KR101534265B1

KR101534265B1 - Heat grinding apparatus

Info

Publication number: KR101534265B1
Application number: KR1020130120018A
Authority: KR
Inventors: 배순석; 심재홍; 윤창섭; 변현희; 김세연; 유병남
Original assignee: 주식회사 에스에프에이; 코닝정밀소재 주식회사
Priority date: 2013-10-08
Filing date: 2013-10-08
Publication date: 2015-07-07
Also published as: KR20150041709A

Abstract

A thermal processing apparatus is disclosed. A thermal processing apparatus according to an embodiment of the present invention includes a thermal processing heating unit having a heating tip for heating a substrate to thermally process an end of the substrate; And an air blow unit for supplying compressed air toward the substrate on which the thermal processing is completed by the heating tip to double the separation efficiency of chips to be separated from the substrate by thermal processing .

Description

[0001] HEAT GRINDING APPARATUS [0002]

More particularly, the present invention relates to a thermal processing apparatus, and more particularly, to a method and a system for thermal processing a chip that is chamfered from a substrate by thermal processing and can be smoothly separated from the substrate, The present invention relates to a thermal processing apparatus capable of solving the problem of substrate contamination due to particles.

A substrate for a flat display including a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode (OLED), and the like has a glass material.

Among the solar cells that convert light energy into electrical energy using the properties of semiconductors, the substrate for thin-film solar cells also has a glass material.

Since the flat panel display or solar cell substrate is made of glass, it is necessary to perform thermal processing, for example, chamfering, of the edge of the substrate to eliminate the sharpness of the glass itself, thereby facilitating the transfer and manipulation between the processes. It can be prevented in advance. For this chamfering, a so-called chamfering device is used.

Hereinafter, a thermally processed chamfer as a thermally processing apparatus will be described for convenience of explanation.

Referring to FIG. 1, the shape of chamfering of the substrate will be described below.

The chamfering process for forming the chamfering process on the substrate is performed by chamfering the chamfering process in which the end portion (four corners, long side or short side) of the substrate is cut out in the oblique direction of, for example, 45 degrees as shown in FIG. And a rounding process for rounding the end regions of the substrate.

Among the chamfering patterns shown in FIG. 1, it is known that the rounding process as shown in (b) is effective and preferable for preventing the corner cracking on the substrate and improving the strength as compared with the chamfering process as in (a).

However, since the rounding process as shown in FIG. 1 (b) has a larger amount of chamfer than the chamfering process, the time required for the chamfering process is increased and chamfering process may be relatively difficult.

In contrast, when the chamfering process is performed on the end portion of the substrate as shown in FIG. 1 (a), since the surface area can be reduced as compared with the rounding process, the time required for chamfering process can be reduced, There is an advantage.

Therefore, in the case of a flat panel display or a solar cell substrate, only chaffer processing is generally performed as shown in Fig. 1 (a).

On the other hand, conventional chamfering machines have a method of physically rubbing and polishing the end portion of the substrate using a diamond wheel, that is, a grinder.

Therefore, although the rounding process as shown in FIG. 1 (b) is effective and preferable for preventing the corner breakage or the like to the substrate compared to the chamfering process as shown in FIG. 1 (a) and improving the strength, The chaffer machining as shown in Fig. 1 (a) has been carried out in consideration of time and the like.

However, it is possible to obtain a sharp edge of the glass by the thermal expansion and contraction phenomenon of the substrate made of, for example, glass, by using heat, for example, in place of the chamfering method of the conventional chamfering having a polishing method by the physical friction of the grinder, It is expected that the chamfering of the substrate can be carried out in various forms and methods regardless of the face-wipe amount.

If such a thermal processing apparatus can be commercialized, it is possible to improve the strength and the light intensity and the particle generation by remarkably reducing the generation of particles by deviating from the chamfering method of the conventional grinding system, It is possible to achieve cost reduction and further improve the productivity. Therefore, it is necessary to study the heat-processed chamfer.

However, when a chip is separated from the substrate during thermal processing using a thermal processing apparatus, the chip to be separated can not be easily separated from the substrate and is attached to the substrate. Alternatively, the chip can not be separated into a single line, Considering that the latter can add to the problem of contamination of the workplace and the problem of contamination of the substrate due to particles that are scattered, it is necessary to develop the structure considering these matters as a whole .

Korea Patent Office Registration No. 10-0658320

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a chip to be separated from a substrate by heat processing can be smoothly separated from the substrate, And to provide a thermal processing apparatus capable of solving the problem.

