KR101537151B1 - Cu-Zn-Sn-Ca ALLOY FOR ELECTRICAL AND ELECTRONIC DEVICE - Google Patents

Abstract

A Cu-Zn-Sn-Ca alloy improved in press punching workability is provided as a material for electric and electronic devices.
A copper alloy for electrical and electronic equipment having a composition containing 2 to 15 mass% of Zn, 0.1 to 0.6 mass% of Sn, and 0.005 to 0.1 mass% of Ca and the balance of Cu and inevitable impurities, The average particle diameter of the compound particles observed on the surface parallel to the rolled surface is 0.3 to 0.8 占 퐉, and the frequency of the compound particles having a diameter larger than 5 占 퐉 is 10 / mm2 or less.

Description

Cu-Zn-Sn-Ca alloy for electric and electronic devices {Cu-Zn-Sn-Ca ALLOY FOR ELECTRICAL AND ELECTRONIC DEVICE}

The present invention relates to a Cu-Zn-Sn-Ca alloy suitable for use as a material for electronic parts such as terminals, connectors, relays or switches used in electrical and electronic equipment. Among them, excellent strength, conductivity, bending workability, Cu-Zn-Sn-Ca alloy suitable for applications requiring workability.

Inexpensive brass is used for various terminals, connectors, relays, switches, and the like of electric and electronic devices in applications where production cost is emphasized. Phosphor bronze is used in applications where the spring property is important, and nickel white is used in applications where the spring property and corrosion resistance are important. These copper alloys are solid solution strengthening type copper alloys, and the strength and the spring property are improved due to the action of the alloying elements, but the conductivity and the thermal conductivity are lowered.

Recently, the amount of precipitation hardening type copper alloy is increasing in place of the solid solution strengthening type copper alloy. The precipitation hardening type copper alloy is characterized in that an alloy element is precipitated as fine compound particles in a Cu core. When the alloy element is precipitated, the strength is increased and the conductivity is also increased. Therefore, in the precipitation hardening alloy, a higher electric conductivity can be obtained with the same strength for the solid solution strengthening type copper alloy. Examples of the precipitation hardening type copper alloy include Cu-Ni-Si alloys, Cu-Be alloys, Cu-Ti alloys, Cu-Zr alloys and the like.

However, in the precipitation hardening type copper alloy, there is a need for a high-temperature and short-time heat treatment (solution treatment) for temporarily solidifying an alloy element in Cu and a low temperature and long heat treatment (aging treatment) for depositing an alloy element. The process is complex. In addition, since the alloy contains active elements such as Si, Ti, Zr, and Be, ingot quality is difficult to produce. Therefore, the production cost of the precipitation hardening type copper alloy is very high as compared with the production cost of the solid solution strengthening type copper alloy.

On the other hand, development of an inexpensive copper alloy having necessary and sufficient conductivity and strength has been progressed by improving the solid solution strengthening type copper alloy. Cu-Zn based alloys typified by brass are alloys which can be easily produced, are low in Zn, and can be manufactured at low cost. The inventors of the present invention have found that by adjusting the amount of Zn in a previous Cu-Zn alloy, adding a small amount of Sn, and further adjusting the metal structure, an alloy having necessary conductivity, strength and bending workability (Patent Document 1).

In general, necessary and sufficient conductivity, strength and bending workability are described below.

(A) Conductivity: 28% IACS or higher. The conductivity of brass (C2600) is 28% IACS, and the conductivity of phosphor bronze (C5210) is 13% IACS.

(B) Tensile strength: 550 MPa or more. This tensile strength exceeds the tensile strength 410 MPa of the quality (by quality) H of brass (C2600) specified by JIS standard (JIS H 3100).

(C) Bendability: Under the conditions of the bending radius R / plate thickness t = 0.1, W bending both in the Good Way (direction in which the bending axis is perpendicular to the rolling direction) and Bad Way (in the direction in which the bending axis is parallel to the rolling direction) Possible. If cracks do not occur in this bending test, bending of the most severe level applied to the connector becomes possible.

