KR101638995B1 - A treatment device for detaching the semiconductor package - Google Patents

A treatment device for detaching the semiconductor package Download PDF

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Publication number
KR101638995B1
KR101638995B1 KR1020160004530A KR20160004530A KR101638995B1 KR 101638995 B1 KR101638995 B1 KR 101638995B1 KR 1020160004530 A KR1020160004530 A KR 1020160004530A KR 20160004530 A KR20160004530 A KR 20160004530A KR 101638995 B1 KR101638995 B1 KR 101638995B1
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KR
South Korea
Prior art keywords
semiconductor package
block
ring
film
intake
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Application number
KR1020160004530A
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Korean (ko)
Inventor
한복우
오백호
Original Assignee
제너셈(주)
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Priority to KR1020160004530A priority Critical patent/KR101638995B1/en
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Publication of KR101638995B1 publication Critical patent/KR101638995B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a semiconductor package detachable processing apparatus for detachably attaching a semiconductor package adhered to a bonding surface of a film attached to a ring, the apparatus comprising: a mounting plate having a seating portion; A ring fixing member having a clamp for fixing the ring and a mounting provided at a lower portion of the mounting plate; And a heating means provided inside the ring fixing member so that the heating plate is positioned on the inner periphery of the seating portion on which the ring is seated. When the semiconductor package is being sucked and transferred, the semiconductor package is bonded The detachment of the semiconductor package using the adsorption force of the picker can be achieved.

Description

[0001] The present invention relates to a semiconductor device,

The present invention relates to a desorption treatment apparatus for a semiconductor package, which can lower the adhesiveness of a film through a heating plate, thereby facilitating the desorption treatment of a semiconductor package using a picker, The semiconductor package can be easily removed from the semiconductor package by using the picker, thereby improving the workability and preventing the semiconductor package from malfunctioning.

Generally, in order to manufacture a semiconductor package, a predetermined thin film is deposited on a wafer, a predetermined circuit pattern is formed on the deposited thin film through a photolithography and an etching process, and then a predetermined test is performed. Then, ), And the cut individual die must be subjected to a die bonding process, a molding process, and a packaging process.

In the die bonding process, since the dies cut in the cutting process are not individually transferred to the die bonding equipment, but are transferred to the die bonding equipment while being attached to the adhesive sheet of the die frame, A transfer robot for picking up the die separated from the adhesive sheet in cooperation with the die ejecting apparatus and transferring the die to the waiting PCB, and a dispenser for supplying the adhesive to be applied to the picked- Device, and the like.

1, the die ejecting apparatus 10 generally includes an ejector pin 11 for pushing up an individual die at the bottom of the die frame 20 and a plurality of ejector pins 11 for raising and lowering the ejector pins 11 And an up-down driving means (not shown).

The operation of the die ejecting apparatus 10 is such that when the die frame 20 to which the cut die 30 is attached is fixed at a predetermined position, And the lifted die 30 is picked up by the transfer robot 40 and transferred to the waiting PCB. Then, the die ejecting apparatus 10 is moved to the other die < RTI ID = 0.0 > The operation of horizontally moving the die frame 20 by a predetermined distance is performed so that the die 30 can be separated. Thereafter, the operation of lifting the other die 30 upward is performed continuously in the above-described order.

The conventional die ejecting apparatus 10 includes a ball screw and a linear motion (LM) guide reciprocating in the same direction as the moving direction (z-axis direction) of the ejector pin 11 to drive the ejector pin 11 There is a problem that the manufacturing cost of the device is high and the price competitiveness is poor, and it is difficult to design the product compactly.

If the size of the die 30 is changed, it is necessary to change the number of the ejector pins 11 or the installation interval. However, if the size of the die 30 to be processed is changed, So that the elevator block of the ejector pin 11 can not be replaced. This increases the cost and increases the inconvenience of the operator.

Therefore, in order to solve the above-mentioned problems, a "semiconductor die ejecting device" such as that of Patent Publication No. 10-0865766 has been developed.

Korean Patent Registration No. 10-0865766 (Oct. 22, 2008) "Semiconductor die-ejecting device" - DS

The above-described conventional semiconductor die ejecting apparatus includes a drive motor for rotating a drive shaft; A cam connected to the drive shaft; A lifting member which is lifted and lowered by the rotational motion of the cam; A piston block connected to the elevating member and having an ejector pin coupled thereto; A rotation piece coupled to the drive shaft to sense a rotation angle of the drive shaft; And a sensor for detecting whether the rotating piece passes or not. Thus, the manufacturing cost can be reduced and the size can be reduced.

