KR101525736B1 - Multilayered electronic component and manufacturing method thereof - Google Patents
Multilayered electronic component and manufacturing method thereof Download PDFInfo
- Publication number
- KR101525736B1 KR101525736B1 KR1020140054422A KR20140054422A KR101525736B1 KR 101525736 B1 KR101525736 B1 KR 101525736B1 KR 1020140054422 A KR1020140054422 A KR 1020140054422A KR 20140054422 A KR20140054422 A KR 20140054422A KR 101525736 B1 KR101525736 B1 KR 101525736B1
- Authority
- KR
- South Korea
- Prior art keywords
- inner coil
- ferrite
- oxidation preventing
- magnetic
- coil pattern
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000003647 oxidation Effects 0.000 claims abstract description 58
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 58
- 229910000859 α-Fe Inorganic materials 0.000 claims description 42
- 239000010949 copper Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000000696 magnetic material Substances 0.000 claims description 16
- 239000003638 chemical reducing agent Substances 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910018605 Ni—Zn Inorganic materials 0.000 claims description 6
- 229910007565 Zn—Cu Inorganic materials 0.000 claims description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 5
- 230000003078 antioxidant effect Effects 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
Description
The present invention relates to a multilayer electronic component and a manufacturing method thereof.
An inductor, which is one of electronic components, is a typical passive element that removes noise by forming an electronic circuit together with a resistor and a capacitor. The inductor is a passive element that amplifies a signal of a specific frequency band in combination with a capacitor by using electromagnetic characteristics. And is used for a configuration such as a filter circuit.
BACKGROUND ART [0002] In recent years, the demand for miniaturization and high performance of electronic devices has increased, and power consumption has been increasing. As the power consumption increases, a power management integrated circuit (PMIC) or a DC-DC converter (DC-DC converter) used in a power circuit of an electronic device has a high switching frequency and an increased output current And the use of power inductors used for stabilizing the output current of a PMIC or a DC-DC converter is increasing.
As a power inductor used in a DC-DC converter circuit in such a flow, a wire-wound inductor in which a wire is wound around a metal-based magnetic material has been widely used. However, this type of inductor has a fundamental limitation in miniaturization. Therefore, in recent years, the use of a multilayer inductor has been increasing in place of a wound-type inductor.
The multilayer inductor is manufactured by printing an internal conductor on a magnetic material sheet, and through a series of steps such as via hole punching, lamination and firing.
In this case, when the heat treatment and sintering process is performed in a reducing atmosphere such as N 2 and H 2 in order to prevent the oxidation of the internal conductor, there is a problem that the magnetic properties are deteriorated due to the reduction of ferrite as a magnetic material. Therefore, the ferrite laminated inductor should be fired in a weak reducing atmosphere such as Ni / NiO equilibrium oxygen partial pressure.
However, when firing is performed in a weakly reducing atmosphere in order to prevent deterioration of magnetic properties due to reduction of ferrite, there is a problem in that the outgoing portion of the inner coil comes into contact with oxygen to cause oxidation and decrease the electric conductivity.
Particularly, in order to reduce the manufacturing cost, there is a tendency to replace the internal coil with expensive silver (Ag) to less expensive copper (Cu). Since copper is oxidized more easily than silver (Ag) It is necessary to solve the oxidation problem of the inner coil in such a weakly reducing atmosphere.
An embodiment of the present invention relates to a multilayer electronic component and a method of manufacturing the multilayer electronic component that can prevent problems such as reduction of electrical conductivity due to oxidation of an internal coil portion even if firing proceeds in a weakly reducing atmosphere.
According to an aspect of the present invention, there is provided a magnetic head comprising: a magnetic body formed by stacking a plurality of magnetic layers; an inner coil formed inside the magnetic body by electrically connecting a plurality of inner coil patterns formed on the plurality of magnetic layers; And an outer electrode formed on an end surface of the magnetic body body and connected to the inner coil portion, wherein an oxidation preventing portion is formed on the inner coil pattern including the lead portion of the inner coil portion among the plurality of inner coil patterns, And the porosity of the oxidation preventing portion is 3% to 25%.
The oxidation preventing portion may be formed only in a portion of the inner coil pattern including the lead portion of the inner coil portion, including the lead portion of the inner coil portion.
