KR101579510B1 - Apparatus for Processing Substrate - Google Patents

Abstract

The substrate processing apparatus of the present invention comprises: an index portion having a port and an index robot on which a container containing a substrate is placed; A processing section having a development processing section in which a first development processing chamber and a second development processing chamber, which are subjected to a process of developing a substrate, are divided and arranged in layers; And a first path portion disposed between the development processing portion and the index portion; Wherein the first development processing chamber includes a development module and a first heating module and a first main transfer robot disposed on a transfer passage accessible to the development module and the first heating module, A first buffer carrying robot disposed on a moving path accessible to the first buffer module, the first buffer module, the cooling module, the second buffer module, and the second heating module, the first buffer module, the cooling module, . ≪ / RTI >

Description

[0001] Apparatus for Processing Substrate [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing a coating, developing, and baking process.

In general, a manufacturing apparatus for a semiconductor device is manufactured by forming a predetermined film on a substrate and forming the film into a pattern having electrical characteristics. The pattern is formed by sequential or repetitive execution of unit processes such as film formation, photolithography, etching, cleaning, and the like.

Here, in the photolithography process, a coating process for forming a photoresist film on a silicon substrate, an exposure process for selectively exposing the substrate with the photoresist film formed thereon using a mask, and a step for developing the exposed photoresist film to form a fine circuit pattern And a baking step which proceeds after the application step, the exposure step and the development step, respectively.

The facility for carrying out the photolithography process includes a facility including a coating processing area for performing a coating process, a developing processing area for carrying out a developing process, and a bake processing area for carrying out a baking process, and a separate exposure facility Respectively. In the photolithography equipment for performing the coating, developing and baking processes, a baking process region is arranged on the opposite side of the coating process region and the developing process region on one side in order to increase the substrate transfer efficiency. Therefore, a robot for transferring the substrate to each layer is separately installed.

However, such a configuration has limitations in increasing the operating rate of equipment. For example, one transport robot disposed in the development processing layer processes seven steps consisting of buffer-post-exposure bake-cooling-development-hard bake-cooling-buffer. Therefore, a large load is applied to the conveying robot disposed in one layer, and the facility production efficiency is accordingly reduced.

Embodiments of the present invention are intended to provide a substrate processing apparatus having a layout capable of distributing a load of a carrier robot.

Embodiments of the present invention provide a substrate processing apparatus capable of selectively performing a positive type development process and a negative type development process while improving a substrate production amount.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an apparatus including: an index unit having a port and an index robot on which a container containing a substrate is placed; A processing section having a development processing section in which a first development processing chamber and a second development processing chamber, which are subjected to a process of developing a substrate, are divided and arranged in layers; And a first path portion disposed between the development processing portion and the index portion; Wherein the first development processing chamber includes a development module and a first heating module and a first main transfer robot disposed on a transfer passage accessible to the development module and the first heating module, A first buffer carrying robot disposed on a moving path accessible to the first buffer module, the first buffer module, the cooling module, the second buffer module, and the second heating module, the first buffer module, the cooling module, May be provided.

In addition, the first buffer module and the cooling module may be disposed at positions accessible to both the first main transport robot and the first buffer transport robot.

In addition, the first buffer module and the cooling module may be disposed between the moving path of the first main transporting robot and the moving path of the first buffer transporting robot.

The moving path of the first main transporting robot may be provided in a horizontal direction, and the moving path of the first buffer transporting robot may be provided in a vertical direction.

Also, the first heating module may be a post exposure bake (PEB) module.

Also, the second heating module may be a hard bake (H / B) module.

It is preferable that the developing module of the first developing chamber is provided by only one of a positive developing module that performs positive development and a negative developing module that performs negative development, and the developing module of the second developing chamber performs a positive developing Only the other of the positive developing module for performing negative development and the negative developing module for performing negative developing can be provided.

In addition, the number of the first development processing chambers may be smaller than the number of the second development processing chambers.

Further, the process processing unit may further include a coating processing unit in which coating treatment chambers for performing a photoresist coating process on the substrate are divided and arranged in layers; The coating unit may be divided and disposed in layers with the developing unit.

According to an aspect of the present invention, A development processing section in which a first development processing chamber for performing a positive development process and a second development processing chamber for advancing a negative development process are stacked and arranged; And a first path portion disposed between the development processing portion and the index portion; In order to sequentially perform the post-exposure baking, cooling, and developing processes, any one of the first developing chamber and the second developing chamber may be provided with a developing module, a post exposure bake (PEB) module, A hard bake module for performing a hard bake (H / B) process on the substrate processed in the development module is disposed on a transfer path of the main transfer robot, A substrate processing equipment disposed on the transfer path can be provided.

In addition, the cooling module may be disposed at a position where the first main transport robot and the first buffer transport robot are both accessible, and the first buffer module in which the substrate temporarily stays may be stacked on the cooling module.

The first pass unit may further include a second buffer module for transferring the substrate to the index unit.

The moving path of the first main transporting robot may be provided in a horizontal direction, and the moving path of the first buffer transporting robot may be provided in a vertical direction.

In addition, any one of the above described treatment chamber quantities may be smaller than the other one.

According to an aspect of the present invention, A development processing section in which the first development processing chamber and the second development processing chamber are divided and arranged in layers; And a first path portion disposed between the development processing portion and the index portion; Wherein the first development processing chamber is disposed on a horizontal transfer path of the first main transfer robot for sequentially performing post-exposure baking, cooling, and developing processes, and the first pass portion performs development processing in the first development processing chamber A processing module for performing a hard bake (H / B) process on the substrate is disposed on the vertical transfer path of the first buffer transfer robot, and the first buffer transfer robot is connected to the first developing processing chamber And a substrate processing apparatus provided so as to be movable up and down so as to allow interlayer movement to the second development processing chambers.

In addition, the first developing process chamber may include only one type of developing module among a developing module for performing a positive developing process or a developing module for performing a negative developing process.

In addition, the first buffer module and the cooling module may be disposed at positions accessible to both the first main transport robot and the first buffer transport robot.

According to the present invention, it is possible to improve the substrate production amount by dispersing the load of the transport robot.

According to the present invention, it is possible to improve the substrate production amount while selectively performing the positive type development step and the negative type development step.

1 is an external view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is a configuration diagram showing the layout of each layer in the substrate processing facility shown in Fig. 1. Fig.
3 is a configuration diagram for explaining a development processing section, a first development path section, and a second development path section;
4 is a perspective view for explaining the development processing section, the first development path section, and the second development path section;

The present invention is not limited to the embodiments described herein but can be implemented in other forms. The embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the spirit and scope of the invention to those skilled in the art. In the drawings, each apparatus is schematically shown for the sake of clarity of the present invention. In addition, each device may be provided with various additional devices not described in detail herein. Like reference numerals refer to like elements throughout the specification.

In this embodiment, a semiconductor wafer will be described as an example of a substrate. However, the substrate may be various kinds of substrates such as a photomask, a flat display panel, etc. in addition to a semiconductor wafer. In this embodiment, the substrate processing equipment is a facility for performing a photolithography process. However, the substrate processing equipment may be a facility for performing a cleaning process on other types of substrates such as wafers and the like.

FIG. 1 is an external view showing a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration diagram showing layouts of respective layers in the substrate processing apparatus shown in FIG.

1 and 2, a substrate processing apparatus 1000 according to the present invention includes an index unit 10, a processing unit 20, a first pass unit 30, a second pass unit 40, 50).

The index unit 10, the first path unit 30, the processing unit 20, the second path unit 40, and the interface unit 50 are arranged in a line. The direction in which the index unit 10, the first path unit 30, the processing unit 20, the second path unit 40, and the interface unit 50 are arranged is referred to as a first direction, A direction perpendicular to the first direction is referred to as a second direction and a direction perpendicular to the plane including the first direction and the second direction is defined as a third direction.

The substrate W is moved in a state accommodated in the container 16. At this time, the container 16 has a structure that can be sealed from the outside. For example, as the container 16, a front open unified pod (FOUP) having a door at the front can be used. Hereinafter, each configuration will be described in detail with reference to Figs. 1 to 3. Fig.

(Index portion)

The index portion 10 is disposed in front of the substrate processing apparatus 1000 in the first direction. The index section 10 includes four load ports 12 and one index robot 13.

The four load ports 12 are disposed in front of the index portion 10 in the first direction. A plurality of load ports 12 are provided and they are disposed along the second direction. The number of the load ports 12 may increase or decrease depending on the process efficiency and the footprint condition of the substrate processing apparatus 1000. The load ports 12 are loaded with a substrate W to be supplied to the process and a container (e.g., cassette, FOUP, etc.) in which the processed substrate W is placed.

