KR101559593B1 - 광전 소자의 제조 방법 및 광전 소자 - Google Patents

광전 소자의 제조 방법 및 광전 소자 Download PDF

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Publication number
KR101559593B1
KR101559593B1 KR1020097023449A KR20097023449A KR101559593B1 KR 101559593 B1 KR101559593 B1 KR 101559593B1 KR 1020097023449 A KR1020097023449 A KR 1020097023449A KR 20097023449 A KR20097023449 A KR 20097023449A KR 101559593 B1 KR101559593 B1 KR 101559593B1
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South Korea
Prior art keywords
substrate
major surface
tool
semiconductor body
packing
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KR1020097023449A
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English (en)
Korean (ko)
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KR20100016402A (ko
Inventor
헤럴드 예거
허벌트 브루너
알버트 슈니더
토마스 질러
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020097023449A 2007-04-16 2008-04-14 광전 소자의 제조 방법 및 광전 소자 Active KR101559593B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007017855A DE102007017855A1 (de) 2007-04-16 2007-04-16 Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement
DE102007017855.9 2007-04-16

Publications (2)

Publication Number Publication Date
KR20100016402A KR20100016402A (ko) 2010-02-12
KR101559593B1 true KR101559593B1 (ko) 2015-10-12

Family

ID=39767773

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097023449A Active KR101559593B1 (ko) 2007-04-16 2008-04-14 광전 소자의 제조 방법 및 광전 소자

Country Status (8)

Country Link
US (1) US8435806B2 (https=)
EP (1) EP2136981B1 (https=)
JP (1) JP2010524269A (https=)
KR (1) KR101559593B1 (https=)
CN (1) CN101678569B (https=)
DE (1) DE102007017855A1 (https=)
TW (1) TWI368339B (https=)
WO (1) WO2008125096A2 (https=)

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DE102009034370A1 (de) * 2009-07-23 2011-01-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optischen Elements für ein optoelektronisches Bauteil
DE102009055786A1 (de) * 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
KR101114197B1 (ko) * 2010-08-09 2012-02-22 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
DE102010034923A1 (de) 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht
TW201313455A (zh) * 2011-09-28 2013-04-01 Ichia Tech Inc 將塑膠機構固著於金屬殼體之方法
KR101896661B1 (ko) * 2011-10-28 2018-09-07 엘지이노텍 주식회사 발광소자 패키지, 백라이트 유닛 및 영상표시장치
DE102013214793A1 (de) * 2013-07-29 2015-01-29 Trumpf Medizin Systeme Gmbh + Co. Kg Operationsleuchte und Verfahren zum Herstellen einer Operationsleuchte
DE102015113438B4 (de) 2015-08-14 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Trägersubstrat für ein optoelektronisches Halbleiterbauteil
DE102016108369A1 (de) * 2016-05-04 2017-11-09 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
DE102017219325A1 (de) * 2017-10-27 2019-05-02 Zf Friedrichshafen Ag Spritzwerkzeug und Verfahren zur Abdichtung von Einlegeteilen
DE102018104382A1 (de) * 2018-02-27 2019-08-29 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und herstellungsverfahren
DE102019216723A1 (de) * 2019-10-30 2021-05-06 Robert Bosch Gmbh Mold-Modul
CN112810043B (zh) * 2020-12-15 2022-12-27 河北中瓷电子科技股份有限公司 塑料封装外壳的制备方法
DE102021118490A1 (de) 2021-07-16 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer vielzahl von licht emittierenden bauelementen und bauteil
DE102022121518A1 (de) * 2022-08-25 2024-03-07 Ams-Osram International Gmbh Verfahren zur herstellung einer vielzahl strahlungsemittierender bauelemente und strahlungsemittierendes bauelement
US20250144857A1 (en) * 2023-11-02 2025-05-08 Intel Corporation Molding system and molding method
DE102024131728A1 (de) * 2024-10-30 2026-04-30 Ams-Osram International Gmbh Spritzgusskörper mit formflexibler optoelektronischer anordung und verfahren zur herstellung desselbigen

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WO2007007959A1 (en) * 2005-07-13 2007-01-18 Seoul Semiconductor Co., Ltd. Mold for forming a molding member and method of fabricating a molding member using the same

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JP2006078517A (ja) 2004-09-07 2006-03-23 Canon Inc 撮像モジュール及び撮像モジュールの製造方法
JP2006148147A (ja) * 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Ｌｅｄダイ上のオーバーモールドレンズ
WO2007007959A1 (en) * 2005-07-13 2007-01-18 Seoul Semiconductor Co., Ltd. Mold for forming a molding member and method of fabricating a molding member using the same

Also Published As

Publication number Publication date
JP2010524269A (ja) 2010-07-15
DE102007017855A1 (de) 2008-10-23
US8435806B2 (en) 2013-05-07
EP2136981B1 (de) 2013-06-05
WO2008125096A2 (de) 2008-10-23
CN101678569B (zh) 2015-08-26
KR20100016402A (ko) 2010-02-12
TWI368339B (en) 2012-07-11
US20100193815A1 (en) 2010-08-05
WO2008125096A3 (de) 2009-04-30
EP2136981A2 (de) 2009-12-30
TW200847491A (en) 2008-12-01
CN101678569A (zh) 2010-03-24

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