The oxidation preventing portion may be formed on the entire inner coil pattern including the lead portion of the inner coil portion.
The porosity of the oxidation preventing portion may be 3% to 25% larger than the porosity of the inner coil pattern where the oxidation preventing portion is not formed.
The diameter of the air gap of the oxidation preventing portion may be 0.3 탆 to 15 탆.
The inner coil portion may include copper (Cu).
The magnetic body may include at least one selected from the group consisting of Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite and Li ferrite .
According to another aspect of the present invention, there is provided a magnetic recording medium comprising: a plurality of magnetic sheet sheets; Forming an inner coil pattern on the magnetic sheet; Forming a magnetic material body having an inner coil portion by laminating magnetic material sheets on which the inner coil pattern is formed, and sintering the magnetic material body; And forming an outer electrode connected to a lead portion of the inner coil portion on an end face of the sintered magnetic body body, wherein the inner coil pattern includes a lead portion of the inner coil portion, A method of manufacturing a multilayer electronic component which forms a part is provided.
The oxidation preventing portion may be formed only in a portion of the inner coil pattern including the lead portion of the inner coil portion, including the lead portion of the inner coil portion.
The oxidation preventing portion may be formed on the entire inner coil pattern including the lead portion of the inner coil portion.
The inner coil pattern may be formed of a conductive paste containing copper (Cu).
The antioxidant may be formed of a conductive paste containing copper (Cu) and at least one reducing agent selected from the group consisting of carbon, graphene, boron nitride (BN), and sodium hydrogen sulfide have.
The conductive paste forming the antioxidant may contain the reducing agent in an amount of 0.1 wt% to 30 wt%.
The reducing agent may be pyrolyzed through the sintering step to form a gap in the oxidation preventing part.
The porosity of the oxidation preventing portion may be 3% to 25%.
The magnetic body may include at least one selected from the group consisting of Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite and Li ferrite .
The sintering may be performed at 850 ° C to 1100 ° C.
According to one embodiment of the present invention, it is possible to prevent problems such as reduction in electrical conductivity due to oxidation of the inner coil portion even if firing proceeds in a weakly reducing atmosphere.
In addition, since firing proceeds in a weakly reducing atmosphere, it is possible to prevent reduction of magnetic characteristics due to reduction of ferrite and to replace costly copper (Cu) with internal copper, thereby reducing manufacturing cost.
1 is a perspective view of a multilayer electronic component according to an embodiment of the present invention.
2 is a sectional view taken along the line A-A 'in Fig.
3 is an exploded perspective view of a multilayer electronic component according to an embodiment of the present invention shown in Fig.
4 is a cross-sectional view of a multilayer electronic component according to an embodiment of the present invention.
5 is an exploded perspective view of a multilayer electronic component according to an embodiment of the present invention shown in Fig.
6 is a process diagram showing a method of manufacturing a multilayer electronic component according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.
It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols.
Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.
Laminated type
Electronic parts
Hereinafter, a multilayer electronic device according to an embodiment of the present invention will be described, but is not particularly limited to, a stacked inductor.
Fig. 1 is a perspective view of a multilayer electronic component according to an embodiment of the present invention, and Fig. 2 is a sectional view taken along the line A-A 'in Fig.
1 and 2, a multilayer
A plurality of magnetic material layers forming the
In order to clearly explain the embodiment of the present invention, when the direction of the hexahedron is defined, L, W, and T shown in FIG. 1 indicate the longitudinal direction, the width direction, and the thickness direction .
The
The
A via is formed at a predetermined position in each magnetic layer on which the
The conductive metal forming the
The
When the heat treatment firing process is performed in the weakly reducing atmosphere, the
Therefore, according to one embodiment of the present invention, even if firing is performed in a weak reducing atmosphere by forming the
The
The porosity can be measured using a transmission electron microscope (TEM), a scanning electron microscope (SEM), or the like. In the case of measurement with an electron microscope, an electron microscope photograph can be taken and the analysis on the cross section can be used. The porosity in the case where the pore size is smaller than 100 nm can be measured by observing with a transmission electron microscope by thinning the porosity by an ultramicrotome method or an ion milling method.