According to an aspect of the present invention, there is provided a thermal processing apparatus comprising: a thermal processing heating unit having a heating tip for heating a substrate to thermally process an end of the substrate; And an air blow unit for supplying compressed air toward the substrate having been thermally processed by the heating tip to double the separation efficiency of chips to be separated from the substrate by thermal processing. A thermal processing apparatus according to the present invention can be provided.

The air blowing unit includes an air blowing body supported on one side of the thermal processing heating unit; A compressed air supply unit for supplying the compressed air to the air blow body; And a compressed air injection nozzle having one end connected to the air blow body and the other end disposed near the heating tip to inject the compressed air toward the substrate.

The compressed air injection nozzle may be arranged around the heating tip such that compressed air is injected into the end region of the substrate past the heating tip for thermal processing.

The air blowing unit may further include a heater connected to the air blowing body and heating the compressed air flowing into the air blowing body.

The thermal processing heating unit includes: a unit body; A heating tip clamp for clamping the heating tip to the unit body; And a heating coil disposed outside the heating tip for heating the heating tip.

The thermal processing heating unit includes: a current transformer coupled to one side of the unit body, for supplying a current to the heating coil by a high frequency induction heating method; And a unit body position shifting unit connected to the unit body and configured to position the unit body so that the heating tip is disposed at an end of the substrate.

Wherein the unit body position shifting unit comprises: a Z-axis position shifting unit for shifting the unit body in a vertical Z-axis direction; And an X-axis position shifting unit for shifting the unit body in an X-axis direction that is a direction intersecting the moving direction of the work table.

The heating tip may be provided with a chamfered portion formed by arranging an end portion of the substrate and chamfering with heat. The chamfered portion may be formed in any shape selected from a trapezoidal shape, a triangular shape, and an arc shape As shown in FIG.

The thermal processing heating unit includes: a temperature sensor disposed adjacent to the heating tip for measuring a temperature of the heating tip; And a controller for controlling the heating coil based on the measured value of the temperature sensor.

A work table on which the substrate is loaded and which forms a location where the substrate is thermally processed by interaction with the thermal processing heating unit; A substrate inspection unit provided around the thermal processing heating unit for inspecting a processing state and size of the chamfered substrate; A centering unit for centering the substrate to a loading position on the work table; A loading unit for loading the substrate to be chamfered into the work table; And an unloading unit for unloading the chamfered substrate from the work table.

Wherein the work table includes: a table moving body capable of being moved; A plurality of center tables disposed in an upper central region of the table moving body and supporting the substrate at a lower portion thereof; And a plurality of side cooling tables disposed on the side of the center table for minimizing thermal deformation of the substrate by lowering the temperature of the substrate and doubling thermal expansion and contraction efficiency during thermal processing of the substrate.

The heating tip can be positioned or rotatably disposed.

The heating tips may include a pair of heating unit tips that are accessible or spaced from each other.

The heating tip comprises: a main heating tip forming an exterior and made of a silicon carbide (SiC) material; And an auxiliary heating tip disposed within the main heating tip, the auxiliary heating tip being heated first before the main heating tip is heated.

The heating tip may be arranged vertically or horizontally.

According to the present invention, a chip, which is to be separated from a substrate by thermal processing, can be smoothly separated from the substrate, and the problem of contamination of the substrate due to scattered particles can be solved have.

1 is a view showing various forms of chamfering with respect to a substrate.
2 is a schematic plan structural view of a thermal processing apparatus according to a first embodiment of the present invention.
3 is a side view of the structure along the line AB in Fig.
4 is a side view of the structure taken along the line AA in Fig.
5 is a side view of the structure taken along line BB in Fig.
6 is an enlarged structural view of the area C in Fig.
7 is a side view of the thermal processing heating unit.
8 is a partial enlarged view of Fig.
9 is a view showing a process of separating chips.
Figs. 10 and 11 are structural diagrams showing the state where the heating tips are disposed on the substrate, respectively.
12 is a control block diagram of the heat processing apparatus.
13 is a structural view of a heating tip applied to a thermal processing apparatus according to a second embodiment of the present invention.
14 is a structural view of a heating tip applied to a heat processing apparatus according to a third embodiment of the present invention.
15 is a structural view of a heating tip applied to a thermal processing apparatus according to a fourth embodiment of the present invention.
16 is a structural view of a heating tip applied to a thermal processing apparatus according to a fifth embodiment of the present invention.
17 is a structural view of a heating tip applied to a thermal processing apparatus according to a sixth embodiment of the present invention.
18 is a structural view of a heating tip applied to a heat processing apparatus according to a seventh embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

FIG. 2 is a schematic plan view of the heat processing apparatus according to the first embodiment of the present invention, FIG. 3 is a side view of the structure according to the AB line of FIG. 2, Fig. 5 is a side view of the structure according to the BB line in Fig. 2, Fig. 6 is an enlarged structural view of the area C in Fig. 3, Fig. 7 is a side structural view of the thermal processing heating unit, FIG. 9 is a view showing a process of separating chips, FIGS. 10 and 11 are a structural view in a state where the heating tips are disposed on a substrate, and FIG. 12 is a control block diagram of a heat processing device.

