KR20070107361A - Substrate transfer equipment and substrate processing system using the same - Google Patents

Abstract

A substrate transfer apparatus and a substrate processing system using the same are provided to process a plurality of substrates with a process chamber by providing the substrate transfer apparatus loading and unloading substrates at the same time. A substrate transfer apparatus(800) comprises a drive unit(840), at least one spindle(830), a plurality of first rotational plate arms, and a plurality of rotational plate arm. The drive unit provides torque. The spindle is connected with the drive unit. The first rotational plate arms load and unload substrates into a first process chamber. The second rotational plate arms load and unload substrates into a second process chamber. The first and second rotational plate arms includes at least one rotational plate arm(820) for loading pre-processed substrates and at least one rotational plate arm(822) for unloading post-processed substrate.

Description

Substrate conveying apparatus and substrate processing system using same {SUBSTRATE TRANSFER EQUIPMENT AND SUBSTRATE PROCESSING SYSTEM USING THE SAME}

In order to more fully understand the drawings used in the detailed description of the invention, a brief description of each drawing is provided.

1A is a diagram showing the overall configuration of a substrate processing system according to a first embodiment of the present invention.

FIG. 1B is a top view of the substrate processing system of FIG. 1A.

It is a perspective view of the board | substrate conveyance apparatus provided in the transfer chamber.

3 is a view showing an example in which the substrate transfer device is configured in a driving manner separated into upper and lower portions, respectively.

4 is a perspective view showing the structure of one rotating plate arm.

5A to 5E are diagrams sequentially illustrating a substrate exchange process by the substrate transfer apparatus.

6 is a view showing an example in which a substrate transfer device having two drive shafts is employed.

7A and 7B are views showing a modification of the substrate conveying apparatus having the spindle and the drive unit separated from side to side.

8 is a view showing a substrate transport apparatus employing four separate spindles.

9A and 9B are views showing modifications of the substrate conveying apparatus having a plurality of spindles and a driving unit.

10 is a plan view of a substrate processing system according to a second embodiment of the present invention.

It is a figure which shows the board | substrate conveyance flow by a board | substrate conveyance apparatus.

12 and 13 illustrate modifications of the substrate processing system of the present invention.

* Description of the symbols for the main parts of the drawings *

100: index 110: carrier

200: load lock chamber 300: cooling chamber

400: transfer chamber 500, 600: process chamber

700: plasma source 800: substrate transfer device

The present invention relates to a substrate transfer apparatus and a substrate processing system, and more particularly, a substrate transfer apparatus that can improve productivity by saving substrate transfer time by continuously loading / unloading a plurality of substrates into a process chamber, and It relates to a substrate processing system using the same.

Background Art In recent years, substrate processing systems for manufacturing liquid crystal display devices, plasma display devices, and semiconductor devices have generally adopted cluster systems capable of consistently processing a plurality of substrates.

In general, a cluster system refers to a multi-chambered substrate processing system that includes a transfer robot (or handler) and a plurality of substrate processing modules provided around it.

The cluster system includes a transfer chamber and a transfer robot provided with a free rotation in the transfer chamber. Each side of the transfer chamber is equipped with a process chamber for carrying out a substrate processing process. Such a cluster system increases substrate throughput by allowing a plurality of substrates to be processed simultaneously or a plurality of processes can be performed continuously. Another effort to increase the substrate throughput is to simultaneously process a plurality of substrates in one process chamber to increase the substrate throughput per hour.

However, even if the process chamber processes a plurality of substrates simultaneously (or continuously), time loss occurs when the substrates before and after the process are not efficiently exchanged in the process chamber.

In addition, the conventional cluster system, in the case of configuring a hexagonal conveying chamber (basically composed of four process chambers and two load lock chambers), because of the area occupied by the conveying chamber, as well as the whole area of the system, is manufactured. The system width, which is important for the system arrangement in the line, is increased more than necessary, and the size of the vacuum system required to keep the conveying chamber in vacuum is increased, thereby increasing the equipment cost and installation cost. In addition, the area of such a conveyance chamber is further weighted as the number of process chambers installed is increased.

Therefore, there is a demand for a substrate processing system capable of processing a plurality of substrates simultaneously (or continuously) in a process chamber for processing a plurality of substrates, and for exchanging substrates before and after the treatment more efficiently.

An object of the present invention is to provide a substrate transfer device having a structure capable of efficiently processing a substrate and a substrate processing system using the same.

