JPS6329948A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6329948A JPS6329948A JP61174480A JP17448086A JPS6329948A JP S6329948 A JPS6329948 A JP S6329948A JP 61174480 A JP61174480 A JP 61174480A JP 17448086 A JP17448086 A JP 17448086A JP S6329948 A JPS6329948 A JP S6329948A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- adhesive sheet
- semiconductor wafer
- dicing
- soft adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000008188 pellet Substances 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造方法に関し、特に半導体ウェ
ーハを複数のペレットに分割する工程を含む半導体装置
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device including a step of dividing a semiconductor wafer into a plurality of pellets.
従来、半導体ウェーハを複数のペレットに分割するには
、先ず半導体ウェーハの裏面に軟質接着シー）・を張付
け、その後半導体ウェーハを個々のペレットに切断し、
更に裏面の軟質接着シートを拡張してベレット同士を所
定の間隔に引離するという方法がある。Conventionally, in order to divide a semiconductor wafer into multiple pellets, first a soft adhesive sheet was attached to the back side of the semiconductor wafer, and then the semiconductor wafer was cut into individual pellets.
Furthermore, there is a method of expanding the soft adhesive sheet on the back surface and separating the pellets at a predetermined distance.
第３図（ａ）〜（ｅ）は従来の半導体装置の製造方法の
一例を説明するための工程順に示した断面図である。FIGS. 3(a) to 3(e) are cross-sectional views shown in the order of steps for explaining an example of a conventional method for manufacturing a semiconductor device.
この製造方法は、先ず、第３図（ａ＞に示すように、軟
質接着シート３をステンレス製等の固定用フレーム４′
に張付け・固定し続いて半導体ウェーハの裏面を張付け
る。これをダイシング装置のステージ６′上にセットし
てダイシングにより複数のペレット２に切断する。In this manufacturing method, first, as shown in FIG.
Then, the back side of the semiconductor wafer is attached. This is set on the stage 6' of a dicing device and cut into a plurality of pellets 2 by dicing.
そこで、複数のペレット２は、第３図（ｂ）に示すよう
に、軟質接着シート３上で切断溝９を介して分割される
。Therefore, the plurality of pellets 2 are divided through cutting grooves 9 on the soft adhesive sheet 3, as shown in FIG. 3(b).
更に、このペレットを軟質接着シート３と共にダイシン
グ装置から外し洗浄・乾燥を行った後に、第３図（ｄ）
に示すように、軟質接着シート拡大装置にセットして加
熱しながら軟質接着シートを拡大する。Furthermore, after removing the pellets from the dicing machine together with the soft adhesive sheet 3 and cleaning and drying them, the pellets are shown in FIG. 3(d).
As shown in , the soft adhesive sheet is set in a soft adhesive sheet expanding device and expanded while being heated.
ここで、ダイシング装置から外して軟質接着シート拡大
装置にセットする間のハンドリングの際に、第３図（ｃ
）に示すように、隣り同士のペレット２が衝突し合って
角が欠けたり傷が付いたりしてしまうということがある
。Here, during handling while removing the sheet from the dicing device and setting it on the soft adhesive sheet expanding device, as shown in FIG.
), adjacent pellets 2 may collide with each other, resulting in chipped or damaged corners.
従って、軟質接着シートを接大したペレットの中には、
第３図（ｅ）に示すように、角の欠けたペレット２′が
含まれる。Therefore, in the pellets made by enlarging the soft adhesive sheet,
As shown in FIG. 3(e), pellets 2' with missing corners are included.
上述した従来の半導体装置の製造方法の半導体ウェーハ
を個々のペレットに分割する方法は、ダイシング装置の
ステージ上での完全切断後から軟質接着シート拡大装置
にセットするまでの工程におけるハンドリングの際に、
軟質接着シートの弛み等により隣接するベレット同士が
衝突して欠けたり傷が付いたりして、ペレットの歩留を
低下するという欠点がある。The method of dividing a semiconductor wafer into individual pellets in the conventional semiconductor device manufacturing method described above involves handling during the process from complete cutting on the stage of a dicing device to setting it in a soft adhesive sheet expansion device.
There is a drawback that adjacent pellets collide with each other due to loosening of the soft adhesive sheet, resulting in chipping or damage, which reduces pellet yield.
本発明の目的は、ハンドリングの際の軟質接着シートの
弛みによる隣接ベレット同士の衝突を無くしてペレット
歩留の低下を防止する半導体装置の製造方法を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that eliminates collisions between adjacent pellets due to loosening of a soft adhesive sheet during handling, thereby preventing a decrease in pellet yield.
