JPH05251558A - Workpiece separator - Google Patents

Abstract

PURPOSE:To prevent damage to a workpiece and make a productive step simple, by providing a simple structure in a workpiece separator. CONSTITUTION:A workpiece separator is used to separate semiconductor pellets 3 of a semiconductor wafer 2 from a film sheet 1, on which the pellets 3 are separately stuck thereto. The workpiece separator comprises a sucking means for sucking the film sheet 1 having one outer side that is fixed, and a suction face 6 for receiving the film sheet 1 when the film sheet 1 is sucked with the sucking means 5. The suction face 6 has an uneven shape with a suction groove 6A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work separating apparatus for separating each divided piece of a work which is divided and attached to a sheet from the sheet, and more particularly, to a work separating apparatus which is divided in a semiconductor device assembling process. The present invention relates to a technique effectively applied to a work separation device or the like for separating each semiconductor pellet of a semiconductor wafer attached to a film sheet from the sheet.

[0002]

2. Description of the Related Art For example, as a work separating device used in a process of assembling a semiconductor device of this type, a film sheet having a semiconductor wafer attached thereto is expanded and stretched to separate the divided semiconductor pellets from each other. A device is known in which the separated semiconductor pellets are picked up one by one by suction means such as a vacuum pad. At the time of this pickup, a needle-shaped push rod pushes up the back surface side of the film sheet to push the semiconductor pellets and the film. By separating the adhesive surface of the sheet, the suction of the semiconductor pellets by the suction means is facilitated.

[0003]

In the work separating apparatus as described above, a step of expanding and stretching a film sheet to separate the divided semiconductor pellets from each other, and the separated semiconductor pellets to a film. A plurality of steps including a step of pushing up with a needle-shaped push rod from the back surface side of the sheet are required, and the pushing up of the push rod may damage the work.

It is an object of the present invention to provide a work separating device which can reduce the number of steps and prevent the damage of a work with a simple structure.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0006]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the structure of the work separating device of the present invention is a work separating device for separating the respective divided pieces of the work that are divided and attached to the sheet from the sheet, and suction means for sucking the sheet. And a suction surface on which the sheet is suctioned by suction by the suction means, and the suction surface is formed in an uneven shape.

In this case, it is possible to adopt a structure provided with a heating means for heating the pressure-sensitive adhesive that adheres the work to the sheet to reduce the pressure-sensitive adhesive force.

Further, the work is a semiconductor wafer,
The divided pieces may be semiconductor pellets.

[0010]

According to the above-described structure of the work separating apparatus of the present invention, when the sheet is sucked by the suction means, the sheet is sucked by the uneven suction surface, so that the divided pieces and the sheet are separated from each other. Since the pasting area is greatly reduced, the push-up process by a push rod or the like is not necessary, and each divided piece can be separated from the sheet only by the suction process by the suction means. It is possible to prevent damage, and such an effect can be obtained by a simple structure of the suction means and the uneven suction surface.

In this case, if a structure is provided with heating means for heating the pressure-sensitive adhesive that adheres the work to the sheet to reduce the pressure-sensitive adhesive force, each of the pressure-sensitive adhesives is heated by the heating means. The separation of the divided pieces from the sheet can be further promoted.

[0012]

1 is a sectional view showing a work separating apparatus according to an embodiment of the present invention, FIG. 2 is a partially enlarged sectional view of the work separating apparatus, and FIG. 3 is a plan view showing the work separating apparatus. ..

In the work separating apparatus of this embodiment, each semiconductor pellet 3 (divided piece) of the semiconductor wafer 2 (work) which is divided and attached to the film sheet 1 is divided into the film sheet 1 in the process of assembling the semiconductor device. And a fixing means 4 for detachably fixing the outer peripheral side of the film sheet 1 and the film sheet 1.
4A for detachably supporting the outer peripheral side of the sheet, and a vacuum for vacuum stretching (vacuum) the film sheet 1 fixed and supported by the fixing means 4 and the supporting means 4A to expand and stretch the film sheet 1. The suction means 5 and the suction surface 6 on which the film sheet 1 is sucked by the vacuum suction means 5 are provided.

On the other hand, the semiconductor wafer 2 applied to the work separating apparatus of this embodiment is half-cut by a dicing saw or the like, that is, cut into a lattice shape with a thickness of 70 μm to 200 μm left, and divided. Although the semiconductor pellets 3 are configured, the invention can be applied to the semiconductor wafer 2 configured by dividing each semiconductor pellet 3 by full cutting.

The fixing means 4 holds and fixes the outer peripheral side of the film sheet 1 in an airtight manner, and by this airtight holding and fixing, the vacuum suction means 5 ensures vacuum suction of the film sheet 1. ..

Fine suction grooves 6A are formed on the suction surface 6 in a grid pattern, and the suction grooves 6A form the suction surface 6 in a concavo-convex shape. The suction groove 6A of the suction surface 6 communicates with the vacuum suction means 5 through a suction hole 7 and an annular groove 8 formed on the outer periphery of the suction surface 6.