In addition, an object of the present invention is to provide a substrate transfer device and a substrate processing system using the same that can improve the productivity by reducing the transfer time of the substrate.

Moreover, an object of this invention is to provide the board | substrate conveying apparatus which has a small system area, and a substrate processing system using the same.

Another object of the present invention is to provide a substrate transfer device having a structure capable of shortening the time required for the process and a substrate processing system using the same.

In addition, an object of the present invention is to provide a substrate transfer device having a structure capable of improving the operation rate of the process chamber and a substrate processing system using the same.

In addition, an object of the present invention is to provide a substrate transfer device capable of significantly reducing the area and system width of the system and a substrate processing system using the same.

In addition, an object of the present invention is to provide a substrate transfer device and a substrate processing system using the same, which can minimize the apparatus cost and installation cost by reducing the unnecessary vacuum area.

One aspect of the present invention for achieving the above technical problem relates to a substrate transfer device. A substrate transfer apparatus of the present invention includes: a substrate transfer apparatus for transferring a substrate between a load lock chamber and first and second process chambers for processing a plurality of substrates, the substrate transfer apparatus comprising: a driving unit for providing a rotational force; At least one spindle connected to the drive unit; A plurality of first rotating plate arms for loading / unloading a substrate into the first process chamber; And a plurality of second rotating plate arms for loading / unloading the substrate into the second process chamber.

In one embodiment, each of the first and second rotating plate arms comprises: one or more loading rotating plate arms for loading the substrate prior to processing; And one or more unloading rotating plate arms for unloading the substrate after processing.

In one embodiment, the first and second rotating plate arms are mounted separately and each include at least two different spindles that are rotated independently.

In one embodiment, it includes one or more drives for providing rotational force to at least two different spindles.

In one embodiment, each of the first rotating plate arm and the second rotating plate arm includes: an end effector having a horseshoe-shaped end effector having an opening on one side and a support on which a substrate edge is placed on an upper surface thereof. Include.

In one embodiment, the end effector has: an entry passage formed to allow an end effector of a substrate transfer robot installed in the load lock chamber to enter and receive a substrate.

Another aspect of the present invention relates to a substrate processing system using a substrate transfer device. The substrate processing system comprises: a first process chamber comprising at least two substrate supports; A second process chamber comprising at least two substrate supports; A transfer chamber provided with a substrate transfer device; A first substrate entrance opened between the first process chamber and the transfer chamber; A second substrate entrance opened between the second process chamber and the transfer chamber; And a third substrate entrance opened between the transfer chamber and the exterior, wherein the substrate conveying device: takes over the substrate before and after the treatment from the outside and through the third substrate entrance, wherein the substrate before or after the received treatment is first or first; The substrates are conveyed to the two process chambers, and the substrates are processed to the outside through the third substrate entrance and exit after processing in the first or second process chamber.

In one embodiment, the load lock chamber comprises a load lock chamber coupled to the third substrate entrance, the load lock chamber including an atmospheric transfer robot for transporting the substrate at atmospheric pressure.

In one embodiment, a cooling chamber is provided for cooling the substrate after treatment discharged through the third substrate entrance.

In one embodiment, the first and second process chambers are plasma chambers to be subjected to plasma treatment.

In one embodiment, the first process chamber is a plasma chamber in which a plasma treatment is performed, and the second process chamber is a cooling chamber in which a cooling treatment for cooling a heated substrate is performed after the treatment.

In one embodiment, the apparatus further comprises: a fourth substrate entrance opened between the transfer chamber and another exterior, wherein the substrate transfer device: receives the substrate prior to processing from the outside via the third substrate entrance and removes the processed substrate; 4 Turn over to the outside through the board entrance.

In one embodiment, a load lock chamber is connected to the fourth substrate entrance and the load lock chamber includes an atmospheric transfer robot that carries the substrate at atmospheric pressure.

In one embodiment, a cooling chamber for cooling the substrate after the treatment discharged through the fourth substrate entrance is included.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description. In understanding the drawings, it should be noted that like parts are intended to be represented by the same reference numerals as much as possible. And detailed description of known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention is omitted.

(Example)

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention, the substrate transfer apparatus of the present invention and a substrate processing system using the same. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

 The basic intention of the present invention is to improve productivity by providing a more efficient substrate exchange method in a substrate processing system having a plurality of substrate processing capabilities. In addition, the present invention provides a substrate processing system capable of simultaneously processing a larger number of substrates based on an efficient substrate exchange method.

