KR101605712B1 - Apparatus for Processing Substrate - Google Patents

Abstract

The substrate processing apparatus of the present invention includes an index section; A processing unit in which processing chambers for performing substrate processing are stacked and arranged; And an inspection unit disposed in the index module and the processing unit; The inspection unit may include a first inspection conveying robot and an inspection process of the first item for the first number of substrates which are disposed at positions accessible to the first inspection transporting robot and processed by the processing unit, A first inspection chamber having a first inspection module for performing the inspection; And a second inspection conveying robot which is disposed at a position accessible to the second inspection carrying robot and which is arranged to be movable in a second direction different from the first direction with respect to a second number of substrates of the substrates processed by the processing processing unit, And a second inspection module having a second inspection module for performing an inspection process of the item.

Description

[0001] Apparatus for Processing Substrate [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing a coating, developing, and baking process.

In general, a manufacturing apparatus for a semiconductor device is manufactured by forming a predetermined film on a substrate and forming the film into a pattern having electrical characteristics. The pattern is formed by sequential or repetitive execution of unit processes such as film formation, photolithography, etching, cleaning, and the like.

Here, in the photolithography process, a coating process for forming a photoresist film on a silicon substrate, an exposure process for selectively exposing the substrate with the photoresist film formed thereon using a mask, and a step for developing the exposed photoresist film to form a fine circuit pattern And a baking step which proceeds after the application step, the exposure step and the development step, respectively.

However, in recent years, in addition to the above-described processes, a greater number of processes are required before and after exposure.

In the photolithography equipment having such a configuration, the substrate is processed based on the process recipe in which the operation order is set, and then the substrates having completed the photolithography process are transported to a separate inspection and measurement facility to determine whether there is a defect.

Embodiments of the present invention provide a substrate processing apparatus capable of determining whether or not a substrate has a defective process.

Embodiments of the present invention are intended to provide a substrate processing apparatus having a layout capable of dividing the entire inspection or the sampling inspection so that various tests can be performed and the load of the transportation robot can be distributed.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, A processing unit in which processing chambers for performing substrate processing are stacked and arranged; And an inspection unit disposed in the index module and the processing unit; The inspection unit may include a first inspection conveying robot and an inspection process of the first item for the first number of substrates which are disposed at positions accessible to the first inspection transporting robot and processed by the processing unit, A first inspection chamber having a first inspection module for performing the inspection; And a second inspection conveying robot which is disposed at a position accessible to the second inspection carrying robot and which is arranged to be movable in a second direction different from the first direction with respect to a second number of substrates of the substrates processed by the processing processing unit, A substrate processing apparatus including a second inspection chamber having a second inspection module for performing an inspection process of an item may be provided.

The first inspection chamber and the second inspection chamber may be stacked vertically.

The inspection unit may further include a bridge chamber connecting the first inspection chamber and the second inspection chamber, wherein the bridge chamber comprises an interlayer transport robot; A first conveyor disposed at a position where the interlayer conveying robot and the first conveying robot for inspection are accessible; A second buffer disposed at a position at which the interlayer conveying robot and the second inspection carrying robot are accessible; And an index buffer disposed at a position accessible by the interlayer conveying robot and the first inspection carrying robot and for loading and unloading the substrate with the index unit.

The number of conveying paths of the first inspection conveying robot may be greater than the number of conveying paths of the second inspection conveying robot and the first number of sheets may be provided smaller than the second number of sheets.

The first inspection chamber performs a sampling inspection on some of the substrates processed by the processing unit, and the second inspection chamber performs a full inspection on all the substrates processed by the processing unit. Can be performed.

The first inspection module may include any one of a CD measurement unit and an overlay measurement unit for performing a sampling inspection, and the second inspection module may include a Macro Defect inspection unit and a thickness measurement unit Or the like.

In addition, the processing unit is stacked and arranged so as to be divided into a coating unit for performing a coating process and a developing unit layer for performing a developing process, the first inspection chamber being disposed at the same height as the coating unit, The second inspection chamber may be disposed at the same height as the development unit.

According to an aspect of the present invention, A processing unit stacked and arranged so as to be divided into a coating unit for performing the coating process and a developing unit for performing the developing process; And an inspection unit disposed in the index module and the processing unit; The inspection unit may include a first inspection chamber disposed at the same height as the application unit and performing a sampling inspection on a part of the substrates processed in the processing unit; And a second inspection chamber disposed at the same height as the development section and performing a full inspection on all of the substrates processed in the process processing section.

