JP6572441B2 - MOUNTING BOARD MANUFACTURING SYSTEM AND METHOD FOR INSTALLING BOARD SUBSTITTING MEMBER IN MOUNTING BOARD MANUFACTURING SYSTEM - Google Patents

Description

  The present invention relates to a mounting board manufacturing system that performs predetermined processing such as screen printing and component mounting on a board, and a method for installing a substrate receiving member in the mounting board manufacturing system.

  Conventionally, in a mounting board manufacturing system that performs predetermined processing such as screen printing and component mounting on a substrate, the lower surface of the substrate to be processed is supported for the purpose of stably performing the processing on the substrate. ing. The substrate receiving member used for supporting the substrate differs in shape, size, etc. depending on the size of the substrate and the state of the lower surface (for example, the arrangement state of components already mounted on the lower surface of the substrate). In order to switch the type of substrate to be produced, it is necessary to prepare for replacing the substrate receiving member in accordance with the substrate to be processed. Most of the setup work for replacing the substrate receiving member is manual work, which leads to an increase in work man-hours. For this reason, it is known that a plurality of substrate receiving members corresponding to the type of substrate are prepared in advance, and these substrate receiving members are automatically replaced according to the substrate to be processed. . For example, Patent Document 1 below discloses a carrier in which a carrier capable of holding a substrate receiving member is supplied into a transport unit, and the substrate receiving member is supplied and collected through the supplied carrier. .

Japanese Patent No. 3499759

  However, in the apparatus described in Patent Document 1, since the carrier is sent to the transport unit along the same path as the substrate, the substrate supply unit is used to supply and automatically install the substrate receiving member to be automatically installed in the transport unit. It was necessary to temporarily stop the supply of the substrate. For this reason, the processing operation for the substrate is interrupted, and there is a problem that the productivity of the substrate may be lowered.

  Accordingly, the present invention provides a mounting substrate manufacturing system capable of automatically installing a substrate receiving member without interfering with the substrate supply by the substrate supply unit, and a method for installing the substrate receiving member in the mounting substrate manufacturing system. With the goal.

The mounting board manufacturing system of the present invention includes a transport unit that transports an object to be transported and performs positioning to a work position, a lower receiving member installation unit provided below the transport unit, and a lower receiving member installation unit. A substrate lowering member that is detachably installed and supports the lower surface of the substrate as the object to be transferred that has been transferred to the work position by the transfer unit, and an upper surface of the substrate whose lower surface is supported by the substrate lowering member. A substrate processing unit that performs a predetermined process; a transfer-side distribution unit that receives the transfer object at any of a plurality of receiving positions; and transfers the received transfer object to the transfer unit; and the transfer-side distribution unit A substrate supply unit for supplying a substrate as the transfer object to a first position among the plurality of receiving positions provided; and the first position among the plurality of receiving positions provided in the carry-in distribution unit; Is A lower receiving member supply unit for supplying the substrate lower receiving member as the transfer object to the second position, and the transfer unit removes the substrate lower receiving member removed from the lower receiving member installation unit. The delivery side distribution unit delivers the substrate lower receiving member received from the transfer unit from the second position, and the substrate lower receiving member is held on the lower surface of the carrier. The carrier is supplied to the second position in the state, and the carrier is transported to the work position by being transported by the carry-in distribution unit and the transport unit, and is installed in the lower receiving member installation unit, and the lower receiving member The substrate receiving member removed from the installation unit is held on the lower surface of the carrier located at the working position, and the carrier is conveyed by the conveyance unit and the carry-in distribution unit. Is carried out from the second position in Rukoto, the substrate lower receiving member is held by the magnetic force between the carrier on the underside of the carrier.

In the mounting substrate manufacturing system according to the present invention, the substrate receiving member installation method includes a transport unit that transports an object to be transported and performs positioning to a work position, and a lower member installation unit provided below the transport unit. A substrate lower receiving member that is detachably installed in the lower receiving member installing portion and that supports the lower surface of the substrate as the transfer object transferred to the work position by the transfer portion; and a lower surface by the substrate lower receiving member A substrate processing unit that performs a predetermined process on the upper surface of the substrate on which the substrate is supported, and a carry-in distribution unit that receives the transfer object at any of a plurality of receiving positions and delivers the received transfer object to the transfer unit And a substrate supply unit that supplies a substrate as the object to be transported to a first position among the plurality of receiving positions included in the carry-in distribution unit. It is an installation method of a board lower receiving member, Comprising: The said board lower receiving member as said conveyance target object in the 2nd position different from the said 1st position among these receiving positions with which the said carrying-in distribution part is equipped a step of supplying in a state of being held on the lower surface of the carrier, a step of conveying the lower receiving member fed from the second position to the working position by the carry-distribution unit and the transport unit, the lower A step of transferring the substrate lowering member removed from the receiving member installation unit to the carry-in distribution unit in a state where the substrate lowering member is held on the lower surface of the carrier; and the substrate lowering member received from the conveying unit only contains a step of the loading-side distributing portion is carried out from the second position, the substrate lower receiving member is held by the magnetic force between the carrier on the underside of the carrier.