Referring to these drawings, the thermal processing apparatus of the present embodiment is a system in which a chip to be separated from the substrate by thermal processing can be separated smoothly from the substrate, the substrate to be chamfered is loaded, And a heating tip 150 disposed at the chamfering position and heating and heating the end portion of the substrate loaded on the work table 110 to thermally process the chamfered surface, The heating unit 140 and the heating tip 150 supply the compressed air toward the substrate on which the thermal processing operation is completed so that the separation efficiency of a chip (see FIG. 9) to be separated from the substrate by heat processing And an air blow unit 190 for doubling.

Hereinafter, for the sake of convenience of description, the terms of the heat processing apparatus and the thermo-machining apparatus, and the terms of heat processing and chamfering are used in combination. Therefore, the term " thermally processing the end portion of the substrate " can be interpreted to mean chamfering the end portion of the substrate using heat.

As described above, in the present embodiment, since the end portion of the substrate is chamfered using the heat away from the conventional method, it is possible not only to improve the strength and the roughness, but also to remarkably reduce the generation of particles, Cost reductions can be achieved due to reduced facilities.

Referring to FIG. 2, a process of chamfering a substrate will be briefly described. The substrate is loaded on the work table 110 and then moved to position (1), position (2), and position (3), and the sharp portion of the end is chamfered as shown in FIG. Can be processed. 2 (2) is the chamfering position.

At this time, the chamfering of the long side or the short side is proceeded while the substrate is moved to the position (1), the position (2) and the position (3), and then the substrate is moved back to the position (1) The first chamfered machining route in which the chamfering of the short side or the long side proceeds is performed while being moved to the position (1), the position (2), and the position (3).

Of course, unlike this route, after the substrate is moved from the position (1) to the position (2) and the chamfering of the long side or the short side proceeds, the substrate is returned to the position (1) 2) position, a second chamfered machining route may be formed in which chamfering of the short side or the long side proceeds and then unloading through the position (3).

Although the method of the second chamfering route may be preferable on the efficiency of the process, the method of the first chamfering route may be sufficiently applied, so all of these matters should be within the scope of the present invention.

In order to perform such an organic operation, the thermal processing apparatus of the present embodiment may be provided with a loading unit (not shown) and an unloading unit (not shown).

The loading unit serves to load the substrate to be chamfered into the work table 110, and the unloading unit serves to unload the substrate having been chamfered from the work table 110.

When the substrate is loaded onto the work table 110 in the loading unit, the centering unit 120 is equipped so that it can be properly loaded in place.

The centering unit 120 allows the centering of the substrate on the work table 110 to be accurate by pressing the four corner areas of the substrate at a predetermined force and distance, as shown in FIG.

Although not shown, the loading unit and the unloading unit will be briefly described. The loading unit and the unloading unit are substrate transfer structures provided at positions (1) and (3) in FIG. 2, respectively.

Since both the loading unit and the unloading unit serve to transfer the substrate, they can be applied, for example, as a roller type conveyor. That is, both the loading unit and the unloading unit may have a structure in which a plurality of rollers are coupled to the plurality of rotation shafts to rotatably support the substrate.

Of course, the scope of the present invention is not limited thereto, so that the loading unit and the unloading unit may be applied to a belt conveyor type or a stage type.

In the case where the loading unit and the unloading unit are applied as a conveyor type or a stage type, it is advantageous that an air floating module (not shown) is also applied together to raise the substrate.

The work table 110 transfers the substrate from the loading unit to the thermal processing heating unit 140 disposed at the chamfering position and advances the chamfering operation to the substrate while moving the chamfered substrate to the unloading unit As shown in FIG.

As a result, in the case of the present embodiment, the substrate is loaded on the work table 110 and is moved together with the work table 110 in a mounted state, thereby advancing the chamfering operation.