With the recent miniaturization of electronic parts, terminals, connectors, switches, relays, and the like are becoming smaller. Corresponding to this tendency, there is a demand for a copper alloy material having a balance of conductivity, strength and bending workability at a higher level. The Cu-Zn-Sn based alloy described in Patent Document 1 has a bending workability equal to or higher than that of brass, the conductivity of the Colson alloy, and brass or Colson alloy, and the balance of the characteristics is obtained by using a conventional Cu-Zn- (Patent Documents 2 to 4). This alloy can be said to be a preferable copper alloy as a material of an electronic device part where miniaturization is progressing.

On the other hand, when the copper alloy strip is processed into an electronic component, first, punching is performed by pressing. With the miniaturization of terminals, connectors, switches, relays and the like, the demand for dimensional precision after press-forming has become strict. That is, there is a demand for a copper alloy strip in which burrs and sagging are hardly generated in the press-forming process. In the conventional Cu-Zn-Sn based alloys disclosed in Patent Documents 1 to 4, alloy design considering press strike is not performed, and it has become difficult to cope with press precision required in recent years.

Under such a background, the present applicant has proposed a Cu-Zn-Sn alloy having excellent press peelability in Japanese Patent Application Laid-Open No. 2007-84920 (Patent Document 5). In the copper alloy, the optimum distribution state of the compound particles in the Cu-Zn-Sn alloy is clarified, and specifically, in the cross section parallel to the rolled surface, the diameter of the compound particles having a diameter of from 0.1 to 5 mu m The frequency is set to 500 to 50000 pieces / mm 2, and the frequency of the compound particles having a diameter of more than 5 μm is set to 10 pieces / mm 2 or less.

Japanese Patent Application Laid-Open No. 2007-046159 Japanese Unexamined Patent Publication No. 1-162737 Japanese Patent Application Laid-Open No. 2-170954 Japanese Patent Application Laid-Open No. 7-258777 Japanese Patent Application Laid-Open No. 2007-84920

However, there is still room for improvement in the processability of press-punching, and it is necessary to meet the demand characteristics that become strict every year. It is therefore an object of the present invention to provide a copper alloy having improved press punching processability.

The present inventors have intensively studied in order to solve the above problems and found that a small amount of Ca is added to a Cu-Zn-Sn-based alloy and then compound particles such as precipitates and nonmetallic inclusions are added to the alloy It was found that the press punching workability was significantly improved.

The present invention has been made on the basis of this finding, and it is an object of the present invention to provide an alloy containing 2 to 15 mass% of Zn, 0.1 to 0.6 mass% of Sn, and 0.005 to 0.1 mass% of Ca, 1. A copper alloy for electrical and electronic equipment having a composition consisting of impurities, wherein the average particle diameter of the compound particles having a diameter of not less than 0.1 탆 and not more than 5 탆 observed on a plane parallel to the rolled surface is 0.3 to 0.8 탆, Is 10 / mm < 2 > or less.

In one embodiment of the copper alloy according to the present invention, a maximum of 0.6 mass% of Mg is contained.

In another embodiment of the copper alloy according to the present invention, at least one selected from the group consisting of Ni, Fe, Mn, Co, Ti, Cr, Zr, Al, P, %.

In another embodiment of the copper alloy according to the present invention, a total of 10 to 80 mass ppm of S and O is contained.

According to another aspect of the present invention, there is provided an electronic component comprising a copper alloy according to the present invention.

According to another aspect of the present invention, there is provided an electric / electronic device having an electronic component according to the present invention.

According to the present invention, there is provided a copper alloy having improved press punching processability, and preferably a copper alloy having excellent strength, conductivity, bending workability and press punching workability. The copper alloy according to the present invention is preferable as a material for electronic parts such as terminals, connectors, relays or switches used in electric and electronic devices.

Fig. 1 is a schematic diagram showing minor axis (L1) and major axis (L2) when the shape of the compound particles is an oval, a bar, a line, and the like.
Fig. 2 is a schematic view showing the height of the inversors of the test pieces (the rolling direction is perpendicular to the drawing) after the press-punching process.
3 is a schematic view showing a state of a press-punch test in the present invention as compared with Patent Document 5. Fig.