  According to the present invention, automatic installation of the substrate receiving member can be performed without hindering the substrate supply by the substrate supply unit.

The top view which shows schematic structure of the mounting substrate manufacturing system in one embodiment of this invention The side view of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided The sectional side view of the vicinity of the board | substrate receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided The sectional side view which shows the board | substrate lower receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided with the lower receiving member installation part The block diagram which shows the operation | movement system of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided. (A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) Operation explanatory drawing at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention Operation explanatory diagram at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) The perspective view which shows the board | substrate lower receiving member of the screen printing apparatus with which a mounting board manufacturing system in one embodiment of this invention is equipped with a carrier (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention (A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention (A) (b) (c) Operation explanatory drawing at the time of collection work of a substrate lowering member by a mounting substrate manufacturing system in one embodiment of the present invention (A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a mounting board manufacturing system 1 according to an embodiment of the present invention. The mounting board manufacturing system 1 manufactures a mounting board by subjecting a board 2 to screen printing processing and component mounting processing, and includes a board supply unit 11, a carry-in relay conveyor 12, a screen printing device 13, and a carry-out relay conveyor. 14, the component mounting apparatus 15 and the lower receiving member stocker 16 (lower receiving member supply part) are provided. The flow of the substrate 2 is a direction from the left to the right as viewed from the operator OP, and this direction is defined as the X-axis direction. Further, the front-rear direction viewed from the operator OP is the Y-axis direction, and the vertical direction is the Z-axis direction.

  The substrate supply unit 11 is provided on the most upstream process side of the mounting substrate manufacturing system 1 and continuously supplies the substrate 2. The carry-in relay conveyor 12 is provided on the downstream process side of the substrate supply unit 11, and conveys the substrate 2 supplied by the substrate supply unit 11 to the screen printing apparatus 13 on the downstream process side.

  As shown in FIG. 1, the screen printing apparatus 13 includes a carry-in distribution unit 22, a print execution unit 23, and a carry-out distribution unit 24 on a base 21. The print execution unit 23 is provided in the center of the base 21, and the carry-in distribution unit 22 is provided in the left area of the print execution unit 23 on the base 21 (upstream process side of the print execution unit 23). Yes. The carry-out distribution unit 24 is provided in a region on the right side of the print execution unit 23 on the base 21 (on the downstream process side of the print execution unit 23).

  In FIG. 1, the carry-in distribution unit 22 receives a conveyance object supplied from the upstream process side at any of a plurality of reception positions set in the Y-axis direction, and the received conveyance object is a print execution unit. 23 is transferred to the transport unit entrance on the left end side (details of the transport unit 44 described later in detail). In the present embodiment, the receiving position at which the carry-in distribution unit 22 receives the object to be conveyed is a first position (shown by a solid line in FIG. 1) close to the worker OP side and a second position far from the worker OP side. The first position is coincident with the entrance of the transport unit.

  The substrate supply unit 11 supplies the substrate 2 to the first position via the carry-in relay conveyor 12. For this reason, when the carry-in distribution unit 22 receives the conveyance object (here, the substrate 2) at the first position, the carry-in distribution unit 22 positions the substrate 2 as it is at the conveyance unit entrance. In other words, in the present embodiment, the substrate supply unit 11 supplies the substrate 2 as the conveyance object to the first position among the plurality of receiving positions provided in the carry-in distribution unit 22.

  In FIG. 2, the print execution unit 23 includes a substrate holding unit 31 provided on a base 21, a mask 32, and a squeegee head 33. The substrate holding unit 31 includes an XYZ rotary stage 41 installed on the base 21, a base part 42 that can be moved in the horizontal plane, moved up and down, and rotated around the Z axis by the XYZ rotary stage 41, and a base part 42. A pair of clamps 45 and a transport unit 44 attached to a pair of transport unit support walls 43, a lower receiving member installation unit 46 provided below the transport unit 44, and an upper surface of the lower support member installation unit 46. A freely installed substrate lowering member 47 and an elevating mechanism 48 (lower receiving member installing portion elevating mechanism) for elevating and lowering the lower receiving member setting portion 46 (that is, the lower substrate receiving member 47) with respect to the base portion 42 are provided. ing. The mask 32 and the squeegee head 33 constitute a substrate processing unit that performs a predetermined process on the upper surface of the substrate 2 whose lower surface is supported by the substrate receiving member 47.

  In FIG. 2, the transport unit 44 includes a pair of conveyors 44 a that are installed to face each other in the Y-axis direction. The pair of clamp members 45 are driven by the clamp member drive unit 45M to operate so as to approach or separate from each other. The transport unit 44 receives and transports the transport object positioned by the carry-in distribution unit 22 at the transport unit entrance (first position), and performs positioning and unloading of the transport object to a predetermined work position.

  As shown in FIGS. 2 and 3, the mask 32 is held in a horizontal posture above the substrate holding unit 31. The mask 32 is made of, for example, a metal plate-like member, and a pattern opening (not shown) corresponding to each of a plurality of electrodes (not shown) formed on the upper surface of the substrate 2 is provided at the center thereof. ing. The squeegee head 33 is driven by a head drive mechanism 33M and is moved to the squeegee base 33b that moves in the Y-axis direction above the mask 32. The two squeegees 33k are provided so as to face each other in the Y-axis direction. The configuration includes two cylinders 33 s that are moved up and down with respect to 33 b.

