KR101560378B1 - 레이저 처리장치 및 처리방법 - Google Patents
레이저 처리장치 및 처리방법 Download PDFInfo
- Publication number
- KR101560378B1 KR101560378B1 KR1020140052456A KR20140052456A KR101560378B1 KR 101560378 B1 KR101560378 B1 KR 101560378B1 KR 1020140052456 A KR1020140052456 A KR 1020140052456A KR 20140052456 A KR20140052456 A KR 20140052456A KR 101560378 B1 KR101560378 B1 KR 101560378B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- laser beam
- laser
- scanner
- unit
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140052456A KR101560378B1 (ko) | 2014-04-30 | 2014-04-30 | 레이저 처리장치 및 처리방법 |
JP2015052099A JP6423294B2 (ja) | 2014-04-30 | 2015-03-16 | レーザ処理装置及び処理方法 |
CN201510210016.XA CN105014245B (zh) | 2014-04-30 | 2015-04-29 | 激光处理设备和方法 |
TW104113807A TWI553981B (zh) | 2014-04-30 | 2015-04-30 | 雷射處理設備和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140052456A KR101560378B1 (ko) | 2014-04-30 | 2014-04-30 | 레이저 처리장치 및 처리방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101560378B1 true KR101560378B1 (ko) | 2015-10-20 |
Family
ID=54399934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140052456A KR101560378B1 (ko) | 2014-04-30 | 2014-04-30 | 레이저 처리장치 및 처리방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6423294B2 (ja) |
KR (1) | KR101560378B1 (ja) |
CN (1) | CN105014245B (ja) |
TW (1) | TWI553981B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210063200A (ko) * | 2019-11-21 | 2021-06-01 | 참엔지니어링(주) | 마이크로 led 디스플레이 리페어 장치 및 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101918727B1 (ko) * | 2016-04-26 | 2019-02-08 | 에이피시스템 주식회사 | 레이저 처리 장치 및 레이저 처리 방법 |
CN110137784A (zh) * | 2019-05-14 | 2019-08-16 | 北京兆维科技开发有限公司 | 激光光源部件及其组成的亮点缺陷修复设备 |
JP2023082229A (ja) * | 2020-04-27 | 2023-06-14 | パナソニックIpマネジメント株式会社 | レーザ加工ヘッド及びレーザ加工装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002120081A (ja) * | 2000-10-19 | 2002-04-23 | Toshiba Corp | レーザ加工方法および装置 |
JP2002217550A (ja) * | 2001-01-16 | 2002-08-02 | Toshiba Corp | レーザ加工方法、レーザ加工装置および多層配線基板の製造方法 |
DE10237945A1 (de) * | 2002-08-20 | 2004-03-11 | Quintis Gmbh | Laserbasierte Vorrichtung zur nichtmechanischen, dreidimensionalen Trepanation bei Hornhauttransplantationen |
GB2438600B (en) * | 2006-05-19 | 2008-07-09 | Exitech Ltd | Method for patterning thin films on moving substrates |
US7977602B2 (en) * | 2007-03-21 | 2011-07-12 | Photon Dynamics, Inc. | Laser ablation using multiple wavelengths |
CN101902616A (zh) * | 2009-06-01 | 2010-12-01 | 金三立视频科技(深圳)有限公司 | 视频监控快速立体定位方法 |
CN104722928A (zh) * | 2009-12-07 | 2015-06-24 | Ipg微系统有限公司 | 激光加工及切割系统与方法 |
WO2012172814A1 (ja) * | 2011-06-17 | 2012-12-20 | 横浜ゴム株式会社 | グレージングガスケット付きガラスパネルの製造方法および製造装置 |
JP2013226588A (ja) * | 2012-04-26 | 2013-11-07 | Olympus Corp | リペア装置及びリペア方法 |
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2014
- 2014-04-30 KR KR1020140052456A patent/KR101560378B1/ko active IP Right Grant
-
2015
- 2015-03-16 JP JP2015052099A patent/JP6423294B2/ja active Active
- 2015-04-29 CN CN201510210016.XA patent/CN105014245B/zh active Active
- 2015-04-30 TW TW104113807A patent/TWI553981B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210063200A (ko) * | 2019-11-21 | 2021-06-01 | 참엔지니어링(주) | 마이크로 led 디스플레이 리페어 장치 및 방법 |
KR102624389B1 (ko) * | 2019-11-21 | 2024-01-15 | 참엔지니어링(주) | 마이크로 led 디스플레이 리페어 장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP6423294B2 (ja) | 2018-11-14 |
TWI553981B (zh) | 2016-10-11 |
CN105014245A (zh) | 2015-11-04 |
CN105014245B (zh) | 2018-04-20 |
TW201541771A (zh) | 2015-11-01 |
JP2015211982A (ja) | 2015-11-26 |
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