(A) Zn, Sn, and Ca concentrations

The copper alloy of the present invention contains Zn, Sn and Ca as basic components, and produces mechanical properties and electrical conductivity by the action of each element. The concentration of Zn is in the range of 2 to 15 mass%, preferably 3 to 12 mass%, the range of the Sn concentration is 0.1 to 0.6 mass%, preferably 0.1 to 0.5 mass%, the concentration range of Ca is 0.005 to 0.1 mass% , Preferably 0.007 to 0.07 mass%, and more preferably 0.01 to 0.05 mass%. If the content of Zn is less than 2% by mass, the strength is insufficient and the good fabrication characteristic of the Cu-Zn alloy is lost. If the content of Zn exceeds 15 mass%, it is impossible to obtain a conductivity of 28% IACS or more even if the Sn concentration is adjusted. Sn has a function of promoting work hardening at the time of rolling, and when Sn is less than 0.1% by mass, strength is insufficient. On the other hand, when Sn exceeds 0.6% by mass, the composition of the alloy deteriorates. If the content of Ca is less than 0.005 mass%, the effect of decreasing the average particle diameter of the compound particles to be described later can not be obtained, and compound particles such as CaO and CaS are not produced. If it exceeds the mass%, coarse compound particles are produced and the bending workability is deteriorated.

(B) Mg concentration

Mg has an effect of improving the strength mainly by solid solution strengthening without significantly lowering the conductivity of the alloy. In addition, MgO or MgS compound particles are generated to reduce burrs after press stamping. When the content is less than 0.01%, the effect of strength enhancement by solid solution strengthening can not be sufficiently obtained. On the other hand, when the content is more than 0.6%, the conductivity and the bending workability of the alloy deteriorate remarkably. Therefore, the Mg concentration ranges from 0 to 0.6 mass%, preferably from 0.01 to 0.6 mass%, and more preferably from 0.1 to 0.5 mass%.

(C) Ni, Fe, Mn, Co, Ti, Cr, Zr, Al, P, Si and Ag

The alloy of the present invention may contain at least one selected from the group of Ni, Fe, Mn, Co, Ti, Cr, Zr, Al, P, Si and Ag for the purpose of improving the strength, heat resistance, Species can be added. However, addition of the alloying element may cause lowering of electric conductivity, lowering of manufacturability, increase of raw material cost, etc. Therefore, consideration of this point is necessary.

If the total amount of the above elements is less than 0.005 mass%, the effect of improving the characteristics is not exhibited. On the other hand, when the total amount of the elements exceeds 0.5% by mass, the conductivity deteriorates remarkably. Therefore, the total amount of the above elements is defined as 0 to 0.5 mass%, preferably 0.005 to 0.5 mass%.

(D) Compound particles

By controlling the average particle diameter to 0.3 to 0.8 mu m for the compound particles having a diameter of 0.1 mu m or more and 5 mu m or less (hereinafter referred to as fine particles) on the surface parallel to the rolled surface, burrs after press stamping are reduced. More preferable average particle diameter is 0.3 to 0.6 占 퐉, and good punching workability and bending workability are more stably compatible. The constituent components of the above-mentioned compound particles are described in (e) below.

Among the fine particles, the compound particles having diameters of not less than 0.1 탆 and not more than 1.5 탆 are preferably present at a frequency of 300 × 10 ³ / mm 2 to 8000 × 10 ³ / mm ^{2 in} order to increase the frequency of presence and improve the press- More preferably from 400 x 10 ³ / mm 2 to 6000 x 10 ³ / mm 2, even more preferably from 700 x 10 ³ / mm 2 to 5000 x 10 ³ / mm 2, even more preferably from 1000 x 10 ³ / Most preferably 4000 x 10 ³ / mm 2.

Among the fine particles, the compound particles having diameters of not less than 1.5 탆 and not more than 5 탆 decrease the number of the compound particles having diameters of not less than 0.1 탆 and not more than 1.5 탆 as the existence frequency of the compound particles is in the range of 0 × 10 ³ / 10 ³ / mm 2, more preferably 0 × 10 ³ / mm 2 to 0.05 × 10 ³ / mm 2, and still more preferably 0 × 10 ³ / mm 2.

