KR101605921B1 - 시임이 없는 레이저 제거된 롤 공구 - Google Patents

시임이 없는 레이저 제거된 롤 공구 Download PDF

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Publication number
KR101605921B1
KR101605921B1 KR1020107012872A KR20107012872A KR101605921B1 KR 101605921 B1 KR101605921 B1 KR 101605921B1 KR 1020107012872 A KR1020107012872 A KR 1020107012872A KR 20107012872 A KR20107012872 A KR 20107012872A KR 101605921 B1 KR101605921 B1 KR 101605921B1
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South Korea
Prior art keywords
workpiece
laser
image
laser beam
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Expired - Fee Related
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KR1020107012872A
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English (en)
Korean (ko)
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KR20100093083A (ko
Inventor
토마스 알 코리건
패트릭 알 플레밍
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20100093083A publication Critical patent/KR20100093083A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020107012872A 2007-11-16 2008-08-25 시임이 없는 레이저 제거된 롤 공구 Expired - Fee Related KR101605921B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/941,206 2007-11-16
US11/941,206 US7985941B2 (en) 2007-11-16 2007-11-16 Seamless laser ablated roll tooling

Publications (2)

Publication Number Publication Date
KR20100093083A KR20100093083A (ko) 2010-08-24
KR101605921B1 true KR101605921B1 (ko) 2016-03-23

Family

ID=40639057

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107012872A Expired - Fee Related KR101605921B1 (ko) 2007-11-16 2008-08-25 시임이 없는 레이저 제거된 롤 공구

Country Status (6)

Country Link
US (2) US7985941B2 (enExample)
EP (1) EP2222433B1 (enExample)
JP (1) JP5508276B2 (enExample)
KR (1) KR101605921B1 (enExample)
CN (1) CN101861227B (enExample)
WO (1) WO2009064527A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
US20110070398A1 (en) * 2009-09-18 2011-03-24 3M Innovative Properties Company Laser ablation tooling via distributed patterned masks
US8460754B2 (en) 2009-12-21 2013-06-11 3M Innovative Properties Company Needle coating and in-line curing of a coated workpiece
US9452574B2 (en) * 2011-12-19 2016-09-27 Canon Nanotechnologies, Inc. Fabrication of seamless large area master templates for imprint lithography using step and repeat tools
KR101461883B1 (ko) * 2012-12-28 2014-11-14 현대자동차 주식회사 크랭크샤프트 열처리장치
DE102014207263A1 (de) * 2013-04-16 2014-10-16 Audi Hungaria Motor Kft. Bifokal-Optik zur Strukturierung von Zylinderkurbelgehäusen
DE102013212652B4 (de) * 2013-06-28 2016-12-15 Continental Automotive Gmbh Vorrichtung zum Betreiben einer Werkzeugmaschine und Werkzeugmaschine
KR102148383B1 (ko) * 2016-01-22 2020-08-26 주식회사 포스코 방향성 전기강판의 자구미세화 방법과 그 장치
ES2636715B2 (es) * 2017-06-07 2018-02-12 Sitexco Girona, S.L. Máquina de limpieza de rodillos anilox por láser y procedimiento para autoajuste del punto focal láser al diámetro del rodillo anilox.
US10926355B2 (en) * 2019-02-05 2021-02-23 Dukane Ias, Llc Systems and methods for laser-welding tubular components using a single, fixed optical reflector with multiple reflecting surfaces
US11931823B2 (en) 2019-02-05 2024-03-19 Dukane Ias, Llc Systems and methods for laser-welding a workpiece with a laser beam that reaches inaccessible areas of the workpiece using multiple reflecting parts
US11819940B2 (en) 2019-02-05 2023-11-21 Dukane Ias, Llc Systems and methods for laser-welding a workpiece with a laser beam that reaches inaccessible areas of the workpiece using multiple reflecting parts
CN111679555A (zh) * 2020-07-08 2020-09-18 江西沃格光电股份有限公司 一种金属辊状模具的制备方法
DE102022001014A1 (de) 2022-03-22 2023-09-28 SIA Z7 Laboratories Verfahren zur Bearbeitung von verunreinigten Oberflächen mittels eines Laserstrahls
DE102022001013A1 (de) 2022-03-22 2023-09-28 SIA Z7 Laboratories Reinigungsvorrichtung für Druckwalzen und Reinigungsverfahren
CN114734138A (zh) * 2022-04-24 2022-07-12 中国科学院重庆绿色智能技术研究院 一种增强空间增材制造丝材激光能量吸收效率的方法
EP4506098A1 (en) 2023-08-10 2025-02-12 Vilnius University Method and system for laser processing of elongated thin workpieces using direct laser writing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001162384A (ja) * 1999-12-07 2001-06-19 Ricoh Microelectronics Co Ltd 光加工方法及びその装置
JP2006075897A (ja) * 2004-09-13 2006-03-23 Hakko Denki Kk レーザ印字装置、そのプログラム

