provide a step of forming a plating solution further comprising a nickel compound.

In this step, the iron compound in the plating solution may be in a concentration range of 0.5-4.0M. When this range is satisfied, the Fe-P-Cr plated layer can be formed properly.

Specific example, the iron compound can include _{FeSO 4, Fe (SO 3 NH} 2) 2, FeCl 2, or a combination thereof. However, the present invention is not limited thereto.

In this step, the phosphorus compound in the plating solution may be in a concentration range of 0.01 to 3.0M. When this range is satisfied, the Fe-P-Cr plated layer can be formed properly.

As a specific example, the phosphorus compound may include NaH ₂ PO ₂ , H ₃ PO ₂ , H ₃ PO ₃ , or a combination thereof. However, the present invention is not limited thereto.

In this step, the chromium compound in the plating solution may be in a concentration range of 0.001 to 2.0M. When this range is satisfied, the Fe-P-Cr plated layer can be formed properly.

As a specific example, the chromium compound may include CrCl ₃ , Cr ₂ (SO ₄ ) ₃ , CrO ₃ , or a combination thereof. However, the present invention is not limited thereto.

In this step, the nickel compound in the plating solution may be in a concentration range of 0.1-3.0M. When this range is satisfied, the Fe-P-Cr plated layer can be formed properly. Concrete may comprise, for example, the nickel compound eunneun NiSO _4, NiCl _2, or a combination thereof. However, the present invention is not limited thereto.

Further, the plating solution may be formed by further including an additive in the plating solution.

The additive may range from 0.001 to 0.1 M concentration. If the above range is not satisfied, the Fe-P-Cr plated layer may not be properly formed. In addition, when it is added in an amount exceeding 0.1 M, the effect of forming a plating layer becomes excessive and it may become meaningless to add more additives, which may not be economical.

More specifically, it may include glycolic acid, saccharin, beta-alanine, DL-alanine, succinic acid, or a combination thereof.

The pH range of the plating solution may be 1-4, and the temperature may be 30-100 < 0 > C.

The pH of the plating solution can be adjusted to a pH range of 1-4 by adding one or more acids and / or one or more bases.

Thus, when the pH range of the plating solution is satisfied, the Fe-P-Cr plating layer can be formed properly.

Also, when the temperature of the plating bath is 30-100 DEG C, the Fe-P-Cr plating layer can be properly formed.

Next, a step of applying an electric current to the formed plating solution is provided.

The current may be a direct current, or a pulse current, and the current density may be 1-100 A / dm < ² >. When the current density range is as described above, the Fe-P-Cr plating layer can be properly formed.

The composition of P can be controlled by changing the current density within the above range.

Further, the present invention provides a step of electrodepositing an Fe-P-Cr alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities in weight% can do.

P-Cr-Ni alloy containing 6.0-13.0% of P, 0.002-0.1% of Cr, 0.5-5.0% of Ni, and the balance of Fe and other unavoidable impurities in weight% Lt; RTI ID = 0.0 > electrodeposition < / RTI >

Finally, the Fe-P-Cr alloy layer is peeled from the negative electrode plate to obtain a Fe-P-Cr alloy thin plate.

The cathode plate material may include stainless steel, titanium, or a combination thereof. In addition to this, it is also possible to use all materials having an acid resistance and an oxide film, so that the material is not limited to the above materials.

The Fe-P-Cr alloy thin plate may have a thickness of 1-100 mu m.

The above range is a general range of the thin plate, and the present invention is not limited to the above range.

Hereinafter, the embodiment will be described in detail. The following examples are illustrative of the present invention only and are not intended to limit the scope of the present invention.

After forming a plating solution containing the iron compound, the phosphorus compound, and the chromium compound disclosed in one embodiment of the present invention, an electric current was applied to the plating solution.

The Fe-P-Cr alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities was electrodeposited by weight on the cathode plate material using the above current.

Thus, the Fe-P-Cr alloy layer was peeled off from the negative electrode plate to obtain an Fe-P-Cr thin plate.

The contents of P and Cr were varied within the above-mentioned range, and the results are shown in Table 1 below.

P content
[wt%] Cr content
[wt%] Microstructure Average
Grain size
(nm) Iron loss
W10 / 400 [W / kg] Processability Comparison 1 5.78 0 Crystalline 15.0 11.3 - Comparative material 2 6.15 0 Amorphous 17.1 8.6 - Inventory 1 6.1 0.0022 Amorphous-nanocrystalline mixture 8.2 5.1 Great Comparative material 3 13.3 0.0025 Amorphous-nanocrystalline mixture 15.0 5.02 Dread Comparison 4 12.5 0.12 Amorphous-nanocrystalline mixture 10.1 5 Dread Comparative material 5 6.2 0.13 Amorphous-nanocrystalline mixture 8.2 5.15 Dread Inventory 2 6.22 0.097 Amorphous-nanocrystalline mixture 7.4 5.09 Great Inventory 3 12.6 0.095 Amorphous-nanocrystalline mixture 9.5 4.9 Great

As shown in Table 1, unlike the Fe-P alloy according to the embodiment of the present invention, the Fe-P-Cr alloy produced by the electroforming method exhibits a mixed phase of amorphous and crystal grains. It can be seen that the iron loss is lower than that of the amorphous single phase due to the mixed phase of amorphous and crystal grains formed by Cr addition.

Further, as described above, on the amorphous-nano-crystal grain mixture of the invention material, the nano-sized crystal grains are present in a proportion of 1-10% of the total volume.

