KR101541201B1 - 열 도전성 개스킷 및 ｏ-링을 이용한 전극 어셈블리 및 플라즈마 프로세싱 챔버 - Google Patents

열 도전성 개스킷 및 ｏ-링을 이용한 전극 어셈블리 및 플라즈마 프로세싱 챔버 Download PDF

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KR101541201B1
KR101541201B1 KR1020107000498A KR20107000498A KR101541201B1 KR 101541201 B1 KR101541201 B1 KR 101541201B1 KR 1020107000498 A KR1020107000498 A KR 1020107000498A KR 20107000498 A KR20107000498 A KR 20107000498A KR 101541201 B1 KR101541201 B1 KR 101541201B1
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control plate
thermal
thermal control
showerhead
electrode
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KR20100048991A (ko
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로저 패트릭
라즈 딘드사
그레그 베텐코트
알렉세이 마라크타노프
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1020107000498A 2007-06-13 2008-05-22 열 도전성 개스킷 및 ｏ-링을 이용한 전극 어셈블리 및 플라즈마 프로세싱 챔버 Active KR101541201B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US92910707P 2007-06-13 2007-06-13
US60/929,107 2007-06-13
US11/896,375 2007-08-31
US11/896,375 US7862682B2 (en) 2007-06-13 2007-08-31 Showerhead electrode assemblies for plasma processing apparatuses
US12/112,112 2008-04-30
US12/112,112 US8216418B2 (en) 2007-06-13 2008-04-30 Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings

Publications (2)

Publication Number Publication Date
KR20100048991A KR20100048991A (ko) 2010-05-11
KR101541201B1 true KR101541201B1 (ko) 2015-07-31

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US (1) US8216418B2 (enExample)
JP (1) JP5341073B2 (enExample)
KR (1) KR101541201B1 (enExample)
CN (1) CN101715605B (enExample)
TW (1) TWI453817B (enExample)
WO (1) WO2008156958A2 (enExample)

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JP7097284B2 (ja) * 2018-12-06 2022-07-07 東京エレクトロン株式会社 プラズマ処理装置
KR102198929B1 (ko) 2019-02-28 2021-01-06 세메스 주식회사 기판 처리 장치의 가스 공급 유닛
CN112837985B (zh) * 2019-11-22 2023-01-24 中微半导体设备(上海)股份有限公司 上电极组件以及等离子体处理设备
JP7583663B2 (ja) * 2021-04-01 2024-11-14 東京エレクトロン株式会社 上部電極アセンブリ
KR20240115340A (ko) * 2021-12-15 2024-07-25 램 리써치 코포레이션 에칭 챔버 내 부분들 사이의 개선된 열 인터페이스 및 전기 인터페이스
CN120221370A (zh) * 2023-12-27 2025-06-27 中微半导体设备(上海)股份有限公司 等离子体处理设备、上电极组件及其装配方法

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CN101715605A (zh) 2010-05-26
KR20100048991A (ko) 2010-05-11
JP2010529303A (ja) 2010-08-26
WO2008156958A2 (en) 2008-12-24
US20080308229A1 (en) 2008-12-18
TWI453817B (zh) 2014-09-21
TW200917359A (en) 2009-04-16
JP5341073B2 (ja) 2013-11-13
WO2008156958A3 (en) 2009-02-19
US8216418B2 (en) 2012-07-10

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