  The substrate receiving member 47 is a hollow box-shaped member having an internal space 47S as shown in FIGS. 3 and 4, and is made of a magnetic material. The substrate receiving member 47 is a member that supports the lower surface of the substrate 2 as a transport object positioned at the work position by the transport unit 44. In the present embodiment, the substrate positioned at the work position by the transport unit 44. It is configured to adsorb while supporting the lower surface of 2.

  The upper surface of the top plate 51 of the substrate receiving member 47 is a surface that contacts the lower surface of the substrate 2 and includes a plurality of suction holes 51a that open upward. The lower surface of the bottom plate 52 of the substrate lower receiving member 47 is a surface that comes into contact with the upper surface of the lower receiving member installation portion 46, and includes a plurality of pipe connection holes 52a that open downward.

  3 and 4, a vacuum suction pipe 53 is formed inside the lower receiving member installation portion 46, and a vacuum suction opening that is an outlet of the vacuum suction piping 53 is formed on the upper surface of the lower receiving member installation portion 46. 53a is formed. When the substrate lower receiving member 47 is installed in the lower receiving member installation portion 46, the vacuum suction opening 53a is closed by the bottom plate 52 of the substrate lower receiving member 47 (FIG. 4).

  In FIG. 3, the vacuum suction pipe 53 is connected to the vacuum source VP through a first external pipe 53G extending outside the lower member installation portion 46, and a first control valve 54 is connected to the first external pipe 53G. It is intervened. When the vacuum source VP sucks out air through the first external pipe 53G and the vacuum suction pipe 53 in a state where the substrate support member 47 is installed in the lower support member installation part 46, the vacuum suction generated in the vacuum suction opening 53a. The substrate lower receiving member 47 is fixed to the lower receiving member installing portion 46 by the force. In addition to adjusting the holding force of the substrate support member 47 by driving the first control valve 54 and adjusting the magnitude of the vacuum suction force generated in the vacuum suction opening 53a, the first control valve 54 is driven. Thus, by releasing the vacuum suction pipe 53 to the atmosphere, the fixing of the substrate lower receiving member 47 to the lower receiving member installing portion 46 can be released. That is, in the present embodiment, the vacuum suction pipe 53, the first external pipe 53G, the first control valve 54, and the like are vacuum suction mechanisms that vacuum-suck the substrate lowering member 47 toward the lower receiving member installation portion 46. 55.

  As shown in FIG. 4, a convex portion 47a projecting downward is provided on the lower surface of the substrate receiving member 47, and a concave portion having a shape that can be fitted to the convex portion 47a on the upper surface of the lower member installing portion 46. 46a is provided. A plurality of convex portions 47 a and concave portions 46 a are provided side by side in the X-axis direction (direction perpendicular to the paper surface of FIG. 4), and the plurality of convex portions 47 a of the substrate lowering member 47 are the lower receiving member installation portions 46. The substrate receiving member 47 is installed in the lower receiving member installation portion 46 in a state of being accurately positioned with respect to the lower receiving member installation portion 46 by being engaged with the plurality of recesses 46a.

  The convex portions 47a are preferably frustoconical. In this way, when the substrate lower receiving member 47 is installed on the lower receiving member installation portion 46 from above, the central axis of each convex portion 47a corresponds to the concave portion 46a. Even if it is slightly off the center axis, the substrate receiving member 47 can be installed in an accurate installation on the lower receiving member installation portion 46. Here, the convex portion 47 a is provided on the lower surface of the substrate receiving member 47 and the concave portion 46 a is provided on the upper surface of the lower receiving member installation portion 46, but the concave portion is provided on the lower surface of the substrate lowering member 47, A convex portion may be provided on the upper surface of the lower receiving member installation portion 46. That is, the convex portion provided in one of the substrate lower receiving member 47 and the lower receiving member installation portion 46 is the concave portion provided in either one of the substrate lower receiving member 47 and the lower receiving member installation portion 46. As long as the board lower member 47 is installed in the lower member installation portion 46 in a state where it is fitted.

  3 and 4, an adsorption pipe 56 is formed inside the lower receiving member installation portion 46, and an outlet opening 56 a of the adsorption pipe 56 is formed on the upper surface of the lower receiving member installation portion 46. . When the substrate receiving member 47 is installed in the lower receiving member installation portion 46, the outlet opening 56a of the suction piping 56 matches the pipe connection hole 52a provided in the bottom plate 52 of the substrate receiving member 47, and the substrate receiving member The internal space 47S of 47 and the suction pipe 56 are connected (FIG. 4).

  In FIG. 3, the suction pipe 56 is connected to the vacuum source VP through a second external pipe 56G extending outside the lower member installation portion 46, and a second control valve 57 is interposed in the second external pipe 56G. It is disguised. When the vacuum source VP sucks air through the second external pipe 56G and the suction pipe 56 in a state where the board 2 is in contact with the substrate lower receiving member 47, the board 2 is moved under the board by the suction force generated in the suction hole 51a. It is adsorbed by the receiving member 47. The holding force of the substrate 2 can be adjusted by driving the second control valve 57 to adjust the magnitude of the suction force generated in the suction hole 51a. In addition, the second control valve 57 is driven to suck the suction pipe 56. Is released to the atmosphere, and the adsorption of the substrate 2 to the substrate receiving member 47 can be released.