本発明の半導体装置の製造方法は、半導体ウェーハの裏
面に軟質接着シートを接着する工程と、前記軟質接着シ
ートを引伸す機構を備えたダイシング装置に前記半導体
ウェーハをセットしてダイシングにより前記半導体ウェ
ーハを複数のペレットに分割する工程と、前記半導体ウ
ェーハを前記ダイシング装置にセットしたまま前記軟質
接着シートを引伸して前記複数のペレットの隣り同士が
所定の間隔になるように配置する工程とを含んで構成さ
れる。The method for manufacturing a semiconductor device of the present invention includes the steps of bonding a soft adhesive sheet to the back surface of a semiconductor wafer, and setting the semiconductor wafer in a dicing device equipped with a mechanism for stretching the soft adhesive sheet, and dicing the semiconductor wafer. a step of dividing the semiconductor wafer into a plurality of pellets, and a step of stretching the soft adhesive sheet while the semiconductor wafer is set in the dicing device and arranging the plurality of pellets so that adjacent pellets are spaced apart from each other by a predetermined distance. configured.
次に、本発明の一実施例について図面を参照して説明す
る。Next, an embodiment of the present invention will be described with reference to the drawings.
第１図（ａ）〜（ｄ）は本発明の一実施例を説明するた
めの工程順に示した断面図、第２図は本発明の一実施例
に使用する拡大用リングの斜視図である。FIGS. 1(a) to (d) are cross-sectional views shown in order of steps to explain an embodiment of the present invention, and FIG. 2 is a perspective view of an enlargement ring used in an embodiment of the present invention. .
この実施例は、先ず、第１図（ａ）に示すように、固定
用フレームに接着・固定した軟質接着シート４を、半導
体ウェーハ４の裏面に張付ける。In this embodiment, first, as shown in FIG. 1(a), a soft adhesive sheet 4 bonded and fixed to a fixing frame is attached to the back surface of a semiconductor wafer 4.
次に、第１図（ｂ）に示すように、第２図に示す拡大用
リング５がステージ６の周囲にセットしである軟質接着
シート拡大機構を備えたダイシング装置に軟質接着シー
トを張付けた、半導体ウェーハ１を真空吸着によりシテ
ージ６上に固定してダイシングにより複数のペレット２
に分割する。Next, as shown in FIG. 1(b), the soft adhesive sheet was attached to a dicing device equipped with a soft adhesive sheet expanding mechanism in which an expanding ring 5 shown in FIG. 2 was set around the stage 6. , the semiconductor wafer 1 is fixed on the stage 6 by vacuum suction, and a plurality of pellets 2 are formed by dicing.
Divide into.
次に、第１図（ｃ）に示すように、真空吸着を切り、拡
大用リング押え７を下げることによって軟質接着シート
を引伸し・拡大してペレット同士を所定の間隔に離し、
その後洗浄と乾燥を行う。Next, as shown in FIG. 1(c), the vacuum suction is turned off and the expansion ring presser 7 is lowered to stretch and expand the soft adhesive sheet to separate the pellets at a predetermined interval.
Then wash and dry.
従って、ダイシングから軟質接着シートの拡大までの間
にハンドリングの際の弛みによるペレット同士の接触が
無いので、第１図（ｄ）に示すように、所定の間隔に離
れたペレットには、従来例のように角が欠けたり傷が付
いたりしたものは無い。Therefore, there is no contact between the pellets due to loosening during handling during the period from dicing to the expansion of the soft adhesive sheet, so as shown in Figure 1(d), the pellets spaced apart at a predetermined distance are There are no missing corners or scratches.
以上説明したように本発明は、裏面に軟質接着シート牙
張付けた半導体ウェーハを拡大用リングを周囲にセット
したダイシング装置のステージ上で、完全切断後軟質接
着シートを引き伸ばしペレット同士を所定の間隔に離す
このにより、ハンドリングの際のペレット同士の衝突に
よる角が欠けたり傷が付いたりすること等による不良ペ
レットの発生を低減できる効果がある。As explained above, in the present invention, a semiconductor wafer with a soft adhesive sheet pasted on the back side is completely cut on the stage of a dicing machine with an enlarging ring set around it, and after the semiconductor wafer is completely cut, the soft adhesive sheet is stretched to space the pellets at predetermined intervals. This separation has the effect of reducing the occurrence of defective pellets due to chipped corners or scratches due to pellets colliding with each other during handling.
更に又、ダイシングの作業中に！ｌ！続して軟質接着シ
ートの拡大を行なう為、従来に比ベニ数を短縮するとい
う効果も期待される。Furthermore, while working on dicing! l! Next, we will expand the use of soft adhesive sheets, which is expected to have the effect of shortening the number of bends compared to the conventional method.