The index robot 13 is disposed in the first direction adjacent to the load port 12. [ The index robot 13 is installed between the load port 12 and the first path portion 30. The index robot 13 transfers the substrate between the first path portion 30 and the load port 12. The substrate W waiting in the buffer module of the first path section 30 is transferred to the container 16 or the substrate W waiting in the container 16 is transferred to the buffer module of the first path section 30 do.

(Interface)

The interface section 50 transfers the substrate between the second pass section 40 and an exposure apparatus (not shown). The interface unit 50 includes an interface robot 510. Although not shown, the interface section 50 may be provided with buffer modules in which the substrate temporarily waits.

(Process processing section)

In the process processing unit 20, a process of applying the photoresist on the substrate W and a process of developing the substrate W after the exposure process may be performed before the exposure process.

The process processing unit 20 may be provided with a coating processing unit 200a for performing a coating process process and a developing process unit 200b for performing a developing process process in a layered manner. The coating processing section 200-a includes three coating processing chambers 200-1, 200-2, and 200-3. The developing processing section 200b includes three developing processing chambers 200-4, 200-5, and 200- 6).

For example, the coating processing unit 200a and the processing chambers 200-1 to 200-6 of the developing processing unit 200b may perform the processings of the central passage 210, the first main transport robots 240 and 250, Lt; / RTI > The processing modules may include thermal processing modules and spin processing modules, and the spin processing modules may include coating modules for the coating process or developing modules for the developing process. As described above, the modules corresponding to the respective process characteristics can be arranged in the coating processing unit 200a and the processing chambers 200-1 to 200-6 of the developing processing unit 200b.

The first main transport robot 240 or 250 is responsible for transporting the substrate on the central passage 210. The first main transport robot 240 and the second main transport robot 240 can be moved in the first direction, the second direction, and the third direction so that the hand for directly handling the substrate can be rotated.

The processing modules may be installed along a central passage 210 accessible by the first main transport robot 240,

In the present embodiment, the coating process chambers for the first to third layers are provided with modules for the coating process, and the developing process chambers for the fourth to sixth layers are provided with modules for the developing process. On the other hand, in the first to third layers, the processing chambers for the developing process and the coating processes for the four to six layers can be disposed, and the number of the processing chambers can be changed.

(First pass section and second pass section)

The first pass section 30 is disposed between the processing section 20 and the index section 10. The first pass section 30 includes a first dispense pass section 30-1 connected to the coating processing chambers 200-1, 200-2 and 200-3, development processing chambers 200-4, 200-5 and 200-6, And the first development pass section 30-1 and the first development pass section 30-2 are partitioned and provided.

The first application pass section 30-1 is provided with an interlayer transport robot 310a for transporting the substrate between the coating processing chambers 200-1, 200-2, and 200-3 as well as the substrate transport between the coating processing section 200a and the index section 10, / RTI >

The first development pass section 30-2 is an interlayer transport robot 310b for transporting the substrate between the development processing chambers 200-4, 200-5, and 200-6 as well as the substrate transport between the development processing section 200b and the index section 10, / RTI >

The second path unit 40 is disposed between the interface unit 50 and the processing unit 20. The second pass section 40 includes a second dispense pass section 40-1 connected to the coating processing chambers 200-1, 200-2 and 200-3, development processing chambers 200-4, 200-5 and 200-6, And the second development pass section 40-1 and the second development pass section 40-2 are provided in a layered manner. Buffer modules 420 are provided in the second application pass section 40-1 and the second development pass section 40-2, in which the substrate temporarily stands by.

The first path portion 30 and the second path portion 40 are disposed opposite to each other with the process processing portion 20 interposed therebetween.

Figs. 3 and 4 are a configuration diagram and a perspective view for explaining the development processing section, the first development path section, and the second development path section.

Referring to Figs. 3 and 4, the development processing section 200b includes three development processing chambers 200-4, 200-5, and 200-6. Each of the three development processing chambers 200-4, 200-5, and 200-6 may perform a positive development process or a negative development process for each layer. For example, the development processing chambers 200-4 and 200-5 of the fourth and fifth layers are provided with four development modules (DEV +) for performing the positive type development process, and the six development processing chambers 200- 6) may be provided with four developing modules DEV- for performing the negative developing process. That is, the development processing section 200b has eight positive development modules (DEV +) and four negative development modules (DEV-).