The inspection unit may further include a bridge chamber for transferring the substrate between the first inspection chamber and the second inspection chamber.

The first inspection chamber may include a first inspection transporting robot and a first inspection module disposed at a position accessible to the first inspection transporting robot and performing inspection of the first item on some substrates Wherein the second inspection chamber comprises a second inspection transport robot and a second item inspection process which is arranged at a position accessible to the second inspection transport robot and which is different from the first item for all of the substrates And a second inspection module performing the inspection.

The inspection unit may include an interlayer conveying robot; A first conveyor disposed at a position where the interlayer conveying robot and the first conveying robot for inspection are accessible; A second buffer disposed at a position at which the interlayer conveying robot and the second inspection carrying robot are accessible; And an index buffer disposed at a position accessible to the interlayer conveying robot and the first inspection carrying robot and for loading and unloading the substrate with the index unit.

The application unit may further include a carry-in buffer that is disposed at a position accessible to the first inspection carrying robot and in which the substrate is carried before the processing, and the developing unit is disposed at a position accessible by the second inspection carrying robot And a carry-out buffer in which the substrate is carried out after the process is performed.

The number of conveying paths of the first inspection conveying robot may be larger than the number of conveying paths of the second inspection conveying robot.

Further, the application unit may be disposed by stacking a first developing process chamber for performing a positive type developing process and a second developing process chamber for performing a negative type developing process.

According to the present invention, an improvement in substrate yield can be expected by disposing an inspection unit for inspecting a substrate in a substrate processing facility for performing a photolithography process.

According to the present invention, the first inspection chamber for the sampling inspection and the second inspection chamber for the whole water inspection are laminated, so that various examinations of the substrate can be performed in a limited space.

According to the present invention, a plurality of layers are arranged in order to optimize the operation between the inspection modules and the transport robots, and the flow between the buffer modules is defined to have a remarkable effect to cope with various inspection recipes.

According to the present invention, it is possible to provide a special effect that can improve inspection operation efficiency by separating and arranging the module for overall inspection and the module for sampling according to the number of conveying paths of the conveying robot of the first inspection chamber and the conveying robot of the second inspection chamber .

1 is an external view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is an overall configuration diagram of the processing unit shown in Fig. 1. Fig.
FIG. 3 is a diagram showing a layout of each floor in the processing unit shown in FIG. 2. FIG.
FIG. 4 is a plan view showing an arrangement structure of the inspection unit shown in FIG. 1. FIG.
5 is a perspective view for explaining the inspection unit shown in FIG.
FIG. 6 is a substrate flow chart when both the total inspection and the sampling inspection are performed in the inspection section.
7 is a flow chart of the substrate when only the full inspection is carried out in the inspection section.

The present invention is not limited to the embodiments described herein but can be implemented in other forms. The embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the spirit and scope of the invention to those skilled in the art. In the drawings, each apparatus is schematically shown for the sake of clarity of the present invention. In addition, each device may be provided with various additional devices not described in detail herein. Like reference numerals refer to like elements throughout the specification.

In this embodiment, a semiconductor wafer will be described as an example of a substrate. However, the substrate may be various kinds of substrates such as a photomask, a flat display panel, etc. in addition to a semiconductor wafer. In this embodiment, the substrate processing equipment is a facility for performing a photolithography process. However, the substrate processing equipment may be a facility for performing a cleaning process on other types of substrates such as wafers and the like.

FIG. 1 is an external view showing a substrate processing facility according to an embodiment of the present invention. FIG. 2 is an overall configuration view of the process processing unit shown in FIG. 1, Fig.

1 to 3, the substrate processing apparatus 1000 of the present invention may include an index unit 10, a processing unit 20, an inspection unit 60, and an interface unit 50.

The index unit 10, the inspection unit 60, the processing unit 20, and the interface unit 50 are arranged in a line. Hereinafter, the direction in which the index unit 10, the inspection unit 60, the processing unit 20, and the interface unit 50 are arranged is referred to as a first direction, and a direction perpendicular to the first direction And a direction perpendicular to the plane including the first direction and the second direction is defined as a third direction.