However, the conventional semiconductor die ejecting apparatus has a problem that it can not be exceeded. That is, the conventional ejector apparatus is positioned below the adhesive sheet attached to the die frame so as to lift the die adhered to the adhesive sheet in accordance with the upward driving. According to this operation, There is a problem in that it is only necessary to detach the die from the die.

In addition, since it is required to precisely link the ejector device and the picker, which are repeatedly operated, to each other, it is difficult to manufacture and cause delays in maintenance due to maintenance.

Thus, the applicant of the present invention has developed a semiconductor package detachment processing apparatus which can easily perform a detachment process of a semiconductor package attached to an adhesive sheet in a single operation.

It is an object of the present invention to provide a semiconductor package which can reduce the adhesiveness of a film through a heating plate and can easily perform a desorption treatment of a semiconductor package using a picker, So that the semiconductor package can be attracted and conveyed at one time, thereby improving the workability of the semiconductor package.

In addition, the present invention can be stably supported without heat transfer through the support legs formed on the heating means, and can be mounted and detached in a state of horizontally moving a plurality of semiconductor packages through the projections formed on the lower surface of the intake block So that the semiconductor package can be prevented from malfunctioning in the semiconductor package detachment process.

According to another aspect of the present invention, there is provided a semiconductor package detachment apparatus for detachably attaching a semiconductor package adhered to a bonding surface of a film attached to a ring, the apparatus comprising: a mounting plate having a seating portion; A ring fixing member provided on the mounting plate and fixed to a lower portion of the mounting plate; And a heating means provided inside the ring fixing member so that the heating plate is positioned on the inner periphery of the seating portion on which the ring is seated. When the semiconductor package is being sucked and transferred, the semiconductor package is bonded A semiconductor package detachable processing apparatus characterized by being capable of achieving detachment of a semiconductor package by using an attracting force of a picker, by lowering the adhesiveness of a bonded surface.

When the desorption treatment apparatus of the semiconductor package of the present invention is used, the adhesiveness of the film can be lowered through the heating plate, so that not only the desorption treatment of the semiconductor package using the picker can be easily achieved, It is possible to improve the workability by simultaneously carrying out the suction and transfer of the semiconductor package using the picker.

In addition, the present invention can be stably supported without heat transfer through the support legs formed on the heating means, and can be mounted and detached in a state of horizontally moving a plurality of semiconductor packages through the projections formed on the lower surface of the intake block It is a useful invention that prevents malfunctions in the semiconductor package detachment process.

1 is a sectional view showing a conventional die ejecting apparatus;
2 is a perspective view showing a desorption processing apparatus of the semiconductor package of the present invention.
3 is a perspective view partially illustrating the semiconductor package detachment apparatus of the present invention.
Fig. 4 is a front view showing a desorption processing apparatus of a semiconductor package in which the picker of the present invention is constituted; Fig.
5 is a perspective view partially illustrating the picker of the present invention.
6 is a partially enlarged cross-sectional view of the apparatus for desorbing and desorbing semiconductor packages of the present invention.
7 is a perspective view showing a picker in a lower direction so that the projections of the present invention can be seen.

Hereinafter, the structure of the present invention will be described.

The present invention relates to a semiconductor package detachment processing apparatus 100 for easily detaching and attaching a semiconductor package 5 adhered to a bonding surface of a film 3 attached to a ring 1 as shown in Figs. The ring fixing and mounting member 10 and the heating means 20. According to such a configuration, when the semiconductor package 5 is sucked and transported, the heating plate 25, The adhesion of the bonding surface to which the semiconductor package 5 is adhered can be lowered through the heating of the film 3 using the adhesive layer 30 and the semiconductor package 5 can be easily attached and detached using the suction force of the picker 30 An action effect is obtained.

Hereinafter, the semiconductor package detachment apparatus 100 including the ring fixing member 10 and the heating means 20 will be described in more detail.

First, the ring fixing member 10 is installed in a conventional semiconductor manufacturing equipment (not shown) so as to perform EMI shielding on a semiconductor package adhered to a film, or to facilitate adsorption transfer of an EMI shielded semiconductor package And a mounting plate (13) having a seating part (11) on which the ring (1) is seated.