  In FIG. 1, the transport unit 44 unloads the transport target from the transport unit outlet on the right end side when unloading the transport target, and the unload-side distribution unit 24 uses the transport target unloaded from the transport unit 44 as the transport unit outlet. Receive in the moved state. Then, the carry-out distribution unit 24 carries the conveyance object received from the conveyance unit 44 to the outside from any one of a plurality of carry-out positions set side by side in the Y-axis direction. In the present embodiment, the unloading position is a third position close to the worker OP side (shown by a solid line in FIG. 1) and a fourth position far from the worker OP side (shown by a one-dot chain line in FIG. 1). And the third position coincides with the exit of the transport unit. For this reason, when the unloading side distribution part 24 receives a conveyance target object in a conveyance part exit, it will position the conveyance target object in a 3rd position as it is.

  In the screen printing apparatus 13 configured as described above, the operation control of the carry-in distribution unit 22, the operation control of the transport unit 44, the operation control of the clamp member driving unit 45 </ b> M, the movement control of the base unit 42 by the XYZ rotary stage 41, and the lift mechanism 48 The control device 60 included in the screen printing device 13 controls the raising / lowering operation control of the base portion 42, the raising / lowering operation control of the squeegee 33k by the cylinder 33s, the movement control of the squeegee head 33 by the head drive mechanism 33M, and the operation control of the carry-out side sorting portion 24. Perform (FIG. 5). The control device 60 also performs drive control of the first control valve 54 (that is, the vacuum suction mechanism 55) and the second control valve 57 (see also FIG. 3).

  In FIG. 1, the carry-out side relay conveyor 14 is provided on the downstream process side of the screen printing apparatus 13. The carry-out-side relay conveyor 14 receives the conveyance object carried out from the third position by the carry-out sorting unit 24 of the screen printing device 13 and carries it to the component mounting device 15 on the downstream process side.

  In FIG. 1, the component mounting apparatus 15 conveys the substrate 2 sent from the carry-out side relay conveyor 14 by the substrate conveyance path 61 and positions it at the work position, and the substrate support unit 62 positioned below the substrate conveyance path 61. To support the substrate 2. Then, a component (not shown) is mounted on the electrode of the substrate 2 on which screen printing has been performed in the screen printing apparatus 13 by the mounting head 63.

  In FIG. 1, the lower receiving member stocker 16 is provided on the upstream process side of the screen printing apparatus 13 side by side with the carry-in relay conveyor 12 in the Y-axis direction. The lower receiving member stocker 16 supplies a substrate lower receiving member 47 installed in the lower receiving member installation portion 46 of the screen printing apparatus 13 as a conveyance object. In the present embodiment, the lower receiving member stocker 16 supplies a substrate lowering member 47 as a conveyance target to a second position provided in the screen printing apparatus 13. Then, after receiving the substrate receiving member 47 at the second position, the carry-in distribution unit 22 moves to the entrance of the transfer unit and transfers the substrate receiving member 47 to the transfer unit 44. Thus, in the present embodiment, the lower receiving member stocker 16 that is the lower receiving member supply unit is transported to a second position different from the first position among the plurality of receiving positions provided in the carry-in distribution unit 22. A substrate lowering member 47 as an object is supplied.

  The carry-in distribution unit 22 moves to the second position when the substrate lower receiving member 47 installed in the lower receiving member installation unit 46 is received from the conveyance unit 44 at the conveyance unit entrance (first position). Then, the substrate receiving member 47 received from the transport unit 44 is transferred to the lower receiving member stocker 16. The lower receiving member stocker 16 collects and stores the substrate lower receiving member 47 received from the carry-in distribution unit 22. For example, the lower receiving member stocker 16 can stock a plurality of substrate lower receiving members 47 before being installed in the lower receiving member installation portion 46, and has a plurality of storage spaces in which the recovered substrate lower receiving members 47 can be stored. It has a configuration having magazines arranged side by side in the vertical direction.

  Next, the operation at the time of manufacturing a mounting board by the mounting board manufacturing system 1 will be described. In manufacturing the mounting substrate, first, the substrate supply unit 11 supplies the substrate 2 to the carry-in relay conveyor 12 (FIG. 6A). The carry-in relay conveyor 12 that has received the substrate 2 from the substrate supply unit 11 delivers the substrate 2 to the carry-in distribution unit 22 that has been previously positioned at the transfer unit entrance (first position) (FIG. 6B). ). The carry-in distribution unit 22 that has received the substrate 2 at the entrance of the transport unit unloads the substrate 2 to the transport unit 44 as it is, and the transport unit 44 transports the received substrate 2 to the working position (FIG. 6C). When the substrate 2 is transported to the working position, the lifting mechanism 48 raises the lower receiving member installation portion 46 (arrow A1 shown in FIG. 7A), and the upper surface of the lower substrate receiving member 47 is brought into contact with the lower surface of the substrate 2. (FIG. 7A).