FIG. 1A is a view showing an overall configuration of a substrate processing system according to a first embodiment of the present invention, and FIG. 1B is a plan view of the substrate processing system of FIG. 1A. Referring to FIG. 1, the substrate processing system of the present invention includes first and second process chambers 500 and 600 and a transfer chamber 400 disposed therebetween. In front of the load lock chamber 200, an index 100 on which a plurality of carriers 110 are mounted is installed. The index, also known as the equipment front end module (EFEM), is sometimes referred to as the load lock chamber. The load lock chamber 200 may be provided with a cooling chamber 300 for cooling the substrate after processing as needed.

The load lock chamber 200 is provided with an atmospheric pressure transport robot 210 operated at atmospheric pressure. The atmospheric transfer robot 210 is responsible for substrate transfer between the transfer chamber 400 and the index 100. The atmospheric pressure transfer robot 210 operates to convey the substrate W between the carrier 110 and the transfer chamber 400. Atmospheric pressure conveying robot 210 is composed of a robot having a double arm structure having four end effectors capable of carrying out four substrates (W) from the carrier 210 to the transfer chamber 400 in one operation. . In addition, the atmospheric transfer robot 210 can be raised and lowered. In addition to the double arm structure shown in the present embodiment, the atmospheric transfer robot 210 may use various robots used in a conventional semiconductor manufacturing process. For example, a robot having a blade-shaped arm capable of handling eight substrates W as a single arm, a robot having four or more arms, or a robot employing a mixture thereof may be used. Robots can be used.

In the first and second process chambers 500 and 600, two substrate supports 520, 522, 620 and 622 are respectively divided at the front and rear ends and on the path in which the rotating plate arms of the substrate conveying apparatus 800 rotate. Is placed.

The first and second process chambers 500 and 600 are vacuum chambers for performing a predetermined plasma treatment process, and are provided with a plasma source 700. The first and second process chambers 500, 600 may be configured to perform various substrate processing operations. For example, it can be an ashing chamber that removes the photoresist using plasma to remove the photoresist, a CVD (Chemical Vapor Deposition) chamber configured to deposit an insulating film, and form interconnect structures. And an etch chamber configured to etch apertures or openings in the insulating film. Or a PVD chamber configured to deposit a barrier film, and may be a PVD chamber configured to deposit a metal film.

The to-be-processed substrate W processed by this substrate processing system is typically a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In addition to the illustrated configuration of the present substrate processing system, multiple processing systems may be required to perform all the processes required for complete fabrication of integrated circuits or chips. However, for the sake of clarity, the conventional structures or configurations that can be understood by those skilled in the art are omitted.

In the substrate processing system of the present invention, a transfer chamber 400 located at the center and first and second process chambers 500 and 600 are disposed on both sides thereof. At least two substrate supports 520, 522, 620, and 622 are installed in the first and second process chambers 500 and 600, respectively. The transfer module 400 is provided with a substrate transfer device 800.

A first substrate entrance 510 is opened between the transfer chamber 400 and the first process chamber 500, and a second substrate entrance 610 is opened between the transfer chamber 400 and the second process chamber 600. have. A third substrate entrance 410 is formed between the transfer chamber 400 and the load lock chamber 200. The first to third substrate entrances 510, 610, and 410 are opened and closed by slit valves (not shown), respectively.

The process of exchanging the substrate before and after the process in the transfer chamber 400 by the atmospheric transfer robot 210 proceeds at the atmospheric pressure state in which the first and second substrate entrances 510 and 610 are closed and the third substrate entrance 410 is open. do. On the other hand, the process of exchanging the substrate before and after the process between the first and second process chambers 500 and 600 and the trans chamber 400 by the substrate transfer apparatus 800 may be performed in a state where the third substrate entrance 410 is closed. The first and second substrate entrances 510 and 610 are opened while the vacuum is maintained, and the vacuum is performed.

It is a perspective view of the board | substrate conveyance apparatus provided in the transfer chamber. Referring to FIG. 2, the substrate conveying apparatus 800 includes a driving unit 840 that provides rotational force, a spindle 830 connected to the driving unit 840, and a plurality of rotating plate arms mounted to the spindle 830. 810.