【図面の簡単な説明】
第１図（ａ）〜（ｄ）は本発明の一実施ρ１を説明する
ための工程順に示した断面図、第２図は本発明の一実施
例に使用する拡大用リングの斜視図、第３図（ａ）〜（
ｅ＞は従来の半導体装置の製造方法の一例を説明するた
めの工程順に示した断面図である。
１・・・半導体ウェーハ、２．２′・・・ベレ・・Ｉト
、３・・・軟質接着シート、４，４′・・・固定用フレ
ーム、５・・・拡大用り〉′グ、６．６′、６”・・・
ステージ、７．７′ ・・拡大用リング押え、８・・・
カッター、９第１図
千２図
第３図[BRIEF DESCRIPTION OF THE DRAWINGS] Figures 1(a) to (d) are sectional views shown in the order of steps for explaining one embodiment ρ1 of the present invention, and Figure 2 is an enlarged view used in one embodiment of the present invention. Perspective view of ring for use, Figures 3(a)-(
e> is a cross-sectional view showing an example of a conventional method for manufacturing a semiconductor device in order of steps. DESCRIPTION OF SYMBOLS 1...Semiconductor wafer, 2.2'...Belt, 3...Soft adhesive sheet, 4,4'...Fixing frame, 5...For enlargement>'g, 6.6′, 6”...
Stage, 7.7'...Enlargement ring holder, 8...
Cutter, 9 Figure 1 Figure 1, 2 Figure 3
Claims (1)
程と、前記軟質接着シートを引伸す機構を備えたダイシ
ング装置に前記半導体ウェーハをセットしてダイシング
により前記半導体ウェーハを複数のペレットに分割する
工程と、前記半導体ウェーハを前記ダイシング装置にセ
ットしたまま前記軟質接着シートを引伸して前記複数の
ペレットの隣り同士が所定の間隔になるように配置する
工程とを含むことを特徴とする半導体装置の製造方法。a step of adhering a soft adhesive sheet to the back surface of the semiconductor wafer; a step of setting the semiconductor wafer in a dicing device equipped with a mechanism for stretching the soft adhesive sheet and dividing the semiconductor wafer into a plurality of pellets by dicing; A method for manufacturing a semiconductor device, comprising the step of stretching the soft adhesive sheet while the semiconductor wafer is set in the dicing device, and arranging the plurality of pellets so that adjacent pellets are spaced at a predetermined distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174480A JPS6329948A (en) | 1986-07-23 | 1986-07-23 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174480A JPS6329948A (en) | 1986-07-23 | 1986-07-23 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6329948A true JPS6329948A (en) | 1988-02-08 |
Family
ID=15979215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61174480A Pending JPS6329948A (en) | 1986-07-23 | 1986-07-23 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6329948A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168954A (en) * | 1990-04-09 | 1992-12-08 | Japan Electronic Control Systems Company, Limited | Apparatus for controllably sucking intake air into each cylinder of internal combustion engine and method for controlling intake air quantity thereof with improved responsive characteristic |
| EP0975008A1 (en) * | 1998-07-20 | 2000-01-26 | Alphasem AG | Method and device for treating a flat workpiece, in particular a semiconductor wafer |
| US7402503B2 (en) | 2004-07-12 | 2008-07-22 | Seiko Epson Corporation | Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
| WO2009020245A3 (en) * | 2007-08-07 | 2009-03-26 | Panasonic Corp | Method of segmenting semiconductor wafer |
| JP2014075405A (en) * | 2012-10-03 | 2014-04-24 | Disco Abrasive Syst Ltd | Grinding apparatus and grinding method |
-
1986
- 1986-07-23 JP JP61174480A patent/JPS6329948A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5168954A (en) * | 1990-04-09 | 1992-12-08 | Japan Electronic Control Systems Company, Limited | Apparatus for controllably sucking intake air into each cylinder of internal combustion engine and method for controlling intake air quantity thereof with improved responsive characteristic |
| EP0975008A1 (en) * | 1998-07-20 | 2000-01-26 | Alphasem AG | Method and device for treating a flat workpiece, in particular a semiconductor wafer |
| WO2000005772A1 (en) * | 1998-07-20 | 2000-02-03 | Alphasem Ag | Method and device for processing a flat workpiece, especially a semiconductor wafer |
| US7402503B2 (en) | 2004-07-12 | 2008-07-22 | Seiko Epson Corporation | Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
| WO2009020245A3 (en) * | 2007-08-07 | 2009-03-26 | Panasonic Corp | Method of segmenting semiconductor wafer |
| US8110481B2 (en) | 2007-08-07 | 2012-02-07 | Panasonic Corporation | Method of segmenting semiconductor wafer |
| JP2014075405A (en) * | 2012-10-03 | 2014-04-24 | Disco Abrasive Syst Ltd | Grinding apparatus and grinding method |
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