In addition, the workability in the above Table 1 was judged by the occurrence of cracks in the punching process. As a result, it can be seen that the Fe-P-Cr alloy produced by the electroforming method is superior to the non-ferrous alloy.

After forming a plating solution containing the iron compound, the phosphorus compound, and the chromium compound disclosed in one embodiment of the present invention, an electric current was applied to the plating solution.

P-Cr-Ni alloy containing 6.0-13.0% of P, 0.002-0.1% of Cr, 0.5-5.0% of Ni, and the balance of Fe and other unavoidable impurities in weight% Layer was electrodeposited.

Thus, the Fe-P-Cr-Ni alloy layer was peeled off from the negative electrode plate to obtain an Fe-P-Cr-Ni thin plate.

The contents of P, Cr, and Ni were varied within the above-mentioned range, and the results are shown in Table 2 below.

P content
[wt%] Cr content
[wt%] Ni content
[wt%] Vickers hardness
[HV] Saturation flux density
[T] Invention material A1 6.1 0.0022 0 605 1.65 Invention material A2 12.5 0.095 0 613 1.62 Invention material A3 6.12 0.0025 0.53 537 1.65 Invention material A4 12.4 0.097 0.52 545 1.62 Comparative material A1 6.15 0.0023 10.2 533 1.46 Comparative material A2 12.6 0.097 10.1 541 1.43 Invention material A5 6.13 0.0025 9.8 533 1.55 Invention material A6 12.7 0.096 9.8 541 1.52

Table 2 compares the hardness and the saturation magnetic flux density according to the Fe-P-Ni-Cr material composition manufactured by the electroforming method.

As shown in Table 2, it can be seen that as Ni is added, the hardness is lowered. When the content of Ni exceeds 5.0 wt%, it can be confirmed that the saturation magnetic flux density is less than 1.5T.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand.

It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be interpreted as being included in the scope of the present invention .

Claims (29)

By weight, P: 6.0-13.0%, Cr: 0.002-0.1%, balance Fe and other unavoidable impurities.
The method according to claim 1,
By weight, Ni: 0.5-5.0%.
3. The method of claim 2,
Wherein the Vickers hardness value of the thin plate is 600 HV or less.
The method of claim 3,
Wherein the thin plate has a saturation magnetic flux density of 1.5T or more.
5. The method of claim 4,
Wherein the thin plate is 1-100 mu m thick.
6. The method of claim 5,
Wherein the alloy thin plate is a mixture of amorphous and crystal grains.
The method according to claim 6,
And the grain size of the crystal grains is 100 nm or less.
8. The method of claim 7,
And the grain size of the crystal grains is 0.1 or more and 100 nm or less.
9. The method of claim 8,
Wherein the grain has a volume fraction of 1-10% for an amorphous matrix.
Forming a plating solution comprising an iron compound, a phosphorus compound, and a chromium compound;
Applying a current to the plating solution;
Electrodepositing an alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities, in weight percent, to the cathode plate using the electric current; And
Peeling the alloy layer from the negative electrode plate to obtain an alloy thin plate;
≪ / RTI >
11. The method of claim 10,
Wherein the alloy thin plate is 1-100 mu m thick.
11. The method of claim 10,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the plating solution further comprises a nickel compound.
13. The method of claim 12,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the concentration of the iron compound in the plating solution is 0.5-4.0M.
14. The method of claim 13,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
The iron compound is _{FeSO 4, Fe (SO 3 NH} 2) 2, FeCl 2, or an alloy thin plate manufacturing method comprising a combination thereof.
15. The method of claim 14,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the concentration of the phosphorus compound in the plating solution is 0.01-3.0M.
16. The method of claim 15,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the compound is _{NaH 2 PO 2, H 3 PO} 2, H 3 PO 3, or an alloy thin plate manufacturing method comprising a combination thereof.
17. The method of claim 16,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the concentration of the chromium compound in the plating solution is 0.001 to 2.0M.
18. The method of claim 17,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
The chromium compound is _{CrCl 3, Cr 2 (SO 4} ) 3, CrO 3, or an alloy thin plate manufacturing method comprising a combination thereof.
19. The method of claim 18,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the concentration of the nickel compound in the plating solution is 0.1-3.0M.
20. The method of claim 19,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
The nickel compounds are NiSO _4, NiCl _2, or the alloy thin plate manufacturing method comprising a combination thereof.
21. The method of claim 20,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the plating solution further comprises an additive.
22. The method of claim 21,
Wherein the concentration of the additive is 0.001-0.1 M in the plating solution.
23. The method of claim 22,
Wherein the additive comprises glycolic acid, saccharin, beta-alanine, DL-alanine, succinic acid, or a combination thereof.
24. The method of claim 23,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the pH range of the plating solution is 1-4.
25. The method of claim 24,
Forming a plating solution comprising the iron compound, the phosphorus compound, and the chromium compound; in,
Wherein the temperature of the plating solution is 30-100 占 폚.
26. The method of claim 25,
Applying a current to the plating solution; in,
Wherein the current is a direct current, or a pulsed current.
27. The method of claim 26,
Applying a current to the plating solution; in,
Wherein the current density is 1-100 A / dm < ^{2 &} gt ;.
28. The method of claim 27,
Electrodepositing an alloy layer containing 6.0-13.0% of P, 0.002-0.1% of Cr, and the balance of Fe and other unavoidable impurities, in weight percent, to the cathode plate using the electric current; in,
Wherein the alloy layer further comprises 0.5-5.0% of Ni.
29. The method of claim 28,
Peeling the alloy layer from the negative electrode plate to obtain an alloy thin plate; in,
Wherein the cathode plate material comprises stainless steel, titanium, or a combination thereof.

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