The plurality of rotating plate arms 810 may include a plurality of first rotating plate arms for loading / unloading substrates into the first process chamber 500 and a plurality of loading / unloading substrates for loading the substrate into the second process chamber 600. Second rotating plate arms. The first and second rotating plate arms are alternately arranged. However, they may be arranged sequentially. The plurality of rotating plate arms 810 may be further divided into a loading arm 820 and an unloading arm 822. At this time, the unloading arm 822 is preferably arranged lower than the loading arm 820. The loading arm 820 and the unloading arm 822 are each paired. In one embodiment, as shown, eight rotating plate arms are provided in four pairs as a whole. As shown in FIG. 1B, the plurality of rotating plate arms 810 operate to unfold in a fan shape and are capable of rotating, lifting and lowering. The loading arm 820 and the unloading arm 822 operate in pairs.

Although not illustrated in detail, the driving unit 840 includes an electric motor for generating rotational force and a gear assembly for transmitting the generated rotational force to the spindle 830 to allow the plurality of rotating plate arms 810 to perform a desired operation. do. Thus, the plurality of rotating plate arms 810 are mounted to the spindle 830, and as shown in FIG. 1B, have a different rotation radius and are unfolded and folded in a fan shape symmetrically about the transfer chamber 400. Do this.

3 is a view showing an example in which the substrate transfer device is configured in a driving manner separated into upper and lower portions, respectively. Referring to FIG. 3, alternatively, the substrate conveying apparatus 800 may drive independent spindles 830a and 830b with upper and lower portions on which the loading arm 820 and the unloading arm 822 are separately mounted. It is provided with a driving unit 840a, 840b separated into an upper portion and a lower portion. Here, it is preferable that the two upper and lower spindles 830a and 830b be aligned on the same axis.

4 is a perspective view showing the structure of one rotating plate arm. Referring to FIG. 4, the plurality of rotating plate arms 810 of the substrate conveying apparatus 800 have an opening 813 having one side open, and a plurality of supporting parts 814 having a substrate edge on the upper surface thereof. It has a horseshoe-shaped end effector (END EFFECTOR) 812. The opening 813 is for entering and exiting the lift pin installed in the substrate support. The end effector 812 has an entry passage 815 formed to allow the end effector 212 of the atmospheric pressure transport robot 210 to enter and exit. Rotating plate arm 810 having such a configuration may be modified in another form within the scope of the technical spirit of the present invention.

5A to 5E are diagrams sequentially illustrating a substrate exchange process by the substrate transfer apparatus. First, referring to FIG. 5A, as indicated by an arrow S10, when the third substrate entrance 410 is opened in a state where the first and second substrate entrances 510 and 610 are closed, the substrate transfer device 800 before the processing. The substrate W1 is taken over. When the substrate takeover is completed, the third substrate entrance 410 is closed and the transfer chamber 400 is switched to the same vacuum state as the interior of the first and second process chambers 500 and 600. The pumping system for this purpose is of course provided in the system, but for convenience the display of the drawings is omitted.

Subsequently, as indicated by arrows S20 in FIG. 5B, the lift pins of the plurality of substrate supports 520, 522, 620, and 622 are lifted and the processed substrate W2 is lifted to a specified height. In conjunction with this operation, the first and second substrate entrances 510 and 610 are opened. At this time, the heights of the lift pins which are elevated are relatively lower than those of the substrate supports 520 and 620 disposed at the front end than those of the substrate supports 522 and 622 arranged at the rear end. Therefore, no mutual interference with the lift pins occurs in the rotational operation for the unloading of the loading arm 820.

Subsequently, as indicated by arrows S30 in FIG. 5C, the loading arm 820 and the unloading arm 822 of the substrate transfer device 800 are paired and rotated symmetrically to be unfolded in a fan shape. At this time, the substrates W1 are taken over from the lift pin to the unloading arm 822 after the treatment. Subsequently, when the substrate W1 is taken over after the treatment, as shown by the arrow S40 in FIG. 5D, the unloading arm 822 returns to the initial position of the transfer chamber 400 again. And as indicated by the arrow S50, the lift pins are lifted again to take over the substrate W2 from the loading arms 820 before processing.

And as shown by arrow S60 in FIG. 5E, the loading arms 820 also return to the initial position of the transfer chamber 400. In addition, the first and second substrate entrances 510 and 610 are closed again. And as shown by the arrow S70, the lift pins are lowered to seat the substrate (W2) before processing on the substrate support (520, 522, 620, 622).

