KR101666288B1 - 임프린트 방법, 임프린트 장치 및 이를 사용한 물품 제조 방법 - Google Patents

임프린트 방법, 임프린트 장치 및 이를 사용한 물품 제조 방법 Download PDF

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KR101666288B1
KR101666288B1 KR1020147024456A KR20147024456A KR101666288B1 KR 101666288 B1 KR101666288 B1 KR 101666288B1 KR 1020147024456 A KR1020147024456 A KR 1020147024456A KR 20147024456 A KR20147024456 A KR 20147024456A KR 101666288 B1 KR101666288 B1 KR 101666288B1
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mold
imprint material
imprint
contact
substrate
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KR20140119800A (ko
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노조무 하야시
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020147024456A 2012-03-12 2013-03-07 임프린트 방법, 임프린트 장치 및 이를 사용한 물품 제조 방법 Active KR101666288B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012053993 2012-03-12
JPJP-P-2012-053993 2012-03-12
JPJP-P-2013-041424 2013-03-04
JP2013041424A JP6029494B2 (ja) 2012-03-12 2013-03-04 インプリント方法およびインプリント装置、それを用いた物品の製造方法
PCT/JP2013/001435 WO2013136730A1 (en) 2012-03-12 2013-03-07 Imprint method, imprint apparatus, and article manufacturing method using the same

Publications (2)

Publication Number Publication Date
KR20140119800A KR20140119800A (ko) 2014-10-10
KR101666288B1 true KR101666288B1 (ko) 2016-10-13

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KR1020147024456A Active KR101666288B1 (ko) 2012-03-12 2013-03-07 임프린트 방법, 임프린트 장치 및 이를 사용한 물품 제조 방법

Country Status (6)

Country Link
US (1) US10901324B2 (enExample)
EP (1) EP2791966B1 (enExample)
JP (1) JP6029494B2 (enExample)
KR (1) KR101666288B1 (enExample)
CN (1) CN104160477B (enExample)
WO (1) WO2013136730A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6472189B2 (ja) 2014-08-14 2019-02-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2016134441A (ja) * 2015-01-16 2016-07-25 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6671160B2 (ja) 2015-11-30 2020-03-25 キヤノン株式会社 インプリント装置、物品製造方法および位置合わせ方法
JP6748496B2 (ja) * 2016-06-30 2020-09-02 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法
JP6716484B2 (ja) * 2017-03-14 2020-07-01 キオクシア株式会社 インプリント方法
JP2018194386A (ja) * 2017-05-16 2018-12-06 大日本印刷株式会社 センサモジュール
JP6865650B2 (ja) * 2017-07-27 2021-04-28 キヤノン株式会社 インプリント装置、および物品製造方法
JP7033994B2 (ja) * 2018-04-11 2022-03-11 キヤノン株式会社 成形装置及び物品の製造方法
JP7317575B2 (ja) * 2019-05-28 2023-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP2021044296A (ja) * 2019-09-06 2021-03-18 キオクシア株式会社 インプリント方法、半導体装置の製造方法、及びインプリント装置
ES2817099B2 (es) * 2020-11-10 2021-08-30 Rudatskiy Sergii Birzhev Molde digital transformable
JP2024003899A (ja) * 2022-06-28 2024-01-16 キヤノン株式会社 インプリントシステム、基板、インプリント方法、レプリカモールド製造方法及び、物品の製造方法
JP2024043963A (ja) * 2022-09-20 2024-04-02 キオクシア株式会社 パターン形成方法、半導体装置の製造方法、及びインプリント装置
JP2024162750A (ja) * 2023-05-11 2024-11-21 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法。

Citations (3)

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JP2006165371A (ja) 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
JP2007165400A (ja) 2005-12-09 2007-06-28 Canon Inc 加工方法
JP2010214913A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd インプリント方法およびインプリント装置

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DE10146583A1 (de) * 2001-09-21 2003-04-17 Siemens Ag Vorrichtung und Verfahren zum optischen Abtasten einer Substratscheibe
CN1800975B (zh) * 2005-11-28 2011-11-30 中国科学院光电技术研究所 分步重复光照纳米压印装置
JP4185941B2 (ja) * 2006-04-04 2008-11-26 キヤノン株式会社 ナノインプリント方法及びナノインプリント装置
CN102360162B (zh) 2007-02-06 2015-08-26 佳能株式会社 刻印方法和刻印装置
EP2128701A1 (en) * 2008-05-30 2009-12-02 ASML Netherlands BV Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process
JP5279397B2 (ja) 2008-08-06 2013-09-04 キヤノン株式会社 インプリント装置、インプリント方法、およびデバイス製造方法
JP2011129720A (ja) 2009-12-17 2011-06-30 Canon Inc インプリント装置、モールド及び物品の製造方法
JP5451450B2 (ja) * 2010-02-24 2014-03-26 キヤノン株式会社 インプリント装置及びそのテンプレート並びに物品の製造方法
US9430824B2 (en) * 2013-05-14 2016-08-30 Kla-Tencor Corporation Machine learning method and apparatus for inspecting reticles
JP5909210B2 (ja) * 2013-07-11 2016-04-26 キヤノン株式会社 インプリント装置及び物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165371A (ja) 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
JP2007165400A (ja) 2005-12-09 2007-06-28 Canon Inc 加工方法
JP2010214913A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd インプリント方法およびインプリント装置

Also Published As

Publication number Publication date
EP2791966A1 (en) 2014-10-22
WO2013136730A1 (en) 2013-09-19
CN104160477A (zh) 2014-11-19
CN104160477B (zh) 2016-11-09
KR20140119800A (ko) 2014-10-10
JP6029494B2 (ja) 2016-11-24
US10901324B2 (en) 2021-01-26
US20150325526A1 (en) 2015-11-12
JP2013219331A (ja) 2013-10-24
EP2791966A4 (en) 2015-07-29
EP2791966B1 (en) 2020-02-26

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