2 to 5, the work table 110 includes a table moving body 111 capable of positional movement, a plurality of table moving bodies 111 arranged in the upper central region of the table moving body 111, And a plurality of side cooling tables 113 disposed on the side of the center table 112. The center table 112 is provided with a center table 112,

The table moving body 111 serves to move the substrate from the position (1) to the position (3) in FIG. 2 or vice versa. Therefore, the table moving body 111 can be applied as a linear motor.

If the chamfering operation for the end portion of the substrate proceeds through the first chamfering route described above, however, if the chamfering operation for the end portion of the substrate proceeds through the second chamfering route, A rotating table, such as a turn table, may be added to the substrate 111 to selectively rotate the substrate.

A plurality of center tables 112 are disposed in the upper central region of the table moving body 111 to support the substrate from below. Considering that the size of the substrate varies, it is preferable that a plurality of center tables 112 are arranged. The center table 112 may be provided with means for sucking the substrate by vacuum pressure.

Unlike the center tables 112 that simply support the substrate, the plurality of side cooling tables 113 support the substrate, but serve to lower the temperature of the substrate.

In other words, the side cooling tables 113 serve to minimize the thermal deformation on the substrate by lowering the temperature of the substrate, and to double the thermal expansion and shrinkage efficiency in the thermal processing of the substrate.

To this end, as shown in FIG. 6, cooling water holes 113a and 113b through which cooling water flows are formed in the side cooling table 113. [

The cooling water is introduced into one of the two cooling water holes 113a and 113b and the cooling water is discharged to the other side. The temperature of the substrate on the side cooling table 113 can be lowered by this action.

On the other hand, the thermal processing heating unit 140 serves to heat and thermally process the end portion of the substrate loaded on the work table 110.

In the case of this embodiment, a chamfering operation is performed on the substrate while the thermal processing heating unit 140 is moved toward the substrate loaded on the work table 110. On the other hand, conversely, it is also possible to take a state in which the thermal processing heating unit 140 is fixed at a predetermined position and move the work table 110 on which the substrate is loaded to the thermal processing heating unit 140, have.

As described above, in the present embodiment, since the chamfering operation of the substrate is carried out by using the heat through the thermal processing heating unit 140, it is possible to improve the strength and the roughness and to remarkably reduce the generation of particles, Cost reduction can be achieved due to the reduction of auxiliary facilities.

The thermal processing heating units 140 are disposed on both sides of the work table 110, respectively, as shown in Fig. At this time, the thermal processing heating unit 140 may be arranged on each side of the work table 110, one by one or a plurality of the processing units.

At a point around the thermal processing heating unit 140, that is, at a point where chamfering of the end of the substrate is completed by the thermal processing heating unit 140, a substrate inspection unit (130).

The substrate inspection unit 130 may also be disposed on both sides of the work table 110 in the same manner as the thermal processing heating units 140 so as to inspect the end of the substrate at the corresponding positions.

The substrate inspection unit 130 includes a substrate inspection head 131 and a head driving unit 132 for moving the substrate inspection head 131 toward or away from the substrate.

The head driving unit 132 may also be applied as a linear motor. The head driving unit 132 moves the substrate inspection head 131 toward the substrate as shown in FIG. 5, You can check the size.

On the other hand, the thermal processing heating unit 140 serves to chamfer the sharp portion of the end portion of the substrate by heat by approaching the substrate and heating the end portion of the substrate.

Unlike the conventional polishing method using physical friction, if a thermal processing method is applied as in the present embodiment, quality improvement, cost reduction, and productivity improvement can be achieved.

7 to 11, a thermal processing heating unit 140 performing such a function is provided with a unit body 170 on which the heating tip 150 is mounted, and a heating unit 150 connected to the unit body 170, And a unit body position shifter 172 for shifting the unit body 170 so that the chamfered portion 151 of the body 150 can be disposed at the end of the substrate.

7, the unit body position shifting unit 172 includes a Z-axis position shifting unit 172a for shifting the unit body 170 in the vertical Z-axis direction, And an X-axis position shifting unit 172b for shifting the unit body 170 in the X-axis direction that is a direction intersecting the moving direction of the unit body 170. [

The Z-axis position shifting portion 172a and the X-axis position shifting portion 172b may also be applied to a linear motor, but may be applied to a ball screw and a motor application structure including a cylinder.

The unit body 170 on which the heating tip 150 is installed is moved to the end of the substrate by the movement of the Z axis position shifter 172a or the X axis position shifter 172b, It is possible to carry out the heat machining chamfering operation for the above.

On the other hand, the structural characteristics of the heating tip 150 will be described in more detail. As described above, the heating tip 150 serves to heat the substrate in contact with or not in contact with the substrate to allow thermal processing, i.e., chamfering, to proceed on the substrate.