Compound particles having a diameter of more than 5 占 퐉 (hereinafter referred to as coarse particles) significantly deteriorate the bending workability. Therefore, the frequency of the coarse particles is defined as 10 pieces / mm 2 or less on the surface parallel to the rolled surface. When the number is 10 / mm2 or less, the influence on the bending workability is almost negligible, but is preferably 7 / mm2 or less, more preferably 5 / mm2 or less, and still more preferably 0 / mm2.

Further, the compound particles having a diameter of less than 0.1 占 퐉 do not affect punching workability and bending workability. Therefore, the frequency of the compound particles having a diameter of less than 0.1 mu m is not specifically defined.

(E) S concentration, O concentration

Examples of the compound particles in the Cu-Zn-Sn-Ca alloy include ZnO, ZnS, Cu ₂ S, CaO, CaS, MgS, MgO, SiO ₂ and the like. The compounds of Zn, Mg, Ca and Cu are derived from an alloy component. In addition, although the compounds of Ca, Mg and Si are derived from the raw material component of the melting furnace or the like, the effect of these compounds is limited.

Since the components of the compound particles are rich in oxides and sulfides, the frequency of the compound particles can be adjusted by adjusting the S concentration and the O concentration.

S and O are preferably adjusted to 10 to 80 mass ppm in total. When the total of S and O is less than 10 mass ppm, the frequency of the fine particles decreases, and burrs after press stamping process tend to be large. On the other hand, when the total of S and O exceeds 80 mass ppm, the frequency of coarse particles may exceed 10 particles / mm 2.

(F) Manufacturing method

In the production of the Cu-Zn-Sn-Ca based alloy of the present invention, an ingot is firstly produced by melt casting, the ingot is hot-rolled, then cold rolling and recrystallization annealing are repeated and finally cold rolling Finish with a predetermined product thickness. For the purpose of improving the spring limit value, stress corrosion cracking susceptibility, stress relaxation resistance, and the like, deformation removal annealing may be performed after finishing cold rolling. The surface of the product may be plated with reflow tin plating or the like. In these series of processes, the important processes for compound particle adjustment are melt casting and hot rolling.

Fe, Mn, Co, Ti, Cr, Zr, and Cr are obtained by adding Zn and Sn, adding Ca, reducing the amount of oxygen in the molten copper by deoxidation of Ca, (ZnO, ZnS, CaO, CaS, MgO, MgS, and the like) in the molten metal by adding Al, P, Si, Ag or the like and casting the compound particles within 30 minutes, preferably within 10 minutes, ), The concentration of Ca, the concentration of S and the concentration of O are adjusted to produce fine compound particles. On the other hand, the metal structure of the ingot is composed of dendritic crystals, and sulfides and compounds such as Cu-Sn are distributed in the gaps between the dendrites. The Cu-Sn-based compound in the ingot is coarsened, and in this form, the effect on improving the punching workability is small. Therefore, it is necessary to dissolve the coarse compound in hot rolling at once in the hot rolling, and crush the coarse compound during hot rolling to make it finer.

In order to dissolve the compound in the matrix, the ingot is heated at a temperature of 800 to 900 DEG C for 1 to 5 hours. If the temperature is lower than 800 占 폚, the dissolution of the compound becomes insufficient. On the other hand, if the temperature exceeds 900 ° C, cracks are generated by hot rolling. When the heating time of the ingot is less than 1 hour, the dissolution of the compound becomes insufficient. On the other hand, even if the heating is performed for more than 5 hours, the compound is not dissolved further, and the cost is increased, which is not economical.

The material temperature at the end of the hot rolling is 600 to 700 캜. If the material temperature at the end of the hot rolling exceeds 700 캜, the recrystallized grain size becomes excessively large, the oxidation of the material becomes remarkable, and cracks occur in the subsequent step or the yield decreases. If the material temperature at the end of hot rolling is less than 600 캜, the workability is lowered and hot rolling cracks are generated.