  When the upper surface of the substrate lowering member 47 comes into contact with the lower surface of the substrate 2, the control device 60 operates the second control valve 57 to generate an adsorption force in the adsorption hole 51a. As a result, the substrate 2 is in close contact with the upper surface of the substrate receiving member 47 and is supported by the substrate receiving member 47 in a state where the deformation is corrected even when the substrate 2 is deformed such as warping.

  When the substrate 2 is supported by the substrate lower receiving member 47, the lifting mechanism 48 further raises the lower receiving member installation portion 46 (arrow A2 shown in FIG. 7B). Thus, the substrate 2 is lifted by the substrate receiving member 47 and is separated from the transport unit 44 (FIG. 7B). When the substrate 2 is lifted and the upper surfaces thereof are at the same height as the upper surfaces of the pair of clamp members 45, the pair of clamp members 45 driven by the clamp member driving unit 45M operate so as to be close to each other. Clamping from both ends in the Y-axis direction (FIG. 7 (b), arrow B shown in the figure).

  When the pair of clamp members 45 clamp the substrate 2, the XYZ rotation stage 41 is actuated to move the substrate 2 horizontally so that the pattern opening of the mask 32 and the electrode of the substrate 2 are aligned vertically, and then the base portion 42. Is raised (arrow C shown in FIG. 8). Thus, when the upper surface of the substrate 2 comes into contact with the lower surface of the mask 32, the squeegee head 33 lowers one squeegee 33k by the cylinder 33s and makes the lower end of the squeegee 33k contact the upper surface of the mask 32 (FIG. 8). When the lower end of the squeegee 33k comes into contact with the upper surface of the mask 32, the head drive mechanism 33M is operated to move the squeegee head 33 in the Y-axis direction (arrow D shown in FIGS. 8 and 9A). Then slide the squeegee 33k. As a result, the paste Pst previously supplied onto the mask 32 is scraped by the squeegee 33k, and the paste Pst is printed on the electrode of the substrate 2 through the opening of the mask 32.

  When the paste Pst is printed on the electrode of the substrate 2, the XYZ rotary stage 41 is operated to lower the base portion 42, thereby separating the substrate 2 from the mask 32 (plate separation). When the substrate 2 is separated from the mask 32, the control device 60 operates the second control valve 57 to release the adsorption of the substrate 2. When the suction of the substrate 2 is released, the pair of clamp members 45 operate in a direction away from each other to release the clamp of the substrate 2, and the lifting mechanism 48 lowers the lower member setting portion 46 to transfer the substrate 2 to the transport portion. 44 (FIG. 3). If the board | substrate 2 is mounted in the conveyance part 44, the conveyance part 44 will convey the board | substrate 2, and will carry it out to the carrying-out side distribution part 24 previously located in the conveyance part exit (3rd position) (FIG.9 (b) )). The carry-out distribution unit 24 receives the substrate 2 (the substrate 2 on which screen printing has been performed) carried out by the carrying unit 44 at the carrying unit exit, and carries it out to the carry-out side relay conveyor 14 as it is (FIG. 9C). Thereby, the screen printing per substrate 2 by the screen printing device 13 is completed.

  The carry-out relay conveyor 14 carries the board 2 received from the screen printing device 13 to the component mounting device 15. The component mounting apparatus 15 receives the substrate 2 carried out by the carry-out-side relay conveyor 14 through the substrate conveyance path 61 and positions the substrate 2 at the work position, supports the substrate 2 by the substrate support unit 62, and then attaches the substrate 2 to the substrate 2 by the mounting head 63. Install the parts. When all the components to be mounted on the substrate 2 are mounted, the substrate 2 is carried out to the outside (downstream process side).

  In the mounting board manufacturing system 1 having such a configuration, the board receiving member 47 provided in the screen printing apparatus 13 can be automatically installed and removed, and the procedure will be described below.

  When the substrate receiving member 47 is automatically installed on the lower receiving member installation portion 46 of the screen printing apparatus 13, a carrier 71 (FIGS. 10A and 10B) formed in a substrate shape is used. A plurality of magnets 71M are provided on the lower surface of the carrier 71 so as to be exposed downward. As described above, the substrate lowering member 47 is made of a magnetic material, and the magnet 71M attracts the substrate lowering member 47 with a magnetic force. Therefore, when the upper surface of the substrate lowering member 47 is brought into contact with the lower surface of the carrier 71, the substrate The lower receiving member 47 is held by the carrier 71. That is, in the present embodiment, the substrate lowering member 47 is held on the lower surface of the carrier 71 by the magnetic force between the carrier 71 and the substrate 71.

  As shown in FIGS. 10A and 10B, the lower surface of the carrier 71 is provided with a plurality of protrusions 71a protruding downward, and the upper surface of the substrate receiving member 47 is fitted with the protrusions 71a. A plurality of holes 47b having shapes that can be combined are provided. The plurality of protrusions 71 a of the carrier 71 are fitted into the plurality of holes 47 b of the substrate receiving member 47, so that the substrate receiving member 47 is accurately held at a predetermined holding position with respect to the carrier 71.