Although not necessarily so, the heating tip 150 may be made of silicon carbide (SiC).

Silicon carbide (SiC) is resistant to high temperatures from 1,000 to 2,000 ℃, has a hardness comparable to that of diamond, and is very strong and lightweight. Silicon carbide (SiC) is known to be widely used in nuclear reactors, fuel rods, jet engines, ships, and structural materials.

In the present embodiment, the chamfered portion 151 is formed in the central region of the heating tip 150, in which the end portion of the substrate is disposed and chamfered. The chamfered portion 151 may have a trapezoidal shape when viewed from the side.

In this embodiment, since the chamfered portion 151 has a trapezoidal shape, the end portion of the substrate can be chamfered as shown in Fig. 1 (a). At this time, based on the operation of the Z-axis position shifting portion 172a, The heating tip 150 is operated downward as shown in FIG. 10 to chamfer the upper edge of the end portion of the substrate. Then, the heating tip 150 is lifted up as shown in FIG. 11 to chamfer the lower end edge of the substrate, The machining can be completed. If the size of the chamfered portion 151 is the same as the thickness of the substrate, the chamfered portion 151 may be processed in a single operation as shown in Fig. 1 (a) Will be able to proceed.

A heating tip 150 is mounted to the unit body 170 and a heating tip clamp 174 is provided in the unit body 170 to clamp the heating tip 150 to replace the damaged heating tip 150 from the unit body 170 ).

The heating tip clamp 174 is disposed at the upper and lower ends of the heating tip 150 and clamps the heating tip 150 while being screwed tightly.

The pair of heating tip clamps 174 fix the heating tip 150 in a state of being vertically arranged in the front portion of the unit body 170. [

A heating coil 160 is arranged outside the heating tip 150 in a helical manner to heat the heating tip 150.

As the heating coil 160 is heated from the outside of the heating tip 150, the heating tip 150 can be heated to transfer heat to the substrate, and the substrate can be thermally processed, i.e., chamfered, due to this action.

A current transformer 176 is provided on the unit body 170 to generate heat of the heating coil 160.

The current transformer 176 applies a current to the heating coil 160 by a high frequency induction heating method. As a result, in this embodiment, the heating tip 150 is heated by the high-frequency induction heating method to heat the end portion of the substrate.

On the other hand, a temperature sensor 178 and a controller 180 are provided to control the heating temperature of the heating tip 150.

The temperature sensor 178 measures the temperature of the heating tip 150. In this embodiment, the temperature sensor 178 is provided in the unit body 170 and is applied as an infrared temperature sensor 178 for measuring the temperature of the heating tip 150 by irradiating infrared rays.

The controller 180 controls the amount of current directed to the heating coil 160 based on the measured value of the infrared temperature sensor 178.

The controller 180 performing such a role may include a central processing unit 181 (CPU), a memory 182 (MEMORY), and a support circuit 183 (SUPPORT CIRCUIT) as shown in Fig.

The central processing unit 181 is connected to various computer processors 182 that can be industrially applied to control the amount of current directed to the heating coil 160 based on the measured value of the infrared temperature sensor 178 in the present embodiment. Lt; / RTI >

The memory 182 (MEMORY) is connected to the central processing unit 181. The memory 182 may be a computer readable recording medium and may be located locally or remotely and may be any of various types of storage devices, including, for example, random access memory (RAM), ROM, floppy disk, hard disk, At least one or more memories.

The support circuit 183 (SUPPORT CIRCUIT) is coupled with the central processing unit 181 to support the typical operation of the processor. The support circuit 183 may include a cache, a power supply, a clock circuit, an input / output circuit, a subsystem, and the like.

In this embodiment, the controller 180 controls the amount of current directed to the heating coil 160 based on the measured value of the infrared temperature sensor 178. At this time, a series of processes or the like in which the controller 180 controls the amount of current directed to the heating coil 160 based on the measured value of the infrared temperature sensor 178 can be stored in the memory 182. Typically, a software routine may be stored in the memory 182. The software routines may also be stored or executed by other central processing units (not shown).

Although processes according to the present invention are described as being performed by software routines, it is also possible that at least some of the processes of the present invention may be performed by hardware. As such, the processes of the present invention may be implemented in software executed on a computer system, or in hardware such as an integrated circuit, or in combination of software and hardware.

In the case of chamfering the end of the substrate by thermal processing as described above, a chip is separated from the end of the substrate, as shown in FIG. 9. At this time, the chip separated from the substrate is not broken It is good to pick them up in one line, and it can solve the problem of contamination of the substrate with contamination of the workplace due to chips of chips that are broken. To this end, the thermal processing apparatus of the present embodiment is equipped with an air blow unit (190).

