KR101522787B1 - 부품 내장 인쇄회로기판 - Google Patents

부품 내장 인쇄회로기판 Download PDF

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Publication number
KR101522787B1
KR101522787B1 KR1020130142245A KR20130142245A KR101522787B1 KR 101522787 B1 KR101522787 B1 KR 101522787B1 KR 1020130142245 A KR1020130142245 A KR 1020130142245A KR 20130142245 A KR20130142245 A KR 20130142245A KR 101522787 B1 KR101522787 B1 KR 101522787B1
Authority
KR
South Korea
Prior art keywords
electronic component
insulating layer
printed circuit
circuit board
core
Prior art date
Application number
KR1020130142245A
Other languages
English (en)
Korean (ko)
Inventor
유연섭
김문일
김준영
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020130142245A priority Critical patent/KR101522787B1/ko
Priority to US14/092,188 priority patent/US9386701B2/en
Priority to CN201410670966.6A priority patent/CN104661432B/zh
Application granted granted Critical
Publication of KR101522787B1 publication Critical patent/KR101522787B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020130142245A 2012-11-30 2013-11-21 부품 내장 인쇄회로기판 KR101522787B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130142245A KR101522787B1 (ko) 2013-11-21 2013-11-21 부품 내장 인쇄회로기판
US14/092,188 US9386701B2 (en) 2012-11-30 2013-11-27 Electronic component embedded printed circuit board
CN201410670966.6A CN104661432B (zh) 2013-11-21 2014-11-20 电子元件嵌入式印刷电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130142245A KR101522787B1 (ko) 2013-11-21 2013-11-21 부품 내장 인쇄회로기판

Publications (1)

Publication Number Publication Date
KR101522787B1 true KR101522787B1 (ko) 2015-05-26

Family

ID=53267169

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130142245A KR101522787B1 (ko) 2012-11-30 2013-11-21 부품 내장 인쇄회로기판

Country Status (2)

Country Link
KR (1) KR101522787B1 (zh)
CN (1) CN104661432B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111182724B (zh) * 2020-01-19 2021-06-25 海东市旭格光电科技有限公司 一种柔性印刷电路板及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10509277A (ja) * 1994-10-05 1998-09-08 ザ ウィタカー コーポレーション 追加の印刷回路のための熱制御
JP3251949B2 (ja) * 1990-06-08 2002-01-28 ザ・ホワイテーカー・コーポレーション 印刷配線盤用改良基板材料及びその製造方法
JP3335707B2 (ja) * 1993-04-30 2002-10-21 日立化成工業株式会社 多層基板の製造方法
JP2013084692A (ja) * 2011-10-06 2013-05-09 Ibiden Co Ltd 配線板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7105221B2 (en) * 2001-07-19 2006-09-12 Toray Industries, Inc. Circuit board, laminated member for circuit board, and method for making laminated member for circuit board
JP2011520024A (ja) * 2008-05-14 2011-07-14 ヘンケル コーポレイション 硬化性組成物およびそれらの使用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3251949B2 (ja) * 1990-06-08 2002-01-28 ザ・ホワイテーカー・コーポレーション 印刷配線盤用改良基板材料及びその製造方法
JP3335707B2 (ja) * 1993-04-30 2002-10-21 日立化成工業株式会社 多層基板の製造方法
JPH10509277A (ja) * 1994-10-05 1998-09-08 ザ ウィタカー コーポレーション 追加の印刷回路のための熱制御
JP2013084692A (ja) * 2011-10-06 2013-05-09 Ibiden Co Ltd 配線板及びその製造方法

Also Published As

Publication number Publication date
CN104661432B (zh) 2018-02-02
CN104661432A (zh) 2015-05-27

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