The mounting portion 11 of the mounting plate 13 is formed as a hollow 11a for installing the heating means 20. The upper portion of the mounting portion 11 adjacent to the hollow 11a It is preferable that a protruding portion 11b is formed so that the film 3 attached to the ring 1 can be stretched in a state in which the film 3 is stretched tightly.

A fitting hole 11c for allowing the ring 1 to be always placed at the same position may be further provided on the outer side of the protruding portion 11b at the upper portion of the seating portion 11. In this case, And a fitting hole (not shown) corresponding to the fitting hole 11c should be further included in the ring 1 for the positioning of the ring 1.

The ring fixing member 10 is provided with a clamp 15 which is formed on the mounting plate 13 and fixes the ring 1 to be seated on the seating part 11, The clamp 15 is a means for firmly fixing the ring 1, as it is conventionally known, and thus a detailed description thereof will be omitted.

In addition, the mounting table 17 is for fixing the ring fixing member 10 to the semiconductor manufacturing equipment. The mounting base 17 protrudes downward while being coupled to the edge of the mounting plate 13 through a normal bolt connection, A mounting leg 17a for supporting the mounting member 10 and a mounting plate 17b for connecting the mounting leg 17a to the lower end of the mounting leg 17a.

Second, the heating means 20 is installed inside the ring fixing member 10 so that the heating plate 25 is positioned on the inner periphery of the seating portion 11 on which the ring 1 is seated, that is, the hollow 11a, The heating plate 25 and the support legs 27. The heater block 23 is provided with a heating plate 25 and a support leg 27. The heater block 23 is provided with a heating plate 25,

The heater block 23 is disposed inside the mounting base 17 of the ring fixing member 10. The heater block 23 includes a plurality of heater rods 21 for heating the heating plate 25, The temperature sensor 22 for maintaining the heating temperature of the heating plate 21 at a constant level through the temperature control of the rod 21 is constructed.

The heating plate 25 is heated by receiving heat controlled at a predetermined temperature through the heater rod 21 and the temperature sensor 22 and is installed on the heater block 23 The film 3 is closely attached to the lower surface of the film 3 attached to the ring 1 and the heat is transferred to the film 3 to lower the adhesiveness of the adhesive surface formed on the film 3, So that all the semiconductor packages 5 adhered to the surfaces of the semiconductor packages 5 can be removed.

Here, the heating temperature of the heating plate 25 is preferably about 150 캜 or less at a temperature that facilitates deterioration of the adhesiveness of the film 3, but only the adhesiveness of the adhesive surface is lowered If the temperature can be set, it can be set to various temperatures.

The supporting leg portion 27 is configured such that one side is coupled to the lower portion of the heater block 23 and the other side is fixedly coupled to the mounting base 17 to thereby support the heater block 23 and prevent heat transfer. It is preferable to minimize the transfer of the heat of the heater block 23 to the ring fixing member 10 through the mounting base 17.

The supporting leg portion 27 is composed of a leg 27a and a torsionally-inserted diaphragm 27b connecting the leg 27a and the mounting table 17 so as to support the heating means 20 firmly, It is more preferable to prevent the heat transfer from being effectively prevented by preventing the device from malfunctioning. Although not shown in the drawings, the legs 27a may be made in a configuration in which length adjustment is performed.

On the other hand, the picker 30 has a constitution in which the semiconductor package 5 placed on the film 3 whose adhesiveness has deteriorated through the heating means 20 is vacuum-adsorbed, thereby carrying out the desorption and the suction transport of the semiconductor package 5 The present invention is characterized in that a plurality of semiconductor packages 1 placed on the bonding surface of the film 3 through the picker 30 can be desorbed at one time to be adsorbed and transported. To this end, the picker 30 , A transfer block (33), a connecting block (37), and an intake block (39).

First, the transfer block 33 is configured to be horizontally and vertically transferred through a normal horizontal and vertical transfer device for the suction and transfer of the semiconductor package 5, and has a suction port 31 to which the suction pipe 32 is connected And a known vacuum and air device (not shown) is connected to the end of the intake tube 32 for adsorption and desorption of the semiconductor package 5.

The connection block 37 is a structure for sucking and transporting a plurality of semiconductor packages 5 placed on the film 3 in one operation at a time and transferring the semiconductor packages 5 to the suction port 31 corresponding to the suction port 31 of the transfer block 33 The connecting plate 35 forms a connecting plate 35 which is tightly coupled to the lower surface of the conveying block 33 by forming a connecting hole 34. The lower surface of the connecting plate 35 is connected to an intake port 31 communicating with the inlet port 31 through a connecting hole 34, And a space 36 is formed.