The air blow unit 190, as shown mainly in FIGS. 7 to 9, must be chamfered from the substrate by heat processing by supplying compressed air toward the substrate on which the thermal processing operation has been completed by the heating tip 150 Thereby doubling the chip separation efficiency.

The air blow unit 190 may include an air blow body 191, a compressed air supply unit 192, a compressed air injection nozzle 193, and a heater 194.

The air blow body 191 can be supported by the unit body 170 of the thermal processing heating unit 140. To this end, the unit body 170 is provided with a supporter 175, and the airblow body 191 can be fixed to the supporter 175 while being supported.

The compressed air supply unit 192 supplies compressed air to the air blow main body 191. Accordingly, the compressed air supply unit 192 can be connected to a compressor (not shown).

One end of the compressed air injection nozzle 193 is connected to the air blow main body 191 and the other end is disposed near the heating tip 150 to spray the compressed air toward the substrate. At this time, the amount of compressed air can be about 70 liters per minute. Of course, the scope of the present invention is not limited to these numerical values.

9, the compressed air injection nozzle 193 is arranged so that the nozzle end 193a of the compressed air injection nozzle 193 is pressed against the end portion of the substrate past the heating tip 150 for thermal processing, (150). &Lt; / RTI >

The heater 194 is connected to the air blow main body 191 and serves to heat the compressed air flowing into the air blow main body 191.

The compressed air can be jetted without activating the heater 194 if necessary. In this case, compressed air is air having an ambient temperature.

However, when the heater 194 is operated, the compressed air can be injected after being heated to about 300 ° C or so, so that when the heating compressed air is injected, the efficiency of chip separation from the substrate can be further improved It has been confirmed. The temperature of the heating tip 150 is about 1500 ° C.

Hereinafter, the operation of the thermal processing apparatus will be described.

First, a loading unit (not shown) loads the substrate to be chamfered onto the work table 110.

The substrate loaded onto the work table 110 is centered in position by the centering unit 120 and then adsorbed and fixed in vacuum on the work table 110.

The prepared substrate is moved to the chamfering position along the work table 110, and the end is chamfered as shown in FIG. 1 (a) by the action of the thermal processing heating unit 140. That is, the work table 110 on which the substrate is mounted is moved with respect to the thermal processing heating unit 140, and the chamfering process proceeds.

In this case, the heating tip 150 is operated downward on the basis of the operation of the Z-axis position shifter 172a to chamfer the upper edge of the substrate, as shown in FIG. 10, The lower end edge of the substrate can be chamfered, and when the chamfering process is completed, the positionally moved thermomechanical heating unit 140 returns to its original position.

On the other hand, when the substrate is chamfered by the heating tip 150, that is, when the chip is chamfered from the substrate as shown in Fig. 9, the air blow unit 190 is operated. The air blow unit 190 may supply compressed air toward the substrate that has been thermally processed by the heating tip 150 to be chamfered from the substrate by thermal processing to double the separation efficiency of chips to be separated . As described above, the compressed air may be at ambient temperature or at a high temperature that has been heated.

When the chamfering process is completed, the wafer is passed through the substrate inspection unit 130 by the movement of the succeeding work table 110, and the processed state and size of the substrate that has been chamfered by the substrate inspection unit 130 are inspected.

Then, the substrate on the work table 110 is unloaded to an unloading unit (not shown), and the chamfering operation for the new substrate proceeds again.

The substrate loaded on the work table 110 from the loading unit is moved to the position (1), the position (2), and the position (3) 1 (a).

According to this embodiment having such a structure and action, a chip to be separated from the substrate by the thermal processing can be smoothly separated from the substrate, so that the problem of contamination of the work site and the scattered particles It is possible to solve the substrate contamination problem caused by the substrate.

13 is a structural view of a heating tip applied to a thermal processing apparatus according to a second embodiment of the present invention.

Referring to this figure, in this embodiment, the chamfered portion 251, which is formed in the central region of the heating tip 250 and chamfered while positioning the end portion of the substrate, has a triangular shape when viewed from the side.

When the chamfered portion 251 has a triangular shape, the end portion of the substrate can be chamfered in a triangular shape corresponding to the chamfered portion 251 of the triangular shape. Even if chamfered in this form, none.

13 is applied to the heat processing apparatus to which the heating tip 250 having the structure as shown in FIG. 13 is applied, the above-described air blow unit 190 is applied, so that a chip, which is to be separated from the substrate by heat processing, So that it can be separated smoothly.