The development processing section 200b according to the present embodiment has six development processing chambers 200 (DEV-), each having a negative development module DEV- since the number of the negative development modules DEV- is smaller than that of the positive development modules DEV + -6 has a layout structure different from that of the developing processing chambers 200-4 and 200-5 of the 4th and 5th layers. The most significant difference between the development processing chamber 200-6 of the sixth layer and the development processing chambers 200-4 and 200-5 of the fourth and fifth layers is that the hard bake module is not disposed in the same layer, (30-2).

For example, the six developing processing chamber 200-6 includes the negative developing modules DEV-, the first heating modules 220, and the first main transport robot 240. The negative development module DEV- and the first heating module 220 are disposed on the moving path 210 accessible by the first main transport robot 240. Here, the first heating module 220 may be a post exposure bake (PEB) module. The number of the first heating units in the sixth development processing chamber 200-6 is increased more than the number of the first heating units in the developing processing chambers 200-4 and 200-5 in the fourth and fifth layers. Accordingly, when the temperature of the bake after the exposure is frequently used as in the system semiconductor production process, the waiting time due to the temperature change can be reduced, thereby reducing the production loss and increasing the facility operation efficiency.

The first development pass unit 30-2 includes a second heating module 340, a first buffer module 320, a cooling module 330, a second buffer module 350 and a first buffer transfer robot 310b . The second heating module 340, the first buffer module 320, the cooling module 330 and the second buffer module 350 are disposed on a moving passage 390 accessible by the first buffer carrying robot 310b . Here, the second heating module 340 may be a hard bake (H / B) module.

The first buffer module 320 and the cooling module 330 are disposed at positions where both the first main transfer robot 240 and the first buffer transfer robot 310b are accessible. The first buffer module 320 and the cooling module 330 are stacked between the moving path 210 of the first main transport robot 240 and the moving path 390 of the first buffer transport robot 310b . The moving path 210 of the first main transport robot 240 is provided in the horizontal direction and the moving path 390 of the first buffer carrying robot 310b is provided in the vertical direction. The first buffer module 320 and the cooling module 330 are connected to each other in a direction in which the first main transport robot 240 is provided so that the first main transport robot 240 can carry the substrate in or out, 310b have openings in the directions in which the first buffer carrying robot 310b is provided so that the boards can be carried in and out.

The development processing chambers 200-4 and 200-5 of the fourth and fifth layers are constituted by the positive development modules DEV +, the first heating modules 220, the second heating module 280 and the first main transport robot 240 ). The positive development modules DEV +, the first heating modules 220 and the second heating module 280 are disposed on the moving path 210 accessible by the first main transport robot 240.

In the development processing chambers 200-4 and 200-5 of the fourth and fifth layers, the developing process of baking-cooling-developing-hard-baking-cooling after exposure is performed in the same layer. In the sixth development processing chamber 200-6, only the post-exposure bake-cooling-developing process is performed in the same layer, and the remaining hard bake-cooling process proceeds in the first development pass section 30-2.

As described above, in the six-layer development processing chamber 200-6 equipped with the negative development module DEV- having a smaller number than the positive development module DEV +, the first main transfer robot 240 transfers the buffer module 420- (DEV-) to the first buffer module (320). The first developing pass section (30) is connected to the first developing module The first buffer transfer robot 310b of the first buffer module 310-1 is connected to the first buffer module 320 to the second heating module 340 to the cooling module 330 to the second buffer module 350, . As described above, the two conveying robots disperse and process the developing process within five steps.

Assuming that the cycle time of one step of the conveying robot is 3.5 seconds, for example, if the negative type development process is performed in the existing layout, the substrate production amount is about 146 pieces per hour. However, in the development processing portion of the present invention, . Therefore, the substrate production amount can be improved by 40% or more through the carrier dispersion and the robot use optimization of the present invention.

If the negative development process is performed in the development processing chambers 200-5 and 200-6 of the fifth and sixth layers and the positive development process is performed in the development processing chamber 200-4 of the fourth layer, Since the number of developing modules DEV + is smaller than that of the negative developing modules DEV-, the four developing processing chambers 200-4 equipped with the positive developing modules DEV + -5, and 200-6).