If the porosity of the
The porosity of the
The gap formed in the
3 is an exploded perspective view of a multilayer electronic component according to an embodiment of the present invention shown in Fig.
Referring to FIG. 3, the
FIG. 4 is an exploded perspective view of a multilayer electronic component according to an embodiment of the present invention, and FIG. 5 is an exploded perspective view of a multilayer electronic component according to an embodiment of the present invention shown in FIG.
4 and 5, the
The
The
The
The
Laminated type
Manufacturing method of electronic parts
6 is a process diagram showing a method of manufacturing a multilayer electronic component according to an embodiment of the present invention.
Referring to FIG. 6, first, a plurality of magnetic sheet 111 'can be provided.
The magnetic material used for producing the magnetic sheet 111 'is not particularly limited and examples thereof include Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, Li ferrite and the like can be used.
A plurality of magnetic material sheets 111 'may be provided by applying and drying a slurry formed by mixing the magnetic material and the organic material onto a carrier film.
Next, the
The
The conductive metal is not particularly limited as long as it is a metal having an excellent electrical conductivity. Examples of the conductive metal include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti) Cu) or platinum (Pt), or the like. Copper (Cu) can be used most preferably when both the improvement of the electrical conductivity and the reduction of the manufacturing cost are taken into consideration.
At this time, the
When the heat treatment firing process is performed in the weakly reducing atmosphere, the
Therefore, according to one embodiment of the present invention, even if firing is performed in a weak reducing atmosphere by forming the
The
The conductive paste forming the
When the reducing agent is contained in an amount of less than 0.1% by weight, the reducing agent for preventing oxidation of the
The
The
The
Next, the
At this time, the
In the sintering process, the reducing agent included in the
Next, an
The
In addition, the same features as those of the above-described multilayer electronic component according to the embodiment of the present invention will be omitted here.
The present invention is not limited to the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.
It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.
100: Multilayer electronic component 121: Inner coil pattern
110: magnetic body main body 123: internal coil part withdrawal part
111 ': magnetic substance sheet 125: antioxidant part
120: internal coil part 130: external electrode
Claims (17)
A plurality of inner coil patterns formed on the plurality of magnetic body layers, the inner coil portions being electrically connected to each other and formed in the magnetic body body;
And an outer electrode formed on an end surface of the magnetic body body and connected to the inner coil portion,
Wherein an oxidation preventing portion is formed in an inner coil pattern including a lead portion of the inner coil portion among the plurality of inner coil patterns, and a porosity of the oxidation preventing portion is 3% to 25%.
Wherein the oxidation preventing portion is formed only in a portion of the inner coil pattern including the lead portion of the inner coil portion including the lead portion of the inner coil portion.
Wherein the oxidation preventing portion is formed on the entire inner coil pattern including the lead portion of the inner coil portion.
Wherein the porosity of the oxidation preventing portion is 3% to 25% larger than the porosity of the internal coil pattern in which the oxidation preventing portion is not formed.
And the diameter of the gap of the oxidation preventing portion is 0.3 mu m to 15 mu m.
And the inner coil portion includes copper (Cu).
Wherein the magnetic body is made of a multilayer electronic device including at least one selected from the group consisting of Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, part.
Forming an inner coil pattern on the magnetic sheet;
Forming a magnetic material body having an inner coil portion by laminating magnetic material sheets on which the inner coil pattern is formed, and sintering the magnetic material body; And
Forming an outer electrode connected to a lead portion of the inner coil portion on an end face of the sintered magnetic body body,
Wherein an oxidation preventing portion is formed on an inner coil pattern including a lead portion of the inner coil portion among the inner coil patterns.
Wherein the oxidation preventing portion is formed only in a portion of the inner coil pattern including the lead portion of the inner coil portion including the lead portion of the inner coil portion.
Wherein the oxidation preventing portion is formed on the entire inner coil pattern including the lead portion of the inner coil portion.
Wherein the inner coil pattern is formed of a conductive paste containing copper (Cu).
Wherein the oxidation preventing portion is formed of a conductive paste containing at least one reducing agent selected from the group consisting of copper (Cu) and carbon, graphene, boron nitride (BN), and sodium hydrogen sulfide A method of manufacturing an electronic component.
Wherein the conductive paste forming the antioxidant portion comprises 0.1 wt% to 30 wt% of the reducing agent.