14 is a structural view of a heating tip applied to a heat processing apparatus according to a third embodiment of the present invention.

Referring to this figure, in the present embodiment, the chamfered portion 351, which is formed in the central region of the heating tip 350 and chamfered while positioning the end portion of the substrate, forms an arc shape .

If the chamfered portion 351 has an arc shape, the end portion of the substrate may be chamfered as shown in FIG. 1 (b) to correspond to the arc-shaped chamfered portion 351. Even if chamfered in this form, There is no problem at all.

In the case of the thermal processing apparatus to which the heating tip 350 having the structure as shown in FIG. 14 is applied, the above-described air blow unit 190 is applied so that a chip to be separated from the substrate by heat processing, So that it can be separated smoothly.

15 is a structural view of a heating tip applied to a thermal processing apparatus according to a fourth embodiment of the present invention.

In the above-described embodiments, the heating tips 150 to 350 are all fixed in position.

However, in the case of this embodiment, the heating tip 450 is rotatably disposed. The rotation of the heating tip 450 can be easily implemented to the extent that a rotary motor is applied to the heating tip clamp 174 (see FIG. 7), so that detailed illustration is omitted.

When the chamfering of the end of the substrate is performed while rotating the heating tip 450, the wear of the heating tip 450 can be uniformed to prolong the life of the heating tip 450, There is an advantage that the temperature loss of the heating tip 450 can be minimized.

15, the chamfered portion 451 formed on the heating tip 450 has a triangular shape, which may be sufficiently modified to have a trapezoidal shape or an arc shape, It should belong to the scope of right.

15, the above-described air blowing unit 190 is applied so that a chip to be separated from the substrate by thermal processing is to be separated from the substrate, So that it can be separated smoothly.

16 is a structural view of a heating tip applied to a thermal processing apparatus according to a fifth embodiment of the present invention.

In the case of this embodiment, the heating tip 550 includes a pair of heating unit tips 550a and 550b unlike the embodiments described above, and the pair of heating unit tips 550a and 550b are mutually approaching or spaced apart So that the end portion of the substrate is chamfered.

The structure in which the pair of heating unit tips 550a and 550b are mutually accessed or spaced can be easily implemented to the extent that a cylinder, an actuator, a gear, or the like is applied to the heating tip clamp 174 (see FIG. 7) do.

When the heating tip 550 is made to be a pair of heating unit tips 550a and 550b as in the present embodiment and they are chamfered or machined while being moved toward each other, it is applied to various substrates having different thicknesses There will be an advantage to be able to do.

In the case of a thermal processing apparatus using the heating tip 550 having the structure as shown in FIG. 16, the air blowing unit 190 described above is applied so that a chip, which is to be separated from the substrate by heat processing, So that it can be separated smoothly.

17 is a structural view of a heating tip applied to a thermal processing apparatus according to a sixth embodiment of the present invention.

In the case of the present embodiment, the heating tip 650 includes a main heating tip 650a that forms the outside, an auxiliary heating element 650a which is disposed inside the main heating tip 650a and which is heated before the main heating tip 650a is heated Tip 650b.

The reason why the auxiliary heating tip 650b is further used in the present embodiment is as follows. The main heating tip 650a may be made of a silicon carbide (SiC) material. Due to the nature of the silicon carbide (SiC) material, the induction heating is good in view of the fact that the high- The auxiliary heating tip 650b is first heated to reduce the resistance value of the silicon carbide (SiC), and then the main heating tip 650a can be used for thermal processing of the substrate by induction heating.

The chamfered portion 651 formed on the heating tip 650 of the present embodiment is formed in a trapezoidal shape when viewed from the side, but it may be changed into a triangular shape or an arc shape.

17 is applied to the heat processing apparatus to which the heating tip 650 having the structure as shown in FIG. 17 is applied, the above-described air blow unit 190 is applied, so that a chip, which is to be separated from the substrate by heat processing, So that it can be separated smoothly.

18 is a structural view of a heating tip applied to a heat processing apparatus according to a seventh embodiment of the present invention.

All of the heating tips 150 to 650 of the above-described embodiments have a vertical arrangement structure in the vertical direction.

However, as shown in FIG. 18, the heating tip 750 may have a horizontal arrangement structure. 18 (a), chamfering the upper edge of the end of the substrate, and then the chamfered portion 751 of the heating tip 750 as shown in FIG. 18 (b) The chamfered portion 751 can be chamfered at the lower edge of the substrate, and chamfering of the edge of the substrate can be performed by this operation.