In the rolling process of the hot rolling, the material is passed through the rolling mill a plurality of times and finished to a predetermined thickness. In order to effectively break off the coarse compound, it is necessary to conduct the pass plate having the degree of processing adjusted to 30% or more, in total, two or more times during the hot rolling. Here, the processing degree R is defined by the following equation.

R = (t0-t) / t0 (t0: thickness before rolling, t: thickness after rolling)

The copper alloy according to the present invention is useful as a terminal for use in electrical and electronic devices such as large and small household electric appliances, IT and communication appliances, lighting appliances, consumer appliances (radio, television, video camera, It is preferable as a material for an electronic part such as a relay or a switch.

Example

Hereinafter, embodiments of the present invention will be described, which are provided for better understanding of the present invention, and are not intended to limit the present invention.

Using a high frequency induction furnace, 2 kg of electric copper was dissolved in a graphite crucible having an inner diameter of 60 mm and a depth of 200 mm. The surface of the molten copper was covered with charcoal, and then Zn and Sn were added and a 5% Ca-Cu parent alloy was added thereto. Then, 50% Mg-Cu parent alloy, Ni, Fe, Mn, Co, Ti, Cr, Zr, Al, P, Si and the like were added. CuS was added as needed for the adjustment of the S concentration, and CuO was added as needed in order to adjust the O concentration. An ingot having a width of 60 mm and a thickness of 30 mm was prepared by pouring molten metal into the mold after 10 minutes from the addition of various elements by adjusting the working temperature to 1250 占 폚. Respectively.

(Step 1) The ingot is heated at 850 占 폚 for 4 hours, and then the thickness is made 6 mm by hot rolling. At this time, the degree of processing for each plate was set to 30 to 35%, and the temperature of the material at the end of hot rolling was set to 630 to 650 ° C.

(Process 2) Grind the oxide scale on the surface of the hot-rolled plate with a grinder.

(Step 3) Cold rolling (rolling) to a plate thickness of 1.5 mm.

(Step 4) As the recrystallization annealing (intermediate annealing), the crystal grain size is adjusted to about 3 탆 by heating at 400 캜 for 30 minutes in the atmosphere.

(Step 5) Pickling with 10 mass% sulfuric acid-1 mass% aqueous hydrogen peroxide solution and mechanical polishing with # 1200 emery are sequentially performed to remove the surface oxide film generated by annealing.

(Step 6) The steel sheet is rolled to a thickness of 0.86 mm by cold rolling (intermediate rolling).

(Step 7) As the recrystallization annealing (final annealing), the crystal grain size is adjusted to about 3 탆 by heating at 400 캜 for 30 minutes in the atmosphere.

(Step 8) Pickling with 10 mass% sulfuric acid-1 mass% aqueous hydrogen peroxide solution and mechanical polishing with # 1200 emery are sequentially performed to remove the surface oxide film generated by annealing.

(Step 9) The steel is rolled to 0.6 mm by cold rolling (finish rolling).

The obtained samples were subjected to the following evaluations.

Measurement of compound particles:

The rolled surface was mirror finished by mechanical polishing and electrolytic polishing. In electrolytic polishing, a solution obtained by mixing 125 ml of phosphoric acid, 250 ml of distilled water, 125 ml of ethanol, 25 ml of propanol and 2.5 g of uric acid was used as an electrolytic solution and the sample was used as an anode to conduct electricity.

The surface after electrolytic polishing was observed using FE-SEM (field emission scanning electron microscope), and the number of compound particles was measured. An area of 0.01 mm 2 was observed at a magnification of 10,000 times for compound particles having a diameter of 0.1 탆 or more and 5 탆 or less and an area of 1 mm 2 was observed at a magnification of 1000 times for compound particles having a diameter of more than 5 탆, And the presence frequency was measured.

When the shape of the compound particles is an oval shape, a bar shape, a line shape, or the like, the average value of the minor axis (L1) and the major axis (L2) is a diameter as shown in Fig. In addition, for a group of particles composed of particles arranged in the rolling direction (for example, a B-system inclusion in JIS G 0555), the diameter and the number of the particle groups are not measured, Were measured.