The substrate W is moved in a state accommodated in the container 16. At this time, the container 16 has a structure that can be sealed from the outside. For example, as the container 16, a front open unified pod (FOUP) having a door at the front can be used. Hereinafter, each configuration will be described in detail with reference to Figs. 1 to 3. Fig.

(Index portion)

The index portion 10 is disposed in front of the substrate processing apparatus 1000 in the first direction. The index unit 10 includes a plurality of load ports 12 and an index robot 13.

The plurality of load ports 12 are disposed in front of the index portion 10 in the first direction. The load port 12 is disposed along the second direction. The number of the load ports 12 may increase or decrease depending on the process efficiency and the footprint condition of the substrate processing apparatus 1000. The load ports 12 are loaded with a substrate W to be supplied to the process and a container (e.g., cassette, FOUP, etc.) in which the processed substrate W is placed.

The index robot 13 is disposed in the first direction adjacent to the load port 12. [ The index robot 13 is installed between the load port 12 and the inspection section 60. The index robot 13 transfers the substrate between the inspection unit 60 and the load port 12. [

(Interface)

The interface section 50 transfers the substrate between the processing section 20 and an exposure apparatus (not shown). The interface unit 50 includes an interface robot 510. Although not shown, the interface section 50 may be provided with buffer modules in which the substrate temporarily waits.

(Process processing section)

In the process processing unit 20, a process of applying the photoresist on the substrate W and a process of developing the substrate W after the exposure process may be performed before the exposure process.

The processing unit 20 may be provided in a stacked manner so that the application unit 200a for performing the coating process and the developing unit 200b for performing the developing process are partitioned into layers.

The application portion 200a may include three coating processing chambers 200-1, 200-2, and 200-3, a first application path portion 30-1, and a second application path portion 40-1. The first coating pass section 30-1 is disposed between the coating processing chambers 200-1, 200-2, and 200-3 and the inspection section 60. The second coating pass section 40-1 is disposed between the coating processing chambers 200-1, 200- 2 and 3 - 3 and the interface unit 50.

The development section 200b includes three development processing chambers 200-4, 200-5 and 200-6, a first development pass section 30-2 and a second development pass section 40-2 can do. The first development pass section 30-2 is disposed between the development processing chambers 200-4, 200-5 and 200-6 and the inspection section 60. The second development pass section 40-2 is disposed between the development processing chamber 200 -4, 200-5, and 200-6, and the interface unit 50, respectively.

For example, the application unit 200a and the process chambers 200-1 to 200-6 of the developing unit 200b may perform the processes of the central passage 210, the first main transport robots 240 and 250, Lt; / RTI >

The first main transport robot 240 or 250 is responsible for transporting the substrate on the central passage 210. The first main transport robot 240 and the second main transport robot 240 can be moved in the first direction, the second direction, and the third direction so that the hand for directly handling the substrate can be rotated.

The processing modules may be installed along a central passage 210 accessible by the first main transport robot 240,

For example, one to three layers of coating chambers 200-1, 200-2, and 200-3 may include coating modules 270 for applying a photosensitive liquid such as photoresist to the substrate, heating and cooling And a heat treatment module 260 for performing a heat treatment process such as a heat treatment process.

Development processing chambers 200-4, 200-5, and 200-6 of the fourth to sixth layers include developing modules 230a and 230b for supplying a developing solution to the substrate to remove a part of the photoresist, And heat treatment modules 220, 280, and 290 that perform heat treatment processes such as heating and cooling performed on the substrate before and after the process.

As described above, the modules corresponding to the respective process characteristics can be disposed in the application unit 200a and the process chambers 200-1 to 200-6 of the development unit 200b.

On the other hand, the first application path section 30-1 and the first development path section 30-2 are provided in a layered manner.

The first dispense pass section 30-1 includes a first buffer transfer robot 310a, a fetch buffer module 370, and a first pass buffer module 360. [ The first buffer transfer robot 310a is provided for substrate transfer between the coating processing chambers 200-1, 200-2, and 200-3 as well as between the coating processing chambers 200-1, 200-2, and 200-3 and the inspection unit 60. [ The first pass buffer module 360 may be disposed on a path through which the first buffer transfer robot 310a and the first main transfer robot 250 can access.