  The carrier 71 holding the substrate lower receiving member 47 as described above is set in advance in the lower receiving member stocker 16, and the lower receiving member stocker 16 has a substrate lower receiving member 47 as a conveyance object at the second position. (Underlying member supplying step). Specifically, after the carry-in distribution unit 22 is positioned in the second position in advance, the carrier 71 holding the substrate receiving member 47 is transferred from the lower receiving member stocker 16 to the carry-in distribution unit 22. It is carried out (FIG. 11 (a)). The carry-in distribution unit 22 that has received the carrier 71 holding the substrate lower receiving member 47 from the lower receiving member stocker 16 moves from the second position to the first position (FIG. 11B). Then, the carry-in distribution unit 22 delivers the carrier 71 to the transport unit 44, and the transport unit 44 transports the received carrier 71 to the working position (FIG. 11 (c)). In other words, the substrate receiving member 47 supplied from the second position is transferred to the work position by the carry-in distribution unit 22 and the transfer unit 44 (substrate receiving member transfer step).

  When the substrate receiving member 47 held by the carrier 71 is positioned above the lower receiving member installation portion 46 by the conveying unit 44 conveying the carrier 71 to the working position (FIG. 12A), the lower receiving member. The substrate receiving member 47 located above the installation unit 46 is installed in the lower receiving member installation unit 46 (substrate lowering member installation step). Specifically, first, the elevating mechanism 48 raises the lower receiving member installation portion 46 (arrow A3 shown in FIG. 12B). As a result, when the upper surface of the lower receiving member installation portion 46 comes into contact with the bottom surface of the substrate lower receiving member 47 held by the carrier 71 and the convex portion 47a is fitted into the concave portion 46a (FIG. 12B), the control device 60 1 control valve 54 is operated to generate a vacuum suction force in the vacuum suction opening 53a. When the substrate lowering member 47 is fixed to the upper surface of the lower receiving member installation portion 46 by the vacuum suction force generated in the vacuum suction opening 53a, the elevating mechanism 48 lowers the lower receiving member installation portion 46 (FIG. 12C). Arrow A4) shown in the figure. As a result, the substrate lower receiving member 47 is separated from the carrier 71 and is installed in the lower receiving member installation portion 46 (FIG. 12C).

  When the substrate lowering member 47 is installed in the lower receiving member installing portion 46 as described above, the transporting portion 44 transports the carrier 71 separated from the substrate lowering member 47 to the transporting portion inlet side, and in advance the transporting portion entrance. The carrier 71 is delivered to the carry-in distribution unit 22 that has been positioned at the (first position) (FIG. 13A). The carry-in distribution unit 22 that has received the carrier 71 moves from the first position to the second position (FIG. 13B), and carries the carrier 71 to the lower receiving member stocker 16. The lower receiving member stocker 16 receives and collects the carrier 71 (FIG. 13C). Thereby, the installation of the substrate lower receiving member 47 in the screen printing apparatus 13 is completed.

  Next, a procedure for automatically collecting the substrate receiving member 47 installed in the screen printing apparatus 13 will be described. In the lower receiving member stocker 16, a single carrier 71 that does not hold the substrate lower receiving member 47 is previously stored in the lower receiving member stocker 16, and the carry-in distribution portion 22 is previously positioned at the second position. Then, a single carrier 71 (not holding the substrate lower receiving member 47) is carried out from the lower receiving member stocker 16 (FIG. 14A). The carry-in distribution unit 22 that has received the single carrier 71 from the lower receiving member stocker 16 moves from the second position to the first position (FIG. 14B). Then, the carry-in distribution unit 22 delivers the carrier 71 to the transport unit 44, and the transport unit 44 transports the received carrier 71 to the working position (FIG. 14C).

  When the conveyance unit 44 conveys the single carrier 71 to the working position, the single carrier 71 is positioned above the substrate lowering member 47 installed in the lower receiving member installation unit 46 (FIG. 15A). ), Removing the substrate receiving member 47 installed in the lower receiving member installation unit 46 from the lower receiving member installation unit 46 and delivering it to the transport unit 44 (substrate lowering unit removing step). Specifically, the elevating mechanism 48 first raises the lower receiving member installation portion 46 (arrow A5 shown in FIG. 15B). Thus, when the upper surface of the substrate receiving member 47 comes into contact with the lower surface of the carrier 71 and the substrate receiving member 47 is held by the carrier 71 by a magnetic force (attraction force) with the carrier 71 (FIG. 15B), The controller 60 operates the first control valve 54 to open the vacuum suction pipe 53 to the atmosphere, and the lift mechanism 48 moves the lower support member installation portion 46 in a state where the vacuum suction of the substrate lower support member 47 is released. It is lowered (FIG. 15 (c), arrow A6 shown in the figure). Thereby, the substrate lower receiving member 47 is separated from the lower receiving member installation portion 46 and is transferred to the carrier 71 (FIG. 15C).

