KR101560378B1 - 레이저 처리장치 및 처리방법 - Google Patents

레이저 처리장치 및 처리방법 Download PDF

Info

Publication number
KR101560378B1
KR101560378B1 KR1020140052456A KR20140052456A KR101560378B1 KR 101560378 B1 KR101560378 B1 KR 101560378B1 KR 1020140052456 A KR1020140052456 A KR 1020140052456A KR 20140052456 A KR20140052456 A KR 20140052456A KR 101560378 B1 KR101560378 B1 KR 101560378B1
Authority
KR
South Korea
Prior art keywords
substrate
laser beam
laser
scanner
unit
Prior art date
Application number
KR1020140052456A
Other languages
English (en)
Korean (ko)
Inventor
김준래
이근행
지영수
Original Assignee
참엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 참엔지니어링(주) filed Critical 참엔지니어링(주)
Priority to KR1020140052456A priority Critical patent/KR101560378B1/ko
Priority to JP2015052099A priority patent/JP6423294B2/ja
Priority to CN201510210016.XA priority patent/CN105014245B/zh
Priority to TW104113807A priority patent/TWI553981B/zh
Application granted granted Critical
Publication of KR101560378B1 publication Critical patent/KR101560378B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020140052456A 2014-04-30 2014-04-30 레이저 처리장치 및 처리방법 KR101560378B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020140052456A KR101560378B1 (ko) 2014-04-30 2014-04-30 레이저 처리장치 및 처리방법
JP2015052099A JP6423294B2 (ja) 2014-04-30 2015-03-16 レーザ処理装置及び処理方法
CN201510210016.XA CN105014245B (zh) 2014-04-30 2015-04-29 激光处理设备和方法
TW104113807A TWI553981B (zh) 2014-04-30 2015-04-30 雷射處理設備和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140052456A KR101560378B1 (ko) 2014-04-30 2014-04-30 레이저 처리장치 및 처리방법

Publications (1)

Publication Number Publication Date
KR101560378B1 true KR101560378B1 (ko) 2015-10-20

Family

ID=54399934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140052456A KR101560378B1 (ko) 2014-04-30 2014-04-30 레이저 처리장치 및 처리방법

Country Status (4)

Country Link
JP (1) JP6423294B2 (ja)
KR (1) KR101560378B1 (ja)
CN (1) CN105014245B (ja)
TW (1) TWI553981B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210063200A (ko) * 2019-11-21 2021-06-01 참엔지니어링(주) 마이크로 led 디스플레이 리페어 장치 및 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101918727B1 (ko) * 2016-04-26 2019-02-08 에이피시스템 주식회사 레이저 처리 장치 및 레이저 처리 방법
CN110137784A (zh) * 2019-05-14 2019-08-16 北京兆维科技开发有限公司 激光光源部件及其组成的亮点缺陷修复设备
JP2023082229A (ja) * 2020-04-27 2023-06-14 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッド及びレーザ加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002120081A (ja) * 2000-10-19 2002-04-23 Toshiba Corp レーザ加工方法および装置
JP2002217550A (ja) * 2001-01-16 2002-08-02 Toshiba Corp レーザ加工方法、レーザ加工装置および多層配線基板の製造方法
DE10237945A1 (de) * 2002-08-20 2004-03-11 Quintis Gmbh Laserbasierte Vorrichtung zur nichtmechanischen, dreidimensionalen Trepanation bei Hornhauttransplantationen
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
US7977602B2 (en) * 2007-03-21 2011-07-12 Photon Dynamics, Inc. Laser ablation using multiple wavelengths
CN101902616A (zh) * 2009-06-01 2010-12-01 金三立视频科技（深圳）有限公司 视频监控快速立体定位方法
CN104722928A (zh) * 2009-12-07 2015-06-24 Ipg微系统有限公司 激光加工及切割系统与方法
WO2012172814A1 (ja) * 2011-06-17 2012-12-20 横浜ゴム株式会社 グレージングガスケット付きガラスパネルの製造方法および製造装置
JP2013226588A (ja) * 2012-04-26 2013-11-07 Olympus Corp リペア装置及びリペア方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210063200A (ko) * 2019-11-21 2021-06-01 참엔지니어링(주) 마이크로 led 디스플레이 리페어 장치 및 방법
KR102624389B1 (ko) * 2019-11-21 2024-01-15 참엔지니어링(주) 마이크로 led 디스플레이 리페어 장치 및 방법

Also Published As

Publication number Publication date
JP6423294B2 (ja) 2018-11-14
TWI553981B (zh) 2016-10-11
CN105014245A (zh) 2015-11-04
CN105014245B (zh) 2018-04-20
TW201541771A (zh) 2015-11-01
JP2015211982A (ja) 2015-11-26

Similar Documents

Publication Publication Date Title
CN203265909U (zh) 修复装置
KR101560378B1 (ko) 레이저 처리장치 및 처리방법
CN203409425U (zh) 修复装置
KR101606197B1 (ko) 관찰기 및 이를 구비하는 레이저 처리장치
CN112171051B (zh) 消除透镜色差的激光修复装置及方法
JP2011025316A (ja) 欠陥修正装置
JP2009056507A (ja) レーザ加工装置
KR101918203B1 (ko) 레이저 처리 장치 및 방법
KR101245804B1 (ko) 레이저 마킹 시스템
KR20120049140A (ko) 레이저 가공 장치
JP7173641B2 (ja) 表示装置パネルに対するレーザーリペア及び検査方法とこれに適したリペア及び検査装置
TWI587957B (zh) 用於電路之一檢測/維修/檢測系統之透鏡總成及用於電路之一檢測/維修/檢測系統之組合器總成
JP2009053485A (ja) オートフォーカス装置、オートフォーカス方法および計測装置
CN114531857A (zh) 检查装置及检查方法
KR20200019386A (ko) 레이저 가공 장치
KR102313467B1 (ko) 레이저 가공 장치
JP3175731B2 (ja) レーザｃｖｄ装置
CN114430706A (zh) 检查装置及检查方法
KR20150077596A (ko) 기판검사장치
TWI484253B (zh) 修復方法及修復裝置
JP2024004778A (ja) レーザ加工装置及びレーザ加工方法
KR100842509B1 (ko) 웨이퍼 표면검사를 위한 레이저 스캐닝장치
JPH04327390A (ja) レーザ加工装置
JPH01249286A (ja) レーザ加工装置

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant