KR101554203B1 - 두께 측정 장치 - Google Patents

두께 측정 장치 Download PDF

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Publication number
KR101554203B1
KR101554203B1 KR1020130078753A KR20130078753A KR101554203B1 KR 101554203 B1 KR101554203 B1 KR 101554203B1 KR 1020130078753 A KR1020130078753 A KR 1020130078753A KR 20130078753 A KR20130078753 A KR 20130078753A KR 101554203 B1 KR101554203 B1 KR 101554203B1
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KR
South Korea
Prior art keywords
wavelength
transparent substrate
transmission beam
intensity
phase difference
Prior art date
Application number
KR1020130078753A
Other languages
English (en)
Korean (ko)
Other versions
KR20150005794A (ko
Inventor
김재완
김종안
강주식
진종한
Original Assignee
한국표준과학연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한국표준과학연구원 filed Critical 한국표준과학연구원
Priority to KR1020130078753A priority Critical patent/KR101554203B1/ko
Priority to JP2014135984A priority patent/JP2015014601A/ja
Priority to CN201410319193.7A priority patent/CN104279968B/zh
Publication of KR20150005794A publication Critical patent/KR20150005794A/ko
Application granted granted Critical
Publication of KR101554203B1 publication Critical patent/KR101554203B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020130078753A 2013-07-05 2013-07-05 두께 측정 장치 KR101554203B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130078753A KR101554203B1 (ko) 2013-07-05 2013-07-05 두께 측정 장치
JP2014135984A JP2015014601A (ja) 2013-07-05 2014-07-01 厚さ測定装置
CN201410319193.7A CN104279968B (zh) 2013-07-05 2014-07-04 厚度测量装置与厚度测量方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130078753A KR101554203B1 (ko) 2013-07-05 2013-07-05 두께 측정 장치

Publications (2)

Publication Number Publication Date
KR20150005794A KR20150005794A (ko) 2015-01-15
KR101554203B1 true KR101554203B1 (ko) 2015-09-21

Family

ID=52255099

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130078753A KR101554203B1 (ko) 2013-07-05 2013-07-05 두께 측정 장치

Country Status (3)

Country Link
JP (1) JP2015014601A (zh)
KR (1) KR101554203B1 (zh)
CN (1) CN104279968B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107765090B (zh) * 2017-10-16 2020-05-19 上海传输线研究所（中国电子科技集团公司第二十三研究所） 一种3×3耦合器相位次序标定方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100631060B1 (ko) 2004-11-10 2006-10-04 한국과학기술원 백색광 간섭계를 이용한 투명박막의 두께 및 형상을측정하는 장치 및 방법
JP2009080038A (ja) 2007-09-26 2009-04-16 Kobe Steel Ltd ヘテロダイン干渉測定方法，ヘテロダイン干渉装置，厚み測定装置，厚み測定方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4314486C2 (de) * 1993-05-03 1998-08-27 Heidenhain Gmbh Dr Johannes Absolutinterferometrisches Meßverfahren sowie dafür geeignete Laserinterferometeranordnung
US6898168B2 (en) * 2000-05-12 2005-05-24 Konica Corporation Optical pick-up apparatus
US7027377B2 (en) * 2001-11-27 2006-04-11 Sankyo Seiki Mfg. Co., Ltd. Optical head device and objective lens
JP4072466B2 (ja) * 2002-12-27 2008-04-09 日本板硝子株式会社 板状体の光学的歪みを評価する装置および方法
US7271921B2 (en) * 2003-07-23 2007-09-18 Kla-Tencor Technologies Corporation Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning
DE102007011425A1 (de) * 2007-03-08 2008-09-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Projektionsvorrichtung zum scannenden Projizieren
CN101571376A (zh) * 2009-02-03 2009-11-04 上海亮兴电子技术有限公司 相位式光栅位移传感器
CN101788267B (zh) * 2010-01-26 2011-06-15 浙江大学 基于两组亚波长光栅的光学微位移传感器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100631060B1 (ko) 2004-11-10 2006-10-04 한국과학기술원 백색광 간섭계를 이용한 투명박막의 두께 및 형상을측정하는 장치 및 방법
JP2009080038A (ja) 2007-09-26 2009-04-16 Kobe Steel Ltd ヘテロダイン干渉測定方法，ヘテロダイン干渉装置，厚み測定装置，厚み測定方法

Also Published As

Publication number Publication date
CN104279968A (zh) 2015-01-14
KR20150005794A (ko) 2015-01-15
JP2015014601A (ja) 2015-01-22
CN104279968B (zh) 2018-05-22

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