  When the substrate lower receiving member 47 is delivered to the carrier 71 as described above, the transport unit 44 delivers the substrate lower receiving member 47 to the carry-in distribution unit 22 (substrate lower member delivery process). Specifically, the carrier 71 holding the substrate lower receiving member 47 is transported by the transport unit 44 to the carry-in unit entrance side, and is received by the carry-in distribution unit 22 previously positioned at the transport unit entrance (first position). Pass (FIG. 16A). Then, the carry-in distribution unit 22 carries out the substrate lower receiving member 47 received from the transfer unit 44 from the second position (substrate lowering portion carrying out step). Specifically, after the carry-in distribution section 22 that has received the carrier 71 holding the substrate receiving member 47 has moved from the first position to the second position (FIG. 16B), the carrier 71 is lowered. It is carried out to the receiving member stocker 16. The lower receiving member stocker 16 receives and collects the substrate lowering member 47 together with the carrier 71 (FIG. 16C). Thereby, the recovery of the substrate receiving member 47 from the screen printing apparatus 13 is completed.

  Thus, in the present embodiment, the transport unit 44 delivers the substrate lower receiving member 47 removed from the lower receiving member installation unit 46 to the carry-in distribution unit 22, and the carry-in distribution unit 22 receives the transfer unit 44 from the transfer unit 44. The substrate lower receiving member 47 is carried out from the second position.

  In the present embodiment, the substrate receiving member 47 is supplied to the second position while being held on the lower surface of the substrate-like carrier 71, and the carrier 71 is conveyed by the carry-in distribution unit 22 and the conveyance unit 44. As a result, the substrate receiving member 47 removed from the lower receiving member installation unit 46 is transported to the working position and installed in the lower receiving member installation unit 46. The carrier 71 is held by the lower surface of 71 and is carried out from the second position by being carried by the carrying unit 44 and the carry-in distribution unit 22.

  The substrate receiving member 47 can be installed on the screen printing apparatus 13 and the substrate receiving member 47 can be collected from the screen printing apparatus 13 by the above-described procedure. After the substrate receiving member 47 is collected, Subsequently, by performing the installation work of the substrate lower support member 47, the replacement work of the substrate lower support member 47 during the production of the mounting board can be automatically performed.

  As described above, in the mounting substrate manufacturing system 1 in this embodiment (the method for installing the substrate receiving member in the mounting substrate manufacturing system 1), the carry-in distribution unit 22 is configured so that the object to be transferred is the substrate 2. Receives the substrate 2 at the first position and delivers it to the transport unit 44. When the object to be transported is the substrate lowering member 47, the substrate lowering member 47 is moved to a second position different from the first position. And is delivered to the transport unit 44. For this reason, when the substrate receiving member 47 is installed, the substrate receiving member 47 can be supplied through a route different from that of the substrate 2, and the supply of the substrate 2 from the substrate supply unit 11 needs to be stopped (interrupted). Therefore, the automatic installation of the substrate receiving member 47 can be performed without hindering the supply of the substrate 2 by the substrate supply unit 11.

  In the above-described embodiment, the substrate receiving member 47 is installed on the lower receiving member installing portion 46 by the vacuum suction mechanism 55 that vacuum-sucks the substrate receiving member 47 toward the lower receiving member installing portion 46. However, the substrate support member 47 may be installed in the support member installation portion 46 by means other than vacuum suction. Further, the substrate receiving member 47 is held on the lower surface of the carrier 71 by the magnetic force between the carrier 71, but the substrate receiving member 47 is held by the carrier 71 by means other than the magnetic force. It may be.

  Further, in the above-described embodiment, the processing content for the substrate 2 is a screen printing operation in which the paste Pst is printed on the substrate 2 by the screen printing device 13, but this is another operation, for example, the substrate by the component mounting device 15. 2 may be a component mounting operation for mounting a component. When the processing content for the substrate 2 is a component mounting operation, the substrate support path 61 provided in the component mounting apparatus 15 shown in the above embodiment is provided in the transport unit 44 in the above embodiment as a substrate support unit. The component mounting device 15 may be configured to include the carry-in distribution unit 22 after replacing the substrate 62 with the substrate receiving member 47 and the screen printing device 13 with the substrate supply unit 11.

  Provided are a mounting substrate manufacturing system capable of automatically installing a substrate receiving member without interfering with substrate supply by a substrate supply unit, and a method for installing a substrate receiving member in the mounting substrate manufacturing system.

DESCRIPTION OF SYMBOLS 1 Mounting board manufacturing system 2 Board | substrate 11 Board | substrate supply part 16 Bottom receiving member stocker (bottom receiving member supply part)
22 Carrying-in distribution section 32 Mask (substrate processing section)
33 Squeegee head (substrate processing section)
44 Conveying part 46 Lower receiving member installation part 46a Concavity 47 Substrate lowering member 47a Convex part 48 Lifting mechanism (lowering member installation part lifting mechanism)
55 Vacuum suction mechanism 71 Carrier

Claims (8)