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701880A (en) * 1968-11-29 1972-10-31 Westinghouse Electric Corp Method for sculpturing an indicia or decorative design in the surface of an article with a beam of corpuscular energy
US3893795A (en) * 1970-08-20 1975-07-08 Rowland Dev Corp Embossing rolls with areas of differential hardness
LU80792A1 (fr) * 1979-01-15 1980-08-08 Ntre De Rech Metallurg Ct Voor Dispsitif et procede pour effectuer des perforations a la surface des cylindres de laminoirs
LU84687A1 (fr) * 1983-03-11 1984-11-14 Centre Rech Metallurgique Procede pour ameliorer l'etat de surface d'un cylindre
US4758705A (en) * 1985-08-06 1988-07-19 Eastman Kodak Company Method and apparatus for texturing a roller
EP0280671B1 (fr) * 1987-02-23 1993-06-23 CENTRE DE RECHERCHES METALLURGIQUES CENTRUM VOOR RESEARCH IN DE METALLURGIE Association sans but lucratif Procédé de marquage de la surface d'un cylindre de laminoir, cylindre de laminoir ainsi obtenu et tôle laminée avec un tel cylindre
JPH03240980A (ja) * 1990-02-16 1991-10-28 Kawasaki Steel Corp 金属ロール表面の加工方法及び装置
JP3350999B2 (ja) * 1993-03-10 2002-11-25 富士通株式会社 ビーム整形レンズモジュール構造
JPH07133704A (ja) * 1993-11-08 1995-05-23 Nissan Motor Co Ltd カムシャフトおよびその製造方法
US5538056A (en) * 1994-12-16 1996-07-23 Beloit Technologies, Inc. Log conditioning before mechanical debarking
WO1996033839A1 (en) 1995-04-26 1996-10-31 Minnesota Mining And Manufacturing Company Method and apparatus for step and repeat exposures
US5654125A (en) * 1995-05-01 1997-08-05 E. I. Du Pont De Nemours And Company Laser apparatus and process of use
US5632204A (en) * 1995-07-27 1997-05-27 Presstek, Inc. Thin-metal lithographic printing members with integral reflective layers
US5733301A (en) * 1996-01-11 1998-03-31 Schneider (Usa) Inc. Laser ablation of angioplasty catheters and balloons
KR19980061912A (ko) * 1996-12-31 1998-10-07 서상기 무늬 각인용 롤(roll)을 제조하는 방법 및 이를 수행하기 위한 장치
US6222157B1 (en) 1998-04-17 2001-04-24 L.A. Batchelder And Sons Consulting, Inc. Seamless holographic transfer using laser generated optical effect patterns
US6919162B1 (en) * 1998-08-28 2005-07-19 Agilent Technologies, Inc. Method for producing high-structure area texturing of a substrate, substrates prepared thereby and masks for use therein
JP2001208993A (ja) 2000-01-25 2001-08-03 Sumitomo Heavy Ind Ltd レーザ描画方法及び描画装置
US6354213B1 (en) * 2000-04-03 2002-03-12 Jerome D. Jenkins Method and apparatus for cleaning a metering roll of a printing press
WO2002029490A1 (en) 2000-10-04 2002-04-11 Panoram Technologies, Inc. Projection system for arrayed or tiled displays
US6538230B2 (en) 2001-05-17 2003-03-25 Preco Laser Systems, Llc Method and apparatus for improving laser hole resolution
JP2003033890A (ja) * 2001-07-19 2003-02-04 Nippon Steel Corp レーザ加工方法
CN2526171Y (zh) * 2002-01-08 2002-12-18 钱远强 一种印刷辊雕刻设备
JP4523757B2 (ja) * 2003-01-09 2010-08-11 新日本製鐵株式会社 レーザ加工装置および加工方法
US6715888B1 (en) 2003-03-21 2004-04-06 Mitsubishi Electric Research Labs, Inc Method and system for displaying images on curved surfaces
US7190387B2 (en) 2003-09-11 2007-03-13 Bright View Technologies, Inc. Systems for fabricating optical microstructures using a cylindrical platform and a rastered radiation beam
US7106415B2 (en) * 2003-12-09 2006-09-12 Anvik Corporation Illumination compensator for curved surface lithography
JP4650837B2 (ja) * 2005-09-22 2011-03-16 住友電気工業株式会社 レーザ光学装置
WO2007062130A1 (en) * 2005-11-22 2007-05-31 J.P. Sercel Associates Inc. System and method for laser machining of three-dimensional structures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001162384A (ja) * 1999-12-07 2001-06-19 Ricoh Microelectronics Co Ltd 光加工方法及びその装置
JP2006075897A (ja) * 2004-09-13 2006-03-23 Hakko Denki Kk レーザ印字装置、そのプログラム

Also Published As

Publication number Publication date
KR20100093083A (ko) 2010-08-24
JP2011502795A (ja) 2011-01-27
EP2222433B1 (en) 2018-10-10
JP5508276B2 (ja) 2014-05-28
US8383981B2 (en) 2013-02-26
WO2009064527A1 (en) 2009-05-22
US20110248004A1 (en) 2011-10-13
US7985941B2 (en) 2011-07-26
CN101861227B (zh) 2015-03-25
EP2222433A4 (en) 2016-11-16
CN101861227A (zh) 2010-10-13
EP2222433A1 (en) 2010-09-01
US20090127238A1 (en) 2009-05-21

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