The first development pass unit 30-2 includes a second heating module 340, a first pass buffer module 320, a cooling module 330, an export buffer module 350, and a first buffer transfer robot 310b. . The second heating module 340, the first pass buffer module 320, the cooling module 330 and the export buffer module 350 are disposed on the moving path 390 accessible by the first buffer carrying robot 310b . Here, the second heating module 340 may be a hard bake (H / B) module. The first buffer transfer robot 310b transfers the substrate between the development processing chambers 200-4, 200-5, and 200-6 and the inspection unit 60 and the substrate transfer between the development processing chambers 200-4, 200-5, 1 buffer carrying robot 310b.

The first pass buffer module 320 and the cooling module 330 are disposed at positions where both the first main transfer robot 240 and the first buffer transfer robot 310b are accessible. The first pass buffer module 320 and the cooling module 330 are stacked between the moving path 210 of the first main transport robot 240 and the moving path 390 of the first buffer transport robot 310b, . The moving path 210 of the first main transport robot 240 is provided in the horizontal direction and the moving path 390 of the first buffer carrying robot 310b is provided in the vertical direction. The first pass buffer module 320 and the cooling module 330 are connected to each other in the direction in which the first main transport robot 240 is provided so that the first main transport robot 240 can carry in or out substrates, The first buffer transfer robot 310b has openings in the directions in which the first buffer transfer robot 310b is provided so that the first buffer transfer robot 310b can carry in and out substrates.

The second application pass section 40-1 and the second development pass section 40-2 are partitioned and provided.

The second pass path unit 40-1 and the second development path unit 40-2 are provided with the second pass buffer modules 420 in which the substrate temporarily waits.

The first application pass section 30-1 and the second application pass section 40-1 are arranged opposite to each other with the coating treatment chambers 200-1, 200-2 and 200-3 therebetween, and the first development pass section 30 -2 and the second development pass section 40-2 are arranged so as to face each other with the development processing chambers 200-4, 200-5, and 200-6 therebetween.

Referring again to FIG. 3, the developing section 200b includes three development processing chambers 200-4, 200-5, and 200-6. Each of the three development processing chambers 200-4, 200-5, and 200-6 may perform a positive development process or a negative development process for each layer. For example, the development processing chambers 200-4 and 200-5 of the fourth and fifth layers are provided with four development modules 230b for performing a positive development process, and six development processing chambers 200- 6) may be provided with four developing modules 230a for performing a negative developing process. That is, the development processing section 200b has eight positive development modules 230b and four negative development modules 230a.

The development unit 200b according to the present embodiment is configured such that the number of the negative development modules 230a is fewer than the number of the positive development modules 230b so that the six development processing chambers 200-6 Has a layout structure different from that of the developing processing chambers 200-4 and 200-5 of the 4th and 5th layers. The most significant difference between the development processing chamber 200-6 of the sixth layer and the development processing chambers 200-4 and 200-5 of the fourth and fifth layers is that the hard bake module is not disposed in the same layer, (30-2).

For example, the six developing processing chamber 200-6 includes the negative developing modules 230a, the first heating modules 220, and the first main transport robot 240. The negative development module 230a and the first heating module 220 are disposed on the moving path 210 accessible by the first main transport robot 250. [ Here, the first heating module 220 of the six developing processing chamber 200-6 may be a post exposure bake (PEB) module.

Since the six developing processing chamber 200-6 has no hard bake module, it is possible to arrange more post-exposure bake modules than the post-exposure bake modules of the four or five development processing chambers 200-4 and 200-5.

Accordingly, when the temperature of the bake after the exposure is frequently used as in the system semiconductor production process, the waiting time due to the temperature change can be reduced, thereby reducing the production loss and increasing the facility operation efficiency.

The development processing chambers 200-4 and 200-5 of the fourth and fifth layers include positive development modules 230b, a first heating module 280, a second heating module 290, a first main transport robot 250, . The positive development modules 230b, the first heating modules 280 and the second heating modules 290 are disposed on the moving path 210 accessible by the first main transport robot 240. [ The first heating module 280 and the second heating module 290 of the development processing chambers 200-4 and 200-5 of the fourth and fifth layers are PEB (Post Exposure Bake) and hard baking (H / B) Hard Bake) module.