The transfer chamber 400 is converted to an atmospheric pressure state, and the third substrate entrance 410 is opened. The atmospheric pressure transfer robot 210 of the load lock chamber 200 takes over the substrate W1 after processing from the unloading arm 822 and exits from the transfer chamber 400 as indicated by arrow S80 in FIG. 5E.

Such a series of substrate exchange steps S10 to S80 are continuously or simultaneously performed in a range where the back and forth steps are not interfered in order to minimize the substrate exchange time. And it can be seen that the step of S10 and the step of S80 are performed simultaneously in the repeated substrate exchange process. In other words, the substrate exchange process between the trans chamber 400 and the load lock chamber 200 is the exchange of the substrate after the unloaded process in the previous step and the substrate before the process to be loaded at the same time.

After the unloaded process, the substrate W1 is moved to the cooling chamber 300 by the atmospheric transfer robot 210 and is cooled and then loaded in the cassette 110. In this embodiment, the cooling chamber 300 is provided separately, but if the transfer chamber 400 performs the cooling treatment function, the separate cooling chamber 300 may be omitted. Alternatively, one of the first or second process chambers 500 or 600 may be configured as a cooling chamber. For example, the first process chamber 500 may be configured as a plasma chamber, and the second process chamber 600 may be configured as a cooling chamber. In such a case, the plasma processing is performed on the substrate in the first process chamber 500, and the substrate transfer device 800 is moved from the first process chamber 500 to the second process chamber 600 after the substrate is processed. To be cooled and cooled. In addition, the cooling may be performed to transfer the substrate from the second process chamber 600 to the load lock chamber 200.

As such, the substrate processing system of the present invention arranges the first and second process chambers 500 and 600 in parallel to process multiple substrates simultaneously and the transfer chamber 400 comprises two first and second process chambers. Located between 500 and 600. In this structure, the substrate conveying apparatus 800 which enables fast substrate exchange can be processed to process a large number of substrates at the same time and to quickly exchange substrates. In this embodiment, two substrates can be processed simultaneously and a total of four substrates can be simultaneously processed and exchanged in one process.

The substrate processing system of the present invention can also be modified in the following alternative embodiments.

6 is a view showing an example in which a substrate transfer device having two drive shafts is employed. Referring to FIG. 6, the substrate transport apparatus 800 may be separated from left to right and independently driven. That is, the rotation plate arm which is responsible for the substrate conveyance of the 1st process chamber 500 and the rotation plate arm which is responsible for the substrate conveyance of the 2nd process chamber 600 can each independently drive.

As shown in FIG. 7A, the separated structure may include first and second spindles 830a and 830b separated from each other and independent first and second drives 840a and 840b for driving them. . In addition, as illustrated in FIG. 7B, the first to fourth spindles 830a to 830d and the first to fourth drives 840a to 840d may be provided to be separated and driven upward and downward.

Furthermore, as shown in FIGS. 8 and 9A and 9B, four spindles 830a to 830d or eight spindles 830a to 830h and four drives 840a to 840d or eight drives 840a to Variations constituting 840h are possible. As such, variations of the spindle and drive unit for the separate drive of the rotating plate arm 810 responsible for substrate transport of the first and second process chambers 500, 600 and for loading and unloading in substrate transport are described. Very diverse

FIG. 10 is a plan view of a substrate processing system according to a second embodiment, and FIG. 11 is a diagram showing a substrate conveyance flow by the substrate conveying apparatus.

Referring to the drawings, the substrate processing system according to the second embodiment of the present invention includes the same configuration as the above-described first embodiment, and has a load lock chamber 250 having an atmospheric pressure transfer robot 260 at its rear end and an index. 150 is further provided. In addition, a fourth substrate entrance 420 opened between the transfer chamber 400 and the rear load lock chamber 250 is further configured. In such a substrate processing system, the substrate is loaded before processing in the front and the substrate is unloaded after processing in the rear. Here, the cooling chamber 300 for cooling the substrate may be configured in the rear load lock chamber 250. In FIG. 11, S100 to S130 indicated by arrows indicate the transfer flow of the substrate before processing and the substrate after processing by the substrate transfer apparatus 800 in stages.

12 and 13 illustrate modifications of the substrate processing system of the present invention.