The compound particles having diameters of not less than 0.1 mu m and less than 1.5 mu m as the frequency of fine particles X (1,000 pieces / mm < 2 >) and diameters of not less than 1.5 mu m and not more than 5 mu m as the frequency of fine particles Y The compound particles were evaluated as the frequency (number / mm 2) of coarse particles.

Press punch processability:

A round hole was formed in the sample by press stamping. The punch had a cylindrical shape with a diameter of 9.92 mm and a hole diameter on the die side of 10.00 mm (clearance 0.04 mm). The punching speed was set at 10 mm / min, and the material was not pressed.

The height of the burr shown in Fig. 2 is calculated by the thickness of the circumference-material of the hole (thickness of the material + burr) and the thickness of the material measured with a digital micrometer (minimum display amount 1 mu m, spindle diameter 6.35 mm) do. The measurement position was carried out eight times with respect to the circumference of one hole, and the maximum value was recorded. The case where the burr height was 10 m or less was evaluated as good.

Here, the press-punch test is a press condition that is liable to be higher than that of Patent Document 5. As shown in Fig. 3, in the condition of Patent Document 5, the gap (clearance) between the punch and the die is 0.02 mm with respect to the sample plate thickness of 0.3 mm. On the other hand, in the present invention, the gap (clearance) between the punch and the die is 0.04 mm with respect to the sample plate thickness of 0.6 mm.

Bending workability:

A W bending test prescribed by JIS H 3110 was performed using a 10 ㎜ short sample. The bending directions were set as Good Way and Bad Way, and the bending radius was 0.06 mm (bending radius R / plate thickness t = 0.1). B, C, D, and E were evaluated in five stages according to the "Standard Method for Evaluating Bending Workability of Copper and Copper Alloy Thin Strips", a technical standard of the Japan ShinDong Association. A is the best, and B, C, D, and E are defective in that order. A, B, and C are accepted, and D and E are rejected. The bending workability of the specimen after bending was evaluated from the surface and the end face of the bent portion, and the evaluation result was evaluated as being inferior in Good Way and Bad Way.

Conductivity:

It was measured by a four-terminal method in accordance with JIS H 0505.

The tensile strength:

A test piece of JIS 13B was prepared using a press machine so that the tensile direction became parallel to the rolling direction. This test piece was subjected to a tensile test according to JIS-Z 2241 to determine the tensile strength.

(Test result)

The concentrations of Zn, Sn, Mg and Ca, and the effect of the compound particles on the press deburring are shown in Tables 1 and 2.

In Inventive Examples 1 to 32, the Zn, Sn and Ca concentrations were adjusted within the range of the present invention. As a result, the average particle size of the fine particles was 0.3 to 0.8 μm and the coarse particles were 10 particles / mm 2 or less, Lt; / RTI > The frequency of the fine particles X was 400 × 1000 / mm 2 to 6000 × 1,000 / mm 2, and the frequency of the fine particles Y was 0 × 1000 / mm 2 to 0.05 × 1,000 / mm 2. In these examples, the burr height was 10 mu m or less and cracks did not occur due to W bending at R / t = 0.1. Further, since the concentration of the alloy component was adjusted to an appropriate range, a conductivity of 28% IACS or more and a tensile strength of 550 MPa or more were obtained.

In Inventive Example 7, since the Ca concentration is close to the lower limit of the range of the present invention, the average particle diameter of the fine particles is slightly larger and the burr height is slightly higher. In Examples 10, 31 and 32, the total concentration of S and O is slightly low, so the frequency of the fine particles X is slightly lower and the burr height is slightly higher. On the other hand, Examples 13, 27 and 28 in Examples 13, 27 and 28 show a slightly higher burr height of 1 mu m because the total concentration of S and O is close to the upper limit of the range of the present invention, but the frequency of coarse particles is slightly higher and the result of W bending is slightly lower .

In Comparative Examples 33 to 53, since the concentration of the alloy component was inadequate, the average particle diameter of the fine particles and the frequency of the coarse particles were out of the range of the present invention, the desired conductivity or tensile strength could not be obtained, Cracks were generated or the burr height was large and the press punching workability was inferior.