Wherein the reducing agent is pyrolyzed through a sintering step to form a gap in the oxidation preventing portion.
And the porosity of the oxidation preventing portion is 3% to 25%.
Wherein the magnetic body is made of a multilayer electronic device including at least one selected from the group consisting of Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite and Li ferrite. A method of manufacturing a component.
Wherein the sintering step is performed at 850 캜 to 1100 캜.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140054422A KR101525736B1 (en) | 2014-05-07 | 2014-05-07 | Multilayered electronic component and manufacturing method thereof |
| JP2014150459A JP5932913B2 (en) | 2014-05-07 | 2014-07-24 | Multilayer electronic component and manufacturing method thereof |
| CN201410396519.6A CN105097185A (en) | 2014-05-07 | 2014-08-13 | Multilayered electronic component and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140054422A KR101525736B1 (en) | 2014-05-07 | 2014-05-07 | Multilayered electronic component and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR101525736B1 true KR101525736B1 (en) | 2015-06-03 |
Family
ID=53505319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140054422A KR101525736B1 (en) | 2014-05-07 | 2014-05-07 | Multilayered electronic component and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5932913B2 (en) |
| KR (1) | KR101525736B1 (en) |
| CN (1) | CN105097185A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6863244B2 (en) * | 2017-11-20 | 2021-04-21 | 株式会社村田製作所 | Electronic components and manufacturing methods for electronic components |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247577A (en) * | 2003-02-14 | 2004-09-02 | Tdk Corp | Layered electronic parts and method for manufacturing the same |
| JP2012238842A (en) * | 2011-04-27 | 2012-12-06 | Taiyo Yuden Co Ltd | Magnetic material and coil component |
| JP2013153119A (en) * | 2011-12-28 | 2013-08-08 | Taiyo Yuden Co Ltd | Multilayer inductor |
| JP2013254917A (en) * | 2012-06-08 | 2013-12-19 | Taiyo Yuden Co Ltd | Multilayer inductor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0294618A (en) * | 1988-09-30 | 1990-04-05 | Toshiba Corp | Manufacture of laminated ceramic capacitor |
| JPH0797525B2 (en) * | 1990-06-28 | 1995-10-18 | 株式会社村田製作所 | Copper conductor integrated firing type ferrite element |
| JP3305605B2 (en) * | 1996-12-24 | 2002-07-24 | 京セラ株式会社 | Multilayer ceramic capacitors |
| JP2000232032A (en) * | 1999-02-10 | 2000-08-22 | Tdk Corp | Nickel composite conductor for forming electrode and laminated ceramic capacitor |
| JP4191506B2 (en) * | 2003-02-21 | 2008-12-03 | Ｔｄｋ株式会社 | High density inductor and manufacturing method thereof |
| JP2009267291A (en) * | 2008-04-30 | 2009-11-12 | Panasonic Corp | Coil component and method of manufacturing the same |
| JP6036007B2 (en) * | 2012-08-27 | 2016-11-30 | Tdk株式会社 | Multilayer coil parts |
| KR101396656B1 (en) * | 2012-09-21 | 2014-05-16 | 삼성전기주식회사 | Multilayered power inductor and method for preparing the same |
-
2014
- 2014-05-07 KR KR1020140054422A patent/KR101525736B1/en active IP Right Grant
- 2014-07-24 JP JP2014150459A patent/JP5932913B2/en not_active Expired - Fee Related
- 2014-08-13 CN CN201410396519.6A patent/CN105097185A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247577A (en) * | 2003-02-14 | 2004-09-02 | Tdk Corp | Layered electronic parts and method for manufacturing the same |
| JP2012238842A (en) * | 2011-04-27 | 2012-12-06 | Taiyo Yuden Co Ltd | Magnetic material and coil component |
| JP2013153119A (en) * | 2011-12-28 | 2013-08-08 | Taiyo Yuden Co Ltd | Multilayer inductor |
| JP2013254917A (en) * | 2012-06-08 | 2013-12-19 | Taiyo Yuden Co Ltd | Multilayer inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5932913B2 (en) | 2016-06-08 |
| JP2015216338A (en) | 2015-12-03 |
| CN105097185A (en) | 2015-11-25 |
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