Even if the heating tip 750 has a horizontal arrangement structure as shown in FIG. 18, it is possible to chamfer the end of the substrate made of glass by heat, thereby improving the quality, cost, and productivity. Can be provided.

18, the air blow unit 190 described above is applied so that a chip to be separated from the substrate by thermal processing is separated from the substrate So that it can be separated smoothly.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: work table 111: table moving body
112: center table 113: side cooling table
113a, 113b: cooling water hole 120: centering unit
130: substrate inspection unit 131: substrate inspection head
132: head driving unit 140: thermal processing heating unit
150: heating tip 151: chamfered part
160: heating coil 170: unit body
172: unit body position shifting section 172a: Z-axis position shifting section
172b: X-axis position shifting unit 174: heating tip clamp
176: Current transformer 178: Temperature sensor
180: controller 190: air blowing unit
191: Air blow body 192: Compressed air supply part
193: Compressed air jet nozzle 194: Heater

Claims

A thermal processing heating unit having a heating tip for heating a substrate to thermally process an end of the substrate; And
And an air blow unit for supplying compressed air toward the substrate having been thermally processed by the heating tip to double the separation efficiency of chips to be separated from the substrate by thermal processing And the heat processing apparatus.

The method according to claim 1,
The air blow unit includes:
An air blow body supported on one side of the thermal processing heating unit;
A compressed air supply unit for supplying the compressed air to the air blow body; And
Wherein the one end portion is connected to the air blow main body and the other end portion is disposed near the heating tip to eject the compressed air toward the substrate.

3. The method of claim 2,
Wherein the compressed air injection nozzle is disposed around the heating tip such that compressed air is injected into the end region of the substrate past the heating tip for thermal processing.

3. The method of claim 2,
The air blow unit includes:
Further comprising a heater connected to the air blow main body for heating the compressed air flowing into the air blow main body.

The method according to claim 1,
The thermal processing heating unit includes:
Unit body;
A heating tip clamp for clamping the heating tip to the unit body; And
Further comprising a heating coil disposed outside the heating tip for heating the heating tip.

6. The method of claim 5,
The thermal processing heating unit includes:
A current transformer coupled to one side of the unit body for supplying a current to the heating coil by a high frequency induction heating method; And
And a unit body position shifting unit connected to the unit body and configured to position the unit body so that the heating tip can be disposed at an end of the substrate.

The method according to claim 6,
Wherein the unit body position shifting unit comprises:
A Z-axis position shifting unit for shifting the unit body in a vertical Z-axis direction; And
And an X-axis position shifting unit for shifting the unit body in the X-axis direction that is a direction intersecting the moving direction of the work table forming a place where the substrate is thermally processed by interaction with the thermal processing heating unit Characterized by a thermal processing device.

The method according to claim 1,
Wherein the heating tip has a chamfered portion formed by locating the end portion of the substrate and chamfered by heat,
Wherein the chamfered portion has a shape selected from a trapezoidal shape, a triangular shape, and an arc shape when viewed from the side.

The method according to claim 1,
The thermal processing heating unit includes:
A temperature sensor disposed adjacent to the heating tip for measuring a temperature of the heating tip; And
And a controller for controlling the heating coil based on the measured value of the temperature sensor.

The method according to claim 1,
A work table on which the substrate is loaded and which forms a location where the substrate is thermally processed by interaction with the thermal processing heating unit;
A substrate inspection unit provided around the thermal processing heating unit for inspecting a processing state and size of the chamfered substrate;
A centering unit for centering the substrate to a loading position on the work table;
A loading unit for loading the substrate to be chamfered into the work table; And
Further comprising an unloading unit for unloading the chamfered substrate from the work table.

11. The method of claim 10,
The work table includes:
A table moving body capable of being moved;
A plurality of center tables disposed in an upper central region of the table moving body and supporting the substrate at a lower portion thereof; And
And a plurality of side cooling tables disposed on the side of the center table for minimizing thermal deformation on the substrate by lowering the temperature of the substrate and doubling thermal expansion and contraction efficiency during thermal processing of the substrate. Processing equipment.

The method according to claim 1,
Wherein the heating tip is position-locked or rotatably disposed.

The method according to claim 1,
Wherein the heating tips comprise a pair of heating unit tips that are accessible or spaced from each other.

The method according to claim 1,
The heating tip,
A main heating tip forming an exterior and made of silicon carbide (SiC); And
And an auxiliary heating tip disposed inside the main heating tip and being heated first before the main heating tip is heated.

The method according to claim 1,
Wherein the heating tip is vertically or horizontally disposed.