As shown in FIG. 12, the first and second process chambers 500 and 600 have four substrate supports 520 to 526 and 620 to 626, respectively, and the substrate transfer device 800 is suitably adapted to this. Sixteen rotating plate arms may be provided. Alternatively, as illustrated in FIG. 13, instead of configuring the first process chamber 500, only the second process chamber 600 may be configured, and the substrate transfer apparatus 800 may also be configured to have eight rotating plate arms. . In addition, one or more cooling chambers 300 for cooling the substrate may be provided to suit the number of substrates to be processed.

Although the substrate processing system of the present invention described above has only described an example in which the process chamber is formed in a single layer in the above-described embodiment, a plurality of process chambers and a transfer chamber may be configured in multiple layers. In the multilayer structure, the substrate transfer devices provided in the transfer chamber may be driven independently or simultaneously.

The substrate transfer apparatus and the substrate processing system using the same according to the present invention may be variously modified and may take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

As described above, the present invention can quickly perform substrate exchange before and after the treatment in a substrate processing system that simultaneously or continuously processes a plurality of substrates, thereby increasing the throughput of the system to increase the overall substrate productivity. In addition, since a substrate transfer device for simultaneously loading and unloading substrates is provided, it is very easy to implement a process chamber for processing a plurality of substrates. In addition, the present invention can improve the productivity by reducing the transfer time of the substrate. In addition, the present invention can minimize the equipment cost and installation cost by significantly reducing the area and system width of the system.

Claims (14)

A substrate transfer apparatus for transferring a substrate between a load lock chamber and first and second process chambers for processing a plurality of substrates: A driving unit providing a rotational force; At least one spindle connected to the drive unit; A plurality of first rotating plate arms for loading / unloading a substrate into the first process chamber; And A substrate transfer device comprising a plurality of second rotating plate arms for loading / unloading a substrate into a second process chamber. The method of claim 1, wherein each of the first and second rotating plate arms is: One or more loading plate plates for loading the substrate prior to processing; And A substrate transfer device comprising one or more unloading rotating plate arms for unloading the substrate after processing. The substrate transport apparatus of claim 1, wherein the first and second rotating plate arms comprise at least two different spindles mounted separately and each independently rotated. The substrate transport apparatus of claim 3, comprising one or more drives for providing rotational force to at least two different spindles. 3. The horseshoe-shaped end effector of claim 2, wherein each of the first rotating plate arm and the second rotating plate arm has an opening having one side open and a support having an edge on which a substrate is placed. Substrate conveying apparatus comprising. 6. The substrate transfer apparatus according to claim 5, wherein the end effector has an entry passage formed to allow an end effector of a substrate transfer robot installed in the load lock chamber to enter and receive a substrate. In the substrate processing system using the substrate conveyance apparatus of Claim 1: A first process chamber comprising at least two substrate supports; A second process chamber comprising at least two substrate supports; A transfer chamber provided with a substrate transfer device; A first substrate entrance opened between the first process chamber and the transfer chamber; A second substrate entrance opened between the second process chamber and the transfer chamber; A third substrate entrance opened between the transfer chamber and the exterior, Substrate conveying device is: Take over the substrate before and after processing from / outside through the third substrate entrance, A substrate processing system for conveying a substrate before the received processing to a first or second process chamber, and taking over the substrates after processing processed in the first or second process chamber to the outside through a third substrate entrance. 8. The substrate processing system of claim 7, comprising a load lock chamber coupled to the third substrate entrance, wherein the load lock chamber comprises an atmospheric transfer robot that carries the substrate at atmospheric pressure. 8. The substrate processing system of claim 7, comprising a cooling chamber for cooling the substrate after processing discharged through the third substrate entrance. The substrate processing system of claim 7, wherein the first and second process chambers are plasma chambers subjected to plasma processing. The substrate processing system of claim 7, wherein the first process chamber is a plasma chamber in which plasma processing is performed, and the second process chamber is a cooling chamber in which a cooling process for cooling a heated substrate is performed after the processing. 8. The device of claim 7, further comprising: a fourth substrate entrance opened between the transfer chamber and another exterior, The substrate transfer device is: a substrate processing system that receives a substrate before processing from the outside through a third substrate entrance and takes over the processed substrate to the outside through a fourth substrate entrance. 13. The substrate processing system of claim 12, comprising a load lock chamber coupled to the fourth substrate entrance, wherein the load lock chamber comprises an atmospheric transfer robot that carries the substrate at atmospheric pressure. The substrate processing system of claim 13, comprising a cooling chamber for cooling the substrate after the treatment discharged through the fourth substrate entrance.

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