The intake block 39 has a structure in which a plurality of semiconductor packages 5 are desorbed and sucked and transferred at once by abutting directly against the upper surface of a plurality of semiconductor packages 5 placed on the film 3. For this purpose, The block 39 is tightly coupled to the lower surface of the connecting block 37 and a plurality of the suction holes 38 are formed so that the plurality of semiconductor packages 5 correspond to the aligned arrangement of the films 3 on the adhesive side.

Each of the plurality of intake holes 38 is formed so as to communicate with the intake space 36 of the connection block 37.

Therefore, when a vacuum is formed in the intake pipe 32 by the vacuum device, the vacuum passes through the intake port 31, the connecting hole 34, and the intake space 36 and is communicated with the plurality of intake holes 38, A plurality of semiconductor packages 5 placed on the adhering surface of the film 3 whose adhesiveness has deteriorated through the plate 25 can be desorbed and transported by one of theobtains.

The suction hole 38 of the intake block 39 may further include a plurality of suction nozzles 38a in order to prevent the suction nozzle 38 from dropping, A spring for releasing the semiconductor package 5 from the intake block 39 through a lowering operation of the valve 38a, and the like. Such a configuration is well known in the art and will not be described in detail.

In the present invention, it is preferable to further include a structure for smoothly performing the detachment process of the semiconductor package using the picker without malfunction. In this configuration, a plurality of semiconductor packages 5 are provided on the lower surface of the intake block 39, And a projection 39a for horizontally moving the suction hole 38 is further included between the suction holes 38, respectively.

A plurality of semiconductor packages 5 placed on the adhering surface of the film 3 whose adhesion has been reduced are attached to the projections 39a in a state of being vacuum-adsorbed by the suction holes 38 of the suction block 39, The adhesive force of the semiconductor package 5 adhered to the adhesive surface of the film 3 can be further reduced and the vacuum suction force of the suction hole 38 can be used to reduce the adhesive force of the semiconductor package 5, It is possible to easily perform the detachment process of the detachable member 5.

The operation of the preferred embodiment of the present invention will now be described.

After the semiconductor package 5 bonded to the adhesive surface of the film 3 is ready to be attached and detached through the picker 30, the heater rod 21 and the temperature sensor 22, which are provided in the heating means 20, Thereby quickly heating the heating plate 25.

As the heating plate 25 thus heated is in close contact with the film, the adhesiveness of the adhesive surface formed on the film 3 is deteriorated. As a result, The adhesiveness of the packages 5 is deteriorated.

In this state, the operator places the plurality of suction holes 38 formed in the intake block 39 of the picker 30 at positions corresponding to the respective semiconductor packages 5 through the horizontal transfer device, The intake hole 38 of the intake block 39 can be brought into close contact with the upper surface of the semiconductor package 5 while the picker 30 is operated to descend using the apparatus, A vacuum is formed in the inner space of the intake port 30, that is, the intake port 31 connected to the intake pipe 32, the connection port 34, the intake space 36 and the intake hole 38, Can be achieved.

Therefore, the operator can move the picker 30 upward by moving the picker 30 through the vertical transfer device, so that the plurality of semiconductor packages 5 can be desorbed and transferred at once. In the present invention, The projections 39a may be horizontally moved all over the plurality of semiconductor packages 30 by horizontally moving the picker 30 through the horizontal transfer device so as not to cause a malfunction, The semiconductor package 5 may be desorbed and transferred by suction while the adhesive strength of the semiconductor package 5 is further reduced.

As described above, the use of the semiconductor package detachment apparatus 100 of the present invention can lower the adhesiveness of the film 3 through the heating plate, so that the semiconductor package 50 using the picker 30 can easily The semiconductor package 5 using the picker 30 can be desorbed and transported all at once so that all of the semiconductor packages 5 bonded to the film 3 can be desorbed in a single operation, It is possible to obtain the action and effect to be improved.