A transport unit for transporting a transport object and positioning the work position;
A lower receiving member installation section provided below the transport section;
A substrate lower receiving member that is detachably installed in the lower receiving member setting portion and supports a lower surface of the substrate as the transfer object transferred to the work position by the transfer portion;
A substrate processing unit for performing a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate receiving member;
A carrying-side distribution unit that receives the conveyance object at any of a plurality of receiving positions and delivers the received conveyance object to the conveyance unit;
A substrate supply unit for supplying a substrate as the transfer object to a first position among the plurality of receiving positions provided in the carry-in distribution unit;
A lower receiving member supply unit that supplies the substrate lower receiving member as the transfer object to a second position different from the first position among the plurality of receiving positions included in the carry-in distribution unit; ,
The transfer unit delivers the substrate lower receiving member removed from the lower receiving member installation unit to the carry-in distribution unit,
The carry-in distribution unit carries out the substrate receiving member received from the transfer unit from the second position ,
The substrate receiving member is supplied to the second position while being held on the lower surface of the carrier, and the carrier is conveyed to the working position by being conveyed by the carry-in distribution unit and the conveyance unit. The substrate lower receiving member installed on the lower receiving member installing portion and removed from the lower receiving member installing portion is held on the lower surface of the carrier positioned at the working position, and the carrier is moved to the transport portion and It is carried out from the second position by being conveyed by the carry-in distribution unit,
The mounting substrate manufacturing system according to claim 1, wherein the substrate receiving member is held on a lower surface of the carrier by a magnetic force between the carrier and the carrier . A lower receiving member installation portion elevating mechanism that elevates and lowers the lower receiving member installation portion, and the lower receiving member installation portion elevating mechanism raises the lower receiving member installation portion and holds the substrate lower support held by the carrier. A member is fixed to the lower receiving member installing portion, and when the substrate lower receiving member is fixed to the lower receiving member installing portion, the lower receiving member installing portion is lowered to install the substrate lower receiving member. The mounting board manufacturing system according to claim 1 , wherein the mounting board manufacturing system is installed in a part. The lower receiving member raising / lowering mechanism raises the lower receiving member installation portion to hold the substrate lower receiving member installed in the lower receiving member installation portion on the carrier, and the substrate lower receiving member acts on the carrier. 3. The mounting board manufacturing system according to claim 2 , wherein when held, the substrate receiving member is removed from the substrate receiving member installation unit by lowering the substrate receiving member installation unit. A vacuum suction mechanism that vacuum-sucks the substrate lower receiving member toward the lower receiving member installing portion; and when the substrate lower receiving member is installed in the lower receiving member installing portion, the vacuum suction mechanism is After the member installation portion raising / lowering mechanism raises the lower receiving member installation portion and the substrate lower receiving member comes into contact with the lower receiving member installation portion, the lower surface of the lower receiving member is vacuum-sucked to install the lower receiving member 4. The mounting board manufacturing system according to claim 2 , wherein the part raising / lowering unit lowers the lower receiving member installation part in a state in which the vacuum suction mechanism vacuum sucks the lower surface of the lower receiving member. When removing the substrate receiving member from the lower receiving member installation portion, the vacuum suction mechanism is configured such that the lower receiving member installation portion raising / lowering mechanism raises the lower receiving member installation portion, and the substrate lower receiving member serves as the carrier. The vacuum suction on the lower surface of the substrate lowering member is released, and the lowering member installation portion lifting means is in a state where the vacuum suction on the lower surface of the substrate lowering member of the vacuum suction mechanism is released. The mounting substrate manufacturing system according to claim 4 , wherein the lower receiving member installation portion is lowered. Mounting board manufacturing system according to any one of claims 1 to 5, wherein the substrate lower receiving member, characterized in that the adsorbing while supporting the lower surface of the substrate which is positioned in the working position by the transport unit. A convex portion provided on one of the substrate lower receiving member and the lower receiving member installing portion is provided on either one of the substrate lower receiving member and the lower receiving member installing portion. mounting board manufacturing system according to any one of claims 1 to 6, characterized in that said substrate under receiving member in a state of being fitted into the recess is disposed in the lower receiving member installation portion. A transport unit that transports an object to be transported and performs positioning to a work position; a lower receiving member installation unit provided below the transport unit; and a removable unit installed on the lower support member installation unit, the transport unit A substrate lower receiving member that supports the lower surface of the substrate as the object to be transferred that has been transferred to the work position, and a substrate processing unit that performs a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate lower receiving member; , Receiving the transport object at any one of a plurality of receiving positions, and transferring the received transport object to the transport unit; and a plurality of the receiving positions provided in the transport side distributing unit A mounting method of a substrate receiving member in a mounting substrate manufacturing system comprising a substrate supply unit that supplies a substrate as the transport object to a first position,
Supplying the substrate receiving member as the transfer object to the second position different from the first position among the plurality of receiving positions provided in the carry-in distribution unit while being held on the lower surface of the carrier And a process of
Transporting the receiving member supplied from the second position to the work position by the carry-in distribution unit and the transport unit;
Passing the substrate receiving member removed from the lower receiving member installing portion to the carry-in distribution portion while being held on the lower surface of the carrier ;
Look including a step wherein the transport of the loading-side distributing unit the substrate under receiving member received from the unit is unloaded from the second position,
The method of installing a substrate support member in a mounting substrate manufacturing system, wherein the substrate support member is held on a lower surface of the carrier by a magnetic force between the carrier and the carrier .

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