In Comparative Example 33, since the Zn concentration was high, the target conductivity could not be obtained, and cracks were generated by W bending due to the increase of coarse particles. In Comparative Example 34, the target tensile strength was not reached because the Zn concentration was low. In Comparative Example 35, since the Sn concentration was high, the target conductivity could not be obtained. In Comparative Example 36, since the Sn concentration was low, the target tensile strength was not reached. In Comparative Example 37, since the Mg concentration was high, the target conductivity could not be obtained, and cracks were generated by W bending due to the increase of coarse particles. Since the concentration of Zn and Sn in Comparative Example 38 and the concentration of Mg in Comparative Example 39 were high, a desired conductivity could not be obtained, and cracks were generated by W bending due to the increase of coarse particles. In Comparative Example 40, since the Zn, Sn, and Mg concentrations were low, the target tensile strength was not reached. In Comparative Example 41, since the Ca concentration greatly deviated from the range of the present invention, the average particle diameter of the fine particles greatly deviated from the range of the present invention, the frequency of coarse particles was high, cracks were generated by W bending, Respectively. In Comparative Examples 42 to 44, since Ca was not added, the average particle size of the compound particles was large, the frequency of the fine particles X was small, and the frequency of the fine particles Y and coarse particles was large, The workability of the press cut was inferior. In Comparative Example 45, since Mg and Ca were not added, the average grain size of the fine particles was large, the press punch workability was inferior, and the desired tensile strength could not be obtained. In Comparative Examples 46 to 48, since the total concentration of S and O exceeded 80 mass ppm when Ca was not added, the average particle size of the fine particles was large and the frequency of the coarse particles was high, Respectively. In Comparative Example 49, since the total concentration of S and O was less than 10 mass ppm at the same time as Ca was not added, the average particle size of the fine particles was as large as 0.88 占 퐉 and the press punching workability was inferior. Comparative Example 50 corresponds to the invention of Patent Document 5, but since Ca is not added, the average particle diameter of the fine particles is as large as 0.83 mu m, so that the press-punchability as in the present invention can not be obtained. In Comparative Example 51, since the Al and Si concentrations were high, the desired conductivity could not be obtained. In Comparative Example 52, the Ti concentration was high, and in Comparative Example 53, the total of Mn, Si and P exceeded the range of the present invention. Therefore, the average particle size of the fine particles was large, And the frequency of coarse particles was high, so that cracks were generated by W bending.

Comparative Examples 54 and 55 are examples in which the above-described manufacturing conditions for manufacturing Examples 1 to 53 were partially changed. In Comparative Example 54, since the molten metal was poured into the mold after 60 minutes after the addition of various additive elements in the dissolving step, the frequency of the coarse particles was high, the average particle diameter of the fine particles became large, cracks were generated by W bending , And the press saturation was inferior. In Comparative Example 55, since the ingot was heated at 750 占 폚 for 1 hour before hot rolling, the coarse compound of Cu-Sn was left remaining, so that the frequency of coarse particles was as high as 30 / mm & Cracks were generated by W bending, and the tensile strength was low because Sn of the core was small.

[Table 1-1]

[Table 1-2]

[Table 2-1]

[Table 2-2]

Claims (4)

Fe, Mn, Co, Ti, Cr, Zr, Al, P, Si and / or Sn in an amount of from 2 to 15 mass%, Sn of from 0.1 to 0.6 mass%, and Ca of from 0.005 to 0.1 mass% Ag and a balance of Cu and inevitable impurities, wherein the copper alloy has a diameter of not less than 0.1 占 퐉 and not more than 5 占 퐉 observed on a surface parallel to the rolled surface, The average particle diameter of the compound particles having a particle diameter of 탆 or less is 0.3 to 0.8 탆, and the frequency of the compound particles having a diameter of 5 탆 or more is 10 / mm 2 or less. The method according to claim 1,
A copper alloy satisfying at least one of the following composition conditions (A) and (B).
(A) further contains at most 0.6% by mass of Mg.
(B) In addition, S and O are contained in a total amount of 10 to 80 mass ppm. An electronic part comprising the copper alloy according to claim 1 or 2. An electric / electronic apparatus comprising the electronic component according to claim 3.

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