1: ring 3: film 5: semiconductor package
[0002] The present invention relates to a ring mounting structure, and more particularly,
20: Heating means 21: Heater rod 22: Temperature sensor 23: Heater block 25: Heating plate 27: Support leg 27a: Leg 27b: Heat transfer zone
The present invention relates to an image forming apparatus, and more particularly, it relates to an image forming apparatus, which comprises: an image forming apparatus including an image forming apparatus, an image forming apparatus, an image forming apparatus, an image forming apparatus, an image forming apparatus,
100: Device for removing / attaching semiconductor packages

Claims (5)

A semiconductor package detachment apparatus for detachably attaching a semiconductor package (5) adhered to a bonding surface of a film (3) attached to a ring (1)
A clamp 15 for fixing a ring 1 formed on the mounting plate 13 and seated on the mounting portion 11 and a mounting plate 13 for mounting the mounting plate 13 And a mounting table (17) provided at a lower portion of the ring fixing member (10);
The heater rod 21 and the temperature sensor 22 are constituted so that the heating plate 25 is positioned on the inner circumference of the seating part 11 on which the ring 1 is placed so that the mounting base 17 of the ring fixing installation member 10, And a heater block 23 installed at the top of the heater block 23 to receive heat controlled at a predetermined temperature through the heater rod 21 and the temperature sensor 22, A heating plate 25 which is attached to the lower surface of the film 3 attached to the heater block 23 and one end of which is coupled to the lower portion of the heater block 23 and the other end of which is fixedly coupled to the mounting table 17, And a heating means (20) composed of a support leg (27) for preventing heat transfer,
The adhesiveness of the bonding surface to which the semiconductor package 5 is adhered is lowered by heating the film 3 using the heating plate 25 during the suction transportation of the semiconductor package 5, Wherein the semiconductor package (5) is detachably attached to the semiconductor package (5).
delete 2. The apparatus according to claim 1, wherein the picker (30)
A conveying block 33 forming an intake port 31 and connected to the intake pipe 32;
A connection plate 35 formed on the lower surface of the connection block 35 so as to communicate with the inlet port 31 by forming a connection port 34 corresponding to the inlet port 31 and closely fitting to a lower surface of the transfer block 33; A connection block 37 constituting an intake space 36 which is formed in the intake passage 36;
And an intake block 39 constituted by a plurality of intake holes 38 communicating with the intake space 36 of the connection block 37 and tightly coupled to the lower surface of the connection block 37,
Wherein a plurality of semiconductor packages (5) placed on a bonding surface of the film (3) whose adhesiveness is deteriorated through the heating plate (25) can be desorbed and transported by suction at one time.
The apparatus according to claim 3, characterized in that the suction holes (38) formed in the suction block (39) further include a plurality of spindles (38a).
4. The air conditioner according to claim 3, wherein a projection (39a) for horizontally moving the plurality of semiconductor packages (5) is further provided between the suction holes (38)
Wherein a plurality of semiconductor packages (5) placed on an adhering surface of the film (3) in a state of being horizontally moved by the projections (39a) can be desorbed and processed.
KR1020160004530A 2016-01-14 2016-01-14 A treatment device for detaching the semiconductor package KR101638995B1 (en)

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KR1020160004530A KR101638995B1 (en) 2016-01-14 2016-01-14 A treatment device for detaching the semiconductor package

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KR1020160004530A KR101638995B1 (en) 2016-01-14 2016-01-14 A treatment device for detaching the semiconductor package

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101754965B1 (en) 2017-03-03 2017-07-07 제너셈(주) Adhesive film desorption method of semiconductor package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251558A (en) * 1991-06-18 1993-09-28 Tenryu Technic:Kk Workpiece separator
KR20060050303A (en) * 2004-08-10 2006-05-19 가부시기가이샤 디스코 Wafer dividing method
KR100865766B1 (en) 2007-07-24 2008-10-29 (주) 에스에스피 Semiconductor die ejecting apparatus
KR20130081170A (en) * 2012-01-06 2013-07-16 한미반도체 주식회사 Chip holding device and pickup system having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251558A (en) * 1991-06-18 1993-09-28 Tenryu Technic:Kk Workpiece separator
KR20060050303A (en) * 2004-08-10 2006-05-19 가부시기가이샤 디스코 Wafer dividing method
KR100865766B1 (en) 2007-07-24 2008-10-29 (주) 에스에스피 Semiconductor die ejecting apparatus
KR20130081170A (en) * 2012-01-06 2013-07-16 한미반도체 주식회사 Chip holding device and pickup system having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101754965B1 (en) 2017-03-03 2017-07-07 제너셈(주) Adhesive film desorption method of semiconductor package

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