In the development processing chambers 200-4 and 200-5 of the fourth and fifth layers, the developing process of baking-cooling-developing-hard-baking-cooling after exposure is performed in the same layer. In the sixth development processing chamber 200-6, only the post-exposure bake-cooling-developing process is performed in the same layer, and the remaining hard bake-cooling process proceeds in the first development pass section 30-2.

As described above, in the six-layer development processing chamber 200-6 having the negative development module 230a having a smaller number than the positive development module 230a, the first main transport robot 240 moves the second pass buffer module 420 ), The first developing module 220, the cooling module 330, the negative developing module 230a, and the first pass buffer module 320, The first buffer transfer robot 310b of the buffer module 30-2 is connected to the fourth pass buffer module 320 through the second pass buffer module 320, the second heating module 340, the cooling module 330, Perform an open step. As described above, the two conveying robots disperse and process the developing process within five steps.

Assuming that the cycle time of one step of the conveying robot is 3.5 seconds, for example, if the negative type development process is performed in the existing layout, the substrate production amount is about 146 pieces per hour. However, in the development processing portion of the present invention, . Therefore, the substrate production amount can be improved by 40% or more through the carrier dispersion and the robot use optimization of the present invention.

If the negative development process is performed in the development processing chambers 200-5 and 200-6 of the fifth and sixth layers and the positive development process is performed in the development processing chamber 200-4 of the fourth layer, Since the developing module 230b is fewer in number than the negative developing module 230a, the four developing processing chambers 200-4 equipped with the positive developing modules 230b are provided in the developing processing chambers 200- 5, 200-6).

(Inspection department)

FIG. 4 is a plan view showing a layout structure of the inspection unit shown in FIG. 1, and FIG. 5 is a perspective view for explaining the inspection unit shown in FIG.

4 and 5, the inspection unit 60 is disposed between the index unit 10 and the processing unit 20.

The inspection unit 60 includes a first inspection chamber 601, a second inspection chamber 602 and a bridge chamber 603. The first inspection chamber 601 and the second inspection chamber 602 are stacked and arranged . The first inspection chamber 601 is disposed at the same height as the application portion 200a and the second inspection chamber 602 is disposed at the same height as the development portion 200b.

The first inspection chamber 601 includes a first inspection transport robot 610 and a first inspection module 620. The first inspection module 620 is disposed at a position where the first inspection carrying robot 610 can access. The first inspection module 620 may perform a first inspection process for the first number of substrates among the substrates processed in the process processing unit 20. [

For example, the first inspection module 620 may be a sampling inspection unit that performs sampling inspection on some of the substrates processed in the processing unit, and may be any of a CD measurement unit and an overlay measurement unit.

The first inspection transport robot 610 transports the substrate from the index buffer module 680 to the transport buffer module 370 and transports the substrate from the second buffer module 670 to the first inspection module 620 And a step of transporting the substrate from the first inspection module 620 to the index buffer module 680. [

The second inspection chamber 602 includes a second inspection conveying robot 630 and a second inspection module 640. The second inspection module 640 is disposed at a position where the second inspection carrying robot 630 can be accessed. The second inspection module 640 may perform an inspection process of a second item different from the first item for the second number of substrates among the substrates processed in the process processing unit.

For example, the second inspection module 630 may include a microdetection inspection unit and a thickness measurement unit (not shown) for performing a complete inspection on all of the substrates processed in the processing unit, It can be either.

The second inspection transport robot 630 transports the substrate from the carry-out buffer module 350 to the second inspection module 640 and transfers the substrate from the second inspection module 640 to the first buffer module 660 And a second conveying path that includes two steps.

When the inspection unit 60 performs both the first inspection module 620 and the second inspection module 640, the first inspection carrying robot 610 performs three steps (conveyance path) operations , The second inspection conveying robot 630 performs two steps (conveying path) operation. Therefore, the first inspection module 620 to which the first inspection carrying robot 630 approaches is provided with sampling (sampling) processing in consideration of the operating characteristics of the first inspection transporting robot 610 and the second inspection transporting robot 630, And the second inspection module 640 to which the second inspection conveying robot 630 approaches is applied with an inspection unit capable of full inspection.

The bridge chamber 603 is a chamber connecting the first inspection chamber 601 and the second inspection chamber 602. The bridge chamber 603 includes an interlayer transport robot 650 and a first buffer module 660, a second buffer module 670 and an index buffer module 680.