In the vacuum suction means 5, the back side of the film sheet 1 which is fixed and supported by the fixing means 4 and the supporting means 4A as shown by the one-dot chain line in FIG. As shown in the drawing, the suction surface 6 side is vacuum-sucked, and the suction groove 6A on the back surface side of the film sheet 1 which is sucked by the suction surface 6 by the vacuum suction is brought into a vacuum state through the suction holes 7 and the annular groove 8. Further, the film sheet 1 is vacuum-sucked to the suction surface 6 side and expanded and stretched.

Further, in the work separating apparatus of the present embodiment, a heating means 9 such as a heater is internally provided on the lower surface side of the suction surface 6, and the adhesive for sticking the semiconductor wafer 2 to the film sheet 1 is the heating means. By being heated by 9 to be in a fluidized state and its adhesive force is reduced, separation of each semiconductor pellet 3 from the semiconductor wafer 2 is further promoted.

Next, the operation of this embodiment will be described.

For example, the work separating apparatus of this embodiment is
It is used as follows.

First, as shown by the alternate long and short dash line in FIG. 1, the outer peripheral side of the film sheet 1 to which the semiconductor wafer 2 is attached is airtightly held and fixed by the fixing means 4 and the supporting means 4 is provided.
Have A support.

Next, as shown by the chain double-dashed line in FIG. 1, the back surface side of the film sheet 1 is vacuum-sucked to the suction surface 6 side through the suction holes 7, so that the film sheet 1 is expanded and stretched to form the semiconductor pellets 3. Separate each other,
At this time, since the suction groove 6A on the back surface side of the film sheet 1 vacuum-sucked to the suction surface 6 side is brought into a vacuum state by the vacuum means, the film sheet 1 is closely attached to the bottom surface side of the suction groove 6A and further expanded and stretched. Each semiconductor pellet 3 and film sheet 1
The adhesive area of the semiconductor pellets is greatly reduced, and when the film sheet 1 is adsorbed on the adsorption surface 6, the adhesive is heated and fluidized by the heating means 9 and its adhesive force is reduced. 3 can be easily separated from the film sheet 1.

That is, when the film sheet 1 is expanded and stretched, a conventional push-up process using a push rod or the like is required in the process of sucking and picking up each semiconductor pellet 3 by a suction means (not shown) such as a vacuum pad. Instead, each divided piece can be separated from the sheet only by the suction step by the suction means.

Therefore, according to the work separating apparatus of this embodiment, the number of steps can be reduced and the work can be prevented from being damaged, and such an effect can be obtained by the simple structure of the suction means and the uneven suction surface 6. Can be obtained by

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above embodiment, the semiconductor wafer 2 in the semiconductor device is used as the work and the divided pieces.
And the semiconductor pellet 3 is applied, but the work and the divided pieces in the present invention are such semiconductor wafers 2.
The application of the semiconductor pellet 3 is not limited to the above.

Further, in the above embodiment, the obstacle means 4
A step is formed between A and the suction surface 6, and the vacuum suction means 5
The structure is such that the film sheet 1 is expanded and stretched by the step when the film sheet 1 is vacuum sucked by the above. In the present invention, the obstruction means 4A and the suction surface 6 are formed on substantially the same plane. It is also possible to adopt a structure in which the film sheet 1 is not expanded / stretched due to a step, that is, a structure in which the film sheet 1 is expanded / stretched only by closely adhering to the bottom surface side of the suction groove 6A.

Particularly, for example, for a semiconductor wafer 2 in which each semiconductor pellet 3 is divided by full cutting and the film sheet 1 is expanded and stretched by another expansion and stretching means, the latter structure without a step. The work separation device can be applied.

[0029]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1) According to the above-described structure of the work separating apparatus of the present invention, when the sheet is sucked by the suction means, the sheet is sucked by the concave-convex suction surface, so that the divided pieces are separated from each other. Since the sticking area with the sheet is greatly reduced, the push rod push-up step is unnecessary, and each divided piece can be separated from the sheet only by the suction step by the suction means, and as a result, the number of steps can be reduced. The work can be prevented from being damaged, and such an effect can be obtained by the simple structure of the suction means and the uneven suction surface.

(2) In the above-mentioned case, if the structure is equipped with a heating means for heating the pressure-sensitive adhesive sticking the work to the sheet to reduce the pressure-sensitive adhesive force, the pressure-sensitive adhesive to the pressure-sensitive adhesive by the heating means is reduced. The heating can further promote the separation of each divided piece from the sheet.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a work separating device according to an embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view of the work separating device.

FIG. 3 is a plan view showing the work separating device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film sheet 2 Semiconductor wafer (work) 3 Semiconductor pellet (divided piece) 4 Fixing means 4A Supporting means 5 Vacuum suction means 6 Adsorption surface 6A Suction groove 7 Suction hole 8 Annular groove 9 Heating means

Claims (3)

[Claims] 1. A work separating device for separating each divided piece of a work, which is divided and attached to a sheet, from the sheet, the suction means sucking the sheet, and the sheet sucked by the suction means. And a suction surface on which the suction surface is sucked, and the suction surface is formed in an uneven shape. 2. The work separating apparatus according to claim 1, further comprising heating means for heating the pressure-sensitive adhesive that adheres the work to the sheet to reduce its adhesive force. 3. The work separating apparatus according to claim 1, wherein the work is a semiconductor wafer, and the divided pieces are semiconductor pellets.