The substrate processing facility of the present invention can be very usefully applied to a lithography processing apparatus that uses both a negative development process and a positive development process.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

10: Index section 20: Process processing section
30: first pass section 40: second pass section
50:

Claims (17)

A substrate processing facility comprising:
An index portion having a port and an index robot on which a container containing a substrate is placed;
A processing section having a development processing section in which a first development processing chamber and a second development processing chamber, which are subjected to a process of developing a substrate, are divided and arranged in layers;
And a first path portion disposed between the development processing portion and the index portion;
Wherein the first development processing chamber includes a development module and a first heating module and a first main transfer robot disposed on a transfer passage accessible to the development module and the first heating module,
Wherein the first pass comprises a second heating module, a first buffer module, a cooling module, a second buffer module, and a travel pathway accessible to the second heating module, the first buffer module, the cooling module and the second buffer module And a second buffer transfer robot disposed on the first buffer transfer robot. The method according to claim 1,
Wherein the first buffer module and the cooling module are disposed at positions accessible to both the first main transfer robot and the first buffer transfer robot. 3. The method according to claim 1 or 2,
Wherein the first buffer module and the cooling module are stacked and disposed between a moving path of the first main transporting robot and a moving path of the first buffer transporting robot. 3. The method according to claim 1 or 2,
Wherein the moving path of the first main transporting robot is provided in the horizontal direction and the moving path of the first buffer transporting robot is provided in the vertical direction. 3. The method according to claim 1 or 2,
Wherein the first heating module is a Post Exposure Bake (PEB) module. 3. The method according to claim 1 or 2,
Wherein the second heating module is a hard bake (H / B) module. 3. The method according to claim 1 or 2,
Wherein the developing module of the first developing chamber is provided by only one of a positive developing module for performing a positive developing and a negative developing module for performing a negative developing,
Wherein the developing module in the second developing chamber is provided only in the other of the positive developing module for performing the positive developing and the negative developing module for performing the negative developing. 3. The method according to claim 1 or 2,
Wherein the number of the first development processing chambers is smaller than the number of the second development processing chambers. 3. The method according to claim 1 or 2,
The process-
Further comprising: a coating processing unit in which a coating treatment chamber for performing a photoresist coating process on the substrate is partitioned and arranged in layers;
Wherein the coating processing unit is divided and disposed as a layer with respect to the development processing unit. A substrate processing facility comprising:
An index portion;
A development processing section in which a first development processing chamber for performing a positive development process and a second development processing chamber for advancing a negative development process are stacked and arranged; And
And a first path portion disposed between the development processing portion and the index portion;
The processing chamber of any one of the first developing processing chamber and the second developing processing chamber
A post exposure bake (PEB) module, and a cooling module are disposed on the conveyance path of the first main conveying robot for sequentially performing baking, cooling, and developing processes after exposure,
Wherein the first pass portion is disposed on a transfer passage of the first buffer transfer robot, wherein a hard bake module for performing a hard bake (H / B) process on the substrate processed in the development module is disposed. 11. The method of claim 10,
Wherein the cooling module is disposed at a position where both the first main transport robot and the first buffer transport robot are accessible,
Wherein the first buffer module in which the substrate temporarily stays is stacked and disposed in the cooling module. 12. The method of claim 11,
The first pass
And a second buffer module for taking over the substrate with the index portion. 12. The method of claim 11,
Wherein the moving path of the first main transporting robot is provided in the horizontal direction and the moving path of the first buffer transporting robot is provided in the vertical direction. 12. The method of claim 11,
Wherein the one of the processing chamber quantities is smaller than the other one of the processing chamber quantities. A substrate processing facility comprising:
An index portion;
A development processing section in which the first development processing chamber and the second development processing chamber are divided and arranged in layers;
And a first path portion disposed between the development processing portion and the index portion;
Wherein the first development processing chamber is disposed on a horizontal transfer path of the first main transfer robot in order to sequentially perform post-exposure baking, cooling, and development,
Wherein the first pass part is disposed on a vertical transfer path of the first buffer transfer robot, wherein a processing module for performing a hard bake (H / B) process on the substrate developed in the first development processing chamber is disposed on the vertical transfer path of the first buffer transfer robot,
Wherein the first buffer carrying robot is provided so as to be able to move up and down so as to be able to move between the first developing processing chamber and the second developing processing chamber adjacent to each other. 16. The method of claim 15,
Wherein the first developing processing chamber includes only one type of developing module among a developing module for performing a positive developing or a developing module for performing a negative developing. 16. The method of claim 15,
Wherein the first buffer module and the cooling module are disposed at positions accessible to both the first main transfer robot and the first buffer transfer robot.

Images