The first buffer module 660 is disposed at a position where the interlayer conveying robot 650 and the first inspection conveying robot 610 are accessible and the second buffer module 670 is disposed at a position where the interlayer conveying robot 650 and the second inspection And the index buffer modules 680 are disposed at positions where the interlayer conveying robot 650 and the first inspection conveying robot 610 are accessible. The index buffer modules 680 are provided for loading and unloading the substrate with the index portion 10.

The stratified charge transport robot 650 transfers one substrate from the first buffer module 660 to the second buffer module 670 or the first buffer module 660 to the index buffer module 680 .

As described above, the inspection unit 60 of the present invention can be arranged in multiple layers to optimize the operation between the inspection modules and the carrier robots, and can define the flow between the buffer modules to cope with various inspection recipes. In addition, inspection efficiency can be increased by separately arranging the whole water inspection unit or the sampling inspection unit according to the number of transport paths of the transportation robots.

FIG. 6 is a substrate flow chart when both the total inspection and the sampling inspection are performed in the inspection unit, and FIG. 7 is a substrate flow chart when only inspection is performed in the inspection unit.

As shown in FIG. 6, the substrate is returned from the index buffer module 680 to the import buffer module 370 (1). The substrate that has been processed in the process processing unit 20 is returned to the second inspection module 640 in the take-out buffer module 350. (2) Some of the boards inspected by the second inspection module 640 are transferred from the second inspection module 640 to the first buffer module 660 and then returned to the second buffer module 670. [ The substrate conveyed to the second buffer module is conveyed from the second buffer module 670 to the first inspection module 620 [5]. The substrate inspected in the first inspection module 620 is transferred from the first inspection module 620 to the index buffer module 680 and then transferred to the index unit 10.

As shown in Fig. 7, the substrate is returned from the index buffer module 680 to the import buffer module 370 (1). The substrate that has been processed in the process processing unit 20 is returned to the second inspection module 640 in the take-out buffer module 350. (2) Substrates inspected in the second inspection module 640 are transferred from the second inspection module 640 to the first buffer module 660 and then returned to the index buffer module 680. [

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

10: Index section 20: Process processing section
50: interface section 60:

Claims (14)

A substrate processing facility comprising:
An index portion;
A processing unit in which processing chambers for performing substrate processing are stacked and arranged; And
And an inspection unit disposed between the index unit and the processing unit;
The inspection unit
A first inspection transport robot and a first inspection process for the first number of substrates, which are disposed at positions accessible to the first inspection transport robot and processed by the processing unit, A first inspection chamber having a first inspection module;
And a second item different from the first item with respect to a second number of substrates arranged in a position accessible by the second inspection carrying robot and processed by the processing unit, A second inspection chamber having a second inspection module for performing an inspection process of the first inspection chamber; And
And a bridge chamber connecting said first inspection chamber and said second inspection chamber. The method according to claim 1,
Wherein the first inspection chamber and the second inspection chamber are stacked vertically. 3. The method according to claim 1 or 2,
The bridge chamber
Interlayer transport robot;
A first conveyor disposed at a position where the interlayer conveying robot and the first conveying robot for inspection are accessible;
A second buffer disposed at a position at which the interlayer conveying robot and the second inspection carrying robot are accessible; And
And an index buffer disposed at a position where the interlayer conveying robot and the first inspection transporting robot are accessible and for loading and unloading the substrate with the index portion. The method of claim 3,
The number of conveying paths of the first inspection conveying robot is larger than the number of conveying paths of the second inspection conveying robot,
Wherein the first number of sheets is provided smaller than the second number of sheets. The method of claim 3,
The first inspection chamber performs a sampling inspection on some of the substrates processed in the processing unit,
Wherein the second inspection chamber performs a full inspection of all of the substrates processed in the process processing unit. The method of claim 3,
The first inspection module
A CD measurement unit and an overlay measurement unit for performing sampling inspection,
Wherein the second inspection module comprises one of a Macro Defect inspection unit and a thickness measurement unit. The method according to claim 1,
The process-
A coating portion for performing a coating process, and a developing portion for performing a developing process,
Wherein the first inspection chamber is disposed at the same height as the application unit,
And said second inspection chamber is disposed at the same height as said development section